CN211181806U - Inner electrode lead-out structure of laminated high-frequency element - Google Patents

Abstract

The utility model discloses an inner electrode leading-out structure of a laminated sheet type high-frequency element, which comprises a through hole layer and a leading-out layer, wherein the main body of the through hole layer is a ferrite substrate, the through hole layer is positioned between an inner electrode layer and the leading-out layer, and the leading-out layer is positioned between the through hole layer and an end electrode; a first through hole is formed in the through hole layer, a first conductive structure is printed on one surface, which is in contact with the inner electrode layer, of the through hole layer, and the first conductive structure is filled in the first through hole and is connected with the end part of the inner electrode coil; the lead-out layer is provided with a plurality of second through holes, one surface of the lead-out layer is printed with a second conductive structure according to a preset pattern, and the second conductive structure is filled and connected with all the second through holes, so that the second conductive structure presents the preset pattern on one surface of the lead-out layer and presents a pattern consistent with the second through holes on the other surface of the lead-out layer; one side of the second conductive structure is in contact with the first conductive structure, and the other side of the second conductive structure is in contact with the terminal electrode, so that the end part of the inner electrode coil is led out to the terminal electrode through the first conductive structure and the second conductive structure in sequence.

Description

Inner electrode lead-out structure of laminated high-frequency element

Technical Field

The utility model relates to a stromatolite formula component, concretely relates to inner electrode extraction structure of stromatolite formula high frequency component.

Background

In the last decade, industries such as information and communication are rapidly developed, and the popularization and application from 3G communication to 4G communication are realized. With the rise of the domestic communication industry, the research and development and popularization of domestic 5G communication have entered the 'albefaction' competitive environment. The development of demand in the industry has put higher demands on chip electronic components that are the bases of electronic products, and multilayer chip components are being developed in the direction of miniaturization, high frequency, and high reliability.

The laminated chip component can be divided into an inductor, a magnetic bead, a filter, a resistor, a capacitor and the like according to performance, and most of the laminated chip components structurally comprise an inner electrode coil, a terminal electrode, an interlayer dielectric layer and a lead-out layer for conducting the inner electrode coil and the terminal electrode. The magnetic beads are used as important components of the laminated sheet type element, and can dissipate energy in an unnecessary frequency band in a mode of impedance absorption and heating. The conventional ferrite bead has the problems of large size (minimum size 1005), poor parameter consistency, low reliability and the like, and cannot meet the requirements of communication development on miniaturization and high reliability of the high-frequency bead. According to the inner electrode lamination structure, ferrite beads can be divided into two inner electrical structures, a horizontal structure (see fig. 1) and a vertical structure (see fig. 2). For the area utilization rate of a single-layer dielectric layer, the vertical structure is obviously higher than that of a horizontal structure, the effective area of an inner electrode coil can be larger, and the multilayer chip component is more suitable for high-frequency band filtering (GHz band); meanwhile, the vertical magnetic beads have better EMI effect due to the winding coil in the same direction as the current. The conventional magnetic bead leading-out structure is mainly led out from the side surface, that is, the connection layer is connected with the terminal electrode through the edge exposed from the medium layer by the planar structure, and the structure is shown in fig. 3. The lead-out structure has the advantages that the lead-out points are multiple, the product failure caused by the lead-out of a single lead and poor connection can be avoided, the exposed total area is small, the lead-out connection with the terminal electrode cannot be ensured to be sufficient, and weak connection is easy to occur. When the chip component is applied with large current, the limited lead-out contact area of the lead-out structure limits the current resistance of the product, and can cause the reliability to be reduced and the product to be invalid when the product is serious. Meanwhile, in order to ensure multipoint connection, the conventional vertical structure leading-out structure has multilateral intersection in a planar structure, which accounts for about 50% of the area of a dielectric layer, and is easy to have process problems of layering, cracking and the like in the preparation process. Therefore, in response to the miniaturization requirement of the stacked high frequency device, the conventional lead-out method needs to be improved to meet the trend of developing high reliability under the miniaturization trend of the stacked device.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at overcomes above-mentioned prior art not enough, provides a laminated sheet formula high frequency component's inner electrode extraction structure, and its extraction layer and the end electrode area of contact who draws forth the inner electrode are bigger, can realize high reliability, low-cost laminated sheet formula component extraction structure.

In order to achieve the above purpose, the utility model provides a following technical scheme:

an internal electrode lead-out structure of a laminated sheet type high-frequency element comprises a through hole layer and a lead-out layer, wherein the main body of the through hole layer is a ferrite substrate; the through hole layer is provided with a first through hole, one surface of the through hole layer, which is in contact with the inner electrode layer, is printed with a first conductive structure, and the first conductive structure fills the first through hole and is connected with the end part of the inner electrode coil; the lead-out layer is provided with a plurality of second through holes, one surface of the lead-out layer is printed with a second conductive structure according to a preset pattern, and the second conductive structure is filled and connected with all the second through holes so that the second conductive structure can form the preset pattern on one surface of the lead-out layer and form a pattern which is consistent with the second through holes on the other surface of the lead-out layer; one surface of the second conductive structure is in contact with the first conductive structure, and the other surface of the second conductive structure is in contact with the terminal electrode, so that the end part of the inner electrode coil is led out to the terminal electrode through the first conductive structure and the second conductive structure in sequence.

Compare with current inner electrode extraction mode, the utility model discloses an above-mentioned technical scheme has following beneficial effect: the connection between the connection point (the first conductive structure) led out from the two ends of the inner electrode coil and the end electrode adopts the second conductive structure, so that the multi-point and large-area connection with the end electrode is realized, and the reliability of the laminated high-frequency element is greatly improved. Meanwhile, the positions, the number and the connection areas of the connection points of the lead-out layer can be determined according to needs, and the design is more flexible.

Drawings

FIG. 1 is a schematic diagram of the interior of a conventional horizontal magnetic bead inner electrode and extraction structure;

FIG. 2 is a schematic diagram of the interior of a conventional vertical magnetic bead inner electrode and lead-out structure;

FIG. 3 is a schematic diagram of the extraction effect of an electrode in a conventional magnetic bead;

fig. 4 and 5 are schematic diagrams of two different forms of inner electrode lead-out structures according to embodiment 1 of the present invention;

fig. 6 and 7 show schematic views of both sides of the extraction layer in example 1, respectively;

FIGS. 8 and 9 show the lead-out effect of the internal electrodes at both ends of the element in example 1 (end electrode perspective), respectively;

fig. 10 and 11 show two schematic views of the extraction layer in example 2, respectively;

fig. 12 and 13 show schematic views of both sides of the extraction layer in example 3, respectively.

Detailed Description

The invention will be further described with reference to the accompanying drawings and preferred embodiments.

Referring to fig. 1 to 3, a conventional inner electrode lead-out method for magnetic beads refers to fig. 1 to 3, fig. 1 shows a horizontal inner electrode lead-out structure including a magnet ①, an inner electrode coil ②, a lead-out layer ③, and a terminal electrode ⑤, fig. 2 shows a vertical inner electrode lead-out structure including a magnet ①, an inner electrode coil ②, a via layer ③, a lead-out layer ④, and a terminal electrode ⑤, and the lead-out effects of the two structures are as shown in fig. 3.

The utility model provides an inner electrode leading-out structure of laminated sheet type high-frequency element, including the main part be the through-hole layer and the extraction layer of ferrite substrate, the through-hole layer is located the inner electrode layer with between the extraction layer, the extraction layer is located between through-hole layer and the end electrode; the through hole layer is provided with a first through hole, one surface of the through hole layer, which is in contact with the inner electrode layer, is printed with a first conductive structure, and the first conductive structure fills the first through hole and is connected with the end part of the inner electrode coil; the lead-out layer is provided with a plurality of second through holes, one surface of the lead-out layer is printed with a second conductive structure according to a preset pattern, and the second conductive structure is filled and connected with all the second through holes, so that the pattern of the second conductive structure on the one surface of the lead-out layer is the preset pattern, and the pattern which is consistent with the second through holes is presented on the other surface of the lead-out layer; one surface of the second conductive structure is in contact with the first conductive structure, and the other surface of the second conductive structure is in contact with the terminal electrode, so that the end part of the inner electrode coil is led out to the terminal electrode through the first conductive structure and the second conductive structure in sequence.

It will be appreciated that the chip component has two end electrodes and therefore the internal electrode lead-out structures are present at both ends. Respectively marking two end electrodes of the element as an end electrode A and an end electrode B, correspondingly marking an extraction structure of leading one end of an internal electrode out of the end electrode A as an internal electrode extraction structure A, and respectively marking a corresponding through hole layer and an extraction layer as a through hole layer A and an extraction layer A; and marking the extraction structure of the other end of the internal electrode, which is extracted to the end electrode B, as an internal electrode extraction structure B, and marking the corresponding through hole layer and the extraction layer as a through hole layer B and an extraction layer B respectively. The via layers a and B have the same structure, and the lead layers a and B have the same structure, but because of the lamination specificity of the lamination process, different lead-out effects are exhibited inside the terminal electrodes at both ends of the element (as will be explained in detail by the specific embodiments described later).

The second through holes formed in the ferrite substrate forming the lead-out layer may be a plurality of second through holes, such as 2, 3, 4, or 5, and the like, and the arrangement shape of the second through holes may be a straight line (as shown in fig. 4 to 9, 12, and 13), a cross (as shown in fig. 10 and 11), a T-shape, or an L-shape, but the present invention is not limited thereto, wherein the straight line arrangement includes a parallel arrangement parallel to the edges of the element (such as the embodiment shown in fig. 12 and 13), or an oblique arrangement angled to the edges of the element (the embodiment shown in fig. 4 to 9), and when the second conductive structure is printed on the one of the surfaces of the lead-out layer, the printed pattern preferably corresponds to the arrangement shape of the plurality of second through holes, such as shown in fig. 6 and 7, and when the 3 second through holes are arranged in a straight line, the second conductive structures are printed in a straight line so as to fill the 3 second through holes and connect the first through holes, such as the second through holes 10, and the second through holes are arranged in a cross, such as the second through holes 10, and 5, and the second through holes are printed in a cross shape.

The technical solution of the present invention will be described in detail by the following specific examples.

Example 1

Referring to fig. 4 and 5, e is an internal electrode of an element, B is a magnet of the element, two ends of a terminal electrode a (reference d1) and a terminal electrode B (reference d2) of the element are respectively provided with an internal electrode lead-out structure (reference d lead-out structures a and B), via layer structures of the internal electrode lead-out structures at the two ends are the same, lead-out layer structures are the same, and only the final lead-out effect is different due to the lamination process. Specifically, the 3 second through holes of the extraction layer a of the internal electrode extraction structure a are a1, a2 and a3, the 3 second through holes of the extraction layer B of the internal electrode extraction structure B are a4, a5 and a6, and the arrangement is in an inclined straight line arrangement, so that the second conductive structures c2 and c1 printed on the extraction layer a and the extraction layer B are both in a straight line pattern, c2 fills not only the 3 second through holes a1, a2 and a3 but also electrically connects the 3 second through holes together, and similarly, c1 also fills and electrically connects a4, a5 and a6 together. The second conductive structure exhibits different patterns on both sides of the lead-out layer, and exhibits a straight-line pattern on one of the sides of the lead-out layer as shown in fig. 7, and exhibits the shape of 3 second through holes (3 dots) on the other side of the lead-out layer as shown in fig. 6. In the lamination, assuming that the layers are laminated in the order from bottom to top in the figure, the process sequence should be the internal electrode lead-out structure a, the internal electrode layer(s), and the internal electrode lead-out structure B. In the case of the lead-out layer a of the internal electrode lead-out structure a and in the case of the lead-out layer B of the internal electrode lead-out structure B, the orientation of the lead-out layers should be kept uniform, that is: for example, as shown in fig. 4 and 5, one of the surfaces (i.e., the surface of the second conductive structure that presents a straight-line pattern) of the lead-out layer a (the lower lead-out layer) faces upward, and one of the surfaces of the lead-out layer B (the upper lead-out layer) faces upward, so that different lead-out effects are presented inside the two terminal electrodes: as shown in fig. 8, the lead-out effect (effect seen through the terminal electrode) of one end (i.e., the lower end in fig. 4/5) of the terminal electrode a (d2) appears as a pattern of 3 dots (i.e., the shape of 3 second through holes); fig. 9 shows the lead-out effect of one end (i.e., the upper end in fig. 4/5) of the terminal electrode B (d1), which appears as a straight-line pattern c connecting 3 second through holes. Even so, at these both ends of two terminal electrodes, the area of being connected of inner electrode extraction structure and terminal electrode compares the increase that all becomes several times in prior art, has guaranteed the connection reliability that the inner electrode was drawn forth.

The via layer may have different forms, for example, in fig. 4, the position of the via layer where the first via is opened is just opposite to the position of the corresponding coil end of the internal electrode, in this case, the printed first conductive structure is the via filling structure t2/t1 of the first via, t2 may electrically connect one end portion (lower end in the figure) of the internal electrode with the second conductive structure c2, and t1 may electrically connect the other end portion (upper end in the figure) of the internal electrode with the second conductive structure c 1. For example, in fig. 5, the position of the through hole for opening the first through hole is not opposite to the corresponding end position of the inner electrode coil, and in this case, the printed first conductive structure t2 '/t 1' includes not only the portion for filling the first through hole, but also the portion extending to the position opposite to the end position of the inner electrode coil, so as to ensure that the first conductive structure can be contacted with the end of the inner electrode coil at this time.

Example 2

As shown in fig. 10 and fig. 11, two-sided structures of different lead-out layers are exemplarily shown, which are different from embodiment 1 in that the lead-out layer is provided with 5 second through holes 1 to 5, and the arrangement is cross-shaped, and the corresponding second conductive structure printing pattern is a cross-shaped pattern. A crisscross pattern is formed on the one surface of the lead-out layer as shown in fig. 10, and the other surface of the lead-out layer is formed in the shape of 5 second through holes as shown in fig. 11. And the large area of the leading-out connection of the inner electrode leading-out structure and the end electrode is also ensured.

Example 3

As shown in fig. 12 and 13, the double-sided structure of the extraction layer is slightly different from that of embodiment 1, and the arrangement of the second through holes on the extraction layer is the aforementioned parallel arrangement, which is different from that of embodiment 1. In short, the number and arrangement of the second through holes on the lead-out layer and the printing shape of the second conductive structure for connecting the internal electrode lead-out connection point (the first conductive structure) to the terminal electrode are not limited.

The utility model discloses a manufacturing method of aforementioned inner electrode extraction structure, including following step:

s1, manufacturing a plurality of ferrite substrates for later use by adopting a tape casting process;

s2, providing the ferrite substrate with the first through hole, and printing the first conductive structure on one surface of the ferrite substrate by using conductive paste to form the through hole layer for lamination;

s3, forming the second through hole on another prepared ferrite substrate, and printing the second conductive structure on one surface of the ferrite substrate according to a preset pattern by adopting conductive paste to form the lead-out layer for lamination;

s4, laminating and performing hydrostatic pressure according to the sequence of the lead-out layer → the through hole layer → the inner electrode layer → the through hole layer → the lead-out layer, realizing high-pressure lamination, forming a bar block, cutting the bar block into monomers, sintering the monomers, and finally manufacturing the end electrode.

The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the technical field of the utility model belongs to the prerequisite of not deviating from the utility model discloses, can also make a plurality of equal substitution or obvious variants, performance or usage are the same moreover, all should regard as belonging to the utility model's scope of protection.

Claims (4)

1. An inner electrode lead-out structure of a laminated sheet type high-frequency component, characterized in that: the lead-in structure comprises a through hole layer and a lead-out layer, wherein the main body of the lead-in layer is a ferrite substrate, the through hole layer is positioned between an inner electrode layer and the lead-out layer, and the lead-out layer is positioned between the through hole layer and a terminal electrode;

the through hole layer is provided with a first through hole, one surface of the through hole layer, which is in contact with the inner electrode layer, is printed with a first conductive structure, and the first conductive structure fills the first through hole and is connected with the end part of the inner electrode coil;

the lead-out layer is provided with a plurality of second through holes, one surface of the lead-out layer is printed with a second conductive structure according to a preset pattern, and the second conductive structure is filled and connected with all the second through holes so that the second conductive structure can form the preset pattern on one surface of the lead-out layer and form a pattern which is consistent with the second through holes on the other surface of the lead-out layer;

one surface of the second conductive structure is in contact with the first conductive structure, and the other surface of the second conductive structure is in contact with the terminal electrode, so that the end part of the inner electrode coil is led out to the terminal electrode through the first conductive structure and the second conductive structure in sequence.

2. The internal electrode lead-out structure of a laminated sheet type high-frequency component according to claim 1, wherein: the shape of the predetermined pattern is in accordance with the arrangement shape of the plurality of second through holes.

3. The structure for drawing an internal electrode of a multilayer chip high-frequency device as claimed in claim 2, wherein the arrangement shape of said plurality of second through holes comprises a straight line shape, a cross shape, a T shape or an L shape, wherein the straight line shape comprises a parallel arrangement parallel to the edges of the device or an oblique arrangement having an angle with the edges of the device.

4. The internal electrode lead-out structure of a laminated sheet type high-frequency component according to claim 1, wherein: the internal electrode lead-out structure at one end of one end electrode A of the element is marked as an internal electrode lead-out structure A, and the corresponding through hole layer and lead-out layer are respectively marked as a through hole layer A and a lead-out layer A; the internal electrode lead-out structure at one end of the other end electrode B of the element is marked as an internal electrode lead-out structure B, and the corresponding through hole layer and lead-out layer are respectively marked as a through hole layer B and a lead-out layer B, then:

one surface of the lead-out layer A is contacted with the through hole layer A, and the other surface of the lead-out layer A is contacted with the terminal electrode A; one of the faces of the lead-out layer B is in contact with the terminal electrode B, and the other face is in contact with the via layer B.

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