CN211221490U

CN211221490U - Transfer cylinder for slurry circulating system of silicon wafer cutting machine

Info

Publication number: CN211221490U
Application number: CN201921638117.7U
Authority: CN
Inventors: 杨帆; 樊欢欢; 王海洋
Original assignee: Crystal Marine Semiconductor Materials Donghai Co ltd
Current assignee: Crystal Marine Semiconductor Materials Donghai Co ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2020-08-11
Anticipated expiration: 2029-09-27

Abstract

The utility model discloses a silicon chip cutting machine's thick liquid is transfer jar for circulation system, it includes the cylinder body, a lateral wall at the cylinder body is equipped with spillway hole and wash port, spillway hole and wash port are located the upper portion and the lower part of cylinder body respectively, spillway hole and wash port are connected with the conflux line that sets up in the cylinder body outside respectively, be equipped with the ooff valve that is used for controlling the drainage on the water pipe of connecting conflux line and wash port, be equipped with the water inlet on the cylinder body, the interior bottom of cylinder body inclines towards wash port place side, be equipped with filter equipment in water inlet department, the thick liquid of flowing through is filtered in advance through filter equipment. The utility model discloses the defective rate of cutting can be reduced.

Description

Transfer cylinder for slurry circulating system of silicon wafer cutting machine

Technical Field

The utility model relates to a silicon chip cutting machine's thick liquid is transfer jar for circulation system.

Background

In the photovoltaic industry, diamond cutting is widely adopted to cut silicon wafers, so that the thickness of the silicon wafers can be reduced from original 200um to current 165um, the overall thickness of the silicon wafers is reduced by 17.5%, and the generation amount of corresponding single-blade silicon powder is increased by 17.5%.

Silicon powder generated in the cutting process of the silicon chip cutting machine flows into the transfer cylinder along with the slurry, the slurry is conveyed to the filter barrel from the transfer cylinder through the water pump for filtering, and then the slurry is circulated to the silicon chip cutting machine again to participate in cutting.

In order to cope with the increase of the amount of generated silica fume and reduce the silica fume and impurities entering the cutting machine, the existing method is to increase the mesh number of the filter bag in the filter barrel, and as the mesh number of the filter bag is higher and higher, the silica fume is easy to block the filter bag, so that the cutting flow is reduced, and adverse consequences such as TTV/line mark, line breakage and the like are caused.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a transfer cylinder for a slurry circulation system of a silicon wafer cutting machine, which can reduce the fraction defective of cutting,

solve above-mentioned technical problem, the utility model discloses a technical scheme as follows:

a transfer cylinder for a slurry circulation system of a silicon wafer cutting machine comprises a cylinder body, wherein an overflow hole and a drain hole are formed in one side wall of the cylinder body and are respectively located on the upper portion and the lower portion of the cylinder body, the overflow hole and the drain hole are respectively connected with a confluence pipeline arranged outside the cylinder body, a switch valve used for controlling drainage is arranged on a water pipe connecting the confluence pipeline and the drain hole, a water inlet is formed in the upper surface of the cylinder body, the transfer cylinder is characterized in that a filtering device is arranged at the water inlet, flowing slurry is filtered in advance through the filtering device, and the inner bottom of the cylinder body inclines towards the side where the drain hole is located.

Furthermore, a water pump is installed on the cylinder body, a water pumping pipe of the water pump extends into the cylinder body, and a water outlet end of the water pump is connected with a filter vat of the slurry circulating system.

Furthermore, the filtering device comprises a stainless steel filtering plate and a filtering screen, the stainless steel filtering plate is arranged at the water inlet, the filtering screen is correspondingly arranged above the stainless steel filtering plate, and a plurality of filtering holes are formed in the stainless steel filtering plate; the slurry falling to the water inlet firstly impacts the filter screen, is filtered by the filter screen and then flows through the stainless steel filter plate.

Furthermore, the transfer cylinder also comprises a moving device, the cylinder body is arranged on the moving device, and the cylinder body is integrally inclined to the side where the drain hole is located, so that the inner bottom surface of the cylinder body is inclined to the side where the drain hole is located.

Further, the mobile device includes four truckles, and four truckles distribute and install four angles at the cylinder body.

Furthermore, the inclination angle of the inner bottom surface of the cylinder body is 2-5 degrees.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses set up filter equipment at the water inlet and carry out prefiltering to the thick liquid of flowing through to reduce and get into inside silica flour of cylinder body and impurity, and then reduce silicon chip cutting machine's slurry circulation system's burden. In the process of discharging the waste water at intervals, because the inner bottom surface of the cylinder body inclines towards the side where the drain hole is located, the silicon powder and impurities deposited at the bottom of the cylinder body can be discharged from the drain hole along with the waste water more easily, and residues are reduced. The filtering device and the inclined arrangement reduce silicon powder and impurities from being brought into the cutting system again, so that the reject ratio of cutting is reduced.

2. The silicon powder can be discharged completely through the inclined arrangement, so that the cylinder washing frequency can be reduced (about 30min for single cylinder washing), the operation time is shortened, and the cutting efficiency is improved.

3. The utility model discloses a filter equipment is double-deck filtration, including stainless steel filter and filter screen, the filter screen can cushion the thick liquid that falls earlier, reduces the impact to the stainless steel filter, and double-deck filtration can be more abundant filter in advance the thick liquid.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a perspective view of the present invention;

FIG. 2 is a schematic side view of the present invention;

fig. 3 is a schematic front view of the present invention.

The reference numerals in the drawings denote:

1-a cylinder body; 11-overflow holes; 12-a drain hole; 13-a water inlet; 2-a filtration device; 3-a water pump; 4-a mobile device; 41-two casters at the side of the drain hole; 42-two casters remote from the drain hole; 5-a converging pipe; 6-switching valve.

Detailed Description

The present invention will be further described with reference to the following examples.

For the convenience of description, the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer" and the like in the present invention are used with reference to the drawings of the present invention, and are not intended to limit the present invention.

As shown in fig. 1 and 2, the transfer cylinder for a slurry circulation system of a silicon wafer cutting machine comprises a cylinder body 1 and a water pump 3 mounted on the cylinder body, wherein a water pumping pipe of the water pump 3 extends into the cylinder body 1 and is used for pumping slurry in the cylinder body 1, and a water outlet end of the water pump 3 is connected with a filter vat of the slurry circulation system. An overflow hole 11 and a drain hole 12 are arranged on one side wall of the cylinder body 1, the overflow hole 11 and the drain hole 12 of the embodiment are long-strip-shaped holes, the overflow hole 11 and the drain hole 12 are respectively positioned at the upper part and the lower part of the cylinder body 1, the overflow hole 11 is close to the upper part of the cylinder body 1, the drain hole 12 is close to the lower part of the cylinder body 1, the overflow hole 11 and the drain hole 12 are respectively connected with a confluence pipeline 5 arranged outside the cylinder body 1, a liquid outlet of the confluence pipeline 5 is connected with a drainage pipeline of a silicon wafer cutting machine, and a switch valve 6 is arranged on a water pipe connecting the confluence pipeline. A water inlet 13 is provided on the upper surface of the cylinder 1, the inner bottom surface of the cylinder 1 is inclined toward the side of the water discharge hole 12, a filter 2 is provided at the water inlet 13, and the slurry flowing through the filter 2 is preliminarily filtered. The water inlet 13 of this embodiment is a square opening, and occupies a half of the area of the upper surface of the cylinder 1.

When the silicon wafer cutting machine is used, the transfer cylinder is located below a cutting chamber of the silicon wafer cutting machine, a slurry outlet of the cutting chamber is vertically aligned with a water inlet 13 of the cylinder body 1, slurry generated during cutting carries silicon powder and impurities, the silicon powder and the impurities fall into the water inlet 13 from the slurry outlet, the slurry passing through the water inlet 13 is firstly filtered by the filtering device 2 in advance and then enters the cylinder body 1, and the slurry in the cylinder body 1 is conveyed into a filtering barrel of the slurry circulating system by the water pump 3. The switch valve 6 is opened to drain accumulated water at the bottom of the cylinder body 1 when the water discharging device works for a certain time, and the inner bottom surface of the cylinder body 1 inclines towards the side where the water discharging hole 12 is located, so that silicon powder and impurities deposited at the bottom of the cylinder body 1 are discharged along with the accumulated water when the water is discharged.

For better filtering the thick liquid in advance, the filter equipment 2 of this embodiment sets up stainless steel filter and filter screen, for double-deck filtration, the stainless steel filter sets up in water inlet department, seals the water inlet, and the filter screen corresponds the top that sets up at the stainless steel filter, has seted up a plurality of on the stainless steel filter and has filtered the hole, and the filtration hole of this embodiment is the square hole that the length of a side is 3cm, and the mesh number of filter screen is 150 meshes. The slurry falling to the water inlet firstly impacts the filter screen, the filter screen buffers the slurry, and the slurry is filtered by the filter screen and then flows through the stainless steel filter plate for filtering. The stainless steel filter plate and the filter screen can be fixed by screws.

In order to facilitate the movement of the cylinder body 1, the transfer cylinder of the present embodiment further includes a moving device 4, the cylinder body 1 is mounted on the moving device 4, and the entire cylinder body 1 is inclined to the side of the drain hole 12 such that the inner bottom of the cylinder body 1 is inclined to the side of the drain hole 12. When the cylinder body 1 needs to be cleaned, the transfer cylinder can be removed from the silicon wafer cutting machine through the moving device 4.

Specifically, mobile device 4 includes four casters, and four casters distribute and install four angles at cylinder body 1, and the size of four casters is the same, makes cylinder body 1 wholly to the slope of wash port place side through the setting up of the mounting height to

caster

41 and 42. As shown in fig. 3, the cylinder 1 of the present embodiment is inclined at an angle of 3 °.

The above embodiments of the present invention are not right the utility model discloses the limited protection scope, the utility model discloses an embodiment is not limited to this, all kinds of basis according to the above-mentioned of the utility model discloses an under the above-mentioned basic technical thought prerequisite of the utility model, right according to ordinary technical knowledge and the conventional means in this field the modification, replacement or the change of other multiple forms that above-mentioned structure made all should fall within the protection scope of the utility model.

Claims

1. A transfer cylinder for a slurry circulation system of a silicon wafer cutting machine comprises a cylinder body, wherein an overflow hole and a drain hole are formed in one side wall of the cylinder body, the overflow hole and the drain hole are respectively located on the upper portion and the lower portion of the cylinder body, the overflow hole and the drain hole are respectively connected with a confluence pipeline arranged outside the cylinder body, a switch valve used for controlling drainage is arranged on a water pipe connecting the confluence pipeline and the drain hole, a water inlet is formed in the upper portion of the cylinder body, and the transfer cylinder is characterized in that a filtering device is arranged at the water inlet and used for pre-filtering flowing slurry, and the inner bottom of the cylinder body inclines towards the side where the drain hole is located.

2. The transit cylinder for the slurry circulation system of the silicon wafer cutting machine as claimed in claim 1, wherein the cylinder body is provided with a water pump, a water suction pipe of the water pump extends into the cylinder body, and a water outlet end of the water pump is connected with a filter vat of the slurry circulation system.

3. The transit cylinder for the slurry circulation system of the silicon wafer cutting machine according to claim 1, wherein the filtering device comprises a stainless steel filter plate and a filter screen, the stainless steel filter plate is arranged at the water inlet, the filter screen is correspondingly arranged above the stainless steel filter plate, and a plurality of filter holes are formed in the stainless steel filter plate; the slurry falling to the water inlet firstly impacts the filter screen, is filtered by the filter screen and then flows through the stainless steel filter plate.

4. The transit cylinder for a slurry circulation system of a silicon wafer slicing machine according to claim 1, wherein the transit cylinder further comprises a moving means, the cylinder body is mounted on the moving means, and the entire cylinder body is inclined to the side of the drain hole so that the inner bottom surface of the cylinder body is inclined to the side of the drain hole.

5. The silicon wafer cutting machine slurry circulation system transfer cylinder according to claim 4, wherein the moving means comprises four casters, and the four casters are installed at four corners of the cylinder body in a distributed manner.

6. The transit cylinder for a slurry circulation system of a silicon wafer slicing machine according to claim 1, wherein an inclination angle of an inner bottom surface of the cylinder body is 2 ° to 5 °.