CN211019413U - Wiring type flexible circuit board - Google Patents
Wiring type flexible circuit board Download PDFInfo
- Publication number
- CN211019413U CN211019413U CN201921857124.6U CN201921857124U CN211019413U CN 211019413 U CN211019413 U CN 211019413U CN 201921857124 U CN201921857124 U CN 201921857124U CN 211019413 U CN211019413 U CN 211019413U
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- CN
- China
- Prior art keywords
- layer
- circuit board
- turn
- circuit
- copper sheets
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 98
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 57
- 229910052802 copper Inorganic materials 0.000 claims description 57
- 239000010949 copper Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 230000006641 stabilisation Effects 0.000 abstract description 4
- 238000011105 stabilization Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a wiring formula flexible line way board, hinder the subassembly including top layer insulating element, turn circuit board and bottom, a side of turn circuit board bond in on the laminating glue film, turn circuit board includes first turn, second turn and extension, first link and second link have on the extension, first turn with the first link of extension is connected, the second turn with the second link of extension is connected the utility model relates to a wiring formula flexible line board can conveniently lay wire to L ED lamp through setting up first turn, second turn and extension on turn circuit board for L ED lamp walk the line more compact, more convenient, avoid appearing the electric connection unstable condition, improve the job stabilization nature of L ED lamp.
Description
Technical Field
The utility model relates to a flexible line way board field especially relates to a wiring formula flexible line way board.
Background
The flexible circuit board has many advantages such as saving space, reducing weight and high flexibility, and global demand for the flexible circuit board is increasing year by year. The unique characteristic of the flexible circuit board enables the flexible circuit board to become a substitution mode of a rigid circuit board and a traditional wiring scheme on various occasions, meanwhile, the flexible circuit board also promotes the development of a plurality of new fields, the fastest growing part is the internal connecting wire of a computer Hard Disk Drive (HDD), the second field with the growing speed is a novel integrated circuit package, and the market potential of the flexible circuit technology in portable equipment (such as a mobile phone) is very large.
In the prior art, when some lamps are installed at corners or in irregular environments, open wires or hidden wires need to be arranged on the wiring of the L ED lamp, and the conventional wiring mode, no matter the open wires or the hidden wires are arranged, needs to be provided with a wire box or a rubber tube for protecting electric wires, so that the conventional wiring mode and installation of the L ED lamp are inconvenient, the conventional wiring mode is not compact and attractive, and meanwhile, the conventional wiring is easy to have unstable electric connection, so that the stability of the L ED lamp is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a wiring formula flexible line way board, can conveniently lay wire to L ED lamp for the line of walking of L ED lamp is more compact, more convenient, avoids appearing the unstable condition of electricity connection, improves the job stabilization nature of L ED lamp.
The purpose of the utility model is realized through the following technical scheme:
a wired flexible wiring board comprising:
the top layer insulation assembly comprises a top layer character layer, an insulation protection layer and a joint glue layer, wherein the top layer character layer is adhered to one side surface of the insulation protection layer, and the joint glue layer is adhered to one side surface, far away from the top layer character layer, of the insulation protection layer;
the folding line comprises a folding line substrate, a first folding line substrate and a second folding line substrate, wherein one side surface of the folding line substrate is bonded on the bonding glue layer, the folding line substrate comprises a first folding part, a second folding part and an extension part, a first connecting end and a second connecting end are arranged on the extension part, the first folding part is connected with the first connecting end of the extension part, and the second folding part is connected with the second connecting end of the extension part; and
the bottom hinders and welds the subassembly, the bottom hinders and welds the subassembly and includes reverse side solder mask and outer protection film, reverse side solder mask attach in turn circuit substrate keeps away from on a side of laminating glue film, outer protection film attach in reverse side solder mask keeps away from on a side of turn circuit substrate.
In one embodiment, the first turning part comprises a first top circuit layer and a first bottom circuit layer, and the first bottom circuit layer is attached to the first top circuit layer.
In one embodiment, the first top circuit layer comprises a plurality of bent copper sheets, and a space is respectively arranged between the bent copper sheets.
In one embodiment, the first bottom layer circuit layer comprises conducting copper sheets, the conducting copper sheets are attached to the bent copper sheets, and the conducting copper sheets are electrically connected with the bent copper sheets respectively.
In one embodiment, the second turning part includes a second top circuit layer and a second bottom circuit layer, and the second bottom circuit layer is attached to the second top circuit layer.
In one embodiment, the second top circuit layer includes three copper bars, and a space is respectively disposed between the three copper bars.
In one embodiment, the second bottom circuit layer comprises corner copper sheets, the corner copper sheets are attached to the copper strips, and the corner copper sheets are respectively connected with the copper strips.
In one embodiment, the insulating protective layer is provided with a plurality of welding windows, and a space is respectively arranged between the welding windows.
In one embodiment, the outer protective film is provided with a plurality of copper plating holes, and the copper plating holes are distributed in a matrix.
In one embodiment, the top text layer is an ink character layer.
The utility model discloses compare in prior art's advantage and beneficial effect as follows:
the utility model relates to a wiring formula flexible line way board through set up first turn, second turn and extension on the turn circuit substrate, can conveniently lay wire to L ED lamp for the line of walking of L ED lamp is more compact, more convenient, avoids appearing the unstable condition of electricity connection, improves the job stabilization nature of L ED lamp.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wired flexible printed circuit according to an embodiment of the present invention;
FIG. 2 is an enlarged view of the structure of the wiring type flexible printed circuit board shown in FIG. 1 at A;
fig. 3 is an enlarged view of the wiring type flexible printed circuit board shown in fig. 1 at B.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a wiring type flexible circuit board includes a top layer insulating assembly 100, a turning circuit substrate 200 and a bottom layer solder mask assembly 300, it should be noted that the top layer insulating assembly 100 is used for protecting and marking, the turning circuit substrate 200 is used for realizing bending, and can conveniently perform wiring on L ED lamps, so that wiring of L ED lamps is more compact and more convenient, the situation of unstable electrical connection is avoided, and the working stability of L ED lamps is improved, the bottom layer solder mask assembly 300 is used for preventing the bottom of the turning circuit substrate 200 from being damaged, and a copper plating hole is formed in the assembly, so that the top layer circuit layer and the bottom layer circuit layer can be electrically connected.
Referring to fig. 1, the top insulating assembly 100 includes a top text layer 110, an insulating protective layer 120, and a bonding layer, where the top text layer is bonded to a side of the insulating protective layer, and the bonding layer is bonded to a side of the insulating protective layer away from the top text layer. It should be noted that the top text layer 110 is used to play a role of identification; the insulating protection layer 120 is used for protecting the front surface circuit from being corroded or damaged; the adhesive layer is used for bonding the insulating protective layer 120 on the substrate of the turning circuit, so as to fix the substrate.
Referring to fig. 1, one side surface of the turning circuit substrate 200 is bonded to the adhesive layer, the turning circuit substrate includes a first turning portion 210, a second turning portion 220 and an extending portion 230, the extending portion has a first connection end and a second connection end, the first turning portion is connected to the first connection end of the extending portion, the second turning portion is connected to the second connection end of the extending portion, it should be noted that the first turning portion 210 is used for electrically connecting to an external circuit, the second turning portion 220 is used for connecting to a next light bar, the extending portion 230 is used for welding L ED light beads and delaying to a next light bar, and a plurality of matrix L ED light beads can be disposed on the extending portion to realize light emission of the light bars.
Furthermore, in the existing use process, through the arrangement of the turning circuit substrate with the turning part, the surface mounting can be carried out at the corner of the wall body, as long as the first turning part is mounted at the corner, so that the extending part can be mounted in a straight line area behind the corner, the extending part 230 can be mounted on a straight line wall foot, the other end of the first turning part is connected with an external connecting circuit, power can be supplied to L ED lamp beads on the delay part, after transition is carried out through the first turning part, a visible wire and a plastic wire box are not needed to be adopted for mounting, so that wiring of the L ED lamp can be facilitated, wiring of the L ED lamp is more compact, more convenient and more attractive, and after the flexible circuit board substrate is adopted for surface mounting, the working stability of the L ED lamp beads can be effectively improved, the unstable condition of electric connection is avoided, and the working stability of the L ED lamp is further improved.
Referring to fig. 1, the bottom layer solder mask assembly 300 includes a reverse side solder mask layer 310 attached to a side of the turning circuit substrate away from the adhesive layer, and an outer layer protection film 320 attached to a side of the reverse side solder mask layer away from the turning circuit substrate. It should be noted that the reverse side solder mask layer 310 is used for protecting the turning circuit substrate, and the reverse side solder mask layer 310 is not provided with a window, so that the sealing performance of the turning circuit substrate is further effectively improved, the reverse side solder mask layer is better attached to the turning circuit substrate, and the structural stability is further improved; the outer protective film 320 is used for plating copper holes, so that the front circuit and the back circuit in the turning circuit substrate can be normally conducted.
Referring to fig. 2, the first turning part 210 includes a first top circuit layer 211 and a first bottom circuit layer 212, and the first bottom circuit layer is attached to the first top circuit layer. It should be noted that the first top circuit layer 211 is a part of the front circuit, and the first bottom circuit layer 212 is a part of the back circuit.
It should be noted that the first top circuit layer 211 includes a plurality of bent copper sheets 211a, and a space is respectively disposed between the bent copper sheets. In this manner, the bent copper sheet 211a can be electrically connected to the back surface wiring.
Referring to fig. 2, the first bottom circuit layer 212 includes conductive copper sheets 212a, the conductive copper sheets are attached to the bent copper sheets, and the conductive copper sheets are electrically connected to the bent copper sheets respectively. It should be noted that the conductive copper sheet 212a is used for conducting each bent copper sheet 211a in the front surface circuit.
Referring to fig. 3, the second turning portion 220 includes a second top circuit layer 221 and a second bottom circuit layer 222, and the second bottom circuit layer is attached to the second top circuit layer. It should be noted that the second top circuit layer 221 is a part of the front circuit, and the second bottom circuit layer 222 is a part of the back circuit.
It should be noted that the second top circuit layer 221 includes three copper bars 221a, and intervals are respectively disposed between the three copper bars. So, through setting up copper bar 221a, can realize switching on of positive pole, negative pole and ground connection respectively, conveniently connect next lamp strip.
Referring to fig. 3, the second bottom circuit layer 222 includes corner copper sheets 222a, the corner copper sheets are attached to the copper bars, and the corner copper sheets are respectively connected to the copper bars. In this way, the corner copper sheets 222a are arranged to be respectively connected with the three copper strips 221a for connecting with the front circuit, so as to realize electrical conduction.
The insulation protection layer is provided with a plurality of welding windows, and intervals are arranged among the welding windows respectively, so that L ED lamp beads can be conveniently welded by arranging the welding windows, and the light bar can emit light.
It should be noted that a plurality of copper plating holes are formed in the outer protective film, and each copper plating hole is distributed in a matrix. So, through setting up a plurality of copper-plating holes for wear to establish reverse side circuit and positive circuit, then the copper facing mode of rethread for positive circuit and reverse side circuit realize switching on.
The top text layer is an ink character layer. Therefore, the ink character layer is arranged, and the function of identification can be achieved.
The utility model discloses compare in prior art's advantage and beneficial effect as follows:
the utility model relates to a wiring formula flexible line way board through set up first turn, second turn and extension on the turn circuit substrate, can conveniently lay wire to L ED lamp for the line of walking of L ED lamp is more compact, more convenient, avoids appearing the unstable condition of electricity connection, improves the job stabilization nature of L ED lamp.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A wiring-type flexible wiring board, comprising:
the top layer insulation assembly comprises a top layer character layer, an insulation protection layer and a joint glue layer, wherein the top layer character layer is adhered to one side surface of the insulation protection layer, and the joint glue layer is adhered to one side surface, far away from the top layer character layer, of the insulation protection layer;
the folding line comprises a folding line substrate, a first folding line substrate and a second folding line substrate, wherein one side surface of the folding line substrate is bonded on the bonding glue layer, the folding line substrate comprises a first folding part, a second folding part and an extension part, a first connecting end and a second connecting end are arranged on the extension part, the first folding part is connected with the first connecting end of the extension part, and the second folding part is connected with the second connecting end of the extension part; and
the bottom hinders and welds the subassembly, the bottom hinders and welds the subassembly and includes reverse side solder mask and outer protection film, reverse side solder mask attach in turn circuit substrate keeps away from on a side of laminating glue film, outer protection film attach in reverse side solder mask keeps away from on a side of turn circuit substrate.
2. The wired flexible circuit board of claim 1, wherein the first turning portion comprises a first top circuit layer and a first bottom circuit layer, and the first bottom circuit layer is attached to the first top circuit layer.
3. The wired flexible circuit board of claim 2, wherein the first top layer circuit layer comprises a plurality of bent copper sheets, and a space is respectively disposed between the bent copper sheets.
4. The wired flexible circuit board of claim 3, wherein the first bottom circuit layer comprises conductive copper sheets, the conductive copper sheets are attached to the bent copper sheets, and the conductive copper sheets are electrically connected with the bent copper sheets respectively.
5. The wired flexible circuit board of claim 1, wherein the second turn comprises a second top circuit layer and a second bottom circuit layer, and the second bottom circuit layer is attached to the second top circuit layer.
6. The wired flexible circuit board of claim 5, wherein the second top circuit layer comprises three copper bars, and a space is disposed between each of the three copper bars.
7. The wired flexible circuit board of claim 6, wherein the second bottom circuit layer comprises corner copper sheets, the corner copper sheets are attached to the copper bars, and the corner copper sheets are respectively connected with the copper bars.
8. The wired flexible circuit board of claim 1, wherein the insulating protective layer has a plurality of solder windows, and a space is provided between each solder window.
9. The wiring type flexible circuit board of claim 1, wherein the outer protective film is provided with a plurality of copper plating holes, and the copper plating holes are distributed in a matrix.
10. A wired flexible circuit board according to claim 1, wherein the top text layer is an ink character layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921857124.6U CN211019413U (en) | 2019-10-31 | 2019-10-31 | Wiring type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921857124.6U CN211019413U (en) | 2019-10-31 | 2019-10-31 | Wiring type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211019413U true CN211019413U (en) | 2020-07-14 |
Family
ID=71475257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921857124.6U Expired - Fee Related CN211019413U (en) | 2019-10-31 | 2019-10-31 | Wiring type flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211019413U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062170A1 (en) * | 2020-09-28 | 2022-03-31 | 深南电路股份有限公司 | Method for forming solder mask layer on circuit board, circuit board manufacturing method, and circuit board |
-
2019
- 2019-10-31 CN CN201921857124.6U patent/CN211019413U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062170A1 (en) * | 2020-09-28 | 2022-03-31 | 深南电路股份有限公司 | Method for forming solder mask layer on circuit board, circuit board manufacturing method, and circuit board |
| CN114286532A (en) * | 2020-09-28 | 2022-04-05 | 深南电路股份有限公司 | Method for forming solder mask layer on circuit board, manufacturing method of circuit board and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200714 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |