CN211208257U - Superconductive solid-state capacitance guide pin with good heat dissipation performance - Google Patents
Superconductive solid-state capacitance guide pin with good heat dissipation performance Download PDFInfo
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- CN211208257U CN211208257U CN201922435403.XU CN201922435403U CN211208257U CN 211208257 U CN211208257 U CN 211208257U CN 201922435403 U CN201922435403 U CN 201922435403U CN 211208257 U CN211208257 U CN 211208257U
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Abstract
The utility model discloses a solid-state electric capacity guide pin of superconductivity that heat dispersion is good, including connecting plate, spliced pole, pin, radiating groove and arch, spliced pole one end is opened there is the draw-in groove, and connecting plate one end sets up in the draw-in groove, and the spliced pole other end is provided with the jack, and the jack inboard that the spliced pole was opened evenly is provided with a plurality of archs, and open on pin outside surface has a plurality of radiating grooves, and the radiating groove cooperatees with the arch, and the pin links to each other with the jack of spliced pole one end, the utility model discloses rational in infrastructure, simple, during operation, the heat that produces is discharged from a plurality of radiating grooves on pin surface, and the radiating effect promotes.
Description
Technical Field
The utility model relates to a solid-state electric capacity guide pin technical field specifically is a solid-state electric capacity guide pin of superconductivity that heat dispersion is good.
Background
The solid state capacitors are all referred to as: solid aluminum electrolytic capacitor. The biggest difference between the aluminum capacitor and the common capacitor (namely, the liquid aluminum electrolytic capacitor) is that different dielectric materials are adopted, the liquid aluminum capacitor dielectric material is electrolyte, and the solid aluminum capacitor dielectric material is conductive polymer material.
In view of the problems of liquid electrolytic capacitors, solid aluminum electrolytic capacitors have been developed. Since the 90 s in the 20 th century, aluminum electrolytic capacitors have revolutionized the development of solid conductive polymer materials as cathodes instead of electrolytes. The conductive capacity of the conductive polymer material is 2-3 orders of magnitude higher than that of the electrolyte, and the ESR can be greatly reduced and the temperature frequency characteristic can be improved when the conductive polymer material is applied to an aluminum electrolytic capacitor; and the polymer material has good processability and is easy to encapsulate, so that the chip development of the aluminum electrolytic capacitor is greatly promoted. At present, commercial solid-state aluminum electrolytic capacitors mainly have two types: organic semiconductor aluminum electrolytic capacitors (OS-CON) and polymer conductor aluminum electrolytic capacitors (PC-CON).
The structure of the organic semiconductor aluminum electrolytic capacitor is similar to that of a liquid aluminum electrolytic capacitor, and a direct-insert vertical packaging mode is mostly adopted. The difference lies in that the cathode material of the solid aluminum polymer electrolytic capacitor uses solid organic semiconductor extract to replace electrolyte, thereby effectively solving the problems of evaporation, leakage, flammability and the like of the electrolyte while improving various electrical properties.
The solid aluminum polymer patch capacitor is a unique structure formed by combining the characteristics of an aluminum electrolytic capacitor and a tantalum capacitor. Like liquid aluminum electrolytic capacitors, solid aluminum polymers are mostly in the form of patches. The high conductivity polymer electrode film is deposited on the alumina as the cathode, and carbon and silver as the extraction electrode of the cathode, which is similar to the structure of the solid tantalum electrolytic capacitor.
At present, the fixed capacitance guide pin often causes unstable operation of an electronic device due to a heat dissipation problem, thereby affecting normal use, and therefore an improved technology is urgently needed to solve the problem existing in the prior art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a solid-state electric capacity guide pin of superconductive that heat dispersion is good to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a solid-state electric capacity guide pin of superconductivity that heat dispersion is good, includes connecting plate, spliced pole, pin, radiating groove and arch, spliced pole one end is opened there is the draw-in groove, connecting plate one end sets up in the draw-in groove, the spliced pole other end is provided with the jack, the jack inboard that the spliced pole was opened evenly is provided with a plurality of archs, open on pin outside surface has a plurality of radiating grooves, the radiating groove cooperatees with the arch, the pin links to each other with the jack of spliced pole one end.
Preferably, the two sides of one end of the connecting plate are arranged to be bevel edges, and the width of one end of the connecting plate connecting clamping groove is consistent with the diameter of the connecting column.
Preferably, the number of the protrusions of the number of the heat dissipation grooves is the same, and the positions of the heat dissipation grooves correspond to the positions of the protrusions.
Preferably, the diameter of the pin is matched with the jack arranged at one end of the connecting column, and sealant is further arranged at the joint of the pin and the connecting column.
Preferably, the thickness of the protrusion and the heat dissipation groove is less than half of the diameter of the pin.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses rational in infrastructure, simple, the during operation, the heat that produces is discharged from a plurality of radiating grooves on pin surface, and the radiating effect promotes greatly to the electric conductive property of electric capacity guide pin has been guaranteed.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic side view of the present invention.
Fig. 3 is a schematic view of the internal structure of the connection post socket.
Fig. 4 is a schematic cross-sectional structure diagram of the lead.
In the figure: connecting plate 1, spliced pole 2, pin 3, radiating groove 4, arch 5, sealed glue 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a superconductive solid-state capacitor guide pin with good heat dissipation performance comprises a connecting plate 1, a connecting column 2, pins 3, heat dissipation grooves 4 and protrusions 5, wherein one end of the connecting column 2 is provided with a clamping groove, two sides of one end of the connecting plate 1 are arranged to be oblique edges, the width of one end, connected with the clamping groove, of the connecting plate 1 is consistent with the diameter of the connecting column 2, one end of the connecting plate 1 is arranged in the clamping groove, the other end of the connecting column 2 is provided with a jack, the inner side of the jack formed by the connecting column 2 is uniformly provided with a plurality of protrusions 5, the outer side surface of each pin 3 is provided with a plurality of heat dissipation grooves 4, the heat dissipation grooves 4 are matched with the protrusions 5, the number of the protrusions 5 of the number of the heat dissipation grooves 4 is consistent, the positions of the heat dissipation grooves 4 are corresponding to the positions of the protrusions 5, the thicknesses of the, and the joint of the pin 3 and the connecting column 2 is also provided with a sealant 6.
The use method and the principle are as follows: insert the draw-in groove that 2 one ends of spliced pole were opened and fixed with 1 one end of connecting plate, insert in the jack of the 2 other ends of spliced pole with pin 3, and make the radiating groove 4 on 3 outside surfaces of pin and 5 one-to-one in the jack and fix, set up sealed glue 6 in the junction of pin 3 and spliced pole 2 afterwards, accomplish the equipment, be connected the back with pin 3 and circuit board, in operation, the heat that produces is discharged from a plurality of radiating grooves 4 on 3 surfaces of pin, the radiating effect promotes greatly, thereby the electric conductive property of electric capacity guide pin has been guaranteed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A superconductivity solid-state capacitance guide pin with good heat dissipation performance is characterized in that: including connecting plate (1), spliced pole (2), pin (3), radiating groove (4) and arch (5), spliced pole (2) one end is opened there is the draw-in groove, connecting plate (1) one end sets up in the draw-in groove, spliced pole (2) other end is provided with the jack, jack inboard that spliced pole (2) was opened evenly is provided with a plurality of archs (5), open on pin (3) outside surface has a plurality of radiating grooves (4), radiating groove (4) cooperate with arch (5), pin (3) link to each other with the jack of spliced pole (2) one end.
2. The superconducting solid capacitive lead of claim 1, wherein: the both sides of connecting plate (1) one end set up to the hypotenuse, the width of connecting draw-in groove one end is unanimous with the diameter of spliced pole (2) in connecting plate (1).
3. The superconducting solid capacitive lead of claim 1, wherein: the number of the protrusions (5) of the number of the heat dissipation grooves (4) is consistent, and the positions of the heat dissipation grooves (4) correspond to the positions of the protrusions (5).
4. The superconducting solid capacitive lead of claim 1, wherein: the diameter of pin (3) and the jack phase-match that spliced pole (2) one end set up, pin (3) still are provided with sealed glue (6) with spliced pole (2) junction.
5. The superconducting solid capacitive lead of claim 1, wherein: the thickness of the protrusion (5) and the heat dissipation groove (4) is smaller than half of the diameter of the pin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922435403.XU CN211208257U (en) | 2019-12-30 | 2019-12-30 | Superconductive solid-state capacitance guide pin with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922435403.XU CN211208257U (en) | 2019-12-30 | 2019-12-30 | Superconductive solid-state capacitance guide pin with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211208257U true CN211208257U (en) | 2020-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922435403.XU Active CN211208257U (en) | 2019-12-30 | 2019-12-30 | Superconductive solid-state capacitance guide pin with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211208257U (en) |
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2019
- 2019-12-30 CN CN201922435403.XU patent/CN211208257U/en active Active
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