CN211086853U

CN211086853U - Display device

Info

Publication number: CN211086853U
Application number: CN201921672884.XU
Authority: CN
Inventors: 阿部英明
Original assignee: Japan Display Inc
Current assignee: Japan Display Inc
Priority date: 2018-10-03
Filing date: 2019-09-30
Publication date: 2020-07-24
Anticipated expiration: 2029-09-30
Also published as: JP2020056951A

Abstract

An object of the utility model is to provide a can realize slim and frame narrow display device. The display device includes a display panel having an insulating substrate, an FPC substrate connected to the display panel, a PCB substrate connected to the FPC substrate, an IC chip for supplying a video signal to the display panel mounted on the PCB substrate, the FPC substrate being bent, and a backlight unit. The backlight unit is disposed between the display panel and the PCB substrate, and the IC chip is disposed on the opposite side of the backlight unit with the PCB substrate interposed therebetween. And the IC chip is connected with the PCB substrate by the ACF. The PCB substrate has a thickness of 0.08mm to 0.2 mm.

Description

Display device

Technical Field

The utility model relates to a display device.

Background

In recent years, there has been an increasing demand for display devices for mobile electronic devices and the like. As a display device, a structure including a display panel and a wiring substrate mounted on the display panel is known. Further, a structure in which a driver circuit for driving a display panel is mounted on a wiring board is known. In this structure, a drive signal output from the drive circuit is supplied to the display panel via the wiring of the wiring substrate (see, for example, patent documents 1, 2, and 3).

[ Prior art documents ]

[ patent document ]

[ patent document 1 ]: japanese patent laid-open No. 2008-10829

[ patent document 2 ]: japanese laid-open patent publication No. 2007-240808

[ patent document 3 ] is: japanese laid-open patent publication No. 2012-204463

SUMMERY OF THE UTILITY MODEL

Problem to be solved by utility model

It is desirable for the display device to be thinner with narrower edges.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a display device which can be thinned and has a narrow frame.

Means for solving the problems

A display device according to one embodiment includes a display panel having an insulating substrate, an FPC substrate connected to the display panel, a PCB substrate connected to the FPC substrate, an IC chip, and a backlight unit, wherein the IC chip supplies a video signal to the display panel mounted on the PCB substrate, the FPC substrate is bent, the PCB substrate is disposed on a back surface side of the display panel, the backlight unit is disposed between the display panel and the PCB substrate, the IC chip is disposed on an opposite side of the backlight unit with the PCB substrate interposed therebetween, the IC chip is acfally connected to the PCB substrate, and the PCB substrate has a thickness of 0.08mm or more and 0.2mm or less.

Preferably, the PCB substrate includes a first portion and a second portion protruding outward from an outer periphery of the first portion.

Preferably, the PCB substrate has a slit provided from a boundary portion between the first portion and the second portion toward an inner side of the PCB substrate.

Preferably, the slit has a cut portion extending from the boundary portion toward the inside of the PCB substrate, and a distal end portion located at a distal end of the cut portion, and a shape of the distal end portion in a plan view includes a curved line.

Preferably, the second portion has a first region adjacent to the first portion and a second region located on a distal end side of the second portion with respect to the first region, and the first region has a larger width than the second region.

Preferably, the display device further includes an insulating cover film provided on one surface side of the PCB substrate, and the cover film continuously covers the first portion and the second portion.

Preferably, the display device further includes a first conductive layer provided on one surface side of the PCB substrate, and the first conductive layer continuously covers the first portion and the second portion.

Preferably, the display device further includes a second conductive layer provided inside the PCB substrate so as to be continuous with the first portion and the second portion.

Preferably, the display device has a recess provided on one surface side of the PCB substrate, and the IC chip is disposed in the recess.

A display device according to another aspect includes a display panel, a circuit board connected to the display panel, and an IC chip mounted on the circuit board, wherein the circuit board includes a first base portion connected to the display panel and a second base portion connected to the first base portion, and the IC chip is mounted on the second base portion, and the second base portion is less likely to bend than the first base portion.

Drawings

Fig. 1 is a plan view showing a configuration example of a display device according to embodiment 1.

FIG. 2 is a sectional view taken along line II-II' of the top view shown in FIG. 1.

Fig. 3 is a cross-sectional view showing a state in which the flexible printed circuit board according to embodiment 1 is bent and the printed circuit board is disposed on the rear surface side of the display panel.

Fig. 4 is a plan view showing a configuration example of the PCB substrate according to embodiment 1.

Fig. 5 is a plan view showing a configuration example of the FPC board according to embodiment 1.

Fig. 6 is a plan view showing a configuration example of the display panel according to embodiment 1.

Fig. 7 is a cross-sectional view showing a first region of the PCB substrate and a fourth region of the FPC substrate facing the first region in accordance with embodiment 1.

Fig. 8 is a cross-sectional view showing a second region of the PCB substrate and a fifth region of the FPC substrate facing the second region in accordance with embodiment 1.

Fig. 9 is a schematic diagram showing an example of a cross-sectional structure of a PCB substrate according to embodiment 1.

Fig. 10 is a sectional view showing an example of bonding the PCB substrate and the IC chip according to embodiment 1.

Fig. 11 is a plan view showing a configuration example of a display device according to modification 1 of embodiment 1.

Fig. 12 is a plan view showing a configuration example of a display device according to modification 2 of embodiment 1.

Fig. 13 is a plan view showing a configuration example of a display device according to modification 3 of embodiment 1.

Fig. 14 is a plan view showing a configuration example of a display device according to modification 4 of embodiment 1.

Fig. 15 is a plan view showing a configuration example of a display device according to modification 5 of embodiment 1.

Fig. 16 is a plan view showing a configuration example of a display device according to modification 6 of embodiment 1.

Fig. 17 is a diagram showing a configuration example of a display device according to modification 7 of embodiment 1.

Fig. 18 is a plan view showing a configuration example of the display device according to embodiment 2.

FIG. 19 is a sectional view of the top view of FIG. 18 taken along line XIX-XIX'.

Fig. 20 is a diagram schematically showing an example of a cross-sectional structure of the rigid-flex circuit board according to embodiment 2.

Description of the reference symbols

1 … film substrate, 7 … solder mask, 11 … FOB terminal, 12 … FOG terminal, 15A, 15B, 16A, 16B, 25A, 25B, 65A, 65B … alignment mark, 21 … output terminal, 22 … input terminal, 26 … slit, 26A … incision, 26B … terminal portion, 50 … backlight unit, 51 … adhesive, 60 … TFT substrate, 61 … extension, 62 … panel terminal, 80 … ACF, 81 … conductive particle, 90 … opposite substrate, 100 … FPC substrate, 110 … PCB substrate, 111 … first portion, 112 … second portion, 113 … boundary portion, 120 … IC chip, 140 CNT 72 backlight FPC substrate, 150 … display panel, 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, … IC chip, 140 CNT 72, … center line …, … C …, … C100H 72, …, 36.

Detailed Description

The embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the description of the embodiments below. The constituent elements described below include elements that can be easily found by those skilled in the art, and substantially the same elements. The constituent elements described below can be combined as appropriate. The disclosure is merely an example, and it is needless to say that the embodiment which can be easily conceived by those skilled in the art with appropriate modifications in accordance with the gist of the present invention is included in the scope of the present invention. In addition, although the drawings schematically show the width, thickness, shape, and the like of each part as compared with the actual embodiment in order to make the description clearer, the drawings are merely examples and do not limit the explanation of the present invention. In the present specification and the drawings, the same elements as those described with reference to the already-shown drawings are denoted by the same reference numerals, and detailed description thereof may be omitted as appropriate.

(embodiment mode 1)

Fig. 1 is a plan view showing a configuration example of a display device according to embodiment 1. FIG. 2 is a sectional view taken along line II-II' of the top view shown in FIG. 1. Fig. 3 is a cross-sectional view showing a state in which the flexible printed circuit board according to embodiment 1 is bent and the printed circuit board is disposed on the rear surface side of the display panel. In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each member is described with reference to the XYZ rectangular coordinate system. For example, a first direction parallel to the one surface 110a of the printed circuit board 110 is an X-axis direction. A second direction parallel to the first surface 110a of the printed circuit board 110 and perpendicular to the first direction is defined as a Y-axis direction. The Z-axis direction is a direction perpendicular to each of the X-axis direction and the Y-axis direction (i.e., a direction perpendicular to the X-Y plane).

As shown in fig. 1 to 3, the display device 200 includes a display panel 150, a Flexible Printed Circuit Board (hereinafter referred to as an FPC (Flexible Printed Circuit) Board) 100 electrically connected to the display panel 150, a Printed Circuit Board (hereinafter referred to as a PCB (Printed Circuit Board) 110 connected to the FPC Board 100, and a backlight FPC Board 140 connecting the backlight unit 50 and the PCB Board 110. In addition, although other additional devices such as a touch panel are provided as necessary in addition to the FPC board 100, the PCB board 110, and the FPC board 140 for a backlight on the display panel 150, they are not illustrated in fig. 1 to 3.

The display panel 150 is, for example, a liquid crystal panel. The display panel 150 includes a TFT substrate 60, a counter substrate 90 disposed to face the TFT substrate 60, a sealing member (not shown) for bonding the TFT substrate 60 and the counter substrate 90, and a liquid crystal layer (not shown) sealed between the TFT substrate 60 and the counter substrate 90. For example, a plurality of wirings (not shown) extending in the X-axis direction and the Y-axis direction are provided in a region of the TFT substrate 60 facing the counter substrate 90. In the TFT substrate 60, a portion where wirings intersect each other corresponds to a pixel which is a minimum unit of display. The entire display region is formed by arranging a plurality of the pixels in a matrix. For example, a color filter is disposed between the liquid crystal layer and the counter substrate 90, but not shown. The color filter may also be printed on the face of the counter substrate 90 that opposes the TFT substrate 60.

In the present embodiment, the display panel 150 is not limited to a liquid crystal panel, and for example, the display panel 150 may be an organic E L (Electro-luminescence) panel or an electrophoretic display.

The TFT substrate 60 has a protruding portion 61 protruding outward of the counter substrate 90. A panel terminal 62 is provided on one surface 61a side of the protruding portion 61, and the panel terminal 62 is directly or indirectly connected to a wiring provided in the display region. The panel terminal 62 is provided on the same layer as a signal line (not shown) and a source and a drain of a pixel transistor (not shown) provided in the display region, and is made of the same material as the signal line and the source and the drain. For example, the panel terminal 62 and the signal line provided in the display region and the source and drain of the pixel transistor are made of tungsten, aluminum, or the like. The plurality of panel terminals 62 are arranged along the outer edge of the extension portion 61, thereby constituting a panel terminal group. An alignment mark 65 and a misalignment check mark 67 are provided on one surface 61a of the protruding portion 61.

As shown in fig. 1, the FPC board 100 and the extension 61 are bonded in the fog (film On glass) region R11. The FPC board 100 and the PCB board 110 are joined to each other in the fob (film On board) region R12.

In the FOG region R11, the panel terminals 62, the alignment marks 65, and the misalignment check marks 67 of the TFT substrate 60 are covered with the FPC substrate 100 and cannot be visually recognized. However, in fig. 1, the panel terminals 62 and the like are illustrated in a perspective view of the FPC board 100 for convenience of explanation. Similarly, in the FOB region R12, the output terminals and the like of the PCB substrate 110 are covered with the FPC substrate 100 and cannot be visually recognized. However, in fig. 1, the output terminal and the like are illustrated in a perspective view of the FPC board 100 for convenience of explanation.

An IC chip 120 is mounted on the upper surface of one surface 110a of the PCB substrate 110. The IC chip 120 is a driver IC for driving the display panel 150, and supplies a video signal to the display panel. Further, a driver circuit for driving a touch panel (not shown) may be mounted on the IC chip 120. The PCB substrate 110 is provided with a connector CNT for connecting the display device 20 to another device.

As shown in fig. 1, the PCB substrate 110 has a first portion 111 and a second portion 112 protruding outward from the outer circumference of the first portion 111. For example, the IC chip 120 is attached to the surface of the first portion 111. A connector CNT is provided at the end of the second portion 112.

The PCB substrate 110 and the FPC substrate 140 for a backlight are connected in the fob (film On board) region R13. The PCB substrate 110 and the FPC substrate 140 for a backlight are connected by solder bonding or a connector.

The FPC substrate 100 can be bent. For example, as shown by an arrow in fig. 2, when the PCB substrate is moved to below the backlight unit, the FPC substrate 100 is bent. Thus, as shown in fig. 3, the display panel 150 and the PCB substrate 110 can be opposed to each other in the thickness direction (for example, the Z-axis direction) of the display device 200. In the display device 200, the backlight unit 50 is disposed between the display panel 150 and the PCB substrate 110. The backlight unit 50 is adhered to the second face 110b of the PCB substrate 110 by an adhesive tape 51.

The thickness L10 of the FPC board 100 is, for example, 0.02mm to 0.1mm, the thickness L11 of the PCB substrate 110 is, for example, 0.08mm to 0.2mm, as shown in fig. 3, the length of protrusion of the FPC board 100 from the end 61E of the protruding portion 61 is L a1, the length L a1 is, for example, 0.1mm to 0.5mm, the thickness L B1 provided from the one surface 100a of the portion connected to the protruding portion 61 in the FPC board 100 to the surface of the IC chip 120 is, for example, 1.0mm to 1.2mm, and the thickness L B1 is, for example, 1.0mm to 1.2mm, and in the display device 200, the ratio between the length L a1 and the thickness L B1 (L B1/L a1) is, for example, 2.0 to 12.

Fig. 4 is a plan view showing a configuration example of the PCB substrate according to embodiment 1, and as shown in fig. 4, in the PCB substrate 110, a line which is provided so that the center of the array of the output terminals 21 (output terminal group) in the X axis direction passes through and is parallel to the Y axis direction is a first center line C L1, and in the PCB substrate 110, a region including the first center line C L1 is a first region R1, a region which is farther from the first center line C L1 than the first region R1 is a second region R2, and a region which is farther from the first center line C L1 than the second region R2 is a third region R3, and for example, the output terminals 21 are provided in the first region R1 and the second region R2, and the alignment mark 25 is provided in the third region R3.

The alignment mark 25 has an alignment mark 25A and an alignment mark 25B. The alignment mark 25A is an alignment mark for an automatic device, and when a manufacturing apparatus (not shown) aligns the PCB substrate 110 and the FPC substrate 100, an image of the alignment mark 25A is automatically recognized by the manufacturing apparatus. The alignment mark 25B is an alignment mark for a manual device, and when an operator performs alignment between the PCB substrate 110 and the FPC substrate 100 by manual operation, an image of the alignment mark 25B is recognized by the operator.

The inclination of the output terminals 21 with respect to the Y-axis direction is greater at a position distant from the first center line C L1 than at a position close to the first center line C L1. for example, the inclination of the output terminals 21 with respect to the Y-axis direction is greater for the second region R2 than for the first region R1. when the inclination of the output terminals 21 with respect to the Y-axis direction in the first region R1 is θ 1 and the inclination of the output terminals 21 with respect to the Y-axis direction in the second region R2 is θ 2, θ 1< θ 2. in the present embodiment, the inclination of the output terminals 21 with respect to the Y-axis direction increases as they are distant from the first center line C L1. further, the inclination of the alignment marks 25B with respect to the Y-axis direction is angle θ 3. the angle θ 3 is a value greater than both the above-mentioned angles θ 1, θ 2. that is, θ 1< θ 2< θ 3.

Fig. 5 is a plan view showing a configuration example of the FPC board according to embodiment 1, and as shown in fig. 5, the FPC board 100 is formed by, for example, punching a long film-like base material (hereinafter referred to as a film base material) 1 along an outer shape cutting line L1, and the FPC board 100 includes the film base material 1, a plurality of FOB terminals 11 provided on one surface 1a side of the film base material 1, a plurality of FOG terminals 12 provided on one surface 1a side of the film base material 1, a plurality of alignment marks 15 and 16 provided on one surface 1a side of the film base material 1, and a solder resist 7 partially covering the one surface 1a of the film base material 1.

The FOB terminal 11 is bonded to the output terminal 21 of the PCB substrate 110 in the FOB region R12. In addition, the FOG terminal 12 is joined to the panel terminal 62 in the FOG region R11. The FOB terminal 11, the FOG terminal 12, and the plurality of alignment marks 15 and 16 are formed of, for example, a metal film such as copper (Cu), and the surface of the metal film is plated with tin (Sn). The FOB terminal 11 and the IC chip 120 are electrically connected by a plurality of wirings 118.

As shown in fig. 5, in the FPC board 100, the center in the X axis direction of the array of the FOB terminals 11 (FOB terminal group) passing through and the line parallel to the Y axis direction is set as the second center line C L2, the second center line C L2 passes between the FOB terminal 11 inclined to the right side with respect to the Y axis direction and the FOB terminal 11 inclined to the left side with respect to the Y axis direction, and in the FPC board 100, a region including the second center line C L2 is set as the fourth region R4, a region farther from the second center line C L2 than the fourth region R4 is set as the fifth region R5, a region farther from the second center line C L2 than the fifth region R5 is set as the sixth region R6., for example, the FOB terminal 11 is disposed in the fourth region R4 and the fifth region R5, and the alignment mark 15 is disposed in the sixth region R6.

For example, the inclination of the FOB terminal 11 with respect to the Y-axis direction is greater in the fifth region R5 than in the fourth region R4, and when the inclination of the FOB terminal 11 in the fourth region R4 with respect to the Y-axis direction is θ 4 and the inclination of the FOB terminal 11 in the fifth region R5 with respect to the Y-axis direction is θ 5, θ 4< θ 5.

The alignment mark 15 has an alignment mark 15A and an alignment mark 15B. The alignment mark 15A is an alignment mark for an automatic device, and when a manufacturing apparatus (not shown) aligns the FPC board 100 and the PCB substrate 110 (see fig. 4), an image of the alignment mark 15A is automatically recognized by the manufacturing apparatus. The alignment mark 15B is an alignment mark for a manual device, and when an operator manually aligns the FPC board 100 and the PCB substrate 110 (see fig. 4), an image of the alignment mark 15B is recognized by the operator. The inclination of the alignment mark 15B with respect to the Y-axis direction is set to an angle θ 6. The angle θ 6 is a value larger than both the angles θ 4 and θ 5. Namely, θ 4< θ 5< θ 6.

As shown in fig. 5, the second center line C L2 passes through the center of the array of FOG terminals 12 (FOG terminal group) in the X axis direction and is parallel to the Y axis direction, the second center line C L2 passes through between the FOG terminal 12 inclined to the right side with respect to the Y axis direction and the FOG terminal 12 inclined to the left side with respect to the Y axis direction, the FOG terminal 12 is disposed in the fourth region R4 and the fifth region R5, and the alignment mark 16 is disposed in the sixth region R6.

For example, the inclination of the FOG terminal 12 with respect to the Y-axis direction is such that the fifth region R5 is larger than the fourth region R4, and when the inclination of the FOG terminal 12 in the fourth region R4 with respect to the Y-axis direction is θ 4 ', and when the inclination of the FOG terminal 12 in the fifth region R5 with respect to the Y-axis direction is θ 5', θ 4 '< θ 5'.

Alignment mark 16 has alignment mark 16A and alignment mark 16B. The alignment mark 16A is an alignment mark for an automatic device, and when a manufacturing apparatus (not shown) aligns the FPC substrate 100 and the protruding portion 61 (see fig. 1) of the TFT substrate 60, an image of the alignment mark 16A is automatically recognized by the manufacturing apparatus. The alignment mark 16B is an alignment mark for a manual device, and when the operator manually aligns the FPC board 100 and the extension portion 61, an image of the alignment mark 16B is recognized by the operator. Let the inclination of the alignment mark 16B with respect to the Y-axis direction be an angle θ 6'. The angle θ 6 ' is larger than the angles θ 4 ' and θ 5 '. Namely, θ 4 ' < θ 5 ' < θ 6 '.

As shown in fig. 6, in the extension portion 61 of the TFT substrate 60, a line which is provided in the extension portion 61 of the TFT substrate 60 and is parallel to the Y-axis direction and through which the center of the array (panel terminal group) of the panel terminals 62 passes in the X-axis direction is a third center line C L3, and as shown in fig. 6, a region including the third center line C L3 is provided as a seventh region R7, a region which is farther from the third center line C L3 than the seventh region R7 is provided as an eighth region R8, a region which is farther from the third center line C L3 than the eighth region R8 is provided as a ninth region R9., for example, panel terminals 62 are provided in the seventh region R7 and the eighth region R8, and the ninth region R9 is provided with an alignment mark 65, and a manual alignment mark B for use of the alignment mark 65 and an alignment mark 25 for use of the alignment mark 65 are provided.

For example, the inclination of the panel terminal 62 with respect to the Y-axis direction is such that the eighth region R8 is larger than the seventh region R7., that is, the inclination of the panel terminal 62 with respect to the Y-axis direction is θ 7 in the seventh region R7 with respect to the Y-axis direction, and that θ 7< θ 8 in the eighth region R8 with respect to the Y-axis direction, in the present embodiment, the inclination of the panel terminal 62 with respect to the Y-axis direction increases with distance from the third center line C L3, and, in addition, the inclination of the alignment mark 25B with respect to the Y-axis direction is an angle θ 9, the angle θ 9 is a value greater than both the above-described angles θ 7, θ 8, that is, θ 7< θ 8< θ 9.

Fig. 7 is a cross-sectional view showing a first region of the PCB substrate and a fourth region of the FPC substrate facing the first region in accordance with embodiment 1. Fig. 8 is a cross-sectional view showing a second region of the PCB substrate and a fifth region of the FPC substrate facing the second region in accordance with embodiment 1. As shown in fig. 7, the output terminal 21 located in the first region R1 of the PCB substrate 110 is bonded to the FOB terminal 11 located in the fourth region R4 of the FPC substrate 100. In addition, as shown in fig. 8, the output terminal 21 located in the second region R2 of the PCB substrate 110 is bonded to the FOB terminal 11 located in the fifth region R5 of the FPC substrate 100.

The pitch between the output terminals 21 adjacent in the X-axis direction is larger in the second region R2 than in the first region R1, for example, as shown in fig. 7 and 8, Pa < Pb., for example, the outer pitch Pb is 1.1 to 2 times the center pitch Pa when Pa is the pitch between the output terminals 21 in the first region R1 (hereinafter, referred to as the center pitch) and Pb is the pitch between the output terminals 21 in the second region R2 (hereinafter, referred to as the outer pitch).

The line width of the output terminal 21 is larger in the second region R2 than in the first region R1, for example, when the line width of the output terminal 21 in the first region R1 is L p1 and the line width of the output terminal 21 in the second region R2 is L p2, L p1< L p 2.

The space between the output terminals 21 adjacent in the X-axis direction is the same value in the first region R1 and the second region R2. For example, as shown in fig. 7 and 8, when the space between the output terminals 21 in the first region R1 is Sp1 and the space between the output terminals 21 in the second region R2 is Sp2, Sp1 is Sp 2. In the present embodiment, the space between the output terminals 21 is constant.

In the FPC board 100, the line width of the FOB terminal 11 is the same value in the fourth region R4 and the fifth region R5, for example, as shown in fig. 7 and 8, when the line width of the FOB terminal 11 in the fourth region R4 is L c1 and the line width of the FOB terminal 11 in the fifth region R5 is L c2, L c1 — L c2. is a constant value in the present embodiment, the line width between the FOB terminals 11.

In addition, the space between the FOB terminals 11 adjacent in the X-axis direction is such that the fifth region R5 is larger than the fourth region R4. For example, as shown in fig. 7 and 8, when the space between the output terminals 21 in the fourth region R4 is Sc1 and the space between the output terminals 21 in the fifth region R5 is Sc2, Sc1< Sc 2. In the present embodiment, the space between the FOB terminals 11 increases as it approaches the end of the FPC substrate 100 in the X-axis direction.

In the FPC substrate 100, the pitch between the FOB terminals 11 adjacent in the X-axis direction is such that the fifth region R5 is larger than the fourth region R4. For example, the pitch between the FOB terminals 11 in the fourth region R4 is the same value as the center pitch Pa of the output terminals 21. The pitch between the FOB terminals 11 in the fifth region R5 is the same value as the outside pitch Pb of the output terminals 21.

The difference between the line width of the output terminal 21 in the first region R1 and the line width of the FOB terminal 11 in the fourth region R4 is represented by L p 1-L c1, in addition, the difference between the line width of the output terminal 21 in the second region R2 and the line width of the FOB terminal 11 in the fifth region R5 is represented by L0 p 2-L1 c2, where L p2> L p1, L c2 ═ L c1, and thus (L p 2-L c2) > (L p 1-L c1), whereby, with respect to the alignment of the output terminal 21 with respect to the FOB terminal 11, the remaining amount in the second region R2 can be made larger than the remaining amount in the first region R1.

Fig. 9 is a schematic diagram showing an example of a cross-sectional structure of a PCB substrate according to embodiment 1. The PCB substrate 110 is a hard substrate having a plurality of metal layers laminated in a thickness direction (for example, Z-axis direction) of the PCB substrate 110. As shown in fig. 9, the PCB substrate 110 includes, for example, an insulating core 211, a first metal layer 212 provided on one surface 211a side of the core 211, a first insulating layer 213, a second metal layer 214, and a second insulating layer 215. In fig. 9, a first metal layer 212, a first insulating layer 213, a second metal layer 214, and a second insulating layer 215 are sequentially stacked from one surface 211a of a core material 211 toward the upper side.

Although the TFT substrate 60 is not described in detail, the TFT substrate 60 includes an insulating substrate such as a glass substrate or a flexible resin substrate, and the insulating substrate is 0.10mm to 0.15mm in the present embodiment. Thus, the PCB substrate 110 is 0.5 times or more and 2.0 times or less the thickness of the insulating substrate of the TFT substrate 60.

The PCB substrate 110 includes, for example, a third metal layer 216, a third insulating layer 217, a fourth metal layer 218, and a fourth insulating layer 219 provided on the other surface 211b side of the core 211. In fig. 9, a third metal layer 216, a third insulating layer 217, a fourth metal layer 218, and a fourth insulating layer 219 are sequentially stacked from the other surface 211b of the core material 211 toward the lower side.

The wiring 118 shown in fig. 1 is formed of one or more layers selected from among a first metal layer 212, a second metal layer 214, a third metal layer 216, and a fourth metal layer 218. The width of the wiring 118 is 6 μm to 8 μm, for example, 7 μm. The space width of the adjacent wiring 118 is 6 μm to 8 μm, for example, 7 μm. As described above, the PCB substrate 110 can route the wirings 118 at a fine pitch.

The first metal layer 212, the second metal layer 214, the third metal layer 216, and the fourth metal layer 218 may be connected to each other through vias, not shown. The first metal layer 212, the second metal layer 214, the third metal layer 216, and the fourth metal layer 218 are formed of a metal film such as copper (Cu), for example. In addition, the surfaces of the portions of the first metal layer 212, the second metal layer 214, the third metal layer 216, and the fourth metal layer 218 used as terminals (for example, the output terminals 21) are plated. As the plating, tin (Sn) plating is exemplified. The first insulating layer 213, the second insulating layer 215, the third insulating layer 217, and the fourth insulating layer 219 are made of, for example, polyimide.

Fig. 10 is a sectional view showing an example of bonding the PCB substrate and the IC chip according to embodiment 1. As shown in fig. 10, the IC chip 120 has, for example, bump electrodes 121. The bump electrode 121 is made of, for example, gold (Au). The bump electrodes 121 of the IC chip 120 are connected to the input terminals 22 of the PCB substrate 110 via Conductive particles 81 contained in an anisotropic Conductive film (hereinafter referred to as acf (anisotropic Conductive film)) 80. Thus, IC chip 120 is AFC connected to PCB substrate 110. The input terminal 22 is made of a metal film such as copper (Cu), for example, and the surface of the metal film is plated with gold (Au) or tin (Sn). An opening penetrating the PCB substrate 110 is not formed in a mounting portion of the PCB substrate 110 on which the IC chip 120 is mounted. The mounting portion of PCB substrate 110 on which IC chip 120 is mounted is a region of PCB substrate 110 that overlaps with IC chip 120 in a plan view.

In addition, the arrangement of the bump electrodes 121 may be a staggered arrangement, a three-stage arrangement, a four-stage arrangement, or the like. In the case of the staggered arrangement, the plurality of bump electrodes 121 are alternately arranged on the left and right sides of a straight line parallel to the X-axis direction, for example. In the case of three-stage arrangement, a row of the plurality of bump electrodes 121 arranged in the X-axis direction is three-stage arranged in the Y-axis direction. The configuration of the input terminal 22 connected to the bump electrode 121 is also the same as that of the bump electrode 121.

The bonding of the output terminals 21 of the PCB substrate 110 and the FOB terminals 11 of the FPC substrate 100 in the FOB region R12, and the bonding of the panel terminals 62 and the FOG terminals 12 of the FPC substrate 100 in the FOB region R11 are performed via the conductive particles 81 included in the ACF80 as shown in fig. 10.

As described above, the display device 200 according to embodiment 1 includes the display panel 150, the FPC board 100 (flexible printed circuit board, first base portion) connected to the display panel 150, the PCB substrate 110 (printed circuit board, second base portion) connected to the FPC board 100, and the IC chip 120 mounted on the PCB substrate 110. The PCB substrate 110 is not easily bent compared to the FPC substrate 100. This allows the FPC board 100 to be bent, and the PCB substrate 110 to be disposed on the rear surface side of the display panel 150. When the PCB substrate 110 is disposed on the rear surface side of the display panel 150, the IC chip 120 mounted on the one surface 110a of the PCB substrate 110 is disposed outside between the display panel 150 and the PCB substrate 110. This can increase the curvature of the FPC board 100, and thus can reduce the thickness of the display device 200 and narrow the frame.

The display device 200 includes a backlight unit 50. The FPC board 100 is bent, and the PCB board 110 is disposed on the rear surface side of the display panel 150. The backlight unit 50 is disposed between the display panel 150 and the PCB substrate 110. Thereby, the backlight unit 50 can be fixed to the PCB substrate 110 by the adhesive tape 51.

The IC chip 120 is disposed on the opposite side of the backlight unit 50 with the PCB substrate 110 interposed therebetween. This can reduce the gap between the backlight unit 50 and the PCB substrate 110, and thus can contribute to the thinning of the display device 200.

The PCB substrate 110 includes a first portion 111 and a second portion 112 protruding outward from the outer periphery of the first portion 111. This facilitates bending of the second portion 112 with respect to the first portion 111. The wiring of the second portion 112 provided with the connector CNT is easy to perform.

In the above-described embodiment, the PCB substrate 110 has been described as having the first portion 111 and the second portion 112 protruding outward from the outer periphery of the first portion 111. The PCB substrate 110 is a hard substrate. Therefore, when a force is applied to the first portion 111 in a direction of bending toward the second portion 112, the force is concentrated in the vicinity of the boundary between the first portion 111 and the second portion 112, and the PCB substrate 110 may be broken. In order to reduce this possibility, a slit such as to alleviate concentration of stress may also be provided in the vicinity of the boundary portion of the first site 111 and the second site 112.

Fig. 11 is a plan view showing a configuration example of a display device according to modification 1 of embodiment 1. As shown in fig. 11, in a display device 200A according to modification 1 of embodiment 1, a slit 26 is provided in a PCB substrate 110. The slit 26 is provided from a boundary 113 between the first portion 111 and the second portion 112 in the outer periphery of the PCB substrate 110 toward the inside of the PCB substrate 110. For example, the slit 26 has a cut portion 26A extending from the boundary portion 113 toward the inside of the PCB substrate 110, and a distal end portion 26B located at the distal end of the cut portion 26A. The shape of the tip portion 26B in plan view includes a curved line. The distal end portion 26B is formed to have a curved shape, and is formed to have no corner or substantially no corner.

Thus, even when a force is applied to the first portion 111 in a direction in which the second portion 112 is bent, the peripheral portion of the slit 26 is deformed, and thus, stress concentration in the vicinity of the boundary portion 113 between the first portion 111 and the second portion 112 can be suppressed. This can reduce the possibility of breaking the PCB substrate 110. In addition, the distal end portion 26B of the slit 26 has a circular arc. Therefore, it is possible to prevent the first portion 111 from being cracked due to stress concentration on one portion of the distal end portion 26B.

In addition, in order to reduce the possibility of breaking the PCB substrate 110, the dimension width near the boundary portion 113 of the first portion 111 and the second portion 112 may be increased. Fig. 12 is a plan view showing a configuration example of a display device according to modification 2 of embodiment 1. As shown in fig. 12, in the display device 200B according to modification 2 of embodiment 1, the second portion 112 of the PCB substrate 110 includes a first region 1121 adjacent to the first portion 111 and a second region 1122 located on the front end side of the second portion 112 with respect to the first region 1121. The width W1 of the first region 1121 is wider than the width W2 of the second region 1122. The width W1 of the first region 1121 gradually increases as it approaches the first portion 111.

This can improve the strength of the boundary portion 113 and its peripheral portion (hereinafter referred to as the vicinity of the boundary portion 113) in the PCB substrate 110. Accordingly, even when a force or stress is applied to the first portion 111 in a direction in which the second portion 112 is bent, and the force or stress is concentrated in the vicinity of the boundary portion 113, the PCB substrate 110 can be prevented from being broken in the vicinity of the boundary portion 113.

In addition, in order to reduce the possibility of breaking the PCB substrate 110, the PCB substrate 110 may be covered with a cover film. Fig. 13 is a plan view showing a configuration example of a display device according to modification 3 of embodiment 1. As shown in fig. 13, a display device 200C according to modification 3 of embodiment 1 includes an insulating cover film 210 provided on one surface 110a side of the PCB substrate 110. The cover film 210 continuously covers the first and

second portions

111 and 112 of the PCB substrate 110.

This enables the cover film 210 to have an increased strength in the vicinity of the boundary portion 113. Therefore, even when a force or stress is applied to the first portion 111 in a direction in which the second portion 112 is bent, and the force or stress is concentrated in the vicinity of the boundary portion 113, the PCB substrate 110 can be prevented from being broken in the vicinity of the boundary portion 113.

In addition, in order to reduce the possibility of breaking the PCB substrate 110, the PCB substrate 110 may be further covered with a conductive material. Fig. 14 is a plan view showing a configuration example of a display device according to modification 4 of embodiment 1. As shown in fig. 14, a display device 200D according to modification 4 of embodiment 1 includes a first conductive layer 220 provided on one surface 110a side of the PCB substrate 110. The first conductive layer 220 continuously covers the first and

second portions

111 and 112 of the PCB substrate 110. The first conductive layer 220 is made of, for example, silver (Ag).

This can increase the strength of the first conductive layer 220 in the vicinity of the boundary portion 113. Therefore, even when a force or stress is applied to the first portion 111 in a direction in which the second portion 112 is bent, and the force or stress is concentrated in the vicinity of the boundary portion 113, the PCB substrate 110 can be prevented from being broken in the vicinity of the boundary portion 113.

In addition, the first conductive layer 220 can shield the PCB substrate 110 from an external electric field or magnetic field. Accordingly, the first conductive layer 220 can reduce noise caused by an external electric field or magnetic field in the PCB substrate 110. In this way, the first conductive layer 220 has a function as a reinforcing layer for reinforcing the PCB substrate 110 and a function as a shielding layer for shielding the PCB substrate 110 from an external electric field or magnetic field.

The PCB substrate 110 has a plurality of metal layers therein. More than one of the plurality of metal layers may be used as a shielding layer against electric or magnetic fields. Fig. 15 is a plan view showing a configuration example of a display device according to modification 5 of embodiment 1. As shown in fig. 15, a display device 200E according to modification 5 of embodiment 1 includes a shield layer 230 (second conductive layer) provided inside the PCB substrate 110. The shielding layer 230 continuously covers the first and

second portions

111 and 112 of the PCB substrate 110. As the shield layer 230, for example, one or more layers of the first metal layer 212, the second metal layer 214, the third metal layer 216, and the fourth metal layer 218 shown in fig. 9 may be used.

Thereby, the shielding layer 230 can shield the PCB substrate 110 from an external electric field or magnetic field. Accordingly, the shielding layer 230 can reduce noise in the PCB substrate 110 due to an external electric field or magnetic field. The shield layer 230 is disposed inside the PCB substrate 110. Therefore, the display device 200E can prevent the shield layer 230 from being damaged by contact with other components.

In embodiment 1 described above, the case where the IC chip 120 is elongated in one direction (for example, the X-axis direction) is illustrated, but the shape of the IC chip 120 is not limited to this, fig. 16 is a plan view showing a configuration example of the display device according to modification 6 of embodiment 1, and in the display device 200F according to modification 6 of embodiment 1, as shown in fig. 16, the shape of the IC chip 120 in plan view is square, and the IC chip 120 is surface-mounted at a position away from the first center line C L1, the IC chip 120 is offset from the first center line C L, the method of mounting the IC chip 120 on the PCB substrate 110 may be the method using the ACF80 as described above, or the method using a copper pillar, and even with such a configuration, the display device 200F can increase the curvature of the FPC substrate 100, and thus can achieve thinning and frame narrowing.

Fig. 17 is a diagram showing a configuration example of a display device according to modification 7 of embodiment 1. The left side view of fig. 17 is a top view. The right-hand side view of fig. 17 is a cross-sectional view taken along line XVII-XVII' from the left-hand top view. As shown in fig. 17, in a display device 200G according to modification 7 of embodiment 1, a recess H1 is provided on the side of one surface 110a of the PCB substrate 110. The IC chip 120 is disposed in the recess H1. This can reduce the height from the one surface 110a of the PCB substrate 110 to the upper surface of the IC chip 120. Therefore, the display device 200G can be further thinned.

(embodiment mode 2)

In embodiment 1, the case where the FPC board 100 is connected to the display panel 150 and the PCB substrate 110 is connected to the FPC board 100 is described. However, the display device according to the embodiment is not limited to this. The display device according to the embodiment may include the flexible-rigid circuit board 300 connected to the display panel 150.

Fig. 18 is a plan view showing a configuration example of the display device according to embodiment 2. FIG. 19 is a sectional view of the top view of FIG. 18 taken along line XIX-XIX'. In fig. 1, the TFT substrate 60 side is shown in a perspective view of the first flexible portion 311 for convenience of explanation. Fig. 19 shows a state in which the first flexible portion 311 is bent.

As shown in fig. 18 and 19, the display device 200H according to embodiment 2 includes a display panel 150, a hard-and-soft combined circuit board 300 electrically connected to the display panel 150, and a backlight FPC board 140 connecting the backlight unit 50 and the hard-and-soft combined circuit board 300. In addition, although other additional devices such as a touch panel are provided as necessary in addition to the flexible printed circuit board 300 and the FPC board 140 for a backlight on the display panel 150, they are not shown in fig. 18 and 19.

The rigid-flex circuit board 300 includes a rigid portion 301, a first flexible portion 311 connected to one end of the rigid portion 301, and a second flexible portion 312 connected to the other end of the rigid portion 301. The rigid portion 301 is less prone to bending than the first flexible portion 311. The rigid portion 301 is less likely to bend than the second flexible portion 312.

The first flexible portion 311 is connected to the protruding portion 61 of the TFT substrate 60. For example, the FOG terminal 12 (see fig. 5) and the alignment mark 16 (see fig. 5) are provided in the first flexible portion 311. The FOG terminal 12 of the first flexible portion 311 is connected to the panel connection terminal 62 (see fig. 6) of the extension portion 61.

An IC chip 120 and a surface Mount component (hereinafter referred to as smd (surface Mount device))130 are mounted on one surface 301a of the rigid portion 301. The IC chip 120 is mounted on the rigid portion 301 by, for example, surface mounting using ACF80 (see fig. 10). The FPC board 140 for the backlight is connected to the rigid portion 301. The second flexible portion 312 is provided with a connector CNT. The FOB terminal 11 and the IC chip 120 are electrically connected by a plurality of wirings 318.

As shown in fig. 19, in a state where the first flexible portion 311 is bent, the length of protrusion of the first flexible portion 311 from the front end 61E of the protruding portion 61 is L a2, the length L a2 is, for example, 0.1mm to 0.5mm, the thickness from the one surface 311a of the portion connected to the protruding portion 61 to the surface of the IC chip 120 in the first flexible portion 311 is L B2, the thickness L B2 is, for example, 1.05mm to 1.3mm, and the ratio of the length L a2 to the thickness L B2 (L B2/L a2) in the display device 200H is, for example, 2.1 to 13.

Fig. 20 is a diagram schematically showing an example of a cross-sectional structure of the rigid-flex circuit board according to embodiment 2. The rigid-flex circuit board 300 includes a plurality of metal layers laminated in the thickness direction (for example, the Z-axis direction) of the rigid-flex circuit board 300.

As shown in fig. 20, the rigid-flex circuit board 300 includes, for example, an insulating core 321, a first metal layer 322 provided on one surface 321a side of the core 321, and a first insulating layer 323. In fig. 20, a first metal layer 322 and a first insulating layer 323 are sequentially stacked from one surface 321a of a core 321 toward the upper side.

The rigid-flex circuit board 300 includes, for example, a second metal layer 324, a second insulating layer 325, a third metal layer 326, and a third insulating layer 327 provided on the other surface 321b side of the core member 321. In fig. 20, a second metal layer 324, a second insulating layer 325, a third metal layer 326, and a third insulating layer 327 are sequentially stacked from the other surface 321b of the core 321 toward the lower side.

The rigid portion 301 is provided with a first metal layer 322, a second metal layer 324, and a third metal layer 326. In the rigid portion 301, the first metal layer 322, the second metal layer 324, and the third metal layer 326 may be connected to each other through a via hole not shown. The third metal layer 326 is disposed in the first flexible portion 311 and the second flexible portion 312.

In the first flexible portion 311 and the second flexible portion 312, only the second metal layer 324 of the first metal layer 322, the second metal layer 324, and the third metal layer 326 is disposed. In the first flexible portion 311 and the second flexible portion 312, the second metal layer 324 is exposed from the second insulating layer 325.

The first metal layer 322, the second metal layer 324, and the third metal layer 326 are formed of a metal film such as copper (Cu), for example. In the first metal layer 322, the second metal layer 324, and the third metal layer 326, the surfaces of portions used as terminals (for example, FOG terminals 12) are plated. As the plating, tin (Sn) plating is exemplified. The first insulating layer 323, the second insulating layer 325, and the third insulating layer 327 are made of polyimide, for example.

The wiring 318 shown in fig. 18 is formed of one or more layers selected from among a first metal layer 322, a second metal layer 324, and a third metal layer 326. The width of the wiring 318 is 6 μm to 8 μm, for example, 7 μm. The space width of the adjacent wiring 318 is 6 μm to 8 μm, for example, 7 μm. As described above, the rigid-flex circuit board 300 can route the wiring 318 at a fine pitch.

The thickness L31 of the first flexible portion 311 and the second flexible portion 312 is, for example, 0.05mm to 0.1mm, and the thickness L30 of the rigid portion 301 is, for example, 0.1mm to 0.3 mm.

As described above, the display device 200H according to embodiment 2 includes the display panel 150, the hard-and-soft-bonded circuit board 300 (circuit board) connected to the display panel 150, and the IC chip 120 mounted on the hard-and-soft-bonded circuit board 300. The rigid-flex circuit board 300 includes a first flexible portion 311 (first base portion) and a rigid portion 301 (second base portion) connected to the first flexible portion 311. The first flexible portion 311 is connected to the display panel 150. The IC chip 120 is mounted on the rigid portion 301. The rigid portion 301 is less prone to bending than the first flexible portion 311.

This allows the first flexible portion 311 to be bent, and the rigid portion 301 to be disposed on the rear surface side of the display panel 150. When the PCB substrate 110 is disposed on the rear surface side of the display panel 150, the IC chip 120 mounted on the one surface 301a of the rigid portion 301 is disposed outside between the display panel 150 and the rigid portion 301. This can increase the curvature of the first flexible portion 311, and thus can reduce the thickness and the frame width of the display device 200H.

The preferred embodiments of the present invention have been described above, but the present invention is not limited to such embodiments. The disclosure of the embodiments is merely an example, and various modifications can be made without departing from the scope of the present invention. For example, each modification of embodiment 1 can be applied to embodiment 2. Further, a plurality of modifications may be combined with each other. It is needless to say that appropriate modifications made without departing from the scope of the present invention are within the technical scope of the present invention.

Claims

1. A display device is provided with:

a display panel having an insulating substrate;

an FPC substrate connected to the display panel;

the PCB substrate is connected with the FPC substrate;

an IC chip for supplying an image signal to the display panel mounted on the PCB substrate; and

a backlight unit for illuminating the backlight unit,

it is characterized in that the preparation method is characterized in that,

the FPC substrate is bent, the PCB substrate is arranged on the back side of the display panel,

the backlight unit is disposed between the display panel and the PCB substrate,

the IC chip is arranged on the opposite side of the backlight unit with the PCB substrate therebetween, and is ACF-connected to the PCB substrate,

the PCB substrate is 0.08mm to 0.2mm thick.

2. The display device according to claim 1,

an opening portion penetrating the PCB substrate is not formed in a mounting portion of the PCB substrate for mounting the IC chip.

3. The display device according to claim 1,

the PCB substrate has:

a first region; and

and a second portion protruding outward from an outer periphery of the first portion.

4. The display device according to claim 2,

the PCB substrate has:

a first region; and

5. The display device according to claim 3,

the PCB substrate is provided with a slit,

the slit is provided from a boundary portion between the first portion and the second portion toward an inner side of the PCB substrate.

6. The display device according to claim 4,

the PCB substrate is provided with a slit,

7. The display device according to claim 5,

the slit has:

a cut-in portion extending from the boundary portion toward an inner side of the PCB substrate; and

a tip portion located at a tip of the incision portion,

the shape of the tip portion as viewed in plan includes a curved line.

8. The display device according to claim 6,

the slit has:

a tip portion located at a tip of the incision portion,

the shape of the tip portion as viewed in plan includes a curved line.

9. The display device according to claim 5,

the second portion has:

a first region adjacent to the first location; and

a second region located on a distal end side of the second portion with respect to the first region,

the first region has a width greater than the second region.

10. The display device according to claim 6,

the second portion has:

a first region adjacent to the first location; and

the first region has a width greater than the second region.

11. The display device according to claim 7,

the second portion has:

a first region adjacent to the first location; and

the first region has a width greater than the second region.

12. The display device according to claim 8,

the second portion has:

a first region adjacent to the first location; and

the first region has a width greater than the second region.

13. The display device according to any one of claims 5 to 12,

the display device further includes an insulating cover film provided on one surface side of the PCB substrate,

the cover film continuously covers the first portion and the second portion.

14. The display device according to any one of claims 5 to 12,

the display device further includes a first conductive layer provided on one surface side of the PCB substrate,

the first conductive layer continuously covers the first portion and the second portion.

15. The display device according to any one of claims 5 to 12,

the display device further includes a second conductive layer provided inside the PCB substrate and continuously connected to the first portion and the second portion.

16. The display device according to claim 1,

the display device has a concave portion provided on one surface side of the PCB substrate,

the IC chip is disposed in the recess.

17. A display device is provided with:

a display panel;

a circuit substrate connected to the display panel; and

an IC chip mounted on the circuit board,

it is characterized in that the preparation method is characterized in that,

the circuit board includes:

a first base; and

a second base connected with the first base,

the first base is connected with the display panel,

the IC chip is mounted to the second base portion,

the second base is less pliable than the first base.