CN211090380U - Resistor heat dissipation device - Google Patents
Resistor heat dissipation device Download PDFInfo
- Publication number
- CN211090380U CN211090380U CN201921683664.7U CN201921683664U CN211090380U CN 211090380 U CN211090380 U CN 211090380U CN 201921683664 U CN201921683664 U CN 201921683664U CN 211090380 U CN211090380 U CN 211090380U
- Authority
- CN
- China
- Prior art keywords
- cooling module
- resistance
- heating panel
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a resistance heat abstractor belongs to the manufacturing field. For solving the problem that the present circuit board circular telegram resistance generates heat and influences power performance, design the utility model discloses a through the upper and lower heating panel of bolt fastening on the cooling module and cladding on the resistance on the circuit board, the cooling module both ends are equipped with water pipe head, and lower heating panel is U type structure, and on its one side direction right side extended through the bolt fastening in the cooling module, on going up the heating panel cover and locating down the heating panel, through the bolt fastening. The utility model discloses a resistance heat abstractor accomplishes being connected between resistance and the cooling module through specific structure to the cooling of resistance is accomplished to the mode of heat transfer, simple structure, the radiating efficiency is high.
Description
Technical Field
The utility model relates to a manufacturing field especially relates to a resistance heat abstractor.
Background
The resistor on the circuit board in the ultra-high stability power supply generates heat when being electrified, and the stability of the power supply is influenced, so that a resistor heat dissipation device needs to be developed, the resistor is connected with the cooling module through a specific structure, and the heat dissipation of the resistor is completed in a heat transfer mode.
Disclosure of Invention
The utility model aims at providing a resistance heat abstractor solves the resistance circular telegram on the circuit board and generates heat in the current super high stability power, influences the problem of power stability, and a research and development section can be with higher efficiency completion resistance radiating resistance heat abstractor.
In order to achieve the above object, the utility model provides a resistance heat abstractor, include through the upper and lower heating panel of bolted fixation on the cooling module 1 and cladding on resistance 2 on the circuit board 5, 1 both ends of cooling module are equipped with water pipe head 6, heating panel 3 is the U template down, and its one side is extended on being fixed in cooling module 1 through the bolt, on 4 covers of last heating panel locate down heating panel 3, through the bolt fastening.
Preferably, a cooling water channel is arranged in the cooling module 1, and water pipe joints 6 are arranged at two ends of the cooling water channel.
Preferably, the upper heat sink 4 is a profile structure, covers the resistor 2, and is filled with a heat conductive silicone grease 7.
Has the advantages that:
(1) the upper heat dissipation plate adopts a profiling structure, the resistor is coated, the heat dissipation area is enlarged, and the heat conduction silicone grease is arranged in the middle of the upper heat dissipation plate, so that the heat dissipation efficiency is improved.
(2) One end of the lower radiating plate is connected with the cooling module, and the other end of the lower radiating plate is connected with the upper radiating plate, so that the connection between the resistor and the cooling module is realized, and the heat dissipation of the resistor is realized in a heat conduction mode.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic structural view of a resistor heat dissipation device of the present invention.
Fig. 2 is a schematic diagram of the resistor heat dissipation device according to the present invention.
Fig. 3 is a schematic side view of the resistor heat sink of the present invention.
Fig. 4 is a schematic diagram of the resistor heat dissipation device according to the present invention.
Wherein: 1-a cooling module; 2-resistance; 3-lower heat dissipation plate; 4-upper heat sink; 5-a circuit board; 6-water pipe joint; 7-heat-conducting silicone grease.
Detailed Description
The following describes embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is the utility model relates to a resistance heat abstractor schematic structure diagram, fig. 2 is the utility model relates to a local enlarged schematic diagram of resistance heat abstractor, fig. 3 is the utility model relates to a resistance heat abstractor looks sideways at the structure schematic diagram, fig. 4 is the utility model relates to a local enlarged schematic diagram of resistance heat abstractor, as shown in the figure, a resistance heat abstractor, include through the upper and lower heating panel of bolt fastening cooling module 1 and cladding on circuit board 5 on resistance 2, cooling module 1 both ends are equipped with water pipe head 6, heating panel 3 is U type structure down, and its side direction right side is extended on through bolt fastening cooling module 1, on 4 covers of last heating panel locate down heating panel 3, through the bolt fastening.
The cooling module 1 is internally provided with a cylindrical cooling water channel, and the two ends of the cooling module are provided with water pipe connectors 6, so that cooling water can flow in the cooling module 1 conveniently.
As shown in fig. 2, the upper heat dissipation plate 4 adopts a profiling structure, the resistor 2 is coated, the contact area is increased, and the heat conduction silicone grease 7 is coated inside the upper heat dissipation plate 4, so that the heat dissipation efficiency is improved, and the temperature reduction of the resistor is accelerated.
As shown in fig. 3, the lower heat dissipating plate 3 is a U-shaped structure, one side plate of which extends to the right and is fixed on the cooling module 1 through bolts, and the plate surface is in direct contact with the cooling module 1 to increase the contact area and facilitate heat conduction, and as shown in fig. 4, the other side of the lower heat dissipating plate is directly inserted into the upper heat dissipating plate 4 and is fixed by bolts to increase the contact area between the lower heat dissipating plate 3 and the upper heat dissipating plate 4 and improve the heat conduction efficiency.
When the power supply works, the resistor 2 generates heat, and heat energy generated by the resistor is transmitted to the lower heating panel 3 through the upper heating panel 4, and then transmitted to the cooling module 1 to cool the resistor 2, so that the heat dissipation of the resistor 2 is realized.
The utility model provides a resistance heat abstractor, simple structure, the radiating efficiency is high, accomplishes being connected between resistance and the cooling module through specific structure to the heat dissipation of resistance is accomplished to the mode of heat transfer.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it, although the technical solution of the present invention is described in detail with reference to the preferred embodiments, the skilled person of the present invention should understand that: the technical solution of the present invention can still be modified or replaced by other equivalent means, and the modified technical solution can not be separated from the spirit and scope of the technical solution of the present invention.
Claims (3)
1. The utility model provides a resistance heat abstractor, includes the upper and lower heating panel of cooling module and cladding on the resistance on the circuit board through the bolt fastening, its characterized in that: the cooling module both ends are equipped with water pipe head, lower heating panel is U type structure, and its one side right extension is fixed in the cooling module on through the bolt, go up the heating panel cover and locate on the heating panel down, through the bolt fastening.
2. A resistive heat sink in accordance with claim 1, wherein: and a cooling water channel is arranged in the cooling module, and water pipe joints are arranged at two ends of the cooling module.
3. A resistive heat sink in accordance with claim 1, wherein: the upper heat dissipation plate adopts a profiling structure, the resistor is coated, and heat-conducting silicone grease is filled inside the upper heat dissipation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921683664.7U CN211090380U (en) | 2019-10-10 | 2019-10-10 | Resistor heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921683664.7U CN211090380U (en) | 2019-10-10 | 2019-10-10 | Resistor heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090380U true CN211090380U (en) | 2020-07-24 |
Family
ID=71641128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921683664.7U Active CN211090380U (en) | 2019-10-10 | 2019-10-10 | Resistor heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211090380U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856095A (en) * | 2020-07-28 | 2020-10-30 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
-
2019
- 2019-10-10 CN CN201921683664.7U patent/CN211090380U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856095A (en) * | 2020-07-28 | 2020-10-30 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
| CN111856095B (en) * | 2020-07-28 | 2023-04-11 | 哈尔滨工业大学 | Pulse high-voltage load resistor module, assembling method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207183037U (en) | A kind of highly effective transformer heat abstractor | |
| CN203206148U (en) | Solar power generation apparatus capable of improving efficiency | |
| CN211090380U (en) | Resistor heat dissipation device | |
| CN207201211U (en) | Homogeneous temperature type air-cooled radiator and photovoltaic DC-to-AC converter | |
| CN209462262U (en) | A kind of EDR rectifier | |
| CN205230713U (en) | Solar energy transformer cooling device | |
| CN201364059Y (en) | Tower type heat dissipating structure of solar energy device | |
| CN203422005U (en) | Energy-saving radiator with combination between copper and aluminum | |
| CN201114831Y (en) | Novel carbon fiber heater | |
| CN207340419U (en) | Energy-saving, environment-friendly and high-efficiency heat-transfer device | |
| CN209462863U (en) | A kind of radiator and heat radiator assembly | |
| CN208338182U (en) | A kind of novel electron cooling fin | |
| CN207398131U (en) | A kind of device radiation structure based on heat pipe water conservancy diversion | |
| CN206178620U (en) | Quick detachable compound cooling formula computer radiator | |
| CN220232931U (en) | Vehicle-mounted charging high-temperature direct-current filter capacitor | |
| CN213019872U (en) | High-pressure radiator | |
| CN219758750U (en) | Computer heat abstractor | |
| CN205124217U (en) | Radiator unit with wind -guiding function | |
| CN213840858U (en) | High-heat-conduction environment-friendly radiator bottom plate | |
| CN208622706U (en) | A kind of novel high-performance ESD transistor arrangement | |
| CN221448287U (en) | Inverter for energy storage power supply | |
| CN204518312U (en) | A kind of water-filled radiator | |
| CN204740554U (en) | CPU heat radiation structure and terminal | |
| CN210432125U (en) | Distribution switch controller convenient to installation heat dissipation | |
| CN213755498U (en) | Square heat pipe radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201118 Address after: 071000 commercial, Room 202, Shenzhen Garden Exhibition Center, 299 Dongsanhuan, Lianchi District, Baoding City, Hebei Province Patentee after: HEBEI HUIREN MEDICAL EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: 072450 No. 1 Ziqiang Street, Wangdu County Economic Development Zone, Baoding City, Hebei Province Patentee before: HUIREN WANGDU MEDICAL EQUIPMENT SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |