CN211017048U - Wafer clamping mechanism of wafer scrubbing machine - Google Patents
Wafer clamping mechanism of wafer scrubbing machine Download PDFInfo
- Publication number
- CN211017048U CN211017048U CN201922389401.1U CN201922389401U CN211017048U CN 211017048 U CN211017048 U CN 211017048U CN 201922389401 U CN201922389401 U CN 201922389401U CN 211017048 U CN211017048 U CN 211017048U
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- Prior art keywords
- wafer
- clip
- clamp
- disk body
- model
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- 238000005201 scrubbing Methods 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 title claims description 6
- 230000000712 assembly Effects 0.000 claims abstract description 8
- 238000000429 assembly Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 31
- 239000000428 dust Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a wafer scrubbing unit wafer fixture, its structure includes the disk body and follows the circumference to 4 clip assemblies of evenly installing on the disk body edge, and top dish under 4 clip assembly bottom surfaces are connected, and the wafer is got to 4 clip assembly top clamps. The utility model has the advantages that: simple structure reasonable in design, during operation, the clip can be opened to the 7 upward movements in top down, and when descending, because of tension spring effect, the wafer can be pressed from both sides tightly to the clip. When the wafer rotates at high speed, the clamp support can not be opened due to centripetal force. Realize carrying out effective centre gripping to the wafer when scrubbing the wafer, can effectively satisfy the production needs.
Description
Technical Field
The utility model relates to a wafer scrubbing unit wafer fixture.
Background
In the production process of semiconductor wafers, small dust or process reactants in the production environment can not be prevented from falling on the wafers, and if the small dust or the process reactants are not removed in time, the yield of the wafers can be reduced, and the stability of the product quality is influenced.
The common prior art method of cleaning is to scrub away the dust on the wafer surface by means of a low dusting foam brush. When the wafer has patterns on both sides, the wafer is fixed by clamping. While the wafer is dry it is necessary to allow the wafer to rotate up to 3000 RPM. The clamping mechanism in the prior art is unreasonable in structural design and cannot effectively meet the production requirements.
SUMMERY OF THE UTILITY MODEL
The utility model provides a wafer scrubbing unit wafer fixture, its purpose aims at overcoming the above-mentioned not enough that prior art exists, realizes carrying out effective centre gripping to the wafer when scrubbing the wafer.
The technical solution of the utility model is as follows: the utility model provides a wafer scrubbing unit wafer fixture, its structure includes disk body and follows 4 clip assemblies of circumference evenly installed on the disk body edge, and top dish under 4 clip assembly bottom surface connection, the wafer is got to 4 clip assembly top clamps.
Preferably, the clamp assembly comprises a clamp base, a clamp support, a clamping head, a tension spring and a pin, wherein the bent part of the 'L' clamp support is rotatably connected with the end part of the clamp base through the pin, the clamp base is positioned on the top surface of the horizontal part of the clamp support, the tension spring is connected between the bottom surface of the clamp base and the top surface of the horizontal part of the clamp support, and the top end of the vertical part of the clamp support is provided with the 'L' shaped clamping head.
The utility model has the advantages that: simple structure reasonable in design, during operation, the clip can be opened to the 7 upward movements in top down, and when descending, because of tension spring effect, the wafer can be pressed from both sides tightly to the clip. When the wafer rotates at high speed, the clamp support can not be opened due to centripetal force. Realize carrying out effective centre gripping to the wafer when scrubbing the wafer, can effectively satisfy the production needs.
Drawings
Fig. 1 is a schematic structural diagram of the wafer clamping mechanism of the wafer scrubbing unit of the present invention.
Fig. 2 is a schematic view of the construction of the clip assembly of fig. 1.
In the figure, 1 is a clip base, 2 is a clip holder, 3 is a collet, 4 is a tension spring, 5 is a pin, 6 is a plate body, 7 is a lower top plate, 8 is a wafer, and 9 is a clip assembly.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments.
As shown in fig. 1 and 2, a wafer clamping mechanism of a wafer scrubbing unit structurally comprises a tray body 6 and 4 clamp assemblies 9 uniformly installed on the edge of the tray body 6 along the circumferential direction, wherein the bottom surfaces of the 4 clamp assemblies 9 are connected with a lower top tray 7, and the top ends of the 4 clamp assemblies 9 clamp a wafer 8.
The clamp assembly 9 comprises a clamp base 1, a clamp support 2, a clamping head 3, a tension spring 4 and a pin 5, wherein the bent part of the clamp support 2 in the shape of L is rotatably connected with the end part of the clamp base 1 through the pin 5, the clamp base 1 is positioned on the top surface of the horizontal part of the clamp support 2, the tension spring 4 is connected between the bottom surface of the clamp base 1 and the top surface of the horizontal part of the clamp support 2, and the clamping head 3 in the shape of L is arranged at the top end of the vertical part of the clamp support 2.
According to the structure, when the clamp is in work, the lower top plate 7 moves upwards to open the clamp, and when the clamp descends, the clamp clamps the wafer under the action of the tension spring 4. When the wafer rotates at a high speed, the clamp holder 2 cannot be opened due to centripetal force.
All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.
Claims (2)
1. The utility model provides a wafer scrubbing unit wafer fixture, its characterized in that includes disk body (6) and follows 4 clip assemblies (9) of circumference evenly installed on disk body (6) edge, top dish (7) under 4 clip assemblies (9) bottom surface connection, wafer (8) are got to 4 clip assemblies (9) top clamp.
2. The wafer clamping mechanism of the wafer scrubbing unit as claimed in claim 1, wherein the clip assembly (9) comprises a clip base (1), a clip support (2), a clamping head (3), a tension spring (4) and a pin (5), the bent part of the 'L' clip support (2) is rotatably connected with the end part of the clip base (1) through the pin (5), the clip base (1) is positioned on the top surface of the horizontal part of the clip support (2), the tension spring (4) is connected between the bottom surface of the clip base (1) and the top surface of the horizontal part of the clip support (2), and the clamping head (3) in the shape of 'L' is arranged at the top end of the vertical part of the clip support (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922389401.1U CN211017048U (en) | 2019-12-27 | 2019-12-27 | Wafer clamping mechanism of wafer scrubbing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922389401.1U CN211017048U (en) | 2019-12-27 | 2019-12-27 | Wafer clamping mechanism of wafer scrubbing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211017048U true CN211017048U (en) | 2020-07-14 |
Family
ID=71474340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922389401.1U Active CN211017048U (en) | 2019-12-27 | 2019-12-27 | Wafer clamping mechanism of wafer scrubbing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211017048U (en) |
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2019
- 2019-12-27 CN CN201922389401.1U patent/CN211017048U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 1 Jingxiang Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Jimsi Semiconductor Technology (Wuxi) Co.,Ltd. Country or region after: China Address before: No. 45, Yougu Enterprise Park, 58 Jinghong Road, Xibei Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: GMC SEMITECH Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |