CN211128410U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
- Publication number
- CN211128410U CN211128410U CN201922017231.4U CN201922017231U CN211128410U CN 211128410 U CN211128410 U CN 211128410U CN 201922017231 U CN201922017231 U CN 201922017231U CN 211128410 U CN211128410 U CN 211128410U
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- circuit board
- connecting block
- sliding rod
- fixedly connected
- lower connecting
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Abstract
The utility model discloses a low-impedance multilayer circuit board, which comprises a first circuit board, a second circuit board positioned below the first circuit board and a third circuit board positioned below the second circuit board; the left side and the right side of the first circuit board, the second circuit board and the third circuit board are respectively and fixedly connected with an upper connecting block, a middle connecting block and a lower connecting block; a sliding rod penetrates through the upper connecting block, the middle connecting block and the lower connecting block, one end of the sliding rod is fixedly connected with the lower connecting block, and the other end of the sliding rod penetrates through the upper connecting block and is in threaded connection with a nut; two sides of the bottoms of the first circuit board, the second circuit board and the third circuit board are fixedly connected with fixed cylinders, and rubber blocks are arranged in the fixed cylinders; fixing columns matched with the fixing cylinders are arranged on two sides of the tops of the first circuit board, the second circuit board and the third circuit board, and the top ends of the fixing columns are embedded into the fixing cylinders and connected with the rubber blocks; the utility model discloses can dismantle the circuit board and get off to maintain and change, can also accelerate the radiating efficiency of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a low impedance multilayer circuit board.
Background
The circuit board is also called as a circuit board, mainly comprises a bonding pad, a via hole, a mounting hole, a lead, a component and the like, and forms the circuit board with FPC characteristic and PCB characteristic according to related process requirements, the two circuit boards have high wiring density, light weight, thin thickness and good bending property, and the price of the circuit board can be changed according to different designs of the circuit board and the material, the layer number and the size of the circuit board.
The connection mode of general low impedance multilayer circuit board is welded connection, can not dismantle and get off to maintain and change, and laminating connection between the circuit board makes the heat in the circuit board difficult for distributing away, influences multilayer circuit board's normal use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low impedance multilayer circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a low impedance multilayer wiring board includes a first wiring board, a second wiring board located below the first wiring board, and a third wiring board located below the second wiring board; the left side and the right side of the first circuit board, the second circuit board and the third circuit board are respectively and fixedly connected with an upper connecting block, a middle connecting block and a lower connecting block; a sliding rod penetrates through the upper connecting block, the middle connecting block and the lower connecting block, one end of the sliding rod is fixedly connected with the lower connecting block, and the other end of the sliding rod penetrates through the upper connecting block and is in threaded connection with a nut; two sides of the bottoms of the first circuit board, the second circuit board and the third circuit board are fixedly connected with fixed cylinders, and rubber blocks are arranged in the fixed cylinders; the top both sides of first circuit board, second circuit board and third circuit board all are equipped with solid fixed cylinder assorted fixed column, the top of fixed column is connected with the block rubber in embedding solid fixed cylinder.
Preferably, the upper connecting block and the middle connecting block are provided with through holes at the corresponding positions of the sliding rods, and the through holes are movably connected with the sliding rods.
Preferably, the upper side and the lower side of the first circuit board, the second circuit board and the third circuit board are respectively provided with a heat dissipation plate, so that the heat dissipation efficiency of the circuit boards can be further improved, and the use effect of the circuit boards is ensured.
Preferably, the bottom of first circuit board, second circuit board and third circuit board all is equipped with four solid fixed cylinder, and four solid fixed cylinder are the rectangle and arrange, have improved the relation of connection between first circuit board, second circuit board and the third circuit board for first circuit board, second circuit board and third circuit board can the firm connection.
Preferably, the lower connecting block is provided with a fixing hole for connecting the sliding rod at the corresponding position of the sliding rod, and the sliding rod is in threaded connection with the fixing hole, so that the lower connecting block is convenient to disassemble and assemble.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses through being equipped with fixed cylinder and fixed column connection, can separate two sets of adjacent circuit boards, avoid the circuit inter-plate laminating together and lead to the heat difficult to distribute away, prevent the heat from causing the internal impedance of circuit board to increase too high, guarantee the normal use of multilayer circuit board; the heat dissipation plate is arranged, so that the heat dissipation efficiency of the circuit board can be further improved, and the use effect of the circuit board is ensured; through being equipped with the rubber block in fixed section of thick bamboo, can cushion the vibrations that the multilayer circuit board produced, have certain guard action to the multilayer circuit board.
2. The utility model can stabilize the connection among the first circuit board, the second circuit board and the third circuit board by arranging the lower connecting block, the middle connecting block, the upper connecting block, the slide bar and the nut, thereby ensuring the normal use of the multilayer circuit board; simultaneously, can dismantle first circuit board, second circuit board and third circuit board fast, the staff of being convenient for is to first circuit board, second circuit board and third circuit board maintenance and change.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of the present invention.
In the figure: 1. a first circuit board; 2. a second circuit board; 3. a third circuit board; 4. an upper connecting block; 5. a middle connecting block; 6. a lower connecting block; 7. a slide bar; 8. a nut; 9. a fixed cylinder; 10. a rubber block; 11. fixing a column; 12. a heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: a low impedance multilayer wiring board comprises a first wiring board 1, a second wiring board 2 positioned below the first wiring board 1, and a third wiring board 3 positioned below the second wiring board 2; the left side and the right side of the first circuit board 1, the second circuit board 2 and the third circuit board 3 are respectively and fixedly connected with an upper connecting block 4, a middle connecting block 5 and a lower connecting block 6; a sliding rod 7 penetrates through the upper connecting block 4, the middle connecting block 5 and the lower connecting block 6, one end of the sliding rod 7 is fixedly connected with the lower connecting block 6, and the other end of the sliding rod penetrates through the upper connecting block 4 and is in threaded connection with a nut 8; two sides of the bottoms of the first circuit board 1, the second circuit board 2 and the third circuit board 3 are fixedly connected with a fixed cylinder 9, and a rubber block 10 is arranged in the fixed cylinder 9; the top both sides of first circuit board 1, second circuit board 2 and third circuit board 3 all are equipped with fixed cylinder 9 assorted fixed column 11, and fixed cylinder 9 is connected with block rubber 10 in being embedded into on the top of fixed column 11.
Furthermore, the upper connecting block 4 and the middle connecting block 5 are provided with through holes at the corresponding positions of the sliding rod 7, and the through holes are movably connected with the sliding rod 7.
Furthermore, the upper and lower sides of the first circuit board 1, the second circuit board 2 and the third circuit board 3 are all provided with heat dissipation plates 12.
Furthermore, four fixing cylinders 9 are arranged at the bottoms of the first circuit board 1, the second circuit board 2 and the third circuit board 3, and the four fixing cylinders 9 are arranged in a rectangular shape.
Furthermore, a fixing hole for connecting the sliding rod 7 is formed in the corresponding position of the sliding rod 7 on the lower connecting block 6, and the sliding rod 7 is in threaded connection with the fixing hole.
The working principle is as follows: when the multi-layer circuit board fixing device is used, the top ends of the fixing columns 11 are embedded into the fixing cylinder 9 and abut against the bottom of the rubber block 10, so that two adjacent groups of circuit boards can be separated, the phenomenon that heat is not easy to dissipate due to the fact that the circuit boards are attached together is avoided, the phenomenon that impedance inside the circuit boards is increased due to overhigh heat is prevented, and normal use of the multi-layer circuit boards is guaranteed; the rubber block 10 is arranged, so that the vibration generated by the multilayer circuit board can be buffered, and the multilayer circuit board has a certain protection effect; pass the through-hole on last connecting block 4 and the well connecting plate 5 respectively with the fixed orifices threaded connection on the connecting block 6 down with the one end of slide bar 7, fix through nut 8 and slide bar 7 threaded connection, can stabilize first circuit board 1, the connection between second circuit board 2 and the third circuit board 3, guarantee the normal use of multilayer circuit board, and simultaneously, can be with first circuit board 1, second circuit board 2 and third circuit board 3 carry out quick dismantlement, the staff of being convenient for is to first circuit board 1, second circuit board 2 and 3 maintenance and the change of third circuit board.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A low-impedance multilayer circuit board is characterized by comprising a first circuit board (1), a second circuit board (2) positioned below the first circuit board (1) and a third circuit board (3) positioned below the second circuit board (2); the left side and the right side of the first circuit board (1), the second circuit board (2) and the third circuit board (3) are fixedly connected with an upper connecting block (4), a middle connecting block (5) and a lower connecting block (6) respectively; a sliding rod (7) penetrates through the upper connecting block (4), the middle connecting block (5) and the lower connecting block (6), one end of the sliding rod (7) is fixedly connected with the lower connecting block (6), and the other end of the sliding rod penetrates through the upper connecting block (4) and is in threaded connection with a nut (8); two sides of the bottoms of the first circuit board (1), the second circuit board (2) and the third circuit board (3) are fixedly connected with fixed cylinders (9), and rubber blocks (10) are arranged in the fixed cylinders (9); the top both sides of first circuit board (1), second circuit board (2) and third circuit board (3) all are equipped with fixed cylinder (9) assorted fixed column (11), are connected with rubber block (10) in fixed cylinder (9) are embedded into to the top of fixed column (11).
2. The low impedance multilayer wiring board of claim 1, wherein: the upper connecting block (4) and the middle connecting block (5) are respectively provided with a through hole at the corresponding position of the sliding rod (7), and the through holes are movably connected with the sliding rod (7).
3. The low impedance multilayer wiring board of claim 1, wherein: the upper side and the lower side of the first circuit board (1), the second circuit board (2) and the third circuit board (3) are respectively provided with a heat dissipation plate (12).
4. The low impedance multilayer wiring board of claim 1, wherein: the bottom of first circuit board (1), second circuit board (2) and third circuit board (3) all is equipped with four solid fixed cylinder (9), and four solid fixed cylinder (9) are the rectangle and arrange.
5. The low impedance multilayer wiring board of claim 1, wherein: and a fixing hole for connecting the sliding rod (7) is formed in the corresponding position of the sliding rod (7) on the lower connecting block (6), and the sliding rod (7) is in threaded connection with the fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017231.4U CN211128410U (en) | 2019-11-20 | 2019-11-20 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017231.4U CN211128410U (en) | 2019-11-20 | 2019-11-20 | Low-impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211128410U true CN211128410U (en) | 2020-07-28 |
Family
ID=71692652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922017231.4U Active CN211128410U (en) | 2019-11-20 | 2019-11-20 | Low-impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211128410U (en) |
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2019
- 2019-11-20 CN CN201922017231.4U patent/CN211128410U/en active Active
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