CN211179521U - Small-size resonant infrared mixed gas detector - Google Patents
Small-size resonant infrared mixed gas detector Download PDFInfo
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- CN211179521U CN211179521U CN201921754450.4U CN201921754450U CN211179521U CN 211179521 U CN211179521 U CN 211179521U CN 201921754450 U CN201921754450 U CN 201921754450U CN 211179521 U CN211179521 U CN 211179521U
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Abstract
The utility model discloses a small-size resonant mode infrared mixed gas detector, this detector comprises infrared light source, collimating lens module, optics microcavity, discrete dispersion detector module. The utility model overcomes the problem that a plurality of gas sensing channels are required to be established for measuring various gases by the traditional non-dispersive infrared gas detection technology, reduces the manufacturing cost of the sensor, improves the integration level of the sensor, and realizes the miniaturization of the sensor; the change relation between the narrow-band infrared light intensity and the resonant frequency of the film bulk acoustic resonator is established by absorbing the weak temperature change of the sensitive structure of the film bulk acoustic resonator caused by infrared light, so that the advantages of quick response, high detection sensitivity and high detection resolution ratio of gas detection are realized; the narrow band-pass filter array window sheet and the film bulk acoustic resonator array substrate are manufactured by an MEMS micro-processing method, and have the advantages of integrated manufacturing, batch production, good consistency, low cost and the like.
Description
Technical Field
The utility model belongs to the technical field of gaseous detection, concretely relates to small-size resonant mode infrared mixed gas detector.
Background
With the continuous development of society and science and technology, qualitative and quantitative gas sensing technology has important application value in various fields such as industry, daily life, medical treatment, residential environment monitoring and the like. Currently, the function of many gas or liquid sensors is limited to being able to detect one type of gas, and detecting mixed gases requires multiple targeted gas sensors to be configured in one system, resulting in increased system volume and increased cost. In addition, some gas sensing technologies also have the problem of low reliability after long-time operation. For example, a metal oxide gas sensor utilizes a chemical reaction between a sensing material and a gas to cause a change in the resistivity of the sensing material. After a long period of use, the sensitivity of the sensor is reduced due to passivation of the sensing material by chemical reactions. Therefore, timely replacement of the sensing element or recalibration of the sensor is required, thereby resulting in increased sensor use and maintenance costs. For the above reasons, measuring gases using optical sensing technology has attracted increasing attention from engineers. For example, fourier transform infrared spectrometers use the special fingerprint absorption effects of gases or liquids in the infrared band to detect unknown gas mixtures. However, fourier transform infrared spectrometers are typically bulky laboratory bench-top instruments that are not suitable for outdoor or home use due to high cost and lack of portability. Therefore, there is significant commercial interest in developing a small probe capable of detecting a gas mixture.
Currently, many optical micro-devices have been used to manufacture small gas detectors. Such as a miniature infrared light source, a miniature thermopile and pyroelectric detector, a miniature fabry-perot infrared filter, a miniature infrared michelson interferometer, a photonic crystal infrared filter, and the like. However, small infrared gas detectors made based on the above-described micro-optics still suffer from low detection sensitivity and resolution. Therefore, how to realize a small infrared mixed gas detector capable of detecting mixed gas and having high sensitivity and high resolution is an urgent task facing the current environmental protection and industrial production safety.
SUMMERY OF THE UTILITY MODEL
The utility model aims to have the too big and with high costs problem of volume to current mist check out test set, perhaps detectivity and resolution ratio problem on the low side are difficult to satisfy current environmental protection and industrial production safety's demand, propose to utilize narrow band pass filter array window piece and film bulk acoustic resonator array substrate to make a small-size resonant mode infrared mixed gas detector that has high sensitivity and high resolution ratio.
The utility model discloses a following technical scheme realizes:
the detector comprises an infrared light source, a collimating lens module, an optical microcavity and a discrete dispersion detector module, wherein the infrared light source is arranged on the collimating lens module, the optical microcavity is a microcavity structure formed by an irregular polygonal cavity, a rectangular light inlet and a rectangular light outlet are formed in the microcavity structure, the collimating lens module is arranged on the rectangular light inlet, and the discrete dispersion detector module is arranged on the rectangular light outlet. The infrared light emitted by the infrared light source in the forward hemispherical space is wide-spectrum infrared light covering middle and far infrared rays, the wide-spectrum infrared light is converted into wide-spectrum parallel infrared beams after passing through the collimating lens module, and the beams are reflected for multiple times in the optical microcavity and fully act with mixed gas in the optical microcavity and then are projected onto the discrete dispersion detector module.
The infrared light source is a wide-spectrum light source capable of emitting middle and far infrared light, the spectrum wavelength range of the wide-spectrum light source is 0.5-15 micrometers, and the infrared light source is an infrared light emitting diode, an infrared filament heat source and an infrared micro-electromechanical light source. An infrared filament heat source is preferably selected for the middle infrared working waveband; the infrared micro-electro-mechanical light source is preferably selected for the far infrared working waveband; the infrared light source may be driven by electrical modulation or mechanical chopper modulation of light waves, preferably electrical modulation.
The collimating lens module can change divergent light beams emitted by an infrared light source into collimated (parallel) light beams and consists of a trapezoidal light guide groove and a collimating convex lens, wherein the middle of the upper bottom surface of the trapezoidal light guide groove is provided with an opening for mounting the infrared light source, the lower bottom surface of the trapezoidal light guide groove is provided with the collimating convex lens, and the inner surface of the trapezoidal light guide groove is plated with an infrared reflection gold film; the rectangular light inlet is connected with the lower bottom surface of the trapezoidal light guide groove.
The structure can realize multiple reflection of incident infrared beams in the optical microcavity to increase the infrared absorption path length of the gas to be detected, effectively improve the detection sensitivity and reduce the size of an instrument, and a rectangular light outlet of the optical microcavity is connected with a discrete dispersion detector module.
The discrete dispersion detector module can convert infrared wide-spectrum light into infrared light waves with a plurality of discrete wavelengths and convert the infrared light waves into electric signals through the photoelectric detector, the discrete dispersion detector module consists of a narrow-band-pass filter array window sheet, a film bulk acoustic resonator array substrate, a signal processing and reading module circuit board, a packaging component and a temperature sensor, and the packaging component comprises a metal packaging pipe cap and a ceramic packaging base; the narrow band-pass filter array window piece is arranged on a window of a metal packaging pipe cap, the metal packaging pipe cap is fixed on a ceramic packaging base, a film bulk acoustic resonator array substrate and a temperature sensor are adhered on the ceramic packaging base, and electrodes on the film bulk acoustic resonator array substrate and the temperature sensor are connected with through hole electrodes of the ceramic packaging base through bonding gold wires; the film bulk acoustic resonator array substrate is positioned right below the narrow band-pass filter array window sheet and covered by a metal packaging pipe cap; the ceramic package base is attached to the signal processing and readout module circuit board, and the through hole electrodes are electrically connected with each other and the through hole electrodes are electrically connected with the signal processing chip through solder balls. The signal processing chip is a CMOS digital integrated chip, and the model of the signal processing chip can be CD4017, CD4040 or CD 4059.
The narrow band-pass filter array window sheet is an array formed by a plurality of Fabry-Perot (F-P) type narrow band-pass optical filters with center wavelengths changing linearly in a linear arrangement mode. The film bulk acoustic resonator array substrate is positioned under the narrow band-pass optical filter array, and each film bulk acoustic resonator unit corresponds to the narrow band-pass optical filter one by one in position and absorbs infrared light which is correspondingly transmitted. After the film bulk acoustic resonator unit absorbs infrared light, the temperature of a film of the film bulk acoustic resonator unit rises and causes the change of resonant frequency, and the amplitude of the frequency change is in a linear relation with the change of the infrared light intensity. The signal processing and reading module substrate can amplify the frequency signal and convert the frequency signal into a digital signal, and the signal is converted into a displayable gas type and concentration signal through a signal processing chip.
The narrow band-pass filter array window sheet is a linear array formed by a plurality of F-P type narrow band-pass optical filters prepared on a silicon substrate by utilizing a microelectronic thin film growth process. The F-P type narrow band-pass optical filter consists of a thin film cavity layer and Bragg reflectors on two sides of the thin film cavity layer. The thin film cavity layer material can be selected from a high refractive index material or a low refractive index material. The thickness of the film cavity layer can be in incremental step change or continuous linear change, and the thickness change range is 500-5000 nanometers. The Bragg reflector is of a multilayer thin film structure consisting of high-refractive-index layers and low-refractive-index layers alternately. In order to increase the transmittance of infrared light and inhibit the generation of a high-order common mode in a short wave direction, an anti-reflection inhibiting film which has infrared anti-reflection and inhibits the generation of the short-wave common mode is prepared on the back surface of a silicon substrate. The anti-reflection inhibiting film is a multilayer film structure consisting of high-refraction layers and low-refraction layers alternately. The high-refractive-index layer can be made of infrared transparent high-refractive-index materials, preferably silicon (Si) and germanium (Ge); the low refractive index layer can be made of infrared transparent low refractive index material, preferably silicon dioxide (SiO)2) And silicon monoxide (SiO)
The narrow band-pass filter array window sheet is an array formed by a plurality of Fabry-Perot (F-P) type narrow band-pass optical filters with center wavelengths changing linearly in a linear arrangement mode; the thin film bulk acoustic resonator array substrate is positioned right below the narrow band-pass optical filter array, and each thin film bulk acoustic resonator unit corresponds to the narrow band-pass optical filter one by one in position and absorbs infrared light which is correspondingly transmitted;
the narrow band-pass filter array window sheet is prepared by the following method:
1) using a double-sided polished silicon wafer as a substrate;
2) preparing an anti-reflection inhibiting film on a silicon substrate by using a thermal evaporation or magnetron sputtering technology, and specifically, depositing a multilayer film structure with alternately arranged low-refractive-index layers and high-refractive-index layers on the silicon substrate in sequence;
3) preparing a Bragg reflector on the other side of the silicon substrate by using a thermal evaporation or magnetron sputtering technology, specifically, depositing a multilayer film structure with alternately arranged low refractive index layers and high refractive index layers on the silicon substrate in sequence, wherein the layers of the low refractive index layers and the high refractive index layers are the same;
4) preparing a film cavity layer on a Bragg reflector by using a thermal evaporation or magnetron sputtering technology, specifically, exposing photoresist on the film cavity layer by using a gray-scale gradient mask technology, providing different ultraviolet light transmittances or linearly-changed ultraviolet light transmittances at different positions in a mask plane to enable the corresponding positions of the photoresist to have different exposure intensities or linearly-changed exposure intensities, and developing to form a step shape or a wedge shape in the photoresist thickness along the length direction;
5) etching the photoresist by using a dry etching technology, and transferring the stepped or wedged shape of the photoresist to the thin film cavity layer to form a stepped or wedged thin film cavity layer;
6) preparing a Bragg reflector on the film cavity layer by using a thermal evaporation or magnetron sputtering technology, and specifically, sequentially depositing a high-refractive-index layer and a low-refractive-index alternately-arranged multilayer film structure on the film cavity layer;
7) and integrally cutting the linearly arranged narrow band-pass filter array window sheets from the silicon wafer by grinding wheel cutting or laser splitting.
The film bulk acoustic resonator array substrate is a linear array formed by a plurality of film bulk acoustic resonators which are prepared on a silicon substrate by utilizing a microelectronic mechanical processing technology. The film bulk acoustic resonator array substrate has the performance characteristics that the change of the detected infrared light wave intensity can be converted into the change of the frequency of the film bulk acoustic resonator, and the detectable infrared wavelength range is 1-20 mm middle and far infrared light waves. The film bulk acoustic resonator array substrate is structurally characterized in that a plurality of rectangular thin plates are suspended on a cavity of a silicon frame through cantilever beams, the long edges of the rectangular thin plates are perpendicular to the array direction, and the thickness of each rectangular thin plate is 1-5 mm. The rectangular thin plate is sequentially composed of a medium thin film layer, a lower metal electrode layer, a piezoelectric thin film layer, an upper metal electrode layer and an infrared absorption thin film layer from bottom to top. The piezoelectric thin film layer can be made of aluminum nitride (AlN), zinc oxide (ZnO) or ferroelectric material (such as lithium niobate, lithium tantalate, PZT piezoelectric ceramics, etc.), and the dielectric thin film layer can be made of SiO2Or silicon nitride (Si)3N4). The infrared absorption film layer covers the surface of the upper metal electrode layer, and the infrared absorption material comprises Si3N4、SiO2Vanadium oxide (V)2O5) Black silicon, platinum black, metal electromagnetic microstructure arrays, and the like; the metal electrode is connected with an electrode bonding pad on the silicon frame through a cantilever beam.
The film bulk acoustic resonator array substrate is a linear array formed by a plurality of film bulk acoustic resonators which are prepared on a silicon substrate by utilizing a microelectronic mechanical processing technology;
the film bulk acoustic resonator array substrate is prepared by the following method:
1) using a double-sided polished silicon wafer as a substrate;
2) growing a dielectric film layer with the thickness of 0.5 micron on the surface of the silicon wafer by utilizing a chemical vapor deposition or thermal oxidation technology;
3) sequentially depositing a lower metal electrode layer, a piezoelectric film layer, an upper metal electrode layer and an infrared absorption film layer on the medium film layer by a magnetic control technology;
4) preparing an electrode through hole on the piezoelectric thin film layer by an etching technology, and exposing the lower metal electrode layer;
5) preparing an electrode pad mask on the surface of the device by a photoetching technology, depositing thick film metal by a thermal evaporation technology, and then removing the mask to form an electrode pad;
6) preparing a mask of a rectangular thin plate suspension structure on the surface of the device through a photoetching technology;
7) removing the upper metal electrode layer, the piezoelectric film layer, the lower metal electrode layer and the dielectric film layer in the etching area of the suspension structure through chemical wet etching;
8) preparing an etching back cavity structure mask on the back of a silicon wafer by a photoetching technology;
9) and etching the silicon in the back cavity structure etching area by using a dry etching technology to form a silicon frame, and releasing the suspended thin film structure.
Compared with the prior art, the utility model, following beneficial effect has:
1) the utility model discloses a prepare narrow band-pass filter array window piece on the silicon chip and change the well far infrared light of continuous wide spectrum into a plurality of discrete narrowband infrared light that central wavelength changes along with the array position. Different narrow-band infrared light corresponds to different gas absorption peaks, multiple optical transmission and reflection channels in the optical microcavity are used for reacting with the mixed gas, and the mixed gas is sensed and detected through the film bulk acoustic resonator array substrate. The utility model overcomes the problem that a plurality of gas sensing channels are required to be established for measuring various gases by the traditional non-dispersive infrared gas detection technology, reduces the manufacturing cost of the sensor, improves the integration level of the sensor, and realizes the miniaturization of the sensor;
2) the utility model discloses a small-size resonant mode infrared mixed gas detector observable infrared absorption peak lies in the single gas or the mist that multiple gas is constituteed between 1~20 mm, and these gases mainly include carbon dioxide (CO)2) Carbon monoxide (CO), nitrogen oxides (NOx) ((CO))Such as N2O and NO2) And hydrocarbon gas (C) x H y ) Hydrocarbon gas (C) x H y O z ) Sulfur dioxide (SO)2) Ammonia (NH)3) Hydrogen sulfide (H)2S) and water vapor (H)2O), etc.;
3) the utility model discloses an use film bulk acoustic resonator to realize surveying the well far infrared light wave that the wavelength range is 1~20 mm. The change relation between the narrow-band infrared light intensity and the resonant frequency of the film bulk acoustic resonator is established by absorbing the weak temperature change of the sensitive structure of the film bulk acoustic resonator caused by infrared light, so that the advantages of quick response, high detection sensitivity and high detection resolution ratio of gas detection are realized;
4) the utility model discloses a narrow band pass filter array window piece and film bulk acoustic resonator array substrate pass through MEMS microfabrication method manufacturing, and the complete cutting lobe of array structure consequently has advantages such as integrated manufacturing, batch production, the uniformity is good and low cost.
Drawings
Fig. 1 is a flow chart of the manufacturing process of the narrow bandpass filter array window piece of the present invention;
fig. 2 is a schematic structural diagram of the narrow bandpass filter array window based on the stepped thin film cavity layer of the present invention;
fig. 3 is a schematic structural diagram of a narrow bandpass filter array window sheet based on a wedged thin film cavity layer according to the present invention;
FIG. 4 is a flow chart of the manufacturing process of the film bulk acoustic resonator array substrate of the present invention;
fig. 5 is a schematic structural diagram of a film bulk acoustic resonator array substrate according to the present invention;
fig. 6 is a schematic structural diagram of a discrete dispersion detector module according to the present invention;
fig. 7 is a schematic view of an optical microcavity structure of the present invention;
fig. 8 is a schematic structural diagram of a collimating lens module according to the present invention;
fig. 9 is a schematic view of the structure and the operation principle of the small resonant infrared mixed gas detector of the present invention;
in the figure, 1-an infrared light source, 2-a collimating lens module, 2-1-a trapezoidal light guide groove and 2-2-a collimating convex lens; 3-optical microcavity, 3-1-rectangular light inlet, 3-2-cavity, 3-3-cover plate, 3-4-vent hole, 3-5-dust-blocking filter screen and 3-6-rectangular light outlet; 4-discrete dispersion detector module, 4-1-narrow band-pass filter array window sheet, 4-2-thin film bulk acoustic resonator array substrate, 4-3-signal processing and reading module circuit board, 4-4-metal packaging pipe cap, 4-5-ceramic packaging base, 4-6-temperature sensor, 4-7-gold bonding wire, 4-8-through hole electrode, 4-9-tin ball and 4-10-signal processing chip; 5-infrared ray, 5-1-silicon substrate, 5-2-thin film cavity layer, 5-3-Bragg reflector, 5-4-high refractive index layer, 5-5-low refractive index layer and 5-6-antireflection inhibiting film; 6-mixed gas, 6-1-rectangular thin plate, 6-2-cantilever beam, 6-3-silicon frame, 6-4-dielectric film layer, 6-5-lower metal electrode layer, 6-6-piezoelectric film layer, 6-7-upper metal electrode layer, 6-8-infrared absorption film layer, 6-9-electrode pad and 7-infrared reflection gold film.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the appended drawings.
The following embodiments are only for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
The utility model relates to a small-size resonant mode infrared mixed gas detector, this detector is by infrared light source 1, collimating lens module 2, optics microcavity 3, discrete dispersion detector module 4 is constituteed, infrared light source 1 sets up on collimating lens module 2, optics microcavity 3 is the microcavity structure of irregular polygon cavity body formation, this microcavity has been structural to have seted up the rectangle and has been gone into light mouth 3-1 and rectangle light-emitting window 3-6, collimating lens module 2 sets up on the rectangle goes into light mouth 3-1, discrete dispersion detector module 4 sets up on rectangle light-emitting window 3-6.
Wherein, the infrared light source 1 is a wide spectrum light source capable of emitting middle and far infrared light, the spectrum wavelength range is 0.5-15 microns, and the infrared light source 1 is an infrared light emitting diode, an infrared filament heat source and an infrared micro-electromechanical light source. The collimating lens module 2 consists of a trapezoidal light guide groove 2-1 and a collimating convex lens 2-2, the middle of the upper bottom surface of the trapezoidal light guide groove 2-1 is provided with a hole for mounting an infrared light source 1, the lower bottom surface of the trapezoidal light guide groove 2-1 is provided with the collimating convex lens, and the inner surface of the trapezoidal light guide groove 2-1 is plated with an infrared reflection gold film 7; the rectangular light inlet 3-1 is connected with the lower bottom surface of the trapezoidal light guide groove 2-1. The optical microcavity 3 has a cavity 3-2 covered with a cover plate 3-3, the cover plate 3-3 has a plurality of vent holes 3-4, the vent holes 3-4 are paved with a dust-blocking filter screen 3-5, the internal reflection surface of the optical microcavity 3 is a multiple irregular angle plane, which is plated with an infrared reflection gold film 7, and the rectangular light outlet 3-6 of the optical microcavity 3 is connected with the discrete dispersion detector module 4.
The preparation method of the narrow band-pass filter array window sheet comprises the following specific process steps as shown in figure 1:
1) using a silicon wafer with two polished sides as a silicon substrate 5-1;
2) preparing an anti-reflection inhibiting film 5-6 on a silicon substrate by using a thermal evaporation or magnetron sputtering technology, wherein the specific parameters are as follows: depositing a high refractive index layer 5-5SiO with a thickness of 556.5 nm, a high refractive index layer 5-4Ge with a thickness of 134.5 nm, SiO with a thickness of 356.1nm, Ge with a thickness of 74.3 nm, SiO with a thickness of 265.3nm, Ge with a thickness of 168.1 nm, SiO with a thickness of 132.8 nm, Ge with a thickness of 134.5 nm, and SiO with a thickness of 556.6 nm on a silicon substrate in this order;
3) preparing a Bragg reflector 5-3 on the other side of the silicon substrate by using a thermal evaporation or magnetron sputtering technology, wherein the specific parameters are as follows: depositing SiO with the thickness of 565.9 nm on a silicon substrate in sequence2Low refractive index layer 5-5, 240.1 nm Si high refractive index layer 5-4, 565.9 nm SiO2A layer, and a 240.1 nm layer of Si;
4) depositing SiO 2 mm thick on Bragg reflector 5-3 by thermal evaporation or magnetron sputtering technique2And (3) a layer. Then, in SiO2Coating photoresist on the layer, and then using gray-scale gradient mask technologyArt pair SiO2The photoresist on the layer is exposed. Finally, step-shaped or wedge-shaped photoresist is formed through development;
5) etching the photoresist by dry etching technique to transfer the step or wedge shape of the photoresist to SiO2On the layer, a step-shaped or wedge-shaped SiO layer is formed25-2 of a film cavity layer, wherein the thickness range of the film cavity layer is 500 nm-3000 nm;
6) by thermal evaporation or magnetron sputtering on SiO2Preparing a Bragg reflector 5-3 on the thin film cavity layer, wherein the specific parameters are as follows: in turn on SiO2Depositing Si high refractive index layer 5-4 with thickness of 240.1 nm and SiO with thickness of 565.9 nm2Low refractive index layer 5-5, 240.1 nm of Si, 565.9 nm of SiO2And 240.1 nm of Si;
7) and integrally cutting the linearly arranged narrow band-pass filter array window sheets from the silicon wafer by grinding wheel cutting or laser splitting.
FIG. 2 shows a schematic diagram of a prepared narrow bandpass filter array window plate structure based on a stepped thin film cavity layer;
fig. 3 shows a schematic diagram of a prepared wedge-shaped thin film cavity layer-based narrow bandpass filter array window sheet structure.
The specific process steps for preparing the film bulk acoustic resonator array substrate are as shown in the process flow shown in figure 4:
1) using a double-sided polished silicon wafer as a substrate;
2) growing SiO 0.5 micron thick on the surface of silicon wafer by thermal oxidation technology26-4 of a dielectric film layer;
3) by magnetic control technique on SiO2A lower metal electrode layer (6-6) consisting of a Ti (50 nm)/Cr (50 nm)/Al (100 nm) composite structure, an AlN piezoelectric film layer 6-6 of 2 mm, an upper metal electrode layer 6-7 consisting of a Ti (50 nm)/Cr (50 nm)/Al (100 nm) composite structure and Si of 200 nm are sequentially deposited on the layers3N46-8 parts of an infrared absorption film layer;
4) preparing an electrode through hole on the AlN piezoelectric film layer by an etching technology, and exposing the lower metal electrode layer;
5) preparing 6-9 masks of the electrode pads on the surface of the device by a photoetching technology, depositing an Al film with the thickness of 3 mm by a thermal evaporation technology, and stripping the masks to form the electrode pads;
6) preparing masks of a rectangular thin plate 6-1 with the width of 100 mm and the length of 200 mm and a cantilever beam 6-2 with the width of 8 mm and the length of 20mm on the surface of the device through a photoetching technology;
7) removing the upper metal electrode layer, the AlN piezoelectric film layer, the lower metal electrode layer and the SiO in the etched area through chemical wet etching2A dielectric thin film layer;
8) preparing an etching back cavity structure mask on the back of a silicon wafer by a photoetching technology;
9) at 0.5 micron thickness of SiO2The dielectric thin film layer is used as an etching stop layer, silicon in the etching area of the back cavity structure is etched by using a dry etching technology to form a silicon frame 6-3, and finally the suspended thin film structure is released;
10) the film bulk acoustic resonator array substrate arranged in a line is cut off from a silicon wafer as a whole by laser dicing.
Fig. 5 shows a schematic structural view of the prepared thin film bulk acoustic resonator array substrate, showing a cross-sectional view a-a and a cross-sectional view B-B, respectively.
Preparation of discrete dispersion detector module
As shown in fig. 6, a narrow bandpass filter array window piece 4-1 is glued on the metal encapsulation cap 4-4 window. Then, the thin film bulk acoustic resonator array substrate 4-2 and the semiconductor thermosensitive temperature sensor 4-6 are glued on the ceramic package base 4-5. The electrodes on the array substrate of the film bulk acoustic resonator and the temperature sensor are connected with the through hole electrodes 4-8 of the ceramic packaging base through bonding gold wires 4-7. And then, gluing a metal packaging pipe cap on the ceramic packaging base 4-5, so that the thin film bulk acoustic resonator array substrate is positioned right below the narrow band-pass filter array window sheet and covered by the metal packaging pipe cap. Finally, the sealed device is mounted on a signal processing and readout module circuit board. The signal processing and reading module circuit board is provided with a signal processing chip 4-10, and the through hole electrode and the signal processing chip are electrically connected through the solder ball 4-9.
Preparation of optical microcavities
As shown in fig. 7, a thin aluminum plate is used and a mechanical stamping technology is used to prepare an irregular polygonal cavity to form a cavity 3-2 of the optical microcavity, wherein the side length ratio of each cavity is as follows:l 1 :l 2 :l 3 :l 4 :l 5 :l 6 :l 7 = 1.42: 1.12: 1.00: 1.23: 1.89: 1.31: 1.00, the angle between adjacent sides of the cavity is: Ða 1 = 154°，Ða 2 = 128°，Ða 3 =93°，Ða 4 = 168°，Ða 5 = 98°，Ða 6 = 119°，Ða 7 = 140 °; electroplating an infrared reflection gold film 7 on the inner surface of the optical microcavity; on a side length ofl 1 A rectangular light inlet 3-1 is cut on the surface of the cavity, and the size of the light inlet is the same as that of the lower bottom surface of the trapezoidal light guide groove 2-1 of the collimating lens module. At the same time, on the side length ofl 3 Rectangular light outlets 3-6 are cut on the surface of the cavity, and the size of the light outlets is the same as that of metal packaging pipe caps 4-4 of the discrete dispersion detector module 4. Processing a metal aluminum plate with the shape consistent with that of the optical microcavity to serve as a cover plate 3-3 on a cavity 3-2 of the optical microcavity, wherein a plurality of vent holes 3-4 are formed in the cover plate, and ash blocking filter screens 3-5 are laid on the vent holes;
preparation of collimating lens Module
As shown in fig. 8, a thin aluminum plate is used and a mechanical stamping technology is used to prepare a trapezoidal light guide groove 2-1, and a rectangular window is formed at the top of the trapezoidal light guide groove to facilitate installation of an infrared light source; electroplating an infrared reflection gold film 7 in the trapezoidal light guide groove to increase infrared reflection; and a collimating convex lens 2-2 is arranged at the bottom of the trapezoidal light guide groove.
Assembly of small-sized resonant infrared mixed gas detector
As shown in fig. 9, an infrared light source 1 is mounted on a collimating lens module 2, and then mounted on a rectangular light inlet 3-1 of an optical microcavity 3. The discrete dispersion detector module 4 is then mounted on the rectangular light exit port 3-6 of the optical microcavity 3.
Claims (7)
1. A small-sized resonant infrared mixed gas detector is characterized by comprising an infrared light source (1), a collimating lens module (2), an optical microcavity (3) and a discrete dispersion detector module (4), wherein the infrared light source (1) is arranged on the collimating lens module (2), the optical microcavity (3) is a microcavity structure formed by an irregular polygonal cavity, a rectangular light inlet (3-1) and a rectangular light outlet (3-6) are formed in the microcavity structure, the collimating lens module (2) is arranged on the rectangular light inlet (3-1), and the discrete dispersion detector module (4) is arranged on the rectangular light outlet (3-6).
2. A small-sized resonant type infrared mixed gas detector as set forth in claim 1, wherein said infrared light source (1) is a wide spectrum light source capable of emitting mid-and far-infrared light having a spectral wavelength range of 0.5 μm to 15 μm, and said infrared light source (1) is an infrared light emitting diode, an infrared filament heat source, an infrared micro-electromechanical light source.
3. The small-sized resonant infrared mixed gas detector according to claim 1, wherein the collimating lens module (2) is composed of a trapezoidal light guide groove (2-1) and a collimating convex lens (2-2), the trapezoidal light guide groove (2-1) is provided with an opening in the middle of the upper bottom surface thereof for mounting the infrared light source (1), the trapezoidal light guide groove (2-1) is provided with the collimating convex lens (2-2) on the lower bottom surface thereof, and the trapezoidal light guide groove (2-1) is plated with an infrared reflecting gold film (7) on the inner surface thereof; the rectangular light inlet (3-1) is connected with the lower bottom surface of the trapezoidal light guide groove (2-1).
4. A small-sized resonant infrared mixed gas detector as claimed in claim 1, wherein the cavity (3-2) of the optical microcavity (3) is covered with a cover plate (3-3), the cover plate (3-3) is provided with a plurality of vent holes (3-4), the vent holes (3-4) are paved with a dust-blocking filter screen (3-5), the internal reflection surface of the optical microcavity (3) is a multiple irregular angle plane, an infrared reflection gold film (7) is plated thereon, and the rectangular light outlet (3-6) of the optical microcavity (3) is connected with the discrete dispersion detector module (4).
5. A compact resonant infrared hybrid gas detector according to claim 1, characterized in that the discrete dispersion detector module (4) is composed of a narrow band-pass filter array window plate (4-1), a thin film bulk acoustic resonator array substrate (4-2), a signal processing and readout module circuit board (4-3), a package component and a temperature sensor (4-6), the package component comprises a metal package cap (4-4) and a ceramic package base (4-5); a narrow band-pass filter array window sheet (4-1) is arranged on a window of a metal packaging pipe cap (4-4), the metal packaging pipe cap (4-4) is fixed on a ceramic packaging base (4-5), a thin film bulk acoustic resonator array substrate (4-2) and a temperature sensor (4-6) are glued on the ceramic packaging base (4-5), and electrodes on the thin film bulk acoustic resonator array substrate (4-2) and the temperature sensor (4-6) are connected with a through hole electrode (4-8) of the ceramic packaging base (4-5) through a bonding gold wire (4-7); the film bulk acoustic resonator array substrate (4-2) is positioned right below the narrow band-pass filter array window sheet (4-1) and covered by a metal packaging pipe cap (4-4); the ceramic package base (4-5) is attached to the signal processing and readout module circuit board (4-3), and the electrical connection between the through hole electrodes (4-8) and the signal processing chip (4-10) are realized through solder balls (4-9).
6. A small-sized resonant infrared hybrid gas detector as set forth in claim 5, characterized in that said narrow band-pass filter array window plate (4-1) is an array of a plurality of Fabry-Perot (F-P) type narrow band-pass optical filters whose center wavelengths are linearly varied in a linear arrangement; the film bulk acoustic resonator array substrate (4-2) is positioned under the narrow band-pass filter array window sheet (4-1), and each film bulk acoustic resonator unit corresponds to the narrow band-pass optical filter in position one by one and absorbs infrared light which is correspondingly transmitted.
7. A small-sized resonant infrared hybrid gas detector according to claim 5, characterized in that the FBAR array substrate (4-2) is a linear array of FBARs fabricated on a silicon substrate (5-1) by micro-electro-mechanical processing.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596034A (en) * | 2019-10-18 | 2019-12-20 | 杭州能工科技有限公司 | Small-size resonant infrared mixed gas detector |
| CN111947791A (en) * | 2020-08-17 | 2020-11-17 | 湖北星奔光电科技有限公司 | Infrared radiation detection device and dark field backscattering optical reading method |
| WO2023151614A1 (en) * | 2022-02-11 | 2023-08-17 | 中国科学院上海技术物理研究所 | Short-wave infrared spectrum detector and preparation method therefor |
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2019
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110596034A (en) * | 2019-10-18 | 2019-12-20 | 杭州能工科技有限公司 | Small-size resonant infrared mixed gas detector |
| CN110596034B (en) * | 2019-10-18 | 2024-05-03 | 杭州能工科技有限公司 | Small-sized resonant infrared mixed gas detector |
| CN111947791A (en) * | 2020-08-17 | 2020-11-17 | 湖北星奔光电科技有限公司 | Infrared radiation detection device and dark field backscattering optical reading method |
| CN111947791B (en) * | 2020-08-17 | 2021-09-17 | 湖北星奔光电科技有限公司 | Infrared radiation detection device and dark field backscattering optical reading method |
| WO2023151614A1 (en) * | 2022-02-11 | 2023-08-17 | 中国科学院上海技术物理研究所 | Short-wave infrared spectrum detector and preparation method therefor |
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