CN214848579U

CN214848579U - Fixing seat of automatic die bonder for semiconductor

Info

Publication number: CN214848579U
Application number: CN202121413524.5U
Authority: CN
Inventors: 陈宏�
Original assignee: Suzhou Grand Future Machinery Manufacturing Corp ltd
Current assignee: Suzhou Grand Future Machinery Manufacturing Corp ltd
Priority date: 2021-06-24
Filing date: 2021-06-24
Publication date: 2021-11-23
Anticipated expiration: 2031-06-24

Abstract

The utility model relates to the technical field of automatic die bonder for semiconductors, and discloses a fixing seat of the automatic die bonder for semiconductors, which solves the problem that the existing automatic die bonder for semiconductors is inconvenient for better fixing, and comprises a base, wherein a supporting frame is arranged at the top of the base, a cover plate is arranged at the top of the supporting frame, fixed plates are symmetrically arranged at the top of the cover plate and are of an L-shaped structure, an adjusting and fixing mechanism is arranged on the supporting frame and is connected with the fixed plates; the utility model discloses, be convenient for can be better fix the automatic solid brilliant machine of semiconductor to be convenient for can be better satisfy people's user demand.

Description

Fixing seat of automatic die bonder for semiconductor

Technical Field

The utility model belongs to the technical field of the automatic solid brilliant machine of semiconductor, specifically be a fixing base of automatic solid brilliant machine of semiconductor.

Background

The die bonder is mainly used for lead frame pressing plates of various gold wire ultrasonic welding equipment, various suction nozzles, ejector pins, dispensing heads, ceramic nozzles, through pins, motors, carbon brushes, encoders, transmission belts of various chip mounting equipment, various spare and accessory parts of automatic equipment, instruments, meters and the like, and the semiconductor automatic die bonder belongs to one of die bonders.

The existing automatic die bonder for semiconductors is inconvenient to fix in the using process, so that the stability of the automatic die bonder for semiconductors is influenced, and the automatic die bonder for semiconductors is inconvenient to work better.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides an automatic solid brilliant machine's of semiconductor fixing base, effectual current automatic solid brilliant machine of semiconductor of having solved is not convenient for better the problem of fixing.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a fixing base of automatic solid brilliant machine of semiconductor, includes the base, the carriage is installed at the top of base, and the apron is installed at the top of carriage, and the fixed plate is installed to the top symmetry of apron, and the fixed plate is L type structure, installs on the carriage and adjusts fixed establishment, and adjusts fixed establishment and be connected with the fixed plate.

Preferably, adjust fixed establishment and include the locating plate, and the bottom of locating plate and the inside bottom fixed connection of carriage, the threaded rod is installed to the equal symmetry in both sides limit of locating plate, the cover is equipped with the screw thread movable block with threaded rod looks adaptation on the threaded rod, the locating piece is installed to the bottom of screw thread movable block, and the bottom of locating piece and the inside bottom contact of carriage, the swing joint piece is installed at the top of screw thread movable block, the movable groove has been seted up with the corresponding position of swing joint piece on the apron, and the top of swing joint piece run through in the movable groove and with the bottom fixed connection of fixed plate, the turning block is all installed on the both sides limit of carriage, and the turning block is connected with the threaded rod.

Preferably, the bottom of the supporting frame is symmetrically provided with a first supporting rod, the bottom of the first supporting rod is provided with a supporting plate, the bottom end of the supporting plate is provided with a supporting air bag, and the bottom of the supporting air bag is fixedly connected with the bottom end of the base.

Preferably, the bottom of the supporting frame is located on one side, away from the first supporting rod, of the second supporting rod, the second supporting rod is of an L-shaped structure, a supporting spring is fixedly mounted at the bottom of the second supporting rod, and the bottom of the supporting spring is fixedly connected with the bottom end of the base.

Preferably, a positioning pulley is installed at one side of the bottom end of the second supporting rod, and a pulley groove matched with the positioning pulley is formed in the position, corresponding to the positioning pulley, of the inner side of the base.

Preferably, the top of the base is symmetrically provided with baffles, and the baffles are positioned on two sides of the supporting frame.

Preferably, the bottom ends of the two side edges of the base are both connected with mounting plates, and mounting bolts penetrate through the mounting plates.

Compared with the prior art, the beneficial effects of the utility model are that:

1) during work, the interaction of the base, the supporting frame, the cover plate, the fixing plate and the adjusting and fixing mechanism is convenient for better fixing the automatic semiconductor die bonder, so that the use requirements of people are better met;

2) in the work, the supporting frame can achieve a better anti-seismic effect by means of interaction of the supporting rod I, the supporting plate and the supporting air bag which are arranged and the supporting rod II and the supporting spring, so that the whole fixing seat can achieve better anti-seismic performance in use, and the semiconductor automatic die bonder can work better.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the adjusting and fixing mechanism of the present invention;

fig. 3 is a schematic view of the internal structure of the base of the present invention.

In the figure: 1. a base; 2. a support frame; 3. a cover plate; 4. a fixing plate; 5. adjusting the fixing mechanism; 6. positioning a plate; 7. a threaded rod; 8. a threaded movable block; 9. positioning blocks; 10. a movable connecting block; 11. a movable groove; 12. rotating the block; 13. a first supporting rod; 14. a support plate; 15. a support airbag; 16. a second supporting rod; 17. a support spring; 18. positioning the pulley; 19. a pulley groove; 20. a baffle plate; 21. mounting a plate; 22. and (6) installing a bolt.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Embodiment one, given by figure 1, figure 2 and figure 3, the utility model discloses a base 1, carriage 2 is installed at base 1's top, apron 3 is installed at carriage 2's top, fixed plate 4 is installed to apron 3's top symmetry, and fixed plate 4 is L type structure, install on carriage 2 and adjust fixed establishment 5, and adjust fixed establishment 5 and be connected with fixed plate 4, base 1 through setting up, carriage 2, apron 3, fixed plate 4 and the interact who adjusts fixed establishment 5, be convenient for can be better fix the automatic solid brilliant machine of semiconductor, thereby be convenient for can be better satisfy people's user demand.

In the second embodiment, on the basis of the first embodiment, the adjusting and fixing mechanism 5 comprises a positioning plate 6, the bottom of the positioning plate 6 is fixedly connected with the inner bottom end of the supporting frame 2, threaded rods 7 are symmetrically installed on both side edges of the positioning plate 6, a threaded movable block 8 matched with the threaded rod 7 is sleeved on the threaded rod 7, a positioning block 9 is installed at the bottom of the threaded movable block 8, the bottom of the positioning block 9 is in contact with the inner bottom end of the supporting frame 2, a movable connecting block 10 is installed at the top of the threaded movable block 8, a movable groove 11 is formed in the cover plate 3 corresponding to the movable connecting block 10, the top end of the movable connecting block 10 penetrates through the movable groove 11 and is fixedly connected with the bottom of the fixing plate 4, rotating blocks 12 are installed on both side edges of the supporting frame 2, and the rotating blocks 12 are connected with the threaded rod 7;

during the use, rotatory turning block 12, drive threaded rod 7 and rotate, threaded rod 7 rotates and makes the screw thread movable block 8 remove along threaded rod 7, because locating piece 9 is installed to the bottom of screw thread movable block 8, can make the screw thread movable block 8 at the in-process that removes, can not rotate along with the rotation of threaded rod 7, screw thread movable block 8 is at the in-process that removes, under the effect of movable connecting block 10, drive fixed plate 4 and remove, carry out the opposite direction motion through adjusting two fixed plates 4, can press from both sides the automatic solid crystal machine of semiconductor and press from both sides tightly between two fixed plates 4, realize the fixed to the automatic solid crystal machine of semiconductor.

In the third embodiment, on the basis of the first embodiment, the first support rods 13 are symmetrically installed at the bottom of the support frame 2, the support plate 14 is installed at the bottom of the first support rod 13, the support airbag 15 is installed at the bottom end of the support plate 14, the bottom of the support airbag 15 is fixedly connected with the inner bottom end of the base 1, the second support rod 16 is installed at the bottom of the support frame 2 and located on the side, away from the first support rod 13, of the support frame 2, the second support rod 16 is of an L-shaped structure, the support springs 17 are fixedly installed at the bottoms of the second support rods 16, and the bottoms of the support springs 17 are fixedly connected with the inner bottom end of the base 1;

through the mutual action of the supporting rod I13, the supporting plate 14 and the supporting air bag 15 which are arranged and the supporting rod II 16 and the supporting spring 17, the supporting frame 2 can achieve a better anti-seismic effect, so that the whole fixing seat can achieve better anti-seismic property in use, and the semiconductor automatic die bonder can work better.

Fourth, on the basis of third embodiment, a positioning pulley 18 is installed at one side of the bottom end of the second supporting rod 16, and a pulley groove 19 matched with the positioning pulley 18 is formed in the corresponding position of the inner side of the base 1 and the positioning pulley 18, so that the second supporting rod 16 can achieve better stability, and a better supporting effect can be achieved.

Fifth, on the basis of the first embodiment, the baffle 20 is symmetrically installed at the top of the base 1, and the baffle 20 is located at the two sides of the supporting frame 2, so that the structure inside the supporting frame 2 can be protected, the safety of the structure is ensured, and the automatic die bonder for semiconductors can be better fixed, thereby better meeting the use requirements of people.

Sixth embodiment, on the basis of first embodiment, base 1's both sides limit bottom all is connected with mounting panel 21, and runs through on the mounting panel 21 and have mounting bolt 22, is convenient for can carry out fixed mounting to whole fixing base when using to can be convenient for better satisfy people's user demand.

The working principle is as follows: during operation, the rotating block 12 is rotated to drive the threaded rod 7 to rotate, the threaded rod 7 rotates to enable the threaded movable block 8 to move along the threaded rod 7, the positioning block 9 is installed at the bottom of the threaded movable block 8, the threaded movable block 8 can not rotate along with the rotation of the threaded rod 7 in the moving process, the threaded movable block 8 drives the fixed plate 4 to move under the action of the movable connecting block 10 in the moving process, the semiconductor automatic die bonder can be clamped between the two fixed plates 4 by adjusting the two fixed plates 4 to move in the opposite direction, the semiconductor automatic die bonder is fixed, in addition, the supporting frame 2 can achieve a better anti-seismic effect by the interaction of the supporting rod one 13, the supporting plate 14 and the supporting air bag 15 and the supporting spring 17, so that the whole fixed seat can achieve better anti-seismic performance in use, thereby ensuring that the automatic die bonder of the semiconductor can work better.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a fixing base of automatic solid brilliant machine of semiconductor, includes base (1), its characterized in that: support frame (2) are installed at the top of base (1), and apron (3) are installed at the top of support frame (2), and fixed plate (4) are installed to the top symmetry of apron (3), and fixed plate (4) are L type structure, install on support frame (2) and adjust fixed establishment (5), and adjust fixed establishment (5) and be connected with fixed plate (4).

2. The fixing base of the automatic die bonder for semiconductor of claim 1, wherein: the adjusting and fixing mechanism (5) comprises a positioning plate (6), the bottom of the positioning plate (6) is fixedly connected with the inner bottom end of the supporting frame (2), threaded rods (7) are symmetrically installed on two side edges of the positioning plate (6), a threaded movable block (8) matched with the threaded rods (7) is sleeved on the threaded rods (7), a positioning block (9) is installed at the bottom of the threaded movable block (8), the bottom of the positioning block (9) is contacted with the inner bottom end of the supporting frame (2), a movable connecting block (10) is installed at the top of the threaded movable block (8), a movable groove (11) is formed in the position, corresponding to the movable connecting block (10), of the cover plate (3), the top end of the movable connecting block (10) penetrates through the movable groove (11) and is fixedly connected with the bottom of the fixing plate (4), rotating blocks (12) are installed on two side edges of the supporting frame (2), and the rotating block (12) is connected with the threaded rod (7).

3. The fixing base of the automatic die bonder for semiconductor of claim 1, wherein: the support frame is characterized in that first support rods (13) are symmetrically installed at the bottom of the support frame (2), a support plate (14) is installed at the bottom of the first support rods (13), a support air bag (15) is installed at the bottom end of the support plate (14), and the bottom of the support air bag (15) is fixedly connected with the bottom end of the base (1).

4. The fixing base of the automatic die bonder for semiconductor of claim 3, wherein: the bottom of carriage (2) just is located one side that bracing piece (13) kept away from each other and installs bracing piece two (16), and bracing piece two (16) are L type structure, and the bottom fixed mounting of bracing piece two (16) has supporting spring (17), and the inside bottom fixed connection of the bottom of supporting spring (17) and base (1).

5. The fixing base of the automatic die bonder for semiconductor of claim 4, wherein: a positioning pulley (18) is arranged at one side edge of the bottom end of the second supporting rod (16), and a pulley groove (19) matched with the positioning pulley (18) is formed in the position, corresponding to the positioning pulley (18), of the inner side edge of the base (1).

6. The fixing base of the automatic die bonder for semiconductor of claim 1, wherein: baffle (20) are symmetrically installed at the top of base (1), and baffle (20) are located the both sides of carriage (2).

7. The fixing base of the automatic die bonder for semiconductor of claim 1, wherein: the bottom ends of two side edges of the base (1) are both connected with mounting plates (21), and mounting bolts (22) penetrate through the mounting plates (21).