CN211088237U

CN211088237U - Multi-size wafer centering device

Info

Publication number: CN211088237U
Application number: CN202020049576.8U
Authority: CN
Inventors: 丁杰
Original assignee: Shenzhen Xinshunxin Technology Co ltd
Current assignee: Shenzhen Xinshunxin Technology Co ltd
Priority date: 2020-01-09
Filing date: 2020-01-09
Publication date: 2020-07-24
Anticipated expiration: 2030-01-09

Abstract

The utility model relates to a correction technical field of wafer position discloses a many sizes wafer centering device, the on-line screen storage device comprises a base, the top both sides of base all are provided with the stand, the top of stand is provided with the gas claw, the top of gas claw is connected with the movable block, one of them the top of movable block is fixed with centering fixture, another the top of movable block is fixed with centering fixture down, all be provided with adjustment mechanism on going up centering fixture, the centering fixture down, the top middle part of base is provided with connects the cylinder, the output of connecting the cylinder is provided with the cushion cap, the cushion cap is provided with the wafer, the both sides of wafer respectively with last centering fixture, centering fixture phase-match down. The utility model discloses an adjustment mechanism who sets up can change the interval of last centering fixture or lower centering fixture in fixed fixture and mobile fixture to be convenient for carry out the centering operation to unidimensional wafer.

Description

Multi-size wafer centering device

Technical Field

The utility model relates to a correction technical field of wafer position especially relates to a many sizes wafer centering device.

Background

At present, a semiconductor processing factory generally requires a machine table capable of compatibly processing wafers of different sizes in order to save equipment cost, but the existing processing equipment has a complex structure and a large volume, and occupies a large space; and the wafer calibration precision is low, and the processing requirements cannot be met.

Through retrieval, the chinese patent No. CN103730400B discloses a multi-size wafer centering device, which comprises a workbench, a power device, a clamping mechanism, a wafer-holding table and supporting columns, wherein the power device is mounted on the workbench, the wafer-holding table is mounted on the workbench, a plurality of supporting columns are distributed around the wafer-holding table, and the top end of the wafer-holding table and the top ends of the supporting columns have height difference and bear wafers of different sizes; the clamping mechanism is connected with the output end of the power device, and wafers are clamped inwards by the two sides of the wafer bearing table and the supporting columns through the driving of the power device, so that the centering of the wafers is completed.

The existing multi-size wafer centering device has the following defects: only the clamps of two-inch wafer and four-inch wafer are arranged, so that the device can only perform centering setting on wafers of two sizes, is poor in practicability and cannot achieve centering setting of multiple sizes.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a many sizes wafer centering device, adjustment mechanism through setting up can change the interval of last centering fixture or lower centering fixture in fixed fixture and removal fixture, thereby be convenient for carry out the advantage of centering operation to unidimensional wafer, the current many sizes wafer centering device has been solved and has only set up the fixture of two cun wafers and four cun wafers, from this can know the device and only can carry out the centering setting to the wafer of two sizes, the practicality is relatively poor, can't reach the problem that a plurality of sizes centering set up.

According to the utility model discloses many sizes wafer centering device, the on-line screen storage device comprises a base, the top both sides of base all are provided with the stand, the top of stand is provided with the gas claw, the top of gas claw is connected with the movable block, one of them the top of movable block is fixed with centering fixture, another the top of movable block is fixed with down centering fixture, go up centering fixture, all be provided with adjustment mechanism on the centering fixture down, the top middle part of base is provided with connects the cylinder, the output of connecting the cylinder is provided with the cushion cap, be provided with the wafer on the cushion cap, the both sides of wafer respectively with last centering fixture, lower centering fixture phase-match.

Furthermore, a wafer detection sensor is arranged on the outer side of the wafer bearing table, and the output end of the wafer detection sensor is right opposite to the wafer.

Further, the adjusting mechanism is arranged inside the protective shell, and the protective shell is arranged on the upper portion of the movable block.

Further, adjustment mechanism includes the connecting rod, inside the one end of connecting rod penetrated the protective housing, and the end passed through fixed bearing and sets up on the inner wall of protective housing.

Furthermore, the other end of connecting rod is provided with the adjusting pin, evenly be provided with a plurality of anti-skidding ribs on the outer wall of adjusting pin.

Furthermore, a threaded column is nested on the outer wall of the connecting rod in the protective shell, and a sliding plate is connected to one side of the threaded column in a meshed mode.

Furthermore, one end of the sliding plate penetrates through the side wall of the protective shell, the end head of the sliding plate is connected with the pushing block, a linear bearing is arranged on the protective shell, and the sliding plate is sleeved inside the linear bearing.

Furthermore, the upper centering fixture and the lower centering fixture respectively comprise a fixing fixture and a moving fixture, one side of the fixing fixture is fixed on the protective shell, and the moving fixture is connected with the push block.

Furthermore, one side of the top end of the sliding plate is provided with scales.

Furthermore, one side of the sliding plate, which is far away from the scales, is uniformly provided with a plurality of convex columns, and the convex columns are meshed with the threads on the threaded columns.

Compared with the prior art, the utility model beneficial effect who has is:

1. the distance between the fixed fixture and the movable fixture in the upper centering fixture or the lower centering fixture can be changed through the arranged adjusting mechanism, so that centering operation on wafers with different sizes is facilitated, the distance between the fixed fixture and the movable fixture is adjusted by rotating the adjusting pin, the adjusting pin drives the threaded column on the connecting rod to be matched with the sliding plate, the self-locking structure is matched with the convex block gear through threads, and external force transformation cannot be carried out after the distance adjustment is completed, so that wafers with multiple sizes can be clamped firstly, and meanwhile, the clamping stability is improved through the self-locking structure;

2. the wafer is clamped by the upper centering fixture and the lower centering fixture and placed on the wafer bearing table, when the wafer is located inside the centering device, the wafer detecting sensor arranged on the wafer bearing table confirms whether the position of the wafer is correct or not through the reflection signal, and sends an alarm signal when the position is abnormal, so that accurate centering of the wafer is achieved conveniently, and the accuracy of the wafer placing position is guaranteed.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a multi-dimension wafer centering device according to the present invention;

fig. 2 is a schematic structural diagram of a middle adjusting mechanism of a multi-sized wafer centering device according to the present invention;

fig. 3 is a schematic view illustrating a connection between a middle threaded post and a sliding plate of the multi-dimension wafer centering device of the present invention.

In the figure: the method comprises the following steps of 1-base, 2-upright post, 3-air claw, 4-movable block, 5-upper centering clamp, 6-lower centering clamp, 7-adjusting mechanism, 8-connecting rod, 9-threaded post, 10-adjusting pin, 11-sliding plate, 12-linear bearing, 13-pushing block, 14-fixed clamp, 15-movable clamp, 16-protective shell, 17-convex post, 18-bearing table, 19-connecting cylinder, 20-piece detecting sensor and 21-wafer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following describes the implementation of the present invention in detail with reference to specific embodiments.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.

Referring to fig. 1-3, the preferred embodiment of the present invention is shown.

A multi-size wafer centering device comprises a base 1, wherein two sides of the top end of the base 1 are respectively provided with an upright post 2, the top end of each upright post 2 is provided with a gas claw 3, the top end of each gas claw 3 is connected with a movable block 4, the top end of one movable block 4 is fixedly provided with an upper centering fixture 5, the top end of the other movable block 4 is fixedly provided with a lower centering fixture 6, the upper centering fixture 5 and the lower centering fixture 6 are respectively provided with an adjusting mechanism 7, the middle part of the top end of the base 1 is provided with a connecting cylinder 19, the output end of the connecting cylinder 19 is provided with a wafer bearing platform 18, the wafer bearing platform 18 is provided with a wafer 21, two sides of the wafer 21 are respectively matched with the upper centering fixture 5 and the lower centering fixture 6, the arc shape enables the upper centering fixture 5 and the lower centering fixture 6 to be contacted with the wafer 21, the upper centering fixture 5 and the lower centering fixture, and the adjusting mechanism 7 can change the distance between the upper centering fixture 5 and the lower centering fixture 6, so that the upper centering fixture 5 and the lower centering fixture 6 can clamp wafers 21 with different sizes, the wafers 21 on the wafer bearing table 18 and the connecting cylinder 19 can drive the wafers 21 to ascend and descend, and the wafers 21 can be conveniently subsequently processed.

In this embodiment, a wafer inspecting sensor 20 is provided outside the wafer support 18, an output end of the wafer inspecting sensor 20 is aligned with the wafer 21, when the wafer 21 is in the centering device, the wafer inspecting sensor 20 confirms whether the position of the wafer 21 is correct or not by a reflection signal, and sends an alarm signal when the wafer 21 is abnormal.

In this embodiment, the adjusting mechanism 7 is disposed inside the protective casing 16, and the protective casing 16 is disposed on the upper portion of the movable block 4, so that when the movable block 4 is driven by the gas claw 3 to move, the upper centering fixture 5 or the lower centering fixture 6 adjusted by the adjusting mechanism 7 can move together with the movable block 4.

In this embodiment, the adjusting mechanism 7 includes a connecting rod 8, one end of the connecting rod 8 penetrates into the protective housing 16, and the end is disposed on the inner wall of the protective housing 16 through a fixed bearing, the other end of the connecting rod 8 is provided with an adjusting pin 10, the outer wall of the adjusting pin 10 is uniformly provided with a plurality of anti-slip ribs for manual adjustment by an operator, the outer wall of the connecting rod 8 in the protective housing 16 is nested with a threaded post 9, one side of the threaded post 9 is engaged with a sliding plate 11, one end of the sliding plate 11 penetrates through the side wall of the protective housing 16 and the end is connected with a push block 13, the protective housing 16 is provided with a linear bearing 12, the sliding plate 11 is nested inside the linear bearing 12, the upper centering fixture 5 and the lower centering fixture 6 both include a fixed fixture 14 and a movable fixture 15, one side of the fixed fixture 14 is fixed on the protective housing 16, the side of the sliding plate 11 away from the scale is uniformly provided with a plurality of convex columns 17, the convex columns 17 are engaged with the threads on the threaded columns 9, and the adjusting mechanism 7 acts on the movable fixture 15 to increase the distance between the fixed fixture 14 and the movable fixture 15, so that wafers 21 with different sizes can be clamped conveniently.

When the technical scheme is used, firstly, the distance between a fixed clamp 14 and a movable clamp 15 in an upper centering clamp 5 or a lower centering clamp 6 can be changed through an arranged adjusting mechanism 7, so that centering operation on wafers with different sizes is facilitated, in addition, the distance between the fixed clamp 14 and the movable clamp 15 is adjusted through rotating an adjusting pin 10, the adjusting pin 10 drives a threaded column 9 on a connecting rod 8 to be matched with a sliding plate 11, the self-locking structure is provided through matching of threads and a bump gear, external force transformation cannot be generated after the distance adjustment is completed, so that wafers 21 with multiple sizes can be clamped firstly, meanwhile, the self-locking structure improves the clamping stability, then the upper centering clamp 5 and the lower centering clamp 6 are utilized to clamp the wafers 21, the wafers 21 are placed on a wafer bearing platform 18, and a wafer detecting sensor 20 arranged on the wafer bearing platform 18 is used when the wafers 21 are positioned in the centering device, the wafer detection sensor 20 confirms whether the position of the wafer is correct or not through the reflection signal, sends an alarm signal when the position is abnormal, is convenient to realize accurate centering of the wafer, ensures the accuracy of the wafer placement position, and finally adjusts the position of the wafer 21 through the connecting air cylinder 19 after the placement is completed, so that the subsequent processing is convenient, namely the centering setting of the wafer 21 is completed.

In this embodiment, the whole operation process may be controlled by a computer, and the automatic operation control is implemented by adding P L C and the like, and in each operation link, signal feedback may be performed by setting a sensor, so as to implement sequential implementation of steps, which are conventional knowledge of the current automatic control, and are not repeated in this embodiment.

The details of the present invention are well known to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A multi-size wafer centering device is characterized in that: the automatic centering device comprises a base, the top both sides of base all are provided with the stand, the top of stand is provided with the gas claw, the top of gas claw is connected with the movable block, one of them the top of movable block is fixed with centering fixture, another the top of movable block is fixed with centering fixture down, all be provided with adjustment mechanism on going up centering fixture, the centering fixture down, the top middle part of base is provided with the connection cylinder, the output of connecting the cylinder is provided with the wafer bearing platform, be provided with the wafer on the wafer bearing platform, the both sides of wafer respectively with last centering fixture, centering fixture phase-match down.

2. The multi-dimensional wafer centering device of claim 1, wherein: and the outer side of the wafer bearing platform is provided with a wafer detection sensor, and the output end of the wafer detection sensor is right opposite to the wafer.

3. A multi-dimensional wafer centering device as claimed in claim 1 or 2, wherein: the adjusting mechanism is arranged inside the protective shell, and the protective shell is arranged on the upper portion of the movable block.

4. A multi-dimensional wafer centering device as claimed in claim 3, wherein: the adjusting mechanism comprises a connecting rod, one end of the connecting rod penetrates into the protective shell, and the end head of the connecting rod is arranged on the inner wall of the protective shell through a fixed bearing.

5. The multi-dimensional wafer centering device of claim 4, wherein: the other end of connecting rod is provided with the regulating pin, evenly be provided with a plurality of anti-skidding ribs on the outer wall of regulating pin.

6. The multi-dimensional wafer centering device of claim 5, wherein: the outer wall of the connecting rod in the protective shell is nested with a threaded column, and one side of the threaded column is meshed with a sliding plate.

7. The multi-dimensional wafer centering device of claim 6, wherein: one end of the sliding plate penetrates through the side wall of the protective shell, the end head of the sliding plate is connected with the push block, a linear bearing is arranged on the protective shell, and the sliding plate is sleeved inside the linear bearing.

8. The multi-dimensional wafer centering device of claim 7, wherein: the upper centering fixture and the lower centering fixture respectively comprise a fixed fixture and a movable fixture, one side of the fixed fixture is fixed on the protective shell, and the movable fixture is connected with the push block.

9. The multi-dimensional wafer centering device of claim 8, wherein: and scales are arranged on one side of the top end of the sliding plate.

10. The multi-dimensional wafer centering device of claim 9, wherein: and one side of the sliding plate, which is far away from the scales, is uniformly provided with a plurality of convex columns, and the convex columns are meshed with the threads on the threaded columns.