CN211208427U

CN211208427U - TT packaging 6A patch bridge stack

Info

Publication number: CN211208427U
Application number: CN202020393461.0U
Authority: CN
Inventors: 马奕俊
Original assignee: Shenzhen Chendahang Electronics Co ltd
Current assignee: Shenzhen Chenda Semiconductor Co ltd
Priority date: 2020-03-24
Filing date: 2020-03-24
Publication date: 2020-08-07
Anticipated expiration: 2030-03-24

Abstract

The utility model relates to a bridge rectifier technical field just discloses a TT encapsulation 6A paster bridge rectifier, including lower packaging body, the top joint of packaging body has last packaging body down, the inside of packaging body has been seted up down and has been placed the chamber, place the electrically conductive base plate of inside fixedly connected with in chamber, the top fixedly connected with chip of electrically conductive base plate, the top fixedly connected with wire jumper of chip, the other end and the adjacent electrically conductive base plate fixed connection of wire jumper. This TT encapsulation 6A paster bridge rectifier, be provided with first pin through the cooperation, lead electrical pillar, first screw, the nut, second screw and electrically conductive hole, the second pin is the welding on the circuit board, through twisting the nut, make nut and first screw separation, make to lead electrical pillar and can follow electrically conductive downthehole shifting out, realized TT encapsulation 6A paster bridge rectifier from the quick dismantlement on the circuit board, do not need the welding many times when making dismouting maintenance TT encapsulation 6A paster bridge rectifier, avoided the welding accident to lead to the damage of circuit board.

Description

TT packaging 6A patch bridge stack

Technical Field

The utility model relates to a bridge rectifier technical field specifically is a TT encapsulation 6A paster bridge rectifier.

Background

The bridge stack is an electronic component, the interior of which is composed of a plurality of diodes, and the main functions of the bridge stack are rectification and current direction adjustment, and the rectification by the bridge stack is better, so that the bridge stack is convenient firstly, and four tubes in the bridge stack are generally selected and matched.

The pin of current TT encapsulation 6A paster bridge pile is the same with other paster bridge piles, all weld on the circuit board through electric luo iron and solder wire, when inside the taking place to open a way or short circuit of TT encapsulation 6A paster bridge pile, need dismantle maintenance or change TT encapsulation 6A paster bridge pile from the circuit board, but because weld on the circuit board, it is very troublesome to dismantle, and current TT encapsulation 6A paster bridge pile is more and more miniaturized, make current bridge pile heat dissipation all add zinc metal casing outside the insulating layer and encapsulate and dispel the heat, can't satisfy the operational requirement of miniature powerful TT encapsulation 6A paster bridge pile, make because the heat dissipation is untimely, can lead to the inside of TT encapsulation 6A paster bridge pile can be because the high temperature, lead to the damage.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a TT encapsulation 6A paster bridge rectifier, possess advantages such as convenient to detach and radiating effect are good, solved when TT encapsulation 6A paster bridge rectifier is inside to take place to open circuit or short circuit, need dismantle maintenance or change TT encapsulation 6A paster bridge rectifier from the circuit board, nevertheless because the welding is on the circuit board, dismantle very troublesome problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a TT packaged A patch bridge stack comprises a lower packaging body, wherein an upper packaging body is clamped at the top of the lower packaging body, a placing cavity is formed in the lower packaging body, a conductive substrate is fixedly connected in the placing cavity, a chip is fixedly connected to the top of the conductive substrate, a jumper wire is fixedly connected to the top of the chip, the other end of the jumper wire is fixedly connected with an adjacent conductive substrate, a first pin is fixedly connected in the conductive substrate, a first screw is arranged on the surface, away from the conductive substrate, of the first pin, a nut is in threaded connection with the surface of the first screw, a second pin is movably connected in the nut, a second screw is arranged on the surface of the second pin, the second screw is in threaded connection with the inside of the nut, a conductive hole is formed in the top of the second pin, and a conductive column is fixedly connected to the bottom of the first pin, the bottom end of the conductive column is lapped with the inner bottom wall of the conductive hole.

Preferably, the left side and the right side of the upper packaging body and the lower packaging body are both provided with a plurality of heat dissipation holes, the plurality of heat dissipation holes are divided into four groups, and the adjacent two heat dissipation holes in each group are arranged at equal intervals.

Preferably, the inner wall of the placing cavity is fixedly connected with a protective sleeve, and the inner part of the protective sleeve is fixedly connected with a heat conducting rod.

Preferably, the left end of the heat conducting rod is fixedly connected with a heat absorbing block, and the heat absorbing block is located inside the placing cavity.

Preferably, a groove is formed in the left side of the lower packaging body, a heat dissipation block is fixedly connected to the inside of the groove, and the right end of the heat dissipation block is fixedly connected with the left end of the heat conduction rod.

Preferably, the upper packaging body and the lower packaging body are both provided with vertically through process holes, and the two process holes have the same diameter.

Compared with the prior art, the utility model provides a TT encapsulation 6A paster bridge rectifier possesses following beneficial effect:

1. this TT encapsulation 6A paster bridge rectifier, through being provided with first pin, be provided with on the bottom of first pin and lead electrical pillar, be provided with first screw socket on the surface of first pin, surface threaded connection at first screw socket has the nut, second screw socket threaded connection on the inside and second pin surface at the nut, top at the second pin is provided with electrically conductive hole, the second pin welds on the circuit board, through twisting the nut, make nut and first screw socket separation, make to lead electrical pillar and can follow electrically conductive downthehole the shifting out, TT encapsulation 6A paster bridge rectifier has been realized dismantling fast from the circuit board, do not need the multiple welding when making dismouting maintenance TT encapsulation 6A paster bridge rectifier, avoided the welding accident to lead to the damage of circuit board.

2. This TT encapsulation 6A paster bridge rectifier, a plurality of louvres have been seted up through the side of last packaging body with packaging body down, be provided with the heat absorption piece placing the intracavity, side at the heat absorption piece is provided with the heat conduction pole, side at the heat conduction pole is provided with the radiating block, the mode of carrying out the heat dissipation has been changed to current bridge rectifier and has been added zinc metal casing outside the insulating layer and sealed, set up the heat absorption piece through the cooperation, heat conduction pole and radiating block, can dispel the heat to TT encapsulation 6A paster bridge rectifier, the radiating effect is good, through being provided with a plurality of louvres, can assist the heat dissipation to TT encapsulation 6A paster bridge rectifier, further strengthen the radiating effect, set up like this, make the radiating effect of high-power miniaturized TT encapsulation 6A paster bridge rectifier good.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the upper package structure of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 1;

FIG. 4 is a left side view of the lower package structure of the present invention;

fig. 5 is an enlarged view of the structure at B in fig. 1.

Wherein: 1. a lower package body; 2. an upper package body; 3. a placement chamber; 4. a conductive substrate; 5. a chip; 6. a jumper wire; 7. a first pin; 8. a first screw port; 9. a nut; 10. a second pin; 11. a second screw; 12. a conductive via; 13. a conductive post; 14. heat dissipation holes; 15. a protective sleeve; 16. a heat conducting rod; 17. a heat absorbing block; 18. a groove; 19. a heat dissipating block; 20. and (5) processing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a TT package 6A patch bridge stack comprises a lower package 1, an upper package 2 is clamped on the top of the lower package 1, a placing cavity 3 is formed inside the lower package 1, a conductive substrate 4 is fixedly connected inside the placing cavity 3, a chip 5 is fixedly connected on the top of the conductive substrate 4, a jumper 6 is fixedly connected on the top of the chip 5, the other end of the jumper 6 is fixedly connected with an adjacent conductive substrate, a first pin 7 is fixedly connected inside the conductive substrate 4, a first screw 8 is arranged on the surface of the first pin 7 far away from the conductive substrate 4, a nut 9 is in threaded connection with the surface of the first screw 8, a second pin 10 is movably connected inside the nut 9, a second screw 11 is arranged on the surface of the second pin 10, the second screw 11 is in threaded connection with the inside of the nut 9, a conductive hole 12 is formed on the top of the second pin 10, the bottom of the first pin 7 is fixedly connected with a conductive column 13, the bottom end of the conductive column 13 is lapped with the inner bottom wall of the conductive hole 12, the first pin 7 is arranged, the conductive column 13 is arranged on the bottom of the first pin 7, the surface of the first pin 7 is provided with a first screw 8, the surface of the first screw 8 is in threaded connection with a nut 9, the inner part of the nut 9 is in threaded connection with a second screw 11 on the surface of a second pin 10, the top of the second pin 10 is provided with a conductive hole 12, the second pin 10 is welded on the circuit board, the nut 9 is separated from the first screw 8 by screwing the nut 9, so that the conductive column 13 can be moved out from the conductive hole 12, the TT packaging 6A patch bridge stack can be quickly disassembled from the circuit board, multiple times of welding are not needed when the TT packaging 6A patch bridge stack is disassembled and maintained, and the damage of the circuit board caused by welding accidents is avoided, the upper packaging body 2 and the lower packaging body 1 are both provided with heat dissipation holes 14 at the left side and the right side, the number of the heat dissipation holes 14 is multiple, the plurality of heat dissipation holes 14 are divided into four groups, adjacent two heat dissipation holes 14 in each group are arranged at equal intervals, the inner wall of the placing cavity 3 is fixedly connected with a protective sleeve 15, the conductive substrate 4 and the chip 5 in the placing cavity 3 can be protected by arranging the protective sleeve 15, the inner part of the protective sleeve 15 is fixedly connected with a heat conduction rod 16, the left end of the heat conduction rod 16 is fixedly connected with a heat absorption block 17, the heat absorption block 17 is positioned in the placing cavity 3, the left side of the lower packaging body 1 is provided with a groove 18, the inner part of the groove 18 is fixedly connected with a heat dissipation block 19, the right end of the heat dissipation block 19 is fixedly connected with the left end of the heat conduction rod 16, the upper packaging body 2 and the lower packaging body 1 are both provided with vertically through process holes 20, the two, be provided with heat absorption piece 17 placing intracavity 3, side at heat absorption piece 17 is provided with heat conduction pole 16, side at heat conduction pole 16 is provided with radiating block 19, the mode that current bridge rectifier adds the encapsulation of zinc metal shell outside the insulating layer and carries out the heat dissipation has been changed, set up heat absorption piece 17 through the cooperation, heat conduction pole 16 and radiating block 19, can dispel the heat to TT encapsulation 6A paster bridge rectifier, the radiating effect is good, through being provided with a plurality of louvres 14, can assist the heat dissipation to TT encapsulation 6A paster bridge rectifier, further strengthen the radiating effect, the setting like this, make the radiating effect of high-power miniaturized TT encapsulation 6A paster bridge rectifier good.

When using, twist nut 9, make nut 9 and the separation of first screw 8, make and lead electrical pillar 13 and can follow electrically conductive hole 12 and shift out, realized TT encapsulation 6A paster bridge heap and followed the quick dismantlement on the circuit board, be provided with heat absorption block 17, heat conduction pole 16 and radiating block 19, can go out the heat conduction that chip 5 and electrically conductive base plate 4 produced, be provided with a plurality of louvres 14, can assist the heat dissipation to TT encapsulation 6A paster bridge heap, be provided with two kinds of radiating modes, the radiating effect is better.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A TT encapsulation 6A patch bridge stack comprises a lower packaging body (1) and is characterized in that: an upper packaging body (2) is clamped at the top of the lower packaging body (1), a placing cavity (3) is formed in the lower packaging body (1), a conductive substrate (4) is fixedly connected to the inside of the placing cavity (3), a chip (5) is fixedly connected to the top of the conductive substrate (4), a jumper wire (6) is fixedly connected to the top of the chip (5), the other end of the jumper wire (6) is fixedly connected with an adjacent conductive substrate, a first pin (7) is fixedly connected to the inside of the conductive substrate (4), a first screw (8) is arranged on the surface, away from the conductive substrate (4), of the first pin (7), a screw cap (9) is connected to the surface of the first screw (8), a second pin (10) is movably connected to the inside of the screw cap (9), and a second screw (11) is formed on the surface of the second pin (10), the second screw (11) is connected with the internal thread of the screw cap (9), the top of the second pin (10) is provided with a conductive hole (12), the bottom of the first pin (7) is fixedly connected with a conductive column (13), and the bottom end of the conductive column (13) is lapped with the inner bottom wall of the conductive hole (12).

2. The TT packaged 6A patch bridge stack of claim 1, wherein: the left side and the right side of the upper packaging body (2) and the lower packaging body (1) are both provided with a plurality of heat dissipation holes (14), the number of the heat dissipation holes (14) is multiple, the heat dissipation holes (14) are divided into four groups, and two adjacent heat dissipation holes (14) in each group are arranged at equal intervals.

3. The TT packaged 6A patch bridge stack of claim 1, wherein: the inner wall fixedly connected with protective sheath (15) of placing chamber (3), the inside fixedly connected with heat conduction pole (16) of protective sheath (15).

4. A TT packaged 6A patch bridge stack according to claim 3, wherein: the left end of the heat conducting rod (16) is fixedly connected with a heat absorbing block (17), and the heat absorbing block (17) is located inside the placing cavity (3).

5. A TT packaged 6A patch bridge stack according to claim 3, wherein: a groove (18) is formed in the left side of the lower packaging body (1), a heat dissipation block (19) is fixedly connected to the inner portion of the groove (18), and the right end of the heat dissipation block (19) is fixedly connected with the left end of the heat conducting rod (16).

6. The TT packaged 6A patch bridge stack of claim 1, wherein: the upper packaging body (2) and the lower packaging body (1) are both provided with vertically through process holes (20), and the two process holes (20) are the same in diameter.