CN211209307U

CN211209307U - EMI filter and power supply

Info

Publication number: CN211209307U
Application number: CN202020157574.0U
Authority: CN
Inventors: 李宗杰
Original assignee: Dezhou Sanhe Electric Co ltd
Current assignee: Dezhou Sanhe Electric Co ltd
Priority date: 2020-02-07
Filing date: 2020-02-07
Publication date: 2020-08-07
Anticipated expiration: 2030-02-07

Abstract

The utility model discloses a EMI wave filter and power, include: the circuit comprises a circuit module, a base and a shell, wherein a cavity for accommodating the circuit module and the base is formed in the shell; the leading-out ends of the inductors of the circuit modules and the extension parts of the leading-out ends of the overlines form a plurality of leading-out pins of the circuit substrate, and the leading-out pins of the circuit substrate correspond to the base pins one by one and are fixedly connected with the base pins. The problem that the copper foil of the circuit substrate is in heavy current circulation is solved, the product quality is improved, the production efficiency is improved due to high integration level combination, the product cost is controlled due to the adoption of the single-sided circuit substrate with lower value, the pouring sealant, the circuit module and the shell are glued and fixed into a whole, and the vibration resistance of the product is improved.

Description

EMI filter and power supply

Technical Field

The utility model belongs to the technical field of electrical components, especially, relate to an EMI wave filter and power.

Background

The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.

The electromagnetic interference filter is also called an EMI filter, the EMI filter is inserted between an input power supply and an electric appliance, the power supply filter is an electric appliance device which effectively filters a frequency point with a specific frequency in a power supply line or frequencies except the frequency point, and the EMI filter can effectively inhibit the electromagnetic interference of the electric appliance on the power supply.

The market demand of filters increases year by year, and the existing production process basically has the following modes:

firstly, all the leading-out ends of the electronic components are welded on the base after being manually lapped and welded, so that the production efficiency is low and the product consistency is poor.

And secondly, after part of electronic components are welded on the circuit substrate, the double-sided circuit substrate is welded on the base, and the inductor is welded on the base independently, so that the production efficiency of part is improved, but the double-sided circuit substrate with higher value is increased.

And thirdly, all electronic components are welded on the circuit substrate and welded on the base by adopting the double-sided circuit substrate, a large current path is provided by using the copper foil of the circuit substrate, the production efficiency is improved, the double-sided circuit substrate with higher value is increased, and meanwhile, the quality risk of failure of a copper foil fusing circuit exists when the copper foil of the circuit substrate works under large current for a long time.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough of above-mentioned prior art, the utility model provides an EMI wave filter, the integrated level is high, production efficiency is high, the quality is reliable.

In order to achieve the above object, one or more embodiments of the present invention provide the following technical solutions:

an EMI filter comprising: the circuit comprises a circuit module, a base and a shell, wherein a cavity for accommodating the circuit module and the base is formed in the shell;

the leading-out ends of the inductors of the circuit modules and the extension parts of the leading-out ends of the overlines form a plurality of leading-out pins of the circuit substrate, and the leading-out pins of the circuit substrate correspond to the base pins one by one and are fixedly connected with the base pins.

According to a further technical scheme, the circuit module comprises a circuit substrate, an inductor, a capacitor, a resistor and a jumper wire;

a plurality of leading-out ends of the inductor penetrate through the circuit substrate, and the extending parts of the leading-out ends form a plurality of leading-out pins of the circuit module;

the capacitor and the resistor are fixed on the circuit substrate, one end of the overline is fixed on the circuit substrate, and the other end of the overline is a leading-out pin of the circuit module.

According to a further technical scheme, the base comprises an insulating substrate and a plurality of leading-out pins penetrating through the insulating substrate, one end of each pin is provided with a bonding pad with a hole, and the holes of the bonding pads are correspondingly welded with the leading-out pins of the circuit module.

According to a further technical scheme, each bonding pad is of an outward bending shape.

In a further technical scheme, the insertion ends of the base pins are provided with anti-falling holes.

In a further technical scheme, the EMI filter is of a structure that a circuit module and a shell are glued and fixed into a whole by using pouring sealant.

According to a further technical scheme, the circuit substrate is provided with a plurality of safety grooves: and the jumper wire, the resistor, the capacitor and the inductor terminals are arranged in the through holes and welded.

According to a further technical scheme, the shape of the circuit substrate is polygonal or circular.

According to the technical scheme, the overline, the resistor, the capacitor and the inductor are mounted on the circuit substrate in a laminated mode, the overline and the resistor are mounted on a first layer, the capacitor is mounted on the first layer or a second layer, and the inductor is mounted on a third layer.

According to a further technical scheme, the inductor comprises a magnetic ring and wires, the wires are wound on two sides of the magnetic ring, and wire terminals are shaped according to the corresponding via hole intervals of the circuit substrate.

According to the further technical scheme, the magnetic ring is square.

In a further technical scheme, the conducting wire can also be one or more.

According to the further technical scheme, when the two wires are used, one wire is wound around the magnetic ring in the forward direction, and the other wire is wound around the magnetic ring in the reverse direction.

According to the further technical scheme, one side of the shell is provided with a fixing bolt or is not provided with the fixing bolt.

In another aspect, the present invention also discloses a power supply, including the above-mentioned EMI filter.

The above one or more technical solutions have the following beneficial effects:

the hole based on the bonding pad is matched and welded with the leading-out pins of the circuit module one by one, the problem that a copper foil of a circuit substrate circulates large current is solved, the product quality is improved, the high integration level combination improves the production efficiency, the single-sided circuit substrate with lower value is adopted, the product cost is controlled, the pouring sealant, the circuit module and the shell are glued and fixed into a whole, and the vibration resistance of the product is improved.

The method and the device improve the production efficiency, guarantee the product quality and control the product cost on the whole.

Drawings

The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without unduly limiting the scope of the invention.

FIG. 1 is a schematic diagram of a base structure of an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a circuit module structure composed of a circuit substrate, an inductor, a capacitor, a resistor, and a jumper according to an embodiment of the disclosure;

FIG. 3 is a schematic diagram of a housing construction of an embodiment of the present disclosure;

FIG. 4 is an assembly view of the overall structure of an embodiment of the present disclosure;

FIG. 5 is an outline view of an embodiment of the present disclosure;

in the figure, 1, a circuit substrate, 2, an inductor, 3, a capacitor A, 4, a capacitor B, 5, a resistor, 6, a jumper wire, 7, a circuit module pin, 8, an insulating substrate, 9, a base pin, 10, a base pin pad hole, 11, a base pin anti-falling hole, 12, pouring sealant, 13 and a shell.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the invention. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

In the case of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other.

Example one

Referring to fig. 3, 4 and 5, the present embodiment discloses an EMI filter including a circuit module with a plurality of lead-out pins, a base, and a housing 13.

Referring to fig. 2, the circuit module comprises a circuit substrate 1, an inductor 2, a capacitor, a resistor 5 and a jumper wire 6, wherein the capacitor comprises a capacitor a3 and a capacitor B4, a plurality of leading-out ends of the inductor penetrate through the circuit substrate and are welded with the circuit substrate, and a plurality of leading-out pins, namely circuit module pins 7, of the circuit module are formed by extension parts of the leading-out ends; the capacitor, the resistor and the jumper wire are welded on the circuit substrate, and one end of the jumper wire forms a leading-out pin of the circuit module.

In this embodiment, specifically, referring to fig. 1, the base includes an insulating substrate 8 and a plurality of base pins 9, which are lead-out pins penetrating through the insulating substrate, and each of the base pins has a pad with a hole at one end and a drop-off preventing hole 11 at the other end, and is connected to an external socket by plugging. The hole is base pin pad hole 10, each pad has the bending shape, make things convenient for circuit module to participate in 7 to insert, the hole of pad and the leading-out pin of circuit module cooperate the welding one by one, the heavy current directly passes through, need not pass through the base plate copper foil, the problem of circuit substrate copper foil circulation heavy current has been solved, product quality is improved, high integration level combination has promoted production efficiency, adopt the lower single face circuit substrate of value, product cost has been controlled, the casting glue is glued with circuit module, shell and is become a whole, the shock resistance of product has been improved.

In this embodiment, the base plug end has a base pin anti-falling hole 11 for preventing the external socket from falling off after being plugged into the external socket.

In this embodiment, the circuit module pins are welded in the base pin pad holes and assembled with the housing, the potting adhesive is injected into the housing, the potting adhesive 12 glues and fixes the circuit module, the housing and the like into a whole, the housing may have a fixing bolt or not, and the fixing bolt is used as an external structure and is matched with an external fastening structure.

In a specific example, the circuit substrate is provided with a plurality of safety grooves; the circuit board is provided with a plurality of through holes, the terminals of the overline, the resistor, the capacitor and the inductor are installed in the through holes and welded, and the circuit board can be polygonal or circular.

In another example, a jumper line, a resistor, a capacitor, and an inductor are stacked on a circuit board, and the jumper line, the resistor, the capacitor, and the inductor are mounted on a first layer, a second layer, and a third layer, respectively, thereby making it possible to make full use of space.

In a specific example, the inductor includes a magnetic ring and two wires, the wires are wound on two sides of the magnetic ring, the magnetic ring can be understood as two symmetrical parts, the winding is that one wire is wound in a forward direction and one wire is wound in a reverse direction, the wire terminals are shaped according to corresponding via hole intervals of the circuit substrate, the commonly used magnetic ring is circular and also has square in a square frame shape, and the wires can also be one or more. In this embodiment, two elements are formed to have substantially the same common mode inductance, and one element is formed to have the same differential mode inductance.

In the EMI filter of this embodiment, the inductor, the capacitor, the resistor, and the jumper wire are integrated on the circuit substrate, the extension portion of the lead-out end of the inductor and the extension portion of the lead-out end of the jumper wire form a plurality of lead-out pins of the circuit substrate, the lead-out pins of the circuit substrate are soldered by inserting the lead-out pins into the pad holes of the base pins in a one-to-one correspondence manner, the potting compound is injected into the case, and the assembly of the circuit substrate and the base is mounted. The production efficiency is improved, the product quality is guaranteed, and the product cost is controlled.

Example two

The object of this embodiment is to provide a power supply including the EMI filter in the first embodiment. The electromagnetic interference suppression circuit is inserted between an input power supply and an electrical appliance, and effectively suppresses the electromagnetic interference of the electrical appliance on the power supply.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Although the present invention has been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without inventive work are still within the scope of the present invention.

Claims

1. An EMI filter, comprising: the circuit comprises a circuit module, a base and a shell, wherein a cavity for accommodating the circuit module and the base is formed in the shell;

2. The EMI filter of claim 1 wherein the circuit block comprises a circuit substrate, an inductor, a capacitor, a resistor, and a flying lead;

3. The EMI filter of claim 1 wherein the base includes an insulating substrate and a plurality of pins extending through the insulating substrate, each pin having a pad with a hole at one end, the holes of the pad being soldered to corresponding pins of the circuit module.

4. An EMI filter as claimed in claim 3 wherein each pad has an outwardly curved shape.

5. The EMI filter of claim 3 wherein the mating ends of the base pins have anti-separation holes.

6. The EMI filter of claim 1 wherein the EMI filter is a unitary structure formed by molding the circuit module and the housing together with potting adhesive.

7. The EMI filter of claim 2 wherein the circuit substrate has a plurality of safety notches: and the jumper wire, the resistor, the capacitor and the inductor terminals are arranged in the through holes and welded.

8. The EMI filter of claim 2 wherein the circuit substrate is polygonal or circular in shape.

9. The EMI filter of claim 2 wherein the crossovers, resistors, capacitors, and inductors are stacked on the circuit substrate, the crossovers, resistors are mounted on a first layer, the capacitors are mounted on a first or second layer, and the inductors are mounted on a third layer.

10. The EMI filter of claim 2 or 9 wherein the inductor comprises a magnetic ring, wires wound around both sides of the magnetic ring, the wire terminals being shaped according to the corresponding via hole pitch of the circuit substrate.

11. The EMI filter of claim 10 wherein the magnetic loop is square in shape.

12. The EMI filter of claim 10 wherein the conductive line is one or more.

13. The EMI filter of claim 10 wherein when there are two conductors, one of the conductors is wound around the magnetic loop in a forward direction and one of the conductors is wound around the magnetic loop in a reverse direction.

14. The EMI filter of claim 1 wherein the housing has either or not a set screw on one side.

15. A power supply comprising an EMI filter as claimed in any one of claims 1 to 14.