CN211170549U - Wafer level packaging chip bonding film with anti-sticking coating - Google Patents
Wafer level packaging chip bonding film with anti-sticking coating Download PDFInfo
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- CN211170549U CN211170549U CN201921909124.6U CN201921909124U CN211170549U CN 211170549 U CN211170549 U CN 211170549U CN 201921909124 U CN201921909124 U CN 201921909124U CN 211170549 U CN211170549 U CN 211170549U
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Abstract
The utility model discloses a wafer level packaging chip joint film with antiseized glutinous coating, this wafer level packaging chip joint film are multilayer structure, include in proper order from type layer, packaging glue film, prevent that static combines the glue film, cuts glue film, resin glue film, and the packaging glue film is formed on the face of can peeling off from the type layer. The utility model discloses wafer level packaging chip joint film has integrateed encapsulation and cutting sticky tape function, uses it for semiconductor wafer's encapsulation and cutting process, has greatly simplified technology, can show improvement operating efficiency, cuts gluing phenomenon between the layer when the rolling still can be avoided to anti glutinous layer of being stained with.
Description
Technical Field
The utility model belongs to the field of semiconductor wafer's encapsulation, cutting process, especially, relate to a wafer level encapsulation chip joint film of antiseized glutinous coating of utensil.
Background
The semiconductor chip is obtained by dicing a semiconductor wafer, and the semiconductor wafer is packaged before dicing in order to protect the electronic components. Meanwhile, the dicing tape is required to stick the wafer, so as to prevent the wafer and the chip from shifting, falling off or flying apart during the dicing process. The conventional wafer packaging and dicing process comprises: packaging the circuit forming surface of the wafer, and then sticking the cutting tape to the back surface of the wafer; subsequently, the wafer is diced from the circuit forming face thereof into individual chips. The cutting process is complicated, and the problems of chip corner breakage and chip flying are easily caused.
Disclosure of Invention
The utility model aims at providing a wafer level packaging chip bonding film with an anti-sticking coating and the functions of packaging and cutting adhesive tape, which can greatly simplify the packaging and cutting procedures of semiconductor wafers and obviously improve the operating efficiency; the sticking phenomenon during rolling can be avoided.
The utility model provides a wafer level encapsulation chip joint film of antiseized glutinous coating of utensil is multilayer structure, includes in proper order from type layer, encapsulation glue film, prevents that static combines the glue film, cuts glue film, resin glue film, and the encapsulation glue film is formed on the face of can peeling off from type layer.
In the wafer level packaging chip bonding film with the anti-sticking coating, the release layer is the outermost layer of the utility model and is used for protecting the packaging adhesive layer; the packaging adhesive layer is used for packaging the wafer so as to completely protect the wafer; the cutting adhesive layer plays a role in cutting the adhesive tape, and the problems of chip corner breakage, chip flying and the like during cutting can be reduced; the anti-static bonding adhesive layer is used for bonding the packaging adhesive layer and the cutting adhesive layer; when the packaging film is rolled, the resin adhesive layer can avoid the adhesion between the cutting adhesive layers.
Further, the release layer is selected from the group consisting of polyethylene, polypropylene, polybutylene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate, ionomer resin, ethylene/(meth) acrylic acid copolymer, ethylene/(meth) acrylic acid ester copolymer, polystyrene, polycarbonate, cellulose acetate, cellulose triacetate, polyimide, and fluorine-containing resin. The thickness of the release layer is usually 5 to 300 micrometers, preferably 10 to 200 micrometers, and more preferably 20 to 150 micrometers.
Further, the encapsulating adhesive layer is made of a conventional polymer composite encapsulating adhesive, such as a thermosetting resin encapsulating adhesive. The thickness of the packaging adhesive layer is usually 5 to 40 micrometers, preferably 7 to 35 micrometers.
Furthermore, the anti-static bonding glue layer is UV or non-UV anti-static glue, and a general AS-PSA anti-static adhesive tape can be adopted.
Further, the cutting adhesive layer is a TPU adhesive layer, namely thermoplastic polyurethane elastomer rubber, and the ready-made cutting adhesive tape can be adopted. The thickness of the dicing tape is usually 10 to 200 μm, preferably 50 to 150 μm.
Further, the resin adhesive layer is preferably a PU resin adhesive layer (i.e., a polyurethane resin layer) or an acrylic resin adhesive layer (i.e., a polymethyl methacrylate layer); the thickness of the resin adhesive layer is 5-10 microns.
The utility model has the following characteristics and beneficial effect:
(1) the utility model discloses the joint film has integrateed encapsulation and cutting sticky tape function, uses it for the encapsulation and the cutting process of semiconductor wafer, has greatly simplified technology, can show improvement operating efficiency, cuts the glutinous phenomenon of gluing between the glue layer when the rolling still can be avoided to the resin glue film.
(2) The anti-static bonding adhesive layer can be used for bonding a packaging adhesive layer and a cutting adhesive layer, and due to the fact that the stripping force between the anti-static bonding adhesive layer and the TPU adhesive layer is high, the phenomena of chip corner breakage, chip flying and the like during cutting can be further avoided.
(3) The bonding film of the utility model has excellent antistatic resistance, extremely high light transmittance and low haze, and the low antistatic resistance can not influence the performance of the semiconductor chip after packaging; the extremely high light transmittance is beneficial to ultraviolet light curing of the anti-static bonding adhesive layer; low haze facilitates viewing of the semiconductor wafer during the packaging and dicing process.
Drawings
FIG. 1 is a diagram illustrating an embodiment of a wafer level package die attach film;
FIGS. 2-5 are schematic views illustrating the fabrication process of the wafer level package die attach film in the embodiment.
In the figure, 100a, 100 b-a release layer, 200-a packaging adhesive layer, 300-an antistatic bonding adhesive layer, 400-a cutting adhesive layer, and 500-a resin adhesive layer.
Detailed Description
In order to more clearly illustrate the technical solutions of the present invention and/or the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be obtained from these drawings without inventive effort.
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, the figure is only used to show the layered structure of the present invention, the wafer level package die bonding film of the present invention is a multi-layered structure, which comprises a release layer 100b, a package adhesive layer 200, an anti-static bonding adhesive layer 300, a cutting adhesive layer 400, and a resin adhesive layer 500 in sequence, wherein the package adhesive layer 200 is formed on the peelable surface of the release layer 100 b.
The releasing layer 100b is used to protect the encapsulant layer 200 and may be made of, for example, polyethylene, polypropylene, polybutylene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate, ionomer resin, ethylene/(meth) acrylic acid copolymer, ethylene/(meth) acrylic acid ester copolymer, polystyrene, polycarbonate, cellulose acetate, cellulose triacetate, polyimide, and fluorine-containing resin. The thickness of the releasing layer 100b is usually 5 to 300 microns, preferably 10 to 200 microns, and more preferably 20 to 150 microns, in this embodiment, the thickness of the releasing layer 100b is 38 microns.
The encapsulating adhesive layer 200 is a high molecular compound encapsulating adhesive, and is further selected from a thermosetting resin encapsulating adhesive selected from polyphenylene oxide resin, polyimide resin, polyamide resin, polyvinyl alcohol resin, polyvinyl phenol resin, polyacrylate resin, epoxy resin, polyurethane resin, fluorine-containing polymer resin, polysiloxane resin, polyester resin, polyacrylonitrile resin, polystyrene resin or polyethylene resin encapsulating adhesive, and the resin may further have a reactive functional group such as hydroxyl group, carboxyl group, alkenyl group, amino group, acid anhydride group, maleic anhydride group, wherein the resin having a reactive functional group includes polyphenylene oxide having an acrylic group, polyphenylene oxide having a vinyl group, polyphenylene oxide having a hydroxyl group, etc., the resin having a reactive functional group includes a styrene copolymer or a styrene-maleic anhydride copolymer having a reactive functional group, a butadiene copolymer having a reactive functional group, or a glycidyl acrylate copolymer including butadiene-styrene, epoxy-bisphenol a, epoxy modified epoxy resin, bisphenol a, bisphenol epoxy resin, bisphenol b-epoxy resin, bisphenol a, bisphenol a, bisphenol a resin, bisphenol.
In the present embodiment, the antistatic bonding adhesive layer 300 is a general AS-PSA antistatic adhesive tape, such AS ACHI LL ES Archimedes AS-PSA antistatic adhesive tape, but not limited thereto, and the AS-PSA antistatic adhesive tape includes a substrate layer and an antistatic adhesive layer, and after being laminated on the dicing adhesive layer 400, the substrate layer of the AS-PSA antistatic adhesive tape is peeled off, and only the antistatic adhesive layer is remained, i.e., the antistatic bonding adhesive layer is formed, and the thickness of the antistatic bonding adhesive layer 300 in the present embodiment is selected to be 5 μm.
Above-mentioned cutting glue film 400 can select for use the TPU glue film, thermoplastic polyurethane elastomer rubber layer promptly, and this material has good ductility, high penetrability, low haze, plays the effect of cutting the sticky tape. Specifically, the dicing tape layer 400 may use a general-purpose dicing tape such as SD3004 (hitachi chemical) or SPV-224P (hitachi electrical), but is not limited thereto. The cutting adhesive tape comprises a PET base film and a TPU adhesive layer, wherein the TPU adhesive layer of the cutting adhesive tape is laminated on the anti-static combined adhesive layer 300 during use, and the PET base film of the cutting adhesive tape is peeled off to obtain the cutting adhesive layer 400. The thickness of the dicing tape 400 is usually 10 to 200 micrometers, preferably 50 to 150 micrometers, and the thickness of the dicing tape 400 is selected to be 100 micrometers in this embodiment.
The resin adhesive layer 500 can prevent the cutting adhesive layers from being sticky during rolling, and is preferably a PU resin adhesive layer or an acrylic resin adhesive layer. In addition, the resin glue layer also has the advantage of excellent light transmission. In this embodiment, the thickness of the resin adhesive layer 500 is selected to be 5-10 μm.
A specific process for manufacturing the wafer level package die attach film of the present invention will be provided with reference to fig. 2-5, but the present invention is not limited thereto.
The specific process comprises the following steps:
(1) the dicing tape layer 400 is obtained by coating the dicing tape paste on the peelable surface of a release layer 100a, as shown in fig. 2. In this embodiment, the cutting rubber slurry is a TPU rubber slurry. The dicing tape 400 may also be formed by using a dicing tape, and when the dicing tape is used, the TPU adhesive layer of the dicing tape is attached to the peelable surface of the release layer 100a by lamination, and then the PET base film of the dicing tape is peeled off.
(2) The resin paste is coated on the dicing tape layer 400, and baked to form a resin tape layer 500 on the dicing tape layer 400, as shown in fig. 3.
(3) A release layer 100a is peeled off, and an antistatic bonding adhesive layer 300 is coated on the other side of the dicing adhesive layer 400, as shown in fig. 4. Alternatively, the antistatic adhesive layer of the AS-PSA antistatic adhesive tape may be attached to the dicing adhesive layer 400 by laminating the AS-PSA antistatic adhesive tape on the dicing adhesive layer 400, and then the base layer of the AS-PSA antistatic adhesive tape may be removed, thereby obtaining the antistatic bonding adhesive layer 300 on the dicing adhesive layer 400.
(4) The prepared encapsulant paste is coated on the peelable surface of the other release layer 100b, and baked to form the encapsulant layer 200 on the other release layer 100 b.
(5) As shown in fig. 5, the encapsulation adhesive layer 200 attached to the other release layer 100b is laid on the anti-static bonding adhesive layer 300, and the encapsulation adhesive layer 200 and the anti-static bonding adhesive layer 300 are laminated to obtain the encapsulation film sequentially composed of the release layer 100b, the encapsulation adhesive layer 200, the anti-static bonding adhesive layer 300, the dicing adhesive layer 400, and the resin adhesive layer 500, as shown in fig. 1.
As a preferable scheme, after the step (4) is completed, the packaging adhesive layer 200 may be pre-cut to form a cutting street on the packaging adhesive layer 200, which is consistent with the wafer. When precutting, it is further preferable that the precutting is performed in a manner that when the packaging adhesive layer 200 is precut, a part of the precut packaging adhesive layer 200 is cut into the release layer 100b, and the precut packaging adhesive layer 200 is a collection of cylinders or square columns which are periodically distributed.
The coating method in each step includes, but is not limited to, spin coating, slot coating, cast coating, roll coating, bar coating, inkjet coating, etc., and spin coating is preferable. The lamination method in each step described above may employ a general lamination method such as roll lamination or vacuum heat pressing, and roll lamination is preferable.
The following will provide a method for using the wafer level package die bonding film of the present invention, but the method of using the present invention is not limited thereto. The using method comprises the following specific steps:
the release layer 100b is first removed, and the encapsulation adhesive layer 200 is adhered to the back surface of the wafer. Cutting from the front surface of the wafer; after cutting, irradiating ultraviolet light to the packaging film to cure the anti-static bonding adhesive layer 300; after curing, the dicing tape layer 400 and the anti-static bonding tape layer 300 may be easily separated to pick up the chip to which only the encapsulation tape layer 200 is attached, i.e., the encapsulated semiconductor chip. It should be noted that, the "front surface" mentioned herein refers to the circuit forming surface of the wafer; the term "back side" refers to the opposite side of the circuit-formed side of the wafer.
Obviously, compare with current loaded down with trivial details encapsulation, cutting process, use the utility model discloses wafer level encapsulation chip bonding film can greatly simplify current technology.
The above-mentioned embodiment is only one of various embodiments, and those skilled in the art can make other variations or modifications on the basis of the above description, and these other variations or modifications derived from the spirit of the present invention still fall into the protection scope of the present invention.
Claims (9)
1. A wafer level packaging chip bonding film with an anti-sticking coating is characterized in that:
the semiconductor wafer packaging film is of a multilayer structure and sequentially comprises a release layer, a packaging adhesive layer, an anti-static bonding adhesive layer, a cutting adhesive layer and a resin adhesive layer, wherein the packaging adhesive layer is formed on a peelable surface of the release layer.
2. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the thickness of the release layer is 5-300 microns.
3. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the packaging adhesive layer is a thermosetting resin packaging adhesive layer.
4. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the thickness of the packaging adhesive layer is 5-40 microns.
5. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the anti-static bonding adhesive layer is a UV or non-UV anti-static adhesive layer.
6. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the anti-static bonding adhesive layer adopts AS-PSA anti-static adhesive tape.
7. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the cutting glue layer is a TPU glue layer.
8. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the resin adhesive layer is a PU resin adhesive layer or an acrylic resin adhesive layer.
9. The wafer level package die bonding film with an anti-adhesive coating of claim 1, wherein:
the thickness of the resin adhesive layer is 5-10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921909124.6U CN211170549U (en) | 2019-11-07 | 2019-11-07 | Wafer level packaging chip bonding film with anti-sticking coating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921909124.6U CN211170549U (en) | 2019-11-07 | 2019-11-07 | Wafer level packaging chip bonding film with anti-sticking coating |
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| CN211170549U true CN211170549U (en) | 2020-08-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116987454A (en) * | 2023-09-28 | 2023-11-03 | 武汉市三选科技有限公司 | Adhesive tape for wafer thinning, preparation method thereof and wafer grinding method |
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2019
- 2019-11-07 CN CN201921909124.6U patent/CN211170549U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116987454A (en) * | 2023-09-28 | 2023-11-03 | 武汉市三选科技有限公司 | Adhesive tape for wafer thinning, preparation method thereof and wafer grinding method |
| CN116987454B (en) * | 2023-09-28 | 2023-12-12 | 武汉市三选科技有限公司 | Adhesive tape for wafer thinning, preparation method thereof and wafer grinding method |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Wafer level packaging chip bonding film with anti sticking coating Effective date of registration: 20220124 Granted publication date: 20200804 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: WUHAN SANXUAN TECHNOLOGY CO.,LTD. Registration number: Y2022420000027 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230228 Granted publication date: 20200804 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: WUHAN SANXUAN TECHNOLOGY CO.,LTD. Registration number: Y2022420000027 |