CN211149378U

CN211149378U - Split type wind scooper applied to AI server

Info

Publication number: CN211149378U
Application number: CN201921813519.6U
Authority: CN
Inventors: 杨拯; 曹真才
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2020-07-31
Anticipated expiration: 2029-10-25

Abstract

The utility model discloses a be applied to split type wind scooper of AI server relates to the supplementary heat dissipation technical field of server. The air guide cover comprises a server bottom plate, wherein a chip radiator is arranged on the server bottom plate, a PCIE card is arranged on the upper portion of the chip radiator, the PCIE card comprises a full-length PCIE card or/and a half-length PCIE card, a system fan is arranged at the front end of the server bottom plate, a plurality of air guide covers are arranged between the chip radiator and the PCIE card and comprise bases in contact with the chip radiator, a baffle is arranged on the upper portion of each base, a connecting plate is arranged at the front end of the baffle, a fixing plate is arranged on the other side of each base, and partition plates are arranged on the side faces of the. The beneficial effects of the utility model reside in that: when the configuration number and the model of the PCIE are changed, the air duct in the PCIE coverage range is unchanged, and the operation stability of the whole server is ensured.

Description

Split type wind scooper applied to AI server

Technical Field

The utility model relates to a supplementary heat dissipation technical field of server specifically is a split type wind scooper for AI server.

Background

With the development of server technology, the number of PCIE supported by a server is increasing, especially for an AI server oriented to an AI application group, dozens or dozens of PCIE cards, mainly a GPU card or an FPGA card, need to be supported in a single server, for such an AI server supporting a large number of PCIE cards, a large variety of cards need to be compatible, and in order to save space and improve signal quality, a chip filter is generally disposed in front of a PCIE slot and at the bottom of the PCIE card.

Due to the wide variety of server compatible cards, there is a need to be compatible with both standard half-length and full-length cards. But for heat dissipation, when the system is provided with a full-length card, a half-length card or no card, the air duct for internal heat dissipation of the system is different; however, in order to meet the heat dissipation requirement of the PCIE card bottom switch chip, the system needs to maintain the original air duct unchanged when different types and lengths of PCIE cards are configured or the PCIE cards are not installed, otherwise the temperature of the switch chip arranged at the bottom of the PCIE card will exceed the standard or the heat dissipation power consumption of the system will be high.

In the prior art, a server solves the problem by the following methods:

1. when PCIE is not installed at a certain position, PCIE dummy is used for replacing the PCIE, a large number of PCIE dummy is used, the difference between short cards and long cards needs to be considered, the dummy has various types, the collocation and the management and control of factory assembly materials are influenced, and the cost is relatively high;

2. in another method, any component needing to be independently radiated is not placed in a range covered by the PCIE card, and if the range covered by the PCIE card is abandoned, the space utilization rate of the server is reduced, the system architecture is not optimal, and the competitive power is lost;

3. or the change of different PCIE air channels is directly not considered, the heat dissipation design of other components is very conservative, a larger heat radiator or a fan is used, the heat dissipation of other components can be met no matter what cards are installed, and the cost of the heat dissipation design is greatly increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be applied to split type wind scooper of AI server guarantees inside many PCIE servers, when PCIE configuration quantity and model change, and the wind channel in the PCIE coverage is unchangeable, has guaranteed the stability of whole server operation.

The utility model discloses a realize above-mentioned purpose, realize through following technical scheme:

a split type wind scooper applied to an AI server comprises a server bottom plate, wherein a chip radiator is arranged on the server bottom plate, a PCIE card is arranged at the upper part of the chip radiator and comprises a full-length PCIE card or/and a half-length PCIE card, a system fan is arranged at the front end of the server bottom plate, a plurality of wind scoopers are arranged between the chip radiator and the PCIE card and comprise bases in contact with the chip radiator, a baffle is arranged at the upper part of each base, and a connecting plate is arranged at the front end of each baffle;

the other side of the base is provided with a fixed plate, and the side surface of the fixed plate is provided with a separation plate.

The server bottom plate upper portion is equipped with the support frame, the connecting plate lower part is equipped with the buckle, buckle and support frame joint.

The supporting frame is provided with a plurality of ventilation holes, and the ventilation holes correspond to the system fans.

The angle between the baffle and the base is 60-80 degrees.

And the baffle and the fixed plate bracket are provided with reinforcing plates.

And a connecting bracket is arranged among the air guide covers.

Contrast prior art, the beneficial effects of the utility model reside in that:

1. when the full-length PCIE card and the half-length PCIE card exist on the chip radiator, the full-length PCIE card can block air volume from a system fan, the air volume is pressed downwards to the upper portion of the chip radiator and cannot change an original system air duct, at the moment, an air guide cover is not arranged between the full-length PCIE card and the chip radiator, the half-length PCIE card cannot block the air volume from the system fan, therefore, the air guide cover needs to be arranged between the half-length PCIE card and the chip radiator, the baffle blocks the air volume from the system fan, the air volume is pressed downwards to the upper portion of the chip radiator, the original system air duct cannot be changed, and stability of internal heat dissipation of the server is guaranteed.

2. The upper portion of the server bottom plate is provided with a support frame, the lower portion of the connecting plate is provided with a buckle, the buckle is connected with the support frame in a clamped mode, the support frame can fix the wind scooper, the wind scooper is prevented from falling off from the server bottom plate, and stability of the system is further guaranteed.

3. The air guide cover is characterized in that a plurality of air vents are formed in the supporting frame and correspond to the system fans, and the air vents can ensure that the air quantity from the system fans can smoothly enter the air guide cover.

4. The angle between the baffle and the base is 60-80 degrees, the baffle can play a role in guiding the air quantity, and the air quantity from the system fan is prevented from blowing upwards after blowing onto the baffle, so that the stability of heat dissipation is further ensured.

5. The baffle and the fixed plate support are provided with the reinforcing plate, the wind resistance strength of the wind scooper can be enhanced through the reinforcing plate, and the service life of the wind scooper is prolonged.

6. A plurality of connecting supports are arranged between the air guiding covers, the connecting supports can play a role in connecting the air guiding covers, the separation phenomenon between the two air guiding covers can be prevented, and the running stability of the whole device is further ensured.

Description of the drawings:

figure 1 is a three-dimensional axonometric view of the invention.

Fig. 2 is a three-dimensional perspective view of a single wind scooper of the present invention.

Fig. 3 is a top view of a single wind scooper of the present invention.

Fig. 4 is a schematic view of the wind guiding cover of the present invention.

Fig. 5 is a front view of the support stand.

Fig. 6 is a diagram illustrating a state of a full-length PCIE card and a half-length PCIE card coexisting.

Reference numerals shown in the drawings:

1. a server backplane; 11. a chip heat sink; 12. a PCIE card; 121. a full-length PCIE card; 122. a half-length PCIE card; 13. a system fan; 2. a wind scooper; 21. a base; 22. a baffle plate; 23. a connecting plate; 24. A fixing plate; 25. a partition plate; 31. a support frame; 32. buckling; 33. a vent hole; 4. a reinforcing plate; 5. And connecting the bracket.

Detailed Description

As shown in the drawings, the present invention will be described below with reference to specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.

Example (b):

the utility model relates to a split type wind scooper applied to AI server, which comprises a server bottom plate 1, a chip radiator 11 is arranged on the server bottom plate 1, a PCIE card 12 is arranged on the upper part of the chip radiator 11, the PCIE card 12 comprises a full length PCIE card 121 or/and a half length PCIE card 122, a system fan 13 is arranged at the front end of the server bottom plate 1, a plurality of wind scoopers 2 are arranged between the chip radiator 11 and the PCIE card 12, the wind scoopers 2 can guide the wind quantity from the system fan 13, the wind scoopers 2 comprise a base 21 contacted with the chip radiator 11, a baffle 22 is arranged on the upper part of the base 21, the wind quantity from the system fan 13 is directly vertical to the baffle 22, a connecting plate 23 is arranged at the front end of the baffle 22, the connecting plate 23 is vertically and fixedly connected with the upper part of the baffle 22, a fixing plate 24 is arranged at the, the side of the fixing plate 24 is provided with the partition plate 25, the PCIE card 12 is placed between the two partition plates 25, which can clamp the PCIE card 12, and ensure the operation stability of the whole device, when the full-length PCIE card 121 and the half-length PCIE card 122 exist on the chip heat sink 11, the full-length PCIE card 121 can block the air volume from the system fan 13, and press the air volume downward to the upper portion of the chip heat sink 11, which will not change the original system air duct, at this time, the air guiding cover 2 is not arranged between the full-length PCIE card 121 and the chip heat sink 11, and the half-length PCIE card 122 cannot block the air volume from the system fan 13, so the air guiding cover 2 needs to be arranged between the half-length PCIE card 122 and the chip heat sink 11, the baffle plate 22 blocks the air volume from the system fan 13, and presses the air volume downward to the upper portion of the chip heat sink 11, which will not change the original system air duct, the stability of the heat dissipation in the server is ensured.

In order to further ensure the stability of the system, the upper part of the server bottom plate 1 is provided with a support frame 31, the lower part of the connecting plate 23 is provided with a buckle 32, the buckle 32 is clamped with the support frame 31, the support frame 31 can fix the wind scooper 2, the wind scooper 2 is prevented from falling off from the server bottom plate 1, and the stability of the system is further ensured.

In order to ensure smooth ventilation, a plurality of ventilation holes 33 are formed in the support frame 31, the ventilation holes 33 correspond to the system fans 13, and the ventilation holes 33 can ensure that the air volume from the system fans 13 can smoothly enter the air guide cover 2.

In order to further ensure the stability of heat dissipation, the angle between the baffle 22 and the base 21 is 60-80 °, and the baffle 22 can guide the air flow to prevent the air flow from the system fan 13 from blowing upwards after blowing onto the baffle 22, thereby further ensuring the stability of heat dissipation.

In order to prolong the service life of the wind scooper 2, the baffle 22 and the fixing plate 24 are supported by the reinforcing plate 4, and the reinforcing plate 4 can enhance the wind resistance strength of the wind scooper 2, so that the service life of the wind scooper 2 is prolonged.

In order to further ensure the operation stability of the whole device, a plurality of connecting supports 5 are arranged between the wind scoopers 2, and the connecting supports 5 can play a connecting role in the wind scoopers 2, so that the separation phenomenon between the two wind scoopers 2 can be prevented, and the operation stability of the whole device is further ensured.

Claims

1. A split type wind scooper applied to an AI server comprises a server bottom plate, wherein a chip radiator is arranged on the server bottom plate, a PCIE card is arranged at the upper part of the chip radiator and comprises a full-length PCIE card or/and a half-length PCIE card, and a system fan is arranged at the front end of the server bottom plate;

2. The split type wind scooper applied to the AI server of claim 1, wherein: the server bottom plate upper portion is equipped with the support frame, the connecting plate lower part is equipped with the buckle, buckle and support frame joint.

3. The split type wind scooper applied to the AI server of claim 2, wherein: the supporting frame is provided with a plurality of ventilation holes, and the ventilation holes correspond to the system fans.

4. The split type wind scooper applied to the AI server of claim 1, wherein: the angle between the baffle and the base is 60-80 degrees.

5. The split type wind scooper applied to the AI server according to claim 1, wherein: and the baffle and the fixed plate bracket are provided with reinforcing plates.

6. The split type wind scooper applied to the AI server of claim 1, wherein: and a connecting bracket is arranged among the air guide covers.