CN211240333U

CN211240333U - Thick copper etching prefabricated plate of FPC

Info

Publication number: CN211240333U
Application number: CN201922078087.5U
Authority: CN
Inventors: 陈浪; 黄志刚; 刘志勇; 徐玉珊
Original assignee: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY CO LTD
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd.
Priority date: 2019-11-27
Filing date: 2019-11-27
Publication date: 2020-08-11
Anticipated expiration: 2029-11-27

Abstract

The utility model discloses and provides a FPC thick copper etching prefabricated plate can improve the trapezoidal serious problem of copper foil thickness FPC thick copper single-sided board cross section more than 2oz, satisfies the circuit tolerance requirement. The FPC thick copper etching prefabricated plate comprises a pure copper foil A, a secondary dry film B and a cover film C, wherein glue D is arranged on the cover film C, the cover film C covers the front surface of the pure copper foil A through the glue D, the secondary dry film B is attached to the back surface of the pure copper foil A, and an etching groove F is formed in the front surface of the pure copper foil A. The utility model discloses be applied to the technical field of the preparation of the thick copper single-sided board of FPC.

Description

Thick copper etching prefabricated plate of FPC

Technical Field

The utility model relates to a thick copper single face board of FPC, in particular to thick copper etching prefabricated plate of FPC.

Background

Adopt single face copper foil substrate production during traditional FPC thick copper single panel preparation, copper foil thickness is generally more than 2oz, and during the circuit etching, because of leading to the foil thickness thick, influenced by etching factor, line distance bottom is difficult to etch, leads to the trapezoidal serious of circuit cross section, and the line width tolerance is difficult to control. The trapezoid of the cross section of the FPC thick copper single-sided board with the copper foil thickness of more than 2oz is serious, and the requirement of circuit tolerance is difficult to meet.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a thick copper etching prefabricated plate of FPC, can improve the trapezoidal serious problem of the thick copper single-sided board cross section of FPC of copper foil thickness more than 2oz, satisfy the circuit tolerance requirement.

The utility model adopts the technical proposal that: the FPC thick copper etching prefabricated plate comprises a pure copper foil A, a secondary dry film B and a cover film C, wherein glue D is arranged on the cover film C, the cover film C covers the front surface of the pure copper foil A through the glue D, the secondary dry film B is attached to the reverse surface of the pure copper foil A, an etching groove F is formed in the front surface of the pure copper foil A, the part, which is not etched, of the front surface of the pure copper foil A is a designed circuit, and the etching groove F is filled with the glue D.

The depth of the etching groove F is half of the thickness of the pure copper foil A.

The utility model has the advantages that: because the utility model discloses a general method of each etching of positive and negative can improve the trapezoidal serious problem of copper foil thickness FPC thick copper single-sided board cross section more than 2oz, satisfies the circuit tolerance requirement.

Drawings

FIG. 1 is a schematic view of a copper foil dry film;

FIG. 2 is a schematic illustration of the front side etching of copper foil;

FIG. 3 is a schematic view of a cover film pressed on a copper foil;

FIG. 4 is a schematic view of a copper foil after being subjected to a hot-pressing of a cover film;

FIG. 5 is a schematic view of a copper foil with a secondary dry film attached to the reverse side;

fig. 6 is a schematic cross-sectional view of a single-sided FPC.

Detailed Description

As shown in fig. 5, in this embodiment, an FPC thick copper etching prefabricated board includes a pure copper foil a, a secondary dry film B, and a cover film C, where a glue D is disposed on the cover film C, the cover film C covers the front surface of the pure copper foil a through the glue D, the secondary dry film B is attached to the back surface of the pure copper foil a, an etching groove F is disposed on the front surface of the pure copper foil a, an unetched portion on the front surface of the pure copper foil a is a designed circuit, and the etching groove F is filled with the glue D.

A manufacturing process of an FPC (flexible printed circuit) thick copper single-panel comprises the following steps:

a. as shown in fig. 1, a pure copper foil a is used, and a dry film B1 and a dry film B2 are attached to the front and back of the pure copper foil a, respectively;

b. as shown in fig. 2, the lower dry film B2 is exposed in full plate, and the front surface of the pure copper foil a is etched by an exposure-development etching process, in which the etching depth is half of the thickness of the pure copper foil a;

c. as shown in fig. 3 and 4, a cover film C is pressed on the front surface of the pure copper foil, the upper layer of the cover film C is a PI layer, the lower layer of the cover film C is an adhesive layer, and the etched grooves are filled with the adhesive D of the cover film C;

d. as shown in fig. 5, removing the exposed lower dry film B2, and attaching a secondary dry film B to the reverse side of the pure copper foil a;

e. as shown in fig. 6, the circuit designed on the reverse side of the pure copper foil is overlapped with the circuit designed in step a, the reverse side of the pure copper foil a is etched through an exposure development etching process, the pure copper foil a is completely etched through, and the groove etched on the reverse side of the pure copper foil a is communicated with the groove etched on the front side of the pure copper foil a to form a guide path E, i.e. the single-sided FPC is formed. The problem that the cross section of the FPC thick copper single-sided board with the copper foil thickness of more than 2oz is trapezoidal can be solved, and the requirement of circuit tolerance is met.

The utility model discloses be applied to the technical field of the preparation of the thick copper single-sided board of FPC.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. The utility model provides a FPC thick copper etching prefabricated plate, includes pure copper foil (A), secondary dry film (B), cover film (C), be equipped with on cover film (C) and glue (D), cover film (C) through glue (D) cover the front of pure copper foil (A), secondary dry film (B) pastes the reverse side of pure copper foil (A), its characterized in that: the front surface of the pure copper foil (A) is provided with an etching groove (F), the part which is not etched on the front surface of the pure copper foil (A) is a designed circuit, and the etching groove (F) is filled with the glue (D).

2. The FPC thick copper etching prefabricated plate as claimed in claim 1, wherein: the depth of the etching groove (F) is half of the thickness of the pure copper foil (A).