CN211063044U - Laser pump - Google Patents
Laser pump Download PDFInfo
- Publication number
- CN211063044U CN211063044U CN201922420633.9U CN201922420633U CN211063044U CN 211063044 U CN211063044 U CN 211063044U CN 201922420633 U CN201922420633 U CN 201922420633U CN 211063044 U CN211063044 U CN 211063044U
- Authority
- CN
- China
- Prior art keywords
- chip
- tube
- pin
- tube shell
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Lasers (AREA)
Abstract
The utility model discloses a laser pump, a chip holder is arranged in a tube, the chip holder is positioned at the middle and rear section of the tube, a control chip is arranged on the chip holder, a protection outer tube and a nozzle are arranged at the left side of the tube, optical fibers are embedded in the protection outer tube and the nozzle, one end of each optical fiber extends out of the protection outer tube, and the other end of each optical fiber is connected to the chip holder; filling holes are respectively formed in the upper side and the lower side of the tube shell and located in front of the chip base, the filling holes are located in the middle of the side wall of the tube shell, and the positive electrode pins and the negative electrode pins are installed in the filling holes in an embedded mode through glass welding rings; and a grounding pin is also arranged on the side surface of the tube shell. According to the chip packaging method, the positions of the positive electrode pin and the negative electrode pin are moved to the positions far away from the chip area, and meanwhile, the height of the filling hole is adjusted to the middle part of the side wall, so that the filling hole is far away from the chip area, and the chip can not be assembled in any interference; compared with the prior art, the method and the device have the advantages of high reliability, high yield and low cost.
Description
Technical Field
The utility model relates to a to the optical device field, concretely relates to laser pump.
Background
The height of a metal Pin (Pin needle) of the existing laser pump from a sealing ring and the height of the metal Pin from the inner bottom of a metal shell have very high requirements. The close distance between the metal pin and the sealing ring can cause the maximum temperature and the maximum stress transmitted to the glass solder in the sealing process to be large, so that the glass welding ring which plays a sealing role between the metal pin and the metal shell is subjected to overlarge thermal stress and mechanical pressure to generate cracks or breakage, the glass welding ring cannot play a sealing role in air leakage, and the glass cracks are generated in about 30% of the actual production and manufacturing process. The distance between the metal pin and the sealing ring is far away, so that the height of the metal pin from the inner bottom of the metal shell is insufficient, and a chip cannot be placed in the assembly process. Therefore, the requirements of the production process of the laser pump and the dimensional accuracy and the process level in the manufacturing process of the metal shell are high, and the qualified rate of manufactured qualified products is relatively low.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model aims at providing an easily produce the laser pump of manufacturing, yields height.
In order to realize the technical purpose, the utility model discloses a scheme is: a laser pump comprises a tube shell, an anode pin, a cathode pin and a grounding pin, wherein a chip holder is arranged in the tube shell, the chip holder is positioned at the middle rear section of the tube shell, a control chip is arranged on the chip holder, a protection outer tube and a nozzle are arranged on the left side of the tube shell, optical fibers are embedded in the protection outer tube and the nozzle, one end of each optical fiber extends out of the protection outer tube, and the other end of each optical fiber is connected to the chip holder;
filling holes are respectively formed in the upper side and the lower side of the tube shell and located in front of the chip base, the filling holes are located in the middle of the side wall of the tube shell, and the positive electrode pins and the negative electrode pins are installed in the filling holes in an embedded mode through glass welding rings;
and a grounding pin is also arranged on the side surface of the tube shell.
Preferably, a protective sleeve is arranged outside the optical fiber, and the protective sleeve is positioned between the optical fiber and the protective outer tube.
Preferably, the thickness of the side wall of the front section of the pipe shell is larger than that of the side wall of the middle and rear sections.
Preferably, the side wall of the tube shell, the grounding pin, the positive electrode pin and the negative electrode pin are made of kovar alloy with the linear expansion coefficient similar to that of the glass welding ring.
The beneficial effects of the utility model are that the positions of the positive pin and the negative pin are moved to the region far away from the chip, and the height of the filling hole is adjusted to the middle part of the side wall, so that the assembly of the chip can not be interfered after the pins are installed in the filling hole far away from the chip region; meanwhile, the thickness of the side wall of the front section of the tube shell is larger than that of the side wall of the middle and rear sections, namely the thickness of a non-chip assembly area is increased, so that the highest temperature and the maximum mechanical stress transmitted to glass solder in the capping process are greatly reduced, and the product gas leakage caused by the damage of a glass welding ring in the capping process is avoided; compared with the prior art, the method and the device have the advantages of high reliability, high yield and low cost.
Drawings
Fig. 1 is a cross-sectional view of a top view of the present invention;
fig. 2 is a cross-sectional view of a side view of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-2, a specific embodiment of the present invention is a laser pump, which includes a tube 1, an anode pin 2, a cathode pin 3 and a ground pin 4, wherein a chip holder 5 is disposed in the tube 1, the chip holder 5 is located at the middle rear section of the tube 1, a control chip 6 is mounted on the chip holder 5, a protection outer tube 7 and a nozzle 8 are disposed on the left side of the tube 1, an optical fiber 9 is embedded in the protection outer tube 7 and the nozzle 8, one end of the optical fiber 9 extends out from the protection outer tube 7, and the other end of the optical fiber 9 is connected to the chip holder 5;
the upper side and the lower side of the tube shell 1 are respectively provided with a filling hole 10, the filling hole 10 is positioned in front of the chip seat 5, the filling hole 10 is positioned in the middle of the side wall of the tube shell 1, and the anode pin 2 and the cathode pin 3 are embedded and installed on the filling hole 10 through a glass welding ring 11;
and a grounding pin 4 is also arranged on the side surface of the tube shell 1.
The packing hole is located tube shell lateral wall middle part, just so increases the distance of metal pin apart from sealing ring (the positive open structure of tube shell), and the highest temperature and the maximum stress that transmit glass welded ring at the closing cap in-process can reduce by a wide margin, and glass welded ring thermal stress and mechanical pressure that play the sealed effect between metal pin and the metal tube shell promptly can reduce, and glass welded ring is difficult for producing crackle or breakage, improves the yields by a wide margin.
For better protection of the optical fibers, a protective sleeve 12 is arranged outside the optical fibers 9, the protective sleeve 12 being located between the optical fibers 9 and the protective outer tube 7.
In order to improve the mounting stability of the positive electrode pin and the negative electrode pin, the side wall thickness of the front section (the position 1/3 on the left side of the figure 1) of the tube shell 1 is larger than that of the middle and rear sections (the right side of the figure 1).
The side wall of the tube shell 1, the grounding pin 4, the anode pin 2 and the cathode pin 3 are made of kovar alloy with the linear expansion coefficient similar to that of the glass welding ring 11.
The structure is comprehensively optimized by utilizing hydrodynamics and material mechanics, and the height of the pin is reduced downwards in the structure so that the pin is far away from the filling hole and the assembly of the chip cannot be interfered. Meanwhile, the thickness of the side wall of the front section of the tube shell is larger than that of the side wall of the middle and rear sections, the section is a non-chip assembly area, the highest temperature and the maximum mechanical stress transmitted to the glass solder in the sealing and covering process can be greatly reduced by adopting the thicker side wall, and the product air leakage caused by the damage of the glass welding ring in the sealing and covering process can be avoided.
And the side wall and the bottom of the tube shell are brazed by a mature and stable process. The side wall of the tube shell is made of 4J29 alloy, also called Kovar (Kovar) alloy. The alloy has a linear expansion coefficient (CTE5.6X10E-6) similar to that of silicon boron hard glass at the temperature of 20-450 ℃, a high Curie point and good low-temperature stability. The oxide film of the alloy is compact and can be well infiltrated. The bottom of the tube shell is made of WCu7 linear expansion coefficient (CTE 5.5X10E-6), 4J29 alloy and borate glass, and is good in heat-conducting property and assembled by AgCu28 through high-temperature brazing at 850 ℃. The positive electrode pin, the negative electrode pin and the grounding pin are made of 4J29 alloy, the assembled tube shell body is subjected to high-temperature oxidation at the same time, a compact oxide film is formed on the surface of the tube shell body, then borate glass is used for melting and infiltrating the alloy oxide layer at high temperature, and the pins and the tube shell body are fixed so as to achieve air tightness, insulativity and certain mechanical strength.
According to the chip packaging structure, the positions of the positive electrode pin and the negative electrode pin are moved to a position far away from the chip area, and meanwhile, the height of the filling hole is adjusted to the middle part of the side wall, so that no interference is caused to the chip assembly after the pins are loaded in the filling hole far away from the chip area; meanwhile, the thickness of the side wall of the front section of the tube shell is larger than that of the side wall of the middle and rear sections, namely the thickness of a non-chip assembly area is increased, so that the highest temperature and the maximum mechanical stress transmitted to glass solder in the capping process are greatly reduced, and the product gas leakage caused by the damage of a glass welding ring in the capping process is avoided; compared with the prior art, the method and the device have the advantages of high reliability, high yield and low cost.
The above, only do the preferred embodiment of the present invention, not used to limit the present invention, all the technical matters of the present invention should be included in the protection scope of the present invention for any slight modification, equivalent replacement and improvement of the above embodiments.
Claims (4)
1. A laser pump, characterized by: the device comprises a tube shell, an anode pin, a cathode pin and a grounding pin, wherein a chip holder is arranged in the tube shell, the chip holder is positioned at the middle rear section of the tube shell, a control chip is arranged on the chip holder, a protective outer tube and a nozzle are arranged on the left side of the tube shell, optical fibers are embedded in the protective outer tube and the nozzle, one end of each optical fiber extends out of the protective outer tube, and the other end of each optical fiber is connected to the chip holder;
filling holes are respectively formed in the upper side and the lower side of the tube shell and located in front of the chip base, the filling holes are located in the middle of the side wall of the tube shell, and the positive electrode pins and the negative electrode pins are installed in the filling holes in an embedded mode through glass welding rings;
and a grounding pin is also arranged on the side surface of the tube shell.
2. The laser pump according to claim 1, wherein: and a protective sleeve is arranged outside the optical fiber and positioned between the optical fiber and the protective outer tube.
3. The laser pump according to claim 1, wherein: the thickness of the side wall of the front section of the pipe shell is larger than that of the side wall of the middle and rear sections.
4. The laser pump according to claim 1, wherein: the side wall of the tube shell, the grounding pin, the anode pin and the cathode pin are made of kovar alloy with the linear expansion coefficient similar to that of the glass welding ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922420633.9U CN211063044U (en) | 2019-12-30 | 2019-12-30 | Laser pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922420633.9U CN211063044U (en) | 2019-12-30 | 2019-12-30 | Laser pump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211063044U true CN211063044U (en) | 2020-07-21 |
Family
ID=71594190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922420633.9U Active CN211063044U (en) | 2019-12-30 | 2019-12-30 | Laser pump |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211063044U (en) |
-
2019
- 2019-12-30 CN CN201922420633.9U patent/CN211063044U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101311691B (en) | Temperature tester based on film type temperature sensor and its manufacture method | |
| CN105261929A (en) | Transistor outline (TO)-CAN packaged semiconductor laser and fabrication method thereof | |
| CN202066613U (en) | Oil-filled temperature pressure combined sensor | |
| CN109175746A (en) | A kind of manufacturing process of vacuum heat-preserving titanium cup | |
| CN211063044U (en) | Laser pump | |
| CN214754652U (en) | 1X laser instrument encapsulation tube shell structure | |
| CN103633535A (en) | Alkali metal steam chamber and assembling and manufacturing method thereof | |
| CN103078064B (en) | A kind of oled panel encapsulating structure and method for packing | |
| CN103078063B (en) | A kind of OLED encapsulating structure | |
| KR100250778B1 (en) | Metallic evacuated double-walled vessel and production method therefor | |
| CN102522343A (en) | Microcomponent vacuum packaging exhaust device and method | |
| CN205789919U (en) | A kind of hydrid integrated circuit aluminium silicon carbide integral packaging shell | |
| CN103236634B (en) | Annular laser device with electrode group and manufacture method for electrode group | |
| CN102044621A (en) | Wafer-level glass ball cavity package method for light emitting diode flip chip | |
| CN209157119U (en) | A kind of split type print head for coaxial powder-feeding increasing material manufacturing | |
| CN103673350B (en) | The manufacture method of solar vacuum heat-collecting pipe | |
| CN110333583A (en) | A kind of optical-electric module tail optical fiber air-tight packaging structure and packaging method | |
| CN201623361U (en) | Metal-ceramic insulator packaging structure for semiconductor laser | |
| CN108129037B (en) | Molybdenum-glass sealing insulator sealing method | |
| CN104377542A (en) | Pin type packaging structure and method for semiconductor laser | |
| CN205069682U (en) | LED wrapper spare with flip -chip structure | |
| CN102544323A (en) | LED (light-emitting diode) fluorescent powder bearing device and packaging module implementing method | |
| CN209150147U (en) | LED component and lamp group array | |
| CN209584005U (en) | A kind of vacuum glass | |
| CN211507685U (en) | Optimized airtight ceramic seal welding structure suitable for laser seal welding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |