CN211234315U - Dicing saw capable of automatically detecting three-dimensional appearance of workpiece - Google Patents
Dicing saw capable of automatically detecting three-dimensional appearance of workpiece Download PDFInfo
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- CN211234315U CN211234315U CN202020038149.XU CN202020038149U CN211234315U CN 211234315 U CN211234315 U CN 211234315U CN 202020038149 U CN202020038149 U CN 202020038149U CN 211234315 U CN211234315 U CN 211234315U
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Abstract
The utility model aims to provide a dicing saw for automatically detecting the three-dimensional appearance of a workpiece, which belongs to a grinding wheel dicing saw and comprises a dicing saw body, wherein a detection device is arranged on the dicing saw body; the detection device includes: the device comprises a detection device mounting frame, and a low-power microscope component, a high-power microscope component and an ultrasonic detector which are arranged on the detection device mounting frame in parallel. The utility model provides a three-dimensional detection device according to work piece two dimension appearance, adjusts the cutting position, skips over the place that does not have the work piece, improves efficiency; secondly, the cutting depth can be adjusted according to the thickness of the workpiece, and the slotting depth is ensured; the volume is small, the installation is convenient, and the device can be suitable for most of the models of the existing scribing machines; and the cutting fluid is dustproof and waterproof, and is suitable for the humid complex environment of a dicing saw cutting cavity.
Description
Technical Field
The utility model belongs to emery wheel scribing machine provides a scribing machine of automatic detection work piece three-dimensional appearance very much.
Background
The abrasive wheel scribing machine is a precise numerical control device integrating the technologies of water, gas and electricity, air static pressure high-speed main shaft, precise mechanical transmission, sensors, automatic control and the like. The cutting tool is mainly used for precision cutting processing of materials such as silicon integrated circuits, light emitting diodes, lithium niobate, piezoelectric ceramics, gallium arsenide, sapphire, quartz, glass, ceramics, solar cells and the like.
The workpiece processed by the grinding wheel scribing machine generally has extremely high requirements on precision and knife edge quality. Therefore, the dicing speed is generally low, the minimum speed is 0.1mm/s, and very many knives are often needed to be diced on a small area, such as 8000-. For the workpiece with irregular shape, the cutting method which can be adopted at present is an approximately regular method, for example, a square workpiece lacking one corner still needs to be cut according to the square, which wastes much time and seriously affects the efficiency.
The more serious problem is that for the workpiece with irregular thickness, the traditional grinding wheel dicing saw cannot adjust the dicing depth along with the thickness change of the workpiece, and only can cut off or perform dicing according to the fixed height from the bottom surface.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a dicing saw for automatically detecting the three-dimensional appearance of a workpiece, which comprises a dicing saw body, wherein a detection device is arranged on the dicing saw body;
the detection device includes: the device comprises a detection device mounting frame, and a low-power microscope component, a high-power microscope component and an ultrasonic detector which are arranged on the detection device mounting frame in parallel;
wherein, the low power microscope component comprises a low power microscope camera, a low power microscope lens cone and a low power microscope point light source; the low-power microscope camera is fixed on a low-power microscope lens barrel through threads, a point light source of the low-power microscope is vertically arranged on the low-power microscope lens barrel, and the low-power microscope lens barrel is fixed on the detection device mounting frame through a low-power microscope fixing seat;
the high power microscope component comprises a high power microscope camera, a high power microscope lens cone and a high power microscope point light source; the high-power microscope camera is fixed on the high-power microscope lens barrel through threads, the point light source of the high-power microscope is vertically arranged on the high-power microscope lens barrel, and the high-power microscope lens barrel is fixed on the detection device mounting frame through the high-power microscope fixing seat.
Further, the detection device further comprises: a low power microscope ring light source and a high power microscope ring light source; low power microscope annular light source and high power microscope annular light source all fix on the detection device mounting bracket through the annular light source mount pad, and low power microscope annular light source is located under the low power microscope subassembly, and high power microscope annular light source is located under the high power microscope subassembly.
Furthermore, the ultrasonic detector is a cylindrical compact ultrasonic detector and is fixed on the detection device mounting frame through an ultrasonic detector fixing seat.
Compared with the prior art, the utility model has the advantages of it is following:
firstly, the three-dimensional detection device provided by the utility model adjusts the cutting position according to the two-dimensional shape of the workpiece, skips over the place without the workpiece, and improves the efficiency; secondly, the cutting depth can be adjusted according to the thickness of the workpiece, and the slotting depth is ensured; the volume is small, the installation is convenient, and the device can be suitable for most of the models of the existing scribing machines; and the cutting fluid is dustproof and waterproof, and is suitable for the humid complex environment of a dicing saw cutting cavity.
Drawings
Fig. 1 is the structure diagram of the detecting device provided by the present invention.
Reference numerals: 10-a detection device mounting frame; 21-low power microscope camera; 22-low power microscope column; 23-low power microscope point light source; 24-low power microscope fixing seat; 31-high power microscope camera; 32-high power microscope column; 33-high power microscope point light source; 34-high power microscope fixing seat; 41-an ultrasonic detector; 42-ultrasonic detector fixing seat; 51-low power microscope ring light source; 52-high power microscope ring light source; 53-annular light source mount.
Detailed Description
Example 1
A dicing saw for automatically detecting the three-dimensional appearance of a workpiece comprises a dicing saw body, wherein a detection device is arranged on the dicing saw body;
the detection device includes: the detection device comprises a detection device mounting frame 10, and a low-power microscope component, a high-power microscope component and an ultrasonic detector 41 which are arranged on the detection device mounting frame 10 in parallel;
wherein, the low power microscope component comprises a low power microscope camera 21, a low power microscope lens cone 22 and a low power microscope point light source 23; the low power microscope camera 21 is fixed on the low power microscope lens cone 22 through threads, the low power microscope point light source 23 is vertically arranged on the low power microscope lens cone 22, and the low power microscope lens cone 22 is fixed on the detection device mounting frame 10 through a low power microscope fixing seat 24;
preferably, the low power microscope camera 21 is a gray point camera BFLY-PGE-03S2M-CS, the low power microscope lens barrel 22 is a clear lens (2 times) WWL08-65CT, and the low power microscope point light source 23 is an OPT-PI 0803-R.
The high power microscope component comprises a high power microscope camera 31, a high power microscope lens barrel 32 and a high power microscope point light source 22; the high power microscope camera 31 is fixed on the high power microscope lens barrel 32 through threads, the high power microscope point light source 33 is vertically arranged on the high power microscope lens barrel 32, and the high power microscope lens barrel 32 is fixed on the detection device mounting frame 10 through the high power microscope fixing seat 34;
preferably, the high power micro-mirror camera 31 is a gray point camera BFLY-PGE-03S2M-CS, the high power micro-mirror column 32 is a clear lens (6 times) WWL60-65CT, and the high power micro-mirror point light source 33 is OPT-PI 0803-R.
Further, the detection device further comprises: a low power microscope ring light source 51 and a high power microscope ring light source 52; the low-power microscope annular light source 51 and the high-power microscope annular light source 52 are both fixed on the detection device mounting frame 10 through an annular light source mounting seat 53, the low-power microscope annular light source 51 is positioned right below the low-power microscope component, and the high-power microscope annular light source 52 is positioned right below the high-power microscope component;
preferably, the low power microscope annular light source 51 is OPT-RI3220-B and the high power microscope annular light source 52 is OPT-RI 3220-B.
Further, the ultrasonic probe 41 is a cylindrical compact ultrasonic probe, and is fixed on the detection device mounting frame 10 through an ultrasonic probe fixing seat 42;
preferably, the ultrasonic detector 41 is of a compact cylindrical type of IPC-m18 of Rake electronics.
The high power microscope component is used for aligning the pattern on the workpiece and determining the cutting position; the low power microscope component is used for scanning the two-dimensional shape of the workpiece, the ultrasonic detector 41 is used for scanning the thickness of the workpiece, and the three-dimensional shape of the workpiece is detected by matching two groups in a mode of splicing after scanning block by block (for example, 0.5 x 0.5mm is scanned each time) through the stepping relative motion of the detection device and the workpiece to be detected.
The three-dimensional shape resolution precision of the device can reach +/-0.05 mm, the alignment precision can reach +/-0.01 mm, the dustproof and waterproof grade of each functional part can reach IP67, and the device is completely suitable for the humid complex environment of a cutting cavity; meanwhile, the ultrasonic detector 41 has a built-in temperature compensation function, so that the influence of stability on the detection result can be eliminated.
The utility model is not the best known technology.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (3)
1. The utility model provides an automatic detect wafer cutter of three-dimensional appearance of work piece, includes the wafer cutter body, its characterized in that: the dicing saw body is provided with a detection device;
the detection device includes: the device comprises a detection device mounting frame (10), and a low-power microscope component, a high-power microscope component and an ultrasonic detector (41) which are arranged on the detection device mounting frame (10) in parallel;
wherein, the low power microscope component comprises a low power microscope camera (21), a low power microscope lens cone (22) and a low power microscope point light source (23); the low power microscope camera (21) is fixed on the low power microscope lens cone (22) through screw threads, the low power microscope point light source (23) is vertically arranged on the low power microscope lens cone (22), and the low power microscope lens cone (22) is fixed on the detection device mounting frame (10) through a low power microscope fixing seat (24);
the high power microscope component comprises a high power microscope camera (31), a high power microscope lens barrel (32) and a high power microscope point light source (33); the high power microscope camera (31) is fixed on the high power microscope lens cone (32) through screw threads, the high power microscope point light source (33) is vertically arranged on the high power microscope lens cone (32), and the high power microscope lens cone (32) is fixed on the detection device mounting frame (10) through a high power microscope fixing seat (34).
2. The dicing saw for automatically inspecting the three-dimensional shape of a workpiece according to claim 1, wherein the inspection apparatus further comprises: a low power microscope ring light source (51) and a high power microscope ring light source (52); low power microscope annular light source (51) and high power microscope annular light source (52) all fix on detection device mounting bracket (10) through annular light source mount pad (53), and low power microscope annular light source (51) are located under the low power microscope subassembly, and high power microscope annular light source (52) are located under the high power microscope subassembly.
3. A dicing saw for automatically inspecting the three-dimensional shape of a work according to claim 1, characterized in that: the ultrasonic detector (41) is a cylindrical compact ultrasonic detector and is fixed on the detection device mounting frame (10) through an ultrasonic detector fixing seat (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020038149.XU CN211234315U (en) | 2020-01-09 | 2020-01-09 | Dicing saw capable of automatically detecting three-dimensional appearance of workpiece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020038149.XU CN211234315U (en) | 2020-01-09 | 2020-01-09 | Dicing saw capable of automatically detecting three-dimensional appearance of workpiece |
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| CN211234315U true CN211234315U (en) | 2020-08-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114755814A (en) * | 2022-06-13 | 2022-07-15 | 沈阳和研科技有限公司 | Novel microscope structure capable of being used for back cutting of scribing machine and scribing machine |
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2020
- 2020-01-09 CN CN202020038149.XU patent/CN211234315U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114755814A (en) * | 2022-06-13 | 2022-07-15 | 沈阳和研科技有限公司 | Novel microscope structure capable of being used for back cutting of scribing machine and scribing machine |
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Address after: 110 000 No. 53 Buyunshan Road, Huanggu District, Shenyang City, Liaoning Province Patentee after: Shenyang Heyan Technology Co.,Ltd. Address before: 110 000 No. 53 Buyunshan Road, Huanggu District, Shenyang City, Liaoning Province Patentee before: SHENYANG HEYAN TECHNOLOGY CO.,LTD. |