CN211207071U

CN211207071U - Photoresist supply device

Info

Publication number: CN211207071U
Application number: CN201921418292.5U
Authority: CN
Inventors: 杨伟靖
Original assignee: Shenzhen BYD Microelectronics Co Ltd
Current assignee: BYD Semiconductor Co Ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-08-07
Anticipated expiration: 2029-08-28

Abstract

The utility model relates to a photoresist feeding mechanism, including the supply container (1) that is used for storing the photoresist, supply container (1) is connected with and is used for leading into the gluey glue spreading groove with photoresist and supply gluey pipeline (3), supply container (1) still is connected with and is used for letting in the inlet line (2) that supply the pressure gas, so that supply the pressure gas can with photoresist extrusion supply container (1). Through above-mentioned technical scheme, supply pressure gas in order to extrude the photoresist through letting in supply container (1), replaced deriving the photoresist through the mode of extraction with the photoresistance pump, can avoid when the photoresist viscosity is great, because of being limited by the unstable problem of photoresist supply that the biggest suction force of photoresistance pump is not enough leads to, improved the quality of coating.

Description

Photoresist supply device

Technical Field

The present disclosure relates to the field of semiconductor manufacturing technologies, and in particular, to a photoresist supply apparatus.

Background

In a semiconductor manufacturing process, a photolithography process is one of the most important process steps, and is mainly used for transferring a pattern on a mask onto a silicon wafer to prepare for the next etching or ion implantation process. The photolithography process generally includes coating, exposure, development and measurement, the coating is an important step in the photolithography process, the quality of the photoresist coating directly affects the quality of the semiconductor, and the stability of the photoresist supply affects the quality of the coating. In the related art, the supply device mainly performs a coating operation on the photoresist in the supply bottle by using a photoresist pump, which is limited by the maximum suction force, and the photoresist pump can only pump the photoresist with the viscosity less than 100CP, so that once the photoresist with the viscosity more than 100CP is used, the problems of unstable photoresist supply, uneven coating and the like can be caused. For example, power devices IGBT with a large number of applications in electric vehicles and large household appliances, a chemical PI (polyimide) with a viscosity much greater than 100CP is required, and the current supply devices have been unable to meet the process requirements.

SUMMERY OF THE UTILITY MODEL

The purpose of the present disclosure is to provide a photoresist supply apparatus to solve the problem that coating quality is affected due to unstable photoresist supply.

In order to achieve the above object, the present disclosure provides a photoresist supply apparatus, including a supply container for storing photoresist, the supply container is connected with a photoresist supply pipeline for guiding the photoresist into a photoresist coating groove, and the supply container is further connected with an air inlet pipeline for introducing a pressure supply gas, so that the pressure supply gas can press the photoresist out of the supply container.

Optionally, the supply container includes a liquid storage bottle for containing the photoresist and a sealed pressure bottle arranged outside the liquid storage bottle, the liquid storage bottle is open, the air inlet pipeline is connected to the pressure bottle, and the glue supply pipeline extends into the liquid storage bottle.

Optionally, the glue supply pipeline extends into the bottom of the liquid storage bottle.

Optionally, the supply vessel is further connected with an exhaust line, the exhaust line being provided with a pressure relief valve.

Optionally, the air inlet pipeline is provided with an air pressure regulating valve for regulating the magnitude of the air inlet pressure.

Optionally, the material of the photoresist is PI.

Optionally, the supply device further comprises a buffer tank, the glue supply pipeline comprises a first pipe section connected to the upper ends of the supply container and the buffer tank and a second pipe section connected to the lower end of the buffer tank, and the upper end of the buffer tank is further connected with a discharge pipeline.

Optionally, the first pipe section is provided with a liquid level detector for detecting the photoresist surplus in the supply bottle.

Optionally, the supply device further comprises an alarm device connected to the liquid level detector for alarming when the remaining amount of the photoresist in the supply container is less than a threshold value.

Optionally, the supply device further comprises a pneumatic valve for adjusting the photoresist spraying amount, the photoresist supply pipeline further comprises a third pipe section, one end of the pneumatic valve is connected with the second pipe section, and the other end of the pneumatic valve is connected to the glue coating groove through the third pipe section.

Optionally, the pipe diameters of the first pipe section, the second pipe section and the third pipe section are the same as the inner diameter of the pneumatic valve.

Optionally, the pipe diameter size of the first pipe section, the second pipe section, the third pipe section and the inner diameter size of the pneumatic valve are 1/4-1/2 inches.

Through above-mentioned technical scheme, supply pressure gas in order to extrude the photoresist through letting in to supply container, replaced deriving the photoresist through the mode of extraction with the photo resist pump, can avoid when the photoresist viscosity is great, because of being limited by the unstable problem of photoresist supply that the biggest suction of photo resist pump is not enough leads to, improved the quality of coating.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

FIG. 1 is a schematic diagram of a photoresist supply apparatus according to an exemplary embodiment of the present disclosure;

fig. 2 is a schematic structural view of a photoresist supply apparatus according to another exemplary embodiment of the present disclosure.

Description of the reference numerals

1 supply container 11 liquid storage bottle 12 pressure bottle

2 air inlet pipeline 3 glue supply pipeline 31 first pipe section

32 second section 33 third section 4 exhaust line

5 relief valve 6 air pressure regulating valve 7 buffer tank

8 discharge line 9 liquid level detector 10 pneumatic valve

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless otherwise specified, use of directional words such as "upper" and "lower" generally means that the terms are defined with reference to the drawing plane of the corresponding drawing, and "inner" and "outer" mean that the corresponding part is contoured both inwardly and outwardly. The use of the terms first and second do not denote any order or importance, but rather the terms first and second are used to distinguish one element from another. In addition, when the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements, unless otherwise indicated.

As shown in fig. 1, the present disclosure provides a photoresist supply apparatus, which includes a supply container 1 for storing photoresist, the supply container 1 is connected with a photoresist supply pipeline for guiding the photoresist into a photoresist coating slot, and the supply container 1 is further connected with an air inlet pipeline 2 for introducing pressure supply gas, so that the pressure supply gas can press the photoresist out of the supply container 1. The pressure supply gas may be an inert gas such as nitrogen gas to avoid affecting the photoresist in the photoresist supply container 1. During the use, let in through air inlet pipe 2 and supply pressure gas to supply container 1, the photoresist in the supply container 1 receives the pressure drive to enter into and supplies gluey pipeline 3, derives the rubber coating groove at last, carries out the coating operation.

Through above-mentioned technical scheme, supply the pressure gas in order to extrude the photoresist through letting in to supply container 1, replaced deriving the photoresist through the mode of extraction with the photoresistance pump, can avoid when the photoresist viscosity is great, because of being limited by the unstable problem of photoresist supply that the biggest suction of photoresistance pump is not enough leads to, improved the quality of coating.

For high viscosity photoresists, suppliers typically supply them in plastic bottle packages. Since the plastic bottle is not resistant to high pressure, the pressure supply gas cannot be directly introduced into the plastic bottle, and the photoresist provided by the supplier needs to be poured into a high pressure resistant supply container for reuse. However, since the photoresist has high viscosity and poor fluidity, it takes a long time to pour the photoresist from a plastic bottle provided by a supplier into a high pressure resistant container, and the photoresist in the plastic bottle cannot be completely and thoroughly poured out, which seriously wastes production cost and productivity.

In order to solve the above technical problem, as shown in fig. 2, the supply container 1 may include a liquid storage bottle 11 for containing photoresist and a sealed pressure bottle 12 disposed outside the liquid storage bottle 11, the liquid storage bottle 11 is open, the air inlet pipeline 2 is connected to the pressure bottle 12, and the glue supply pipeline 3 extends into the liquid storage bottle 11. The pressure supply gas is introduced into the pressure bottle 12, the photoresist is pressed out from the liquid storage bottle 11 to the photoresist supply pipeline 3, and meanwhile, the internal pressure and the external pressure of the liquid storage bottle 11 can be the same, so that the photoresist does not need to be transferred into a high-pressure-resistant container even if the liquid storage bottle 11 directly adopts a plastic bottle provided by a supplier, and the photoresist is prevented from being polluted in the transferring and dumping process.

In order to ensure that the photoresist can be smoothly pressed into the photoresist supply pipeline 3 from the liquid storage bottle 11 after the pressure supply gas is introduced, as shown in fig. 2, the photoresist supply pipeline 3 extends into the bottom of the liquid storage bottle 11. After the pressure supply gas is introduced, the pressure supply gas drives the photoresist to flow downwards, and the photoresist can be easily pressed into the photoresist supply pipeline 3 due to the fact that the photoresist supply pipeline 3 is located at the bottom of the liquid storage bottle 11.

According to an embodiment of the present disclosure, as shown in fig. 1 and 2, the supply vessel 1 may further be connected with a vent line 4, the vent line 4 being provided with a pressure relief valve 5. In order to prevent the pressure in the supply container 1 from being excessive, a part of the pressure supply gas in the supply container 1 may be discharged through the discharge line 4, and the relief valve 5 may control the speed of pressure supply gas discharge and the discharge amount.

In the present disclosure, as shown in fig. 1 and 2, the intake pipe 2 may be provided with a gas pressure regulating valve 6 for regulating the magnitude of intake pressure. Since the photoresist viscosity is different from the spraying amount and the required pressure is also different, the pressure in the supply container 1 can be changed by adjusting the air pressure adjusting valve 6 to control the amount of the photoresist pressed into the photoresist supply pipeline 3.

When the photoresist has high viscosity, such as PI (polyimide) with ultrahigh viscosity used in manufacturing power devices IGBT (insulated gate bipolar transistor) used in electric vehicles and household appliances, the viscosity of the photoresist supply device can reach 3000-15000 CP, and the requirement of a production process can be well met.

In the present disclosure, as shown in fig. 1 and 2, the photoresist supply apparatus may further include a buffer tank 7, the photoresist supply line 3 includes a first pipe segment 31 connected to upper ends of the supply container 1 and the buffer tank 7 and a second pipe segment 32 connected to a lower end of the buffer tank 7, and the upper end of the buffer tank 7 is further connected to the drain line 8. When changing supply container 1, the inevitable air can enter into and supply gluey pipeline 3 and form the bubble, because the air is lighter than the photoresist, when entering into buffer tank 7, the bubble can come up, consequently buffer tank 7 adopts the mode setting of upper end feed liquor, exhaust bubble, lower extreme play liquid. After the supply container 1 is replaced, the bubbles can float to the upper end of the buffer tank 7, so that the bubbles can be discharged from the discharge pipeline 8 at the upper end of the buffer tank 7, and the bubbles are prevented from entering a glue coating groove along with photoresist, so that the coating is not uniform, and the product quality is influenced.

According to an embodiment of the present disclosure, as shown in fig. 1 and 2, the first pipe section 31 may be provided with a level detector 9 for detecting the photoresist remaining amount in the supply bottle 1. When the photoresist in the supply container 1 is completely supplied, the air in the supply container 1 will escape into the first pipe section 31, and the liquid level detector 9 will detect whether there is air in the first pipe section 31. The present disclosure does not limit the specific implementation form of the liquid level detector 9, and any structure or method capable of detecting whether air enters the first pipe section 31 may be used in the present disclosure, for example, a portion of the first pipe section 31 may be set as a transparent pipe section, one side of the pipe wall is provided with a laser emitting device, the laser emitting device may employ a laser displacement sensor, and the other side is provided with a photoelectric reflection plate for receiving laser. According to the difference of the time when the laser passes through the glue supply pipeline 3 caused by the existence of the photoresist in the first pipe section 31, the photoelectric reflecting plate obtains different reflection signals, so as to judge the photoresist allowance in the supply container 1.

Further, the photoresist supply apparatus of the present disclosure may further include an alarm device connected to the liquid level detector 9 for alarming when the remaining amount of the photoresist in the supply container 1 is less than a threshold value. The threshold value of the residual amount means that when the residual amount of the photoresist in the supply container 1 is smaller than the threshold value, the photoresist can not be pressed into the photoresist supply pipeline 3 by the pressure supply gas any more, and at this time, air enters the photoresist supply pipeline 3. The alarm device may be connected to the photoelectric reflective plate, and when the reflective signal indicates that there is no photoresist in the first pipe section 31, an alarm lamp of the alarm device flashes or a buzzer sounds.

According to an embodiment of the present disclosure, as shown in fig. 1 and 2, the photoresist supply device further includes a pneumatic valve 10 for adjusting a photoresist spraying amount, the photoresist supply pipeline 3 further includes a third pipe section 33, one end of the pneumatic valve 10 is connected with the second pipe section 32, and the other end is connected to the photoresist dispenser through the third pipe section 33. The ejection amount of the photoresist can be controlled by controlling the length of the opening time of the air-operated valve 10.

In the present disclosure, as shown in fig. 2, the pipe diameter dimensions of the first pipe section 31, the second pipe section 32, and the third pipe section 33 are the same as the inner diameter dimension of the air-operated valve 10. Further, the pipe diameters of the first pipe section 31, the second pipe section 32 and the third pipe section 33 and the inner diameter of the air-operated valve 10 are 1/4-1/2 inches. The tube diameter size and the inner diameter of the air-operated valve 10 can be changed according to actual conditions. When the viscosity of the photoresist used is small, the pipe diameter size and the inner diameter of the pneumatic valve 10 can be properly reduced, when the photoresist has a large viscosity, the pipe diameter with a small size and the inner diameter of the pneumatic valve 10 cannot meet the requirements, and when the pressure of the introduced pressure supply gas is increased and the requirements of the production process cannot be met, the pipe diameter size and the inner diameter of the pneumatic valve 10 can be improved by increasing.

A fully implementable photoresist supply apparatus provided in accordance with the present disclosure is now illustratively described. As shown in fig. 1-2, a pressure supply gas is introduced into the supply container 1 through the gas inlet pipe 2 in the direction of a, and the photoresist stored in the supply container 1 is pressure-driven into the first pipe section 31. When the pressure in the supply vessel 1 becomes excessive, the pressure relief valve 5 opens to vent gas from the vent line 4. The photoresist flows through the level detector 9 in the first pipe section 31 and then enters the buffer tank 7 so that the operator can judge the remaining amount of the photoresist in the supply container 1. After the photoresist enters the buffer tank 7, bubbles mixed in the photoresist are discharged from a discharge pipe 8 at the upper end of the buffer tank 7 along the direction C. The photoresist flowing out of the buffer tank 7 enters the second pipe section 32, flows through the pneumatic valve 10, enters the third pipe section 33, and is finally sprayed out to a glue coating groove along the direction B.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, various possible combinations will not be separately described in this disclosure.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims

1. The photoresist supply device is characterized by comprising a supply container (1) for storing photoresist, wherein the supply container (1) is connected with a photoresist supply pipeline (3) for guiding the photoresist into a photoresist coating groove, and the supply container (1) is also connected with an air inlet pipeline (2) for introducing pressure supply gas so that the pressure supply gas can press the photoresist out of the supply container (1).

2. The photoresist supply device according to claim 1, wherein the supply container (1) comprises a liquid storage bottle (11) for containing the photoresist and a closed pressure bottle (12) arranged outside the liquid storage bottle (11), the liquid storage bottle (11) is arranged in an open manner, the air inlet pipeline (2) is connected to the pressure bottle (12), and the photoresist supply pipeline (3) extends into the liquid storage bottle (11).

3. The photoresist supply apparatus according to claim 2, wherein the photoresist supply pipe (3) extends into the bottom of the liquid storage bottle (11).

4. The photoresist supply apparatus according to claim 1, wherein a vent line (4) is further connected to the supply vessel (1), the vent line (4) being provided with a pressure relief valve (5).

5. The photoresist supply apparatus according to claim 1, wherein the gas inlet pipe (2) is provided with a gas pressure regulating valve (6) for regulating the magnitude of the gas inlet pressure.

6. The photoresist supply apparatus according to claim 1, wherein the photoresist material is PI.

7. The photoresist supply apparatus according to any one of claims 1 to 6, further comprising a buffer tank (7), wherein the photoresist supply line (3) comprises a first pipe section (31) connected to the upper ends of the supply container (1) and the buffer tank (7) and a second pipe section (32) connected to the lower end of the buffer tank (7), and a drain line (8) is further connected to the upper end of the buffer tank (7).

8. The photoresist supply apparatus according to claim 7, wherein the first pipe section (31) is provided with a level detector (9) for detecting the photoresist surplus in the supply container (1).

9. The photoresist supply apparatus according to claim 8, further comprising an alarm device connected to the level detector (9) for alarming when the remaining amount of photoresist in the supply container (1) is less than a threshold value.

10. The photoresist supply apparatus according to claim 7, further comprising a pneumatic valve (10) for adjusting the photoresist spraying amount, wherein the photoresist supply pipeline (3) further comprises a third pipe section (33), one end of the pneumatic valve (10) is connected with the second pipe section (32), and the other end is connected to the glue spreading groove through the third pipe section (33).

11. The photoresist supply apparatus according to claim 10, wherein the first, second and third pipe sections (31, 32, 33) have pipe diameter dimensions that are the same as the inner diameter dimensions of the pneumatic valve (10).

12. The photoresist supply apparatus according to claim 11, wherein the first pipe segment (31), the second pipe segment (32), and the third pipe segment (33) have pipe diameters of 1/4-1/2 inches and an inner diameter of the pneumatic valve (10).