CN211148984U - Optical transceiver module and optical fiber cable module - Google Patents

Abstract

The utility model provides an optics transceiver module and fiber optic cable module. The optical transceiver module comprises a substrate, a light receiving component and a plurality of light emitting components. The light emitting component comprises a light emitter, a sealed shell and an optical lens, wherein the light emitter and the optical lens are arranged in the sealed shell. Through the utility model discloses an optics transceiver module and fiber optic cable module can improve the accuracy of light path, and then the energy loss of reducible light signal.

Description

Optical transceiver modules and optical fiber cable modules

technical field

The utility model relates to the technical field of optical fiber communication, in particular to an optical transceiver module and an applied optical fiber cable module.

Background technique

In the application of optical fiber communication technology, the electrical signal needs to be converted into an optical signal through an optical emitting component (such as a laser), and then the optical signal is coupled into an optical fiber that conducts the optical signal.

The traditional telecommunication transmission system is gradually replaced by the optical fiber transmission system. Because the optical fiber transmission system has no bandwidth limitation, it has the advantages of high-speed transmission, long transmission distance, and the material is not interfered by electromagnetic waves. Therefore, the current electronic industry is mostly developing in the direction of optical fiber transmission.

However, in recent years, further miniaturization of optical modules such as optical transceivers has been required, and thus optical alignment between the optical lens and the optical transmitter needs to be optimized to improve the accuracy of the optical path.

Utility model content

The utility model proposes an optical transceiver module: comprising:

substrate;

a light receiving assembly connected to the substrate; and

The light emitting component is connected to the substrate, and the light emitting component includes a light emitter, a sealed casing and an optical lens, and the light emitter and the optical lens are arranged in the sealed casing.

In different embodiments, the light emitting component further includes an optical window, and the optical window is disposed on the sealed casing and is opposite to the optical lens.

In various embodiments, the optical window is a planar light-transmitting plate.

In different embodiments, the material of the optical lens is the same as the material of the optical window.

In different embodiments, the light emitting component further includes a post, and the light emitter and the optical lens are disposed on the post.

In various embodiments, the optical lens and the light emitter are disposed on the same circuit board.

In different embodiments, the plurality of light emitting components are more than two light emitting components, and are arranged in a staggered manner.

In various embodiments, the light emitting assembly further includes a temperature control unit.

In different embodiments, the light emitting component and the substrate may have an inclination angle.

The utility model also proposes an optical fiber cable module, comprising:

fiber optic cable;

Optical transceiver module, including:

substrate;

a light receiving assembly connected to the substrate; and

The light emitting component is connected to the substrate, and the light emitting component includes a light emitter, a sealed casing and an optical lens, and the light emitter and the optical lens are arranged in the sealed casing.

Through the optical transceiver module and the optical fiber cable module of the present invention, the optical alignment between the optical lens and the optical transmitter can be controlled more accurately, so as to improve the accuracy of the optical path, thereby reducing the energy loss of the optical signal.

Description of drawings

1 is a block diagram of a system using an optical cable module of the present invention;

2 to 4 are schematic diagrams of an embodiment of the optical transceiver module of the present invention;

5A to 9 are schematic views of different embodiments of the substrate of the present invention;

10 to 11 are schematic views of different embodiments of the light emitting component and the substrate of the present invention;

FIG. 12 is a schematic diagram of an embodiment of the light emitting device of the present invention;

FIG. 13 is a schematic diagram of an embodiment of the light emitting component of the present invention;

14A is a schematic diagram of an embodiment of an optical transceiver module of the present invention;

14B and 14C are schematic diagrams of the light emission holder of the present invention;

15 to 17 are schematic views of different embodiments of the substrate of the present invention;

FIG. 18 is a schematic diagram of an embodiment of the light emitting device of the present invention.

Detailed ways

The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention may be practiced. The directional terms mentioned in this utility model, such as "up", "down", "front", "rear", "left", "right", "inside", "outside", "side", etc., are only See attached drawings for directions. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.

The drawings and descriptions are to be regarded as illustrative in nature and not restrictive. In the figures, structurally similar elements are denoted by the same reference numerals. In addition, for understanding and ease of description, the size and thickness of each component shown in the accompanying drawings are arbitrarily shown, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thicknesses of some layers and regions are exaggerated for understanding and convenience of description. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.

Additionally, in the specification, unless explicitly described to the contrary, the word "comprising" will be understood to mean the inclusion of stated components, but not the exclusion of any other components. Further, in the specification, "on" means above or below the target component, and does not mean necessarily on top based on the direction of gravity.

Please refer to FIG. 1. This embodiment provides an optical cable module 100. FIG. 1 is a flowchart of using the optical cable module 100. The optical cable module 100 includes an optical transceiver module 110, an optical fiber cable 130 and a Electronic device 101 . The electronic device 101 may be any of a number of computing or display devices including, but not limited to, a data center, desktop or laptop computer, notebook computer, ultra-thin notebook, tablet computer, notebook, or other computing devices. In addition to computing devices, it will be appreciated that many other types of the electronic device 101 may include one or more of the optical transceiver modules 110 and/or matching ports 102 described in this disclosure, and described in The embodiments of the present invention can be equally applied to these electronic devices. Examples of these other electronic devices 101 may include electric vehicles, handheld devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, memory devices, cameras, audio recorders, I/O O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, Internet devices, game equipment, game consoles, or any Other electronic devices 101 may include the optical transceiver module 110 and/or the matching port 102 . In other embodiments, the electronic device 101 may be any other electronic device that processes data or images.

As shown in FIG. 1 , the optical fiber cable 130 is connected to the optical transceiver module 110 for transmitting optical signals. The fiber optic cable 130 may include at least one or more fiber optic cores for allowing optical signals to be transmitted within the fiber optic cores.

Referring to FIG. 1, the electronic device 101 may include a processor 103, which may represent any type of processing component that processes electrical and/or optical I/O signals. It is understood that the processor 103 may be a single processing device, or a plurality of separate devices. The processor 103 may include or be a microprocessor, programmable logic device or array, microcontroller, signal processor, or some combination.

Referring to FIG. 1 , the matching port 102 of the electronic device 101 can be used as an interface to connect to the optical transceiver module 110 . The optical transceiver module 110 may allow another peripheral device 105 to be interconnected with the electronic device 101 . The optical transceiver module 110 of this embodiment can support communication via an optical interface. In various embodiments, the optical transceiver module 110 may also support communication through an electrical interface.

Referring to FIG. 1 , the peripheral device 105 may be a peripheral I/O device. In various embodiments, the peripheral device 105 may be any of a variety of computing devices including, but not limited to, desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, Notebook, or other computing device. In addition to computing devices, it is understood that peripheral devices 105 may include electric vehicles, handheld devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, memory devices, cameras, recorders, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic billboards, projectors, entertainment control units, portable music players, digital cameras, Internet devices, Gaming equipment, game consoles, or other electronic devices.

Referring to FIG. 1 , in one embodiment, the electronic device 101 may also include an internal optical path. The optical path may represent one or more components, which may include processing and/or termination components that communicate an optical signal between the processor 103 and the mating port 102 . Transmitting a signal may include generating and converting to optical, or receiving and converting to electrical. In one embodiment, the device may also include electrical paths. An electrical path represents one or more components that carry an electrical signal between the processor 103 and the matching port 102 .

Please refer to FIG. 1 , the optical transceiver module 110 can be used to correspond to the matching port 102 of the electronic device 101 . In this embodiment, mating one connector plug with another may be used to provide a mechanical connection. Mating one connector plug with another typically also provides a communication connection. The mating port 102 can include a housing 104 that can provide the mechanical connection mechanism. The mating port 102 may include one or more optical interface members. Path 106 may represent one or more components, which may include processing and/or termination components for passing optical signals (or optical and electrical signals) between the processor 103 and the matching port 102 . Transmitting a signal may include generating and converting to an optical signal, or receiving and converting to an electrical signal.

Referring to FIG. 1 , the optical transceiver module 110 of the present invention may be referred to as an optical connector or an optical joint. In general, such an optical connector can be used to provide a physical connection interface to a mating connector and an optical component. The optical transceiver module 110 can be a light engine for generating optical signals and/or receiving and processing optical signals. The optical transceiver module 110 may provide conversion from electrical-to-optical signals or from optical-to-electrical signals.

In some embodiments, the optical transceiver module 110 may be used to process the optical signals in accordance with or in accordance with one or more communication protocols. For the embodiment in which the optical transceiver module 110 is used to transmit an optical signal and an electrical signal, the optical interface and the electrical interface may be based on the same protocol, but this is not absolutely necessary. Whether the optical transceiver module 110 processes signals according to the protocol of the electrical I/O interface or according to a different protocol or standard, the optical transceiver module 110 can be used for an intended protocol. Built or programmed within a particular module, and different transceiver modules or light engines can be built for different protocols.

Please refer to FIGS. 2-4 , which are schematic diagrams of an embodiment of the optical transceiver module of the present invention. The optical transceiver module 110 proposed in this embodiment may include a substrate 111 , a processor 112 , a light emitting component 113 , a light receiving component 114 , a connector 115 , a housing 116 , a connecting plate 117 , and a light emitting holder 118 . The substrate 111 may have opposite first and second surfaces 111a and 111b, such as a printed circuit board (PCB) or a ceramic substrate, and may include, for example, pins or connection balls for interfacing to an external device. The processor 112 is connected to the substrate 111 , and the processor 112 can be any type of processor die or optical IC, and is not limited to any specific processor type. The light-emitting component 113 and the light-receiving component 114 are connected to the processor 112 on the substrate 111, and are used for transmitting and receiving optical signals, respectively. The light-emitting component 113 and the light-receiving component 114 may include a transmitting circuit and a receiving circuit for transmitting electronic signals, more specifically, processing timing or other protocol aspects of the electronic signals corresponding to the optical signals. The housing 116 may have an inner space for accommodating the substrate 111 , the processor 112 , the light emitting element 113 , the light receiving element 114 , the connector 115 , the connecting plate 117 and the light emitting holder 118 . The connection board 117 is connected between the substrate 111 and the light emitting component 113, and the light emitting fixture 118 can be used for positioning and fixing the setting of the light emitting component 113, so as to maintain the characteristic loss and reliability of the joint between the optical fiber channel and the optical transceiver component .

Please refer to FIGS. 4 to 9 , the substrate 111 is disposed in the casing 116 , the substrate 111 may include at least one convex portion 111 c and at least one concave portion 111 d , the convex portion 111 c protrudes from the substrate 111 , and the concave portion 111 d is formed on at least one side of the convex portion 111c. The light emitting element 113 can be accommodated in the recess 111d. That is, the light emitting element 113 may be disposed on at least one side of the convex portion 111c. It should be noted that a circuit or an IC chip can also be formed on the surface of the convex portion 111c of the substrate 111, so as to increase the installation area of the circuit.

In different embodiments, as shown in FIGS. 5 to 7 , the substrate 111 may have one or more convex shapes, and in this case, a plurality of concave portions 111 d may be located on opposite sides of the convex portion 111 c, respectively. Here, as shown in FIG. 7 , the plurality of recesses 111d may have different lengths or depths. In this way, light emitting elements 113 of different sizes can be accommodated according to requirements. Furthermore, different circuits (eg, a flexible circuit board connected to the light emitting element 113 ) can be isolated through the embossed shape of the substrate 111 to avoid mutual interference due to spatial overlap.

In different embodiments, as shown in FIG. 8 , the substrate 111 may have at least one L-shape, and in this case, at least one concave portion 111d may be located on at least one side of the convex portion 111c. As shown in FIG. 9 , the substrate 111 may have at least one stepped shape, and in this case, a plurality of concave portions 111 d may be located on at least one side of the convex portion 111 c.

In addition, in some embodiments, the opposite first surface 111a and the second surface 111b of the substrate 111 may be provided with different circuits for setting circuits, chips or components with different functions. For example, the light receiving element 114 can be disposed on the first surface 111 a of the substrate 111 , and the processor 112 and IC chips (such as but not limited to LDD, PA, CDR, DSP chips, etc.) can be disposed on the second surface of the substrate 111 111b. In this way, the installation space of the circuit or the chip can be increased, and the size of the substrate 111 can be correspondingly reduced. In some embodiments, the light receiving component 114 can also be fixed on the first surface 111a of the substrate 111 by a chip on board method.

In this embodiment, the optical transceiver module 110 can be applied to, for example, a four-fiber channel parallel transmission (Parallel Single Mode 4lane, PSM4) technology, which is to introduce light of different wavelengths from four laser sources into the optical fiber through a plurality of light emitting components 113 respectively. medium and long-distance transmission through optical fiber. The light receiving component 114 can receive the light signal, and can guide the processed light signal to different channels respectively. However, not limited to this, the optical transceiver module 110 can be applied to various multi-fiber channel wavelength division multiplexing (multi-channel, WDM) in addition to the PSM4 technology, such as but not limited to: two-bit phase shift modulation ( Binary Phase Shift Keying, BPSK), Quadrature Phase Shift Keying (QPSK), Coarse Wavelength Division Multiplexing (Conventional/CoarseWavelength Division Multiplexing, CWDM), High Density Wavelength Division Multiplexing (Dense WavelengthDivision Multiplexing, DWDM), Optical Add/Drop Multiplexer (OADM), Reconfigurable Optical Add/Drop Multiplexer (ROADM), LR4 or similar related optical communication technologies.

As shown in FIG. 4 , one or more light emitting components 113 can be connected to the substrate 111 through a connecting plate 117 , and a plurality of light emitting components 113 can be arranged in a staggered manner. There is an included angle between the light emitting directions of the plurality of light emitting elements 113 (ie, the emitting direction of the light signal), for example, the included angle is between 90 degrees and 180 degrees, that is, the distance between the plurality of light emitting elements 113 is It can be arranged in a staggered arrangement. When the plurality of light emitting components 113 are arranged in a staggered arrangement, the light emitting directions of the plurality of light emitting components 113 may be approximately opposite to each other or different from each other, that is, the light emitting directions of the plurality of light emitting components 113 are sandwiched between the light emitting directions. The angle is about 180 degrees.

As shown in FIG. 4 , each light emitting element 113 includes a light emitter 113a, a sealed casing 113b and a cylindrical member 113c, and the light emitter 113a is completely sealed in one or more sealed casings 113b, That is, the light emitter 113a in the light emitting element 113 will not contact the external environment or the air outside the light emitting element 113, so as to avoid the component aging of the light emitter 113a, ensure the component performance of the light emitter 113a, and greatly extend the performance of the light emitter 113a. the service life of the components. Wherein, the sealing degree of the light emitting component 113 is to meet the air tightness requirement of the TO (Transmitter Optical Sub-Assembly) type package for industrial use. For example, the sealing degree of each of the plurality of light emitting components 113 may be 1×10 ⁻¹² to 5×10 ⁻⁷ (atm*cc/sec).

In various embodiments, the wavelength of the light signal emitted by the light emitter 113a of the light emitting component 113 may be in the range of near-infrared light to infrared light, about 830 nanometers (nm)˜1660 nanometers. The light transmitter 113a may be any type of laser chip suitable for generating light signals (eg, edge-emitting laser device, FP/DFB/EML laser, or vertical cavity surface-emitting laser, VCSEL).

In different embodiments, the light emitter 113a can be directly sealed in the sealed casing 113b without an exposed gap, so as to ensure the airtightness of the light emitting component 113 . In some embodiments, the sealed housing 113b is, for example, a cylindrical housing. The cylindrical member 113c is provided on one side of the hermetic case 113b. A light coupling lens (not shown), such as a convex lens or a spherical lens, may be provided inside the cylindrical member 113c for coupling the light signal emitted by the light emitter 113a to an external optical fiber through the cylindrical member 113c. Therefore, the light-emitting direction of each light-receiving component is from the light emitter 113a in the sealed casing 113b toward the cylindrical member 113c.

In various embodiments, the diameter or width of the sealed housing 113b is greater than the diameter or width of the cylindrical member 113c. In this way, through the staggered arrangement of the plurality of light emitting components 113, the plurality of light emitting components 113 can be arranged to be arranged more closely, so as to reduce the configuration space of the plurality of light emitting components 113, so that more light emitting components 113 can be emitted The component 113 is configured and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

As shown in FIG. 10 , in different embodiments, a plurality of light emitting components 113 may be located on the upper and lower sides of the substrate 111 , respectively, and are staggered, thus realizing the staggering of the plurality of light emitting components 113 on the upper and lower sides of the substrate 111 . arrangement.

As shown in FIG. 11 , in different embodiments, a plurality of light emitting components 113 may be respectively located on the same side of the substrate 111 and staggered, thus realizing staggered arrangement of the plurality of light emitting components 113 on the same side of the substrate 111 .

As shown in FIG. 12 , in different embodiments, two or more (eg, three or more) light emitting components 113 may be staggered with each other, so as to realize the staggered arrangement of more light emitting components 113 .

In some embodiments, as shown in FIG. 4 and FIG. 10 , the light emitting element 113 and the substrate 111 may have an inclination angle, that is, the light emitting direction of the light emitting element 113 and the substrate 111 may have an inclination angle, The inclination angle between the light emitting component 113 and the substrate 111 may be less than 90 degrees, such as 30 degrees, 60 degrees or 45 degrees. Therefore, the light emitting components 113 can be arranged obliquely, so as to reduce the configuration space of the light emitting components 113 . Specifically, in some embodiments, the inclination angle of the light emitting component 113 can be realized and fixed by the light emitting fixture 118 . However, it is not limited to this, and in different embodiments, the inclination angle of the light emitting element 113 can also be realized and fixed by different structures or manners. For example, in some embodiments, the inclination angle of the light emitting element 113 can also be fixed by fixing glue.

In the embodiment of the present invention, as shown in FIG. 4 , the plurality of light emitting components 113 can also be arranged in a staggered manner up and down, and at the same time, they are arranged obliquely. At this time, since the front and rear ends of the light emitting components 113 have different sizes, they can be arranged in the optical transceiver module 110 more closely, so as to better realize the miniaturization of the optical transceiver module.

Referring to FIG. 13 , in different embodiments, each light emitting component 113 may further include a temperature control unit 119 , and the temperature control unit 119 may be disposed in the sealed casing 113 b. In some embodiments, the temperature control unit 119 may include a thermistor 119a and a thermoelectric cooler 119b, the thermistor 119a being fixed on the base of the light emitter 113a, for example, the thermoelectric cooler 119b, for example The thermistor 119a is electrically connected to the thermoelectric cooler 119b, which can be fixed in the sealed casing 113b and close to the light emitter 113a. In this embodiment, the resistance value of the thermistor 119a is changed by the temperature of the light emitter 113a, so the temperature of the light emitter 113a can be detected through the thermistor 119a. Then, by controlling the current flow of the thermoelectric cooler 119b, the temperature of the light emitter 113a can be cooled, so as to control the light emitter 113a to work within a reasonable temperature range (eg, 40-50 degrees), and reduce the temperature The variation causes the phenomenon of wavelength shift of the light emitter 113a. Furthermore, since the overall thermal load of the light emitting element 113 can be greatly reduced, the power consumption of the light emitting element 113 can be reduced. For example, the power consumption range of a single light emitting component 113 can be reduced to 0.1-0.2W, for example, the power consumption range of four light emitting components 113 can be reduced to 0.4-0.8W. In this embodiment, the thermistor 119a and the thermoelectric cooler 119b can be fixed on the base of the light emitter 113a by, for example, thermally conductive glue.

As shown in FIG. 3, the connector 115 may provide a reversing mechanism to change the light between the optical transceiver module 110 and some external object (e.g., another device) over an optical fiber (not shown). For example, the connector 115 may provide reorientation of the optical signal through a reflective surface. The angle, general size and shape of the connector 115 will depend on the wavelength of the light, as well as the materials used to make the coupler and the requirements of the overall system. In one embodiment, the connector 115 may be designed to provide reorientation of vertical light from the substrate 111 and horizontal light to the substrate 111 .

Additionally, the size, shape, and configuration of the connectors 115 are related to this standard, which includes tolerances for corresponding connector mating. Therefore, the layout of connectors used to integrate optical I/O components may vary from one standard to another. It will be understood by those skilled in the art that the optical interface requires a line-of-sight connection to have an optical signal transmitter (both may be referred to as a lens) interfaced with the receiver. Therefore, the configuration of the connector will be such that the lens is not blocked by the corresponding electrical contact assembly. For example, optical interface lenses may be positioned on the sides of the contact assemblies, or above or below, depending on the space available within the connector.

In this embodiment, the connector 115 may be, for example, the MPO (Multi-Fibre Push On) specification, and the optical fibers may be connected one-to-one in a multi-channel manner. In some embodiments, a CWDM/WDM system can be used to achieve the specification requirements of LR4 through the steps of splitting and de-splitting.

As shown in FIG. 3 , the outer casing 116 is used to protect and assemble the substrate 111 , the processor 112 , the plurality of light emitting components 113 , the light receiving components 114 and the connection board 117 . In other embodiments, the optical transceiver module 110 may further include a planar light-wave chip (PLC) and a modulator. Planar light-wave chips provide a planar integrated component for the transmission of light and its conversion into electrical signals, and vice versa. It is understood that the functions of a planar light-wave chip (PLC) can also be integrated into the connector 115 . In this embodiment, the casing 116 may include an upper casing 116a and a lower casing 116b, and the upper casing 116a and the lower casing 116b can be combined into one body, and can form an inner space for accommodating the substrate 111, processing The device 112 , a plurality of light emitting components 113 , the light receiving components 114 and the connection board 117 . In some embodiments, the housing 116 may be made of metal, for example, to have electrical shielding that not only electrically shields the circuits enclosed therein, but also efficiently dissipates heat generated by the electronic circuits out of the housing 116 . Function.

As shown in FIG. 4 , the connecting plate 117 is connected between the substrate 111 and the light emitting element 113 for fixing the light emitting element 113 and allowing the light emitting element 113 to be electrically connected to the substrate 111 . That is, through the connection board 117, the substrate 111 and the light emitting component 113 can transmit signals to each other. Specifically, the connection board 117 can be, for example, a flexible circuit board or a flexible printed circuit board (FPC) to transmit signals between the substrate 111 and the light emitting element 113 .

Also, as shown in FIG. 4 , through the connecting plate 117 , the light emitting element 113 can be allowed to be disposed in the concave portion 111 d of the substrate 111 . Specifically, the connecting plate 117 may be disposed in the recess 111 d of the base plate 111 and connected to the base plate 111 . And the light emitting element 113 can be disposed on the connecting plate 117 and connected to the connecting plate 117 . Therefore, through the connecting plate 117 , the light emitting element 113 is disposed in the recess 111 d of the substrate 111 and is electrically connected to the substrate 111 .

Also, as shown in FIG. 4 , the connecting plate 117 may include a first connecting plate 117a and a second connecting plate 117b. In some embodiments, one end of the first connecting plate 117 a may be connected to the first surface 111 a of the substrate 111 , and one end of the second connecting plate 117 b may be connected to the second surface 111 b of the substrate 111 . Therefore, through the first connecting plate 117a and the second connecting plate 117b, the plurality of light emitting elements 113 can be electrically connected to the circuits on the opposite side surfaces of the substrate 111, and can form a staggered configuration of upper and lower positions, so that multiple light emitting elements 113 can be connected The light emitting components 113 are arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

However, it is not limited to this, in some embodiments, the first connecting board 117a and the second connecting board 117b can also be connected to the same side surface (the first surface 111a or the second surface 111b ) of the substrate 111 .

As shown in FIG. 4 , the first connecting plate 117a and the second connecting plate 117b may have different lengths. Specifically, in some embodiments, the length of the second connection plate 117b may be greater than the length of the first connection plate 117a. Therefore, through the different lengths of the first connecting plate 117a and the second connecting plate 117b, the plurality of light emitting elements 113 can be formed in a staggered configuration in front and rear positions, so that the plurality of light emitting elements 113 can be simultaneously arranged and packaged in a smaller In the optical transceiver module 110, the miniaturization of the optical transceiver module is realized.

Also, as shown in FIG. 4 , one end of the connecting plate 117 may have a bending structure and be connected to the light emitting element 113 , and the bending structure (not shown) may correspond to the inclination angle, position or other arrangement of the light emitting element 113 to form bends to correspond to the arrangement configuration of the light emitting components 113 .

Furthermore, when the ICs on the substrate 111 of the optical transceiver module 110 perform high-speed operations, large power consumption and heat are generated. At this time, the substrate 111 and the light emitting element 113 can be appropriately separated through the connecting plate 117 to prevent the heat from being directly transferred to the light emitting element 113 , thereby effectively reducing the power consumption of the temperature control unit 119 and the overall power consumption of the optical transceiver module 110 quantity.

As shown in FIG. 14A , in different embodiments, the position and arrangement of the light emitting components 113 in the optical transceiver module 110 can be fixed by the light emitting fixture 118 . Specifically, the light emitting fixture 118 can be disposed on the housing 116 or the substrate 111 of the optical transceiver module 110 to fix the light emitting component 113. In some embodiments, the light emission holder 118 may be integrally formed on the housing 116, for example. In some embodiments, the light emitting fixture 118 may include a first light emitting fixture 118a and a second light emitting fixture 118b for fixing a plurality of light emitting elements 113 and allowing the light emitting elements 113 to form a staggered arrangement. As shown in FIG. 3 , the first light emitting holder 118a may be disposed on the upper casing 116a, for example, and the second light emitting holder 118b may be disposed on the lower casing 116b, for example. Furthermore, the light emitting holder 118 may include at least one fixing groove 118c, the shape of the groove of the fixing groove 118c is corresponding to the shape of the light emitting component 113 (for example, the shape of the sealed casing 113 or the cylindrical member 113c), It is used for accommodating and engaging the light emitting component 113 to fix the light emitting component 113 . Furthermore, the groove shape of the fixing groove 118c can also be formed corresponding to the inclination angle of the light emitting element 113, so that the light emitting element 113 is fixed obliquely.

Specifically, as shown in FIGS. 14B and 14C , the fixing grooves 118c of the light emission holders 118 (eg, the first light emission holder 118a and the second light emission holder 118b ) may have an inclined angle, and the fixing grooves 118c The inclination angle of the light emitting element 113 can be the same as the inclination angle of the light emitting element 113 to fix the inclination angle of the light emitting element 113 .

As shown in FIG. 15 , in some embodiments, the concave portion 111 d of the substrate 111 may be a hollow cavity formed on the substrate 111 . Further, as shown in FIGS. 16 and 17 , the substrate 111 is formed by a plurality of concave portions 111d, and the substrate 111 may have an I-shaped or F-shaped structure. Therefore, a plurality of light emitting elements 113 can be accommodated on the substrate 111 through the plurality of recesses 111 d on the substrate 111 .

In different embodiments, through the arrangement of the light emitting components 113 and/or the design of the substrate 111, the size of the substrate 111 can be designed to meet the requirements of QSFP28, QSFP+ or Micro QSFP+. For example, in some embodiments, the width of the substrate 111 may be approximately 11-18 mm, and in some embodiments, the length of the substrate 111 may be approximately 58-73 mm to meet the requirements of QSFP+ or QSFP28. Therefore, through the arrangement of the light emitting components 113 and/or the design of the substrate 111 , a plurality of the light emitting components 113 can be arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

In different embodiments, the plurality of light receiving components 114 may also be arranged in a staggered manner, and the light receiving directions of the plurality of light emitting components have an included angle between 90 degrees and 180 degrees.

In different embodiments, the light receiving element 114 and the substrate may have an inclination angle, and the inclination angle between the light receiving element and the substrate may be less than 90 degrees, for example, between 0 degrees and 90 degrees, such as 1 degree, 5 degrees, 30 degrees, 60 degrees or 45 degrees.

Please refer to FIG. 18 again, in different embodiments, each light emitting element 113 may further include a damping unit 113d, submounts 113e, 113f and a base 113g, a light emitter 113a and The bases 113e and 113f can be disposed in the sealed casing 113b, the light emitter 113a can be disposed on the base 113e, and the damping unit 113d can be disposed between the sealed casing 113b and the bases 113e and 113f. 113f is provided on the base 113g.

As shown in FIG. 18 , in different embodiments, each light emitting element 113 may further include at least one optical lens 113L and an optical window 113w. The optical lens 113L is disposed in the sealed casing 113b, and is located in the light emitter 113a for optically improving the light signal emitted by the light emitter 113a, such as focusing, collimating, and diverging. In some embodiments, the optical lens 113L may be disposed on the post 113e, and opposite to the light emitter 113a. However, in different embodiments, the optical lens 113L and the light emitter 113a can also be disposed on the same circuit board.

As shown in FIG. 18 , the optical window 113w is disposed on the sealed casing 113b, for example, at the front end of the sealed casing 113b, and is opposite to the optical lens 113L, so as to allow the optical signal improved by the optical lens 113L to be emitted outside the sealed case 113b. In some embodiments, the optical window 113w may be a planar light-transmitting plate to allow the optical signal improved by the optical lens 113L to be emitted out of the sealed housing 113b. However, in different embodiments, the optical window 113w may further perform optical improvement on the optical signal after passing through the optical lens 113L, so as to improve the optical path after passing through the optical lens 113L again.

It is worth noting that, since the optical lens 113L can be directly disposed in the sealed housing 113b and located opposite to the light emitter 113a, the optical alignment between the optical lens 113L and the light emitter 113a can be controlled more accurately, so as to The accuracy of the optical path is improved, thereby reducing the energy loss of the optical signal. In some embodiments, the material of the optical lens 113L may be different from the material of the optical window 113w. Specifically, the material of the optical lens 113L can be, for example, various glass materials or a new type of silicon based micro-lens. These materials have very low absorptivity for specific application wavelengths (for example: 1200nm-1600nm). Optically transparent medium.

The terms "in some embodiments" and "in various embodiments" are used repeatedly. The term generally does not refer to the same embodiment; however, it can also refer to the same embodiment. The terms "comprising", "having" and "including" are synonymous unless the context of the text indicates otherwise.

Although various examples of methods, apparatus, and systems have been described herein, the scope of coverage of this disclosure is not limited thereto. On the contrary, this disclosure covers all methods, apparatus, systems, and articles of manufacture fairly falling within the scope of the claims, which should be construed in accordance with established principles of patent scope interpretation. For example, while the examples of systems disclosed above include, in addition to other components, software or firmware executable from hardware, it should be understood that such systems are exemplary only and should be construed as limiting example of sex. In particular, any or all of the disclosed hardware, software, and/or firmware components may be embodied exclusively as hardware, exclusively as software, exclusively as firmware, or exclusively as hardware, software and/or or some combination of firmware.

To sum up, although the present invention has been disclosed above with preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art, without departing from the spirit and scope of the present invention, are Various alterations and modifications can be made, so the protection scope of the present invention is subject to the scope defined by the claims.

Claims (10)

1. an optical transceiver module, is characterized in that, comprises: substrate; a light receiving assembly connected to the substrate; and The light emitting component is connected to the substrate, and the light emitting component includes a light emitter, a sealed casing and an optical lens, and the light emitter and the optical lens are arranged in the sealed casing. 2 . The optical transceiver module according to claim 1 , wherein the light emitting component further comprises an optical window, and the optical window is disposed on the sealed casing and is opposite to the optical lens. 3 . 3 . The optical transceiver module according to claim 2 , wherein the optical window is a planar light-transmitting plate. 4 . 4 . The optical transceiver module according to claim 2 , wherein the material of the optical lens is the same as the material of the optical window. 5 . 5 . The optical transceiver module according to claim 1 , wherein the light emitting component further comprises a pillar, and the light transmitter and the optical lens are disposed on the pillar. 6 . 6 . The optical transceiver module of claim 1 , wherein the optical lens and the light emitter are disposed on the same circuit board. 7 . 7 . The optical transceiver module according to claim 1 , wherein the plurality of light emitting components are more than two light emitting components, which are arranged in a staggered manner. 8 . 8. The optical transceiver module according to claim 1, wherein the light emitting component further comprises a temperature control unit. 9 . The optical transceiver module according to claim 8 , wherein an inclination angle exists between the light emitting component and the substrate. 10 . 10. An optical fiber cable module, characterized in that: comprising: fiber optic cable; Optical transceiver module, including: substrate; a light receiving assembly connected to the substrate; and The light emitting component is connected to the substrate, and the light emitting component includes a light emitter, a sealed casing and an optical lens, and the light emitter and the optical lens are arranged in the sealed casing.

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