CN210868296U - Multilayer circuit board with inner layer convenient to install - Google Patents
Multilayer circuit board with inner layer convenient to install Download PDFInfo
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- CN210868296U CN210868296U CN201920002948.9U CN201920002948U CN210868296U CN 210868296 U CN210868296 U CN 210868296U CN 201920002948 U CN201920002948 U CN 201920002948U CN 210868296 U CN210868296 U CN 210868296U
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Abstract
The utility model discloses an inlayer easy to assemble's multilayer circuit board, including last circuit board, the circuit board under the bottom movable mounting of going up the circuit board, movable mounting has the circuit mainboard between going up the circuit board and the circuit board down, the intermediate position fixed mounting who goes up the upper end of circuit board has the stopper, the splice groove has been seted up to the intermediate position of circuit board top avris down, the up end fixed mounting of circuit mainboard has the transmission utmost point, the butt joint mounting groove has been seted up at the both ends of circuit mainboard, fixed mounting has connecting wire between the circuit component. This inlayer easy to assemble's multilayer circuit board compares with original multilayer circuit board, has carried out great optimization transformation to the concatenation compound mode to the complex process that traditional heating, pressurization and adhesion were replaced to the concatenation mode of the groove piece butt joint that can freely dismantle, effectively enlarged holistic application scope and effectual life who prolongs this multilayer circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is an inlayer easy to assemble's multilayer circuit board.
Background
The circuit board is a product of science and technology under continuous development of a new era and is also a proof of the progress of the science and technology level, the circuit board is divided into three categories of a single panel, a double-sided board and a multilayer circuit board according to the number of layers, and the multilayer circuit board is widely applied to a plurality of fields due to excellent performance and rich functionality.
The multilayer board is produced through the processes of making inner layer pattern, printing and etching to form single-sided or double-sided base board, heating, pressurizing and adhering, and drilling hole in the base board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an inlayer easy to assemble's multilayer circuit board to propose in solving above-mentioned background art and adopt traditional multilayer combination mode, with heating, pressurization and give the bonding as main processing mode, this kind of mode can let the circuit board effectively bond, nevertheless when breaking down, because the circuit mainboard is in the intermediate position, inconvenient dismantlement maintenance leads to the practical of multilayer circuit board low, the shorter problem of life.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer circuit board with an inner layer convenient to install comprises an upper circuit board, a lower circuit board is movably installed at the bottom of the upper circuit board, a circuit main board is movably installed between the upper circuit board and the lower circuit board, a limiting block is fixedly installed at the middle position of the upper end of the upper circuit board, a butt joint installation lug is fixedly installed on the inner wall of the upper circuit board, a receiving electrode is fixedly installed at the bottom of the upper circuit board, a splicing rod is fixedly installed at the middle position of the bottom edge side of the upper circuit board, a connecting element is fixedly installed at the upper end position of the front side of the upper circuit board, a circuit element is fixedly installed at the front side of the upper circuit board, a circuit main control module is fixedly installed at the middle position of the upper end of the front side of the upper circuit board, a butt joint installation lug is fixedly installed on, the splicing groove is formed in the middle of the side of the top of the lower circuit board, the transmission pole is fixedly mounted on the upper end face of the circuit main board, the butt joint mounting grooves are formed in the two ends of the circuit main board, and connecting wires are fixedly mounted between the circuit elements.
Preferably, the outer shapes of the upper circuit board and the lower circuit board are the same, and the outer diameter of the splicing rod arranged at the bottom of the upper circuit board is matched with the inner diameter of the splicing groove formed at the top of the lower circuit board.
Preferably, the thickness of the circuit main board is matched with the height of the reserved space after the upper circuit board and the lower circuit board are installed, and the position of the butt joint installation groove formed in the side edge of the circuit main board corresponds to the position of the butt joint installation lug fixed on the inner walls of the upper circuit board and the lower circuit board.
Preferably, the limiting block is fixedly provided with two limiting blocks with the same specification at the middle positions of the upper end and the lower end of the upper circuit board, and the external specification of the butt joint installation lug is matched with the internal specification of the butt joint installation groove.
Preferably, the receiving electrodes are fixedly installed on the upper end face and the bottom of the circuit main board at equal intervals, and the transmission electrodes on the circuit main board correspond to the positions of the receiving electrodes installed on the bottom of the upper circuit board and the top of the lower circuit board.
Preferably, the circuit elements are fixed on the upper end face of the upper circuit board in disorder, and connecting leads for connecting the circuit elements with each other do not affect each other.
Compared with the prior art, the beneficial effects of the utility model are that: this inlayer easy to assemble's multilayer circuit board compares with original multilayer circuit board, great optimization transformation has been carried out to the concatenation compound mode, the traditional heating is replaced to the concatenation mode of the groove piece butt joint that can freely dismantle, pressurize and give adhesive complicated process, make this multilayer circuit board simple to operate, stable in use, can realize dismantling the holistic functionality of this multilayer circuit board to the quick of inlayer circuit mainboard when breaking down, effectively enlarged holistic application scope and the effectual life who prolongs this multilayer circuit board.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic view of the split structure of the present invention;
in the figure: 1. an upper circuit board; 2. a lower circuit board; 3. a circuit main board; 4. a limiting block; 5. butting and mounting the convex blocks; 6. a receiver electrode; 7. a transmission electrode; 8. butting and mounting the grooves; 9. splicing rods; 10. splicing grooves; 11. a connecting element; 12. a circuit element; 13. connecting a lead; 14. and the line main control module.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a multilayer circuit board with an inner layer convenient to install comprises an upper circuit board 1, a lower circuit board 2, a circuit main board 3, a limiting block 4, a butt joint installation lug 5, a receiving electrode 6, a transmission electrode 7, a butt joint installation groove 8, a splicing rod 9, a splicing groove 10, a connecting element 11, a circuit element 12, a connecting lead 13 and a circuit main control module 14, wherein the lower circuit board 2 is movably installed at the bottom of the upper circuit board 1, the circuit main board 3 is movably installed between the upper circuit board 1 and the lower circuit board 2, the limiting block 4 is fixedly installed at the middle position of the upper end of the upper circuit board 1, the butt joint installation lug 5 is fixedly installed on the inner wall of the upper circuit board 1, the receiving electrode 6 is fixedly installed at the bottom of the upper circuit board 1, the splicing rod 9 is fixedly installed at the middle position of the bottom edge side of the upper circuit, the front side of the upper circuit board 1 is fixedly provided with a circuit element 12, the middle position of the upper end of the front side of the upper circuit board 1 is fixedly provided with a circuit main control module 14, the inner wall of the inner part of the lower circuit board 2 is fixedly provided with a butt joint installation lug 5, the top of the lower circuit board 2 is fixedly provided with a receiving electrode 6, the middle position of the side of the top of the lower circuit board 2 is provided with a splicing groove 10, the upper end surface of the circuit main board 3 is fixedly provided with a transmission electrode 7, the two ends of the circuit main board 3 are provided with butt joint installation grooves 8;
furthermore, the external shapes of the upper circuit board 1 and the lower circuit board 2 are the same, and the outer diameter of the splicing rod 9 arranged at the bottom of the upper circuit board 1 is matched with the inner diameter of the splicing groove 10 arranged at the top of the lower circuit board 2, so that the integral appearance integrity of the multilayer circuit board is effectively ensured on the basis of stable splicing and installation;
furthermore, the thickness dimension of the circuit main board 3 is matched with the height dimension of a reserved space after the upper circuit board 1 and the lower circuit board 2 are installed, and the position of a butt joint installation groove 8 formed in the side edge of the circuit main board 3 corresponds to the position of a butt joint installation lug 5 fixed on the inner walls of the upper circuit board 1 and the lower circuit board 2, so that the upper circuit board 1, the lower circuit board 2 and the circuit main board 3 can be stably connected, and the normal use of the multilayer circuit board is ensured;
furthermore, two limiting blocks 4 with the same specification are fixedly arranged at the middle positions of the upper end and the lower end of the upper circuit board 1, the external specification of the butt joint mounting lug 5 is matched with the internal specification of the butt joint mounting groove 8, the upper circuit board 1 and the lower circuit board 2 are prevented from being deviated when being spliced and mounted, and the rationality of the whole structure is ensured;
furthermore, the receiving electrodes 6 are fixedly arranged on the upper end surface and the bottom of the circuit main board 3 at equal intervals, and the transmission electrodes 7 on the circuit main board 3 correspond to the positions of the receiving electrodes 6 arranged on the bottom of the upper circuit board 1 and the top of the lower circuit board 2, so that the multilayer circuit board can be ensured to work stably;
further, the circuit elements 12 are fixed on the upper end face of the upper wiring board 1 in disorder, and the connecting leads 13 of the circuit elements 12 connected with each other are not affected by each other, so that the normal use of the multilayer wiring board is not disturbed.
The working principle is as follows: as shown in fig. 3, the upper circuit board 1 and the lower circuit board 2 are stably clamped and spliced by using the corresponding position relationship between the splicing rod 9 installed at the bottom of the upper circuit board 1 and the splicing groove 10 formed at the top of the lower circuit board 2, the circuit main board 3 is stably installed in the internal space reserved after the upper circuit board 1 and the lower circuit board 2 are spliced by using the corresponding position relationship between the butt-joint installation bump 5 fixed at the inner side of the upper circuit board 1 and the lower circuit board 2 and the butt-joint installation groove 8 formed at the side of the circuit main board 3, the transmission electrode 7 installed at the upper end surface and the bottom of the circuit main board 3 and the receiving electrode 6 installed at the bottom of the upper circuit board 1 and the top of the lower circuit board 2 correspond to each other during the installation process, so as to ensure the normal use of the multilayer circuit board, and after the installation, the connection elements 11 at the two ends of the upper circuit board, the circuit components 12 on the upper circuit board 1 are stably connected through the connecting leads 13, and the circuit main control module 14 is used as a junction control point of the connecting leads 13 between the circuit components 12 on the upper circuit board 1, so that the normal use of the multilayer circuit board is ensured.
It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. The utility model provides an inlayer easy to assemble's multilayer circuit board, includes last circuit board (1), its characterized in that: the bottom movable mounting of going up circuit board (1) has circuit board (2) down, movable mounting has circuit mainboard (3) between going up circuit board (1) and circuit board (2) down, the intermediate position fixed mounting of the upper end of going up circuit board (1) has stopper (4), the inside inner wall fixed mounting of going up circuit board (1) has butt joint installation lug (5), the bottom fixed mounting of going up circuit board (1) has receiving pole (6), the intermediate position fixed mounting of going up circuit board (1) bottom avris has splice bar (9), the positive upper end position fixed mounting of going up circuit board (1) has connecting element (11), the positive fixed mounting of going up circuit board (1) has circuit component (12), the positive intermediate position fixed mounting of the upper end of going up circuit board (1) has circuit host system (14), the inside inner wall fixed mounting of circuit board (2) has butt joint installation lug (5) down, the top fixed mounting of circuit board (2) has receiving pole (6) down, splice groove (10) have been seted up to the intermediate position of circuit board (2) top avris down, the up end fixed mounting of circuit mainboard (3) has transmission utmost point (7), butt joint mounting groove (8) have been seted up at the both ends of circuit mainboard (3), fixed mounting has connecting wire (13) between circuit component (12).
2. An inner layer easy to install multilayer circuit board according to claim 1, wherein: the outer shape of the upper circuit board (1) is the same as that of the lower circuit board (2), and the outer diameter of the splicing rod (9) installed at the bottom of the upper circuit board (1) is identical with the inner diameter of the splicing groove (10) formed at the top of the lower circuit board (2).
3. An inner layer easy to install multilayer circuit board according to claim 1, wherein: the thickness dimension of the circuit main board (3) is matched with the height dimension of a reserved space after the upper circuit board (1) and the lower circuit board (2) are installed, and the position of the butt joint installation groove (8) formed in the side edge of the circuit main board (3) corresponds to the position of the butt joint installation lug (5) fixed on the inner wall in the upper circuit board (1) and the lower circuit board (2).
4. An inner layer easy to install multilayer circuit board according to claim 1, wherein: the limiting blocks (4) are fixedly installed at the middle positions of the upper end and the lower end of the upper circuit board (1) and are the same in specification, and the external specification of the butt joint installation convex blocks (5) is matched with the internal specification of the butt joint installation grooves (8).
5. An inner layer easy to install multilayer circuit board according to claim 1, wherein: the receiving electrode (6) is fixedly arranged on the upper end face and the bottom of the circuit main board (3) at equal intervals, and the transmission electrode (7) on the circuit main board (3) corresponds to the position of the receiving electrode (6) arranged at the bottom of the upper circuit board (1) and the top of the lower circuit board (2).
6. An inner layer easy to install multilayer circuit board according to claim 1, wherein: the circuit elements (12) are fixed on the upper end face of the upper circuit board (1) in disorder, and the connecting leads (13) of the circuit elements (12) which are connected with each other are not affected by each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920002948.9U CN210868296U (en) | 2019-01-02 | 2019-01-02 | Multilayer circuit board with inner layer convenient to install |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920002948.9U CN210868296U (en) | 2019-01-02 | 2019-01-02 | Multilayer circuit board with inner layer convenient to install |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210868296U true CN210868296U (en) | 2020-06-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920002948.9U Active CN210868296U (en) | 2019-01-02 | 2019-01-02 | Multilayer circuit board with inner layer convenient to install |
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| CN (1) | CN210868296U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163593A (en) * | 2021-05-21 | 2021-07-23 | 中山市基信锁芯有限公司 | Circuit board assembly of circuit board for sensor |
-
2019
- 2019-01-02 CN CN201920002948.9U patent/CN210868296U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163593A (en) * | 2021-05-21 | 2021-07-23 | 中山市基信锁芯有限公司 | Circuit board assembly of circuit board for sensor |
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