CN211090126U - Novel circuit board jointed board - Google Patents
Novel circuit board jointed board Download PDFInfo
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- CN211090126U CN211090126U CN201922179634.9U CN201922179634U CN211090126U CN 211090126 U CN211090126 U CN 211090126U CN 201922179634 U CN201922179634 U CN 201922179634U CN 211090126 U CN211090126 U CN 211090126U
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- circuit boards
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Abstract
The utility model relates to a novel circuit board jointed board, which comprises a plurality of rectangular circuit boards arranged along a straight line; two side edges of the novel circuit board splicing plate are respectively provided with a technical edge, and two side edges of each circuit board are respectively connected with one technical edge through a plurality of connecting bridges, so that a plurality of circuit boards are connected into a whole; a plurality of stamp holes are uniformly arranged on the connecting bridge along the direction parallel to the technical edge. The utility model designs a jointed board structure composed of a plurality of circuit boards, the size and the strength of the structure are reasonable, and the process requirements in the batch production of the circuit boards can be met; each circuit board is connected with the technical edge of the side face through a connecting bridge comprising the stamp hole, so that the technical edge is only clamped when the circuit board needs to be clamped in the production process, and the circuit board cannot be damaged; and through the arrangement of the stamp holes, a single circuit board can be easily taken down from the jointed board structure, burrs are not generated, and the production efficiency and the yield of the circuit board are greatly improved.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to novel circuit board makeup.
Background
At present, in mass production of circuit boards, a circuit board is usually assembled into a structure of a board assembly from a plurality of circuit boards before being separated. The circuit board is thin, so that the circuit board is easily damaged when the machine clamps the circuit board; and when the circuit board is welded, the circuit board is easy to warp and deform, the welding quality is further influenced, and the problems of insufficient solder, bending of the circuit board and the like are caused, so that the defective products of the circuit board are greatly increased. In addition, the existing jointed circuit board is easy to generate a large amount of burrs needing manual repair in the process of processing and splitting the circuit board into single circuit boards, and the production efficiency is seriously influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model discloses a technical scheme is:
a novel circuit board jointed board comprises a plurality of rectangular circuit boards which are arranged along a straight line;
two side edges of the novel circuit board splicing plate are respectively provided with a technical edge, and two side edges of each circuit board are respectively connected with one technical edge through a plurality of connecting bridges, so that the circuit boards are connected into a whole;
and a plurality of stamp holes are uniformly formed in the connecting bridge along the direction parallel to the technical edge.
In some embodiments, the number of circuit boards is five.
In some embodiments, each technical edge is provided with two technical edge positioning points.
In some embodiments, two circuit board positioning points are respectively disposed on the front surface and the back surface of each circuit board.
In some embodiments, each of the circuit boards has a rectangular shape with a dimension of 67.5mm by 40mm, and two shorter sides of the circuit board are connected to the process side through the connection bridges.
In some embodiments, each of the circuit boards has a thickness of 1.2 mm; the width of each technical edge is 5 mm; each connecting bridge is 3mm in length; the distance between two adjacent circuit boards is 3 mm.
In some embodiments, one side of each of the circuit boards is connected to the process edge by two of the connecting bridges; seven stamp holes are arranged on each connecting bridge.
In some embodiments, each of the circuit boards has an eight-layer structure, which includes, in order from top to bottom, a first signal routing layer, a first ground layer, a second signal routing layer, a power layer, a second ground layer, a third routing layer, a third ground layer, and a fourth signal routing layer.
The utility model has the advantages that:
the utility model provides a novel circuit board jointed board, which designs a jointed board structure consisting of a plurality of circuit boards distributed along a straight line, and the structure has reasonable size and strength and can meet the process requirements in the batch production of the circuit boards; each circuit board is connected with the technical edge of the side face through a connecting bridge comprising the stamp hole, so that the technical edge is only clamped when the circuit board needs to be clamped in the production process, and the circuit board cannot be damaged; and through the arrangement of the stamp holes, a single circuit board can be easily taken down from the jointed board structure, burrs are not generated, and the production efficiency and the yield of the circuit board are greatly improved.
Drawings
Other objects and advantages of the present invention will become apparent from the following description of the invention, which is made with reference to the accompanying drawings, and can help to provide a thorough understanding of the present invention.
Fig. 1 is an appearance schematic view of a novel circuit board jointed board provided by the present invention;
fig. 2a to fig. 2h are schematic external views of eight-layer structures of the circuit board, respectively.
Detailed Description
The present invention, a novel circuit board assembly, will be described in detail with reference to the following examples and accompanying drawings.
A novel circuit board splicing board is shown in figure 1 and comprises a plurality of rectangular circuit boards 1 which are arranged along a straight line; two side edges of the novel circuit board splicing plate are respectively provided with a technical edge 2, and two side edges of each circuit board 1 are respectively connected with one technical edge 2 through a plurality of connecting bridges 3, so that a plurality of circuit boards 1 are connected into a whole; and a plurality of stamp holes 4 are uniformly arranged on the connecting bridge 3 along the direction parallel to the technical edge 2. In the illustrated embodiment, the number of the circuit boards 1 is five, and it is understood that in other embodiments, the number of the circuit boards 1 may also be other numbers, such as three, four, six, etc., according to practical situations.
Preferably, each technical edge 2 is provided with two technical edge positioning points 5, and the positions of the two technical edge positioning points 5 can be respectively arranged at two ends of the technical edge 2, or can be arranged at other suitable positions, as long as the positioning of the jointed boards of the circuit board can be realized by matching with production equipment. In addition, referring to fig. 2a and fig. 2h, two circuit board positioning points 6 may also be respectively disposed on the front and back surfaces of each circuit board 1, where fig. 2a shows the positions of the two circuit board positioning points 6 on the front surface of the circuit board 1, and fig. 2h shows the positions of the two circuit board positioning points 6 on the back surface of the circuit board 1. By setting the positioning points on the circuit board 1 and the process edge 2, the yield and the accuracy of the positions where the components are welded can be improved when the circuit board 1 is mass-produced.
In a specific embodiment, each circuit board 1 has a rectangular shape with dimensions 67.5mm x 40mm, the two shorter sides of the circuit board 1 being connected to the process side 2 by means of a connecting bridge 3. The thickness of each circuit board 1 is 1.2 mm; the width of each technical edge is 5 mm; each connecting bridge 3 is 3mm long (namely, the distance between the technical edge 2 and the circuit board 1 is 3 mm); the distance between two adjacent circuit boards is 3 mm. One side of each circuit board 1 is connected with the process edge 2 through two connecting bridges 3; each connecting bridge 3 is provided with seven stamp holes 4.
In summary, the novel circuit board jointed board provided by the utility model designs a jointed board structure consisting of a plurality of circuit boards 1 distributed along a straight line, and the structure has reasonable size and strength and can meet the process requirements in the batch production of the circuit boards 1; each circuit board 1 is connected with the technical edge 2 of the side surface through a connecting bridge 3 comprising a stamp hole 4, so that the technical edge 2 only needs to be clamped when the circuit board 1 needs to be clamped in the production process, and the circuit board 1 cannot be damaged; through the arrangement of the stamp holes 4, the single circuit board 1 can be easily taken down from the jointed board structure by hands or pincers or automatic equipment which can be slightly broken off along the direction of the stamp holes 4, no burr is generated, and the production efficiency and the yield of the circuit board 1 are greatly improved.
Preferably, each circuit board 1 has an eight-layer structure, as shown in fig. 2 a-2 h, which are schematic views of the eight-layer structure of the circuit board 1 from top to bottom, respectively. Specifically, the eight-layer structure includes, in order from top to bottom, a first signal routing layer, a first ground layer, a second signal routing layer, a power layer, a second ground layer, a third routing layer, a third ground layer, and a fourth signal routing layer. By such a lamination, a plurality of signal wiring layers and ground layers are provided at intervals, so that the circuit board 1 has a very good geomagnetism absorption capability.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (8)
1. A novel circuit board jointed board is characterized by comprising a plurality of rectangular circuit boards which are arranged along a straight line;
two side edges of the novel circuit board splicing plate are respectively provided with a technical edge, and two side edges of each circuit board are respectively connected with one technical edge through a plurality of connecting bridges, so that the circuit boards are connected into a whole;
and a plurality of stamp holes are uniformly formed in the connecting bridge along the direction parallel to the technical edge.
2. A novel circuit board panel as claimed in claim 1, wherein the number of said circuit boards is five.
3. A novel circuit board panel as defined in claim 1 wherein each of said technical edges is provided with two technical edge locating points.
4. A novel circuit board panel as claimed in claim 1, wherein each of said circuit boards has two circuit board locating points on both sides.
5. A novel circuit board panel as claimed in claim 1, wherein each of said circuit boards is 67.5mm x 40mm rectangular and the two shorter sides of said circuit board are connected to said technical side by said bridges.
6. A novel circuit board panel as claimed in claim 1, wherein each said circuit board has a thickness of 1.2 mm; the width of each technical edge is 5 mm; each connecting bridge is 3mm in length; the distance between two adjacent circuit boards is 3 mm.
7. A novel circuit board panel as claimed in claim 1, wherein one side of each circuit board is connected to said technical edge by two said connecting bridges; seven stamp holes are arranged on each connecting bridge.
8. A novel circuit board panel as claimed in claim 1, wherein each of said circuit boards has an eight-layer structure comprising, in order from top to bottom, a first signal trace layer, a first ground layer, a second signal trace layer, a power layer, a second ground layer, a third trace layer, a third ground layer and a fourth signal trace layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922179634.9U CN211090126U (en) | 2019-12-09 | 2019-12-09 | Novel circuit board jointed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922179634.9U CN211090126U (en) | 2019-12-09 | 2019-12-09 | Novel circuit board jointed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090126U true CN211090126U (en) | 2020-07-24 |
Family
ID=71623955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922179634.9U Active CN211090126U (en) | 2019-12-09 | 2019-12-09 | Novel circuit board jointed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211090126U (en) |
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2019
- 2019-12-09 CN CN201922179634.9U patent/CN211090126U/en active Active
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