CN211017040U

CN211017040U - Detect hollow quick positioning jig of 5G GaN radio frequency chip glue film

Info

Publication number: CN211017040U
Application number: CN201922397404.XU
Authority: CN
Inventors: 黄乙为; 张怡; 尚润; 蔡择贤
Original assignee: Guangdong Chippacking Technology Co ltd
Current assignee: Guangdong Chippacking Technology Co ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-07-14
Anticipated expiration: 2029-12-27

Abstract

The utility model relates to a detect hollow quick positioning jig of 5G GaN radio frequency chip glue film, including bottom plate and apron, be equipped with a plurality of product location needles on the bottom plate, all correspond on full page chip product and the apron and be equipped with the locating hole, the product location needle passes full page chip product and apron on the locating hole, it is equipped with a plurality of metal wire characters that are used for the sign to correspond single chip still to arrange the array on the apron, the position of metal wire character and the position one-to-one of single chip. The cover plate covers the full-page chip product, the X-Ray reflection imaging principle is utilized to reflect the high-density metal, the corresponding metal wire characters can be displayed at the corresponding positions of the product by the imaging photos, after the defective product is confirmed, the contents of the metal wire characters corresponding to the single chip are directly read and recorded, the coordinates of the defective product can be immediately positioned, the phenomenon that the product is found incorrectly by manual recording and the confirmation of repeated positions can be avoided, and the detection efficiency is greatly improved.

Description

Detect hollow quick positioning jig of 5G GaN radio frequency chip glue film

Technical Field

The utility model relates to a chip package technical field especially relates to a detect hollow quick positioning jig of 5GGaN radio frequency chip glue film.

Background

With the development of 5G technologies at home and abroad, gallium nitride chips suitable for 5G products appear in the market successively, and the chips have large current and high power during working and have the working temperature of 250 ℃, so that the chip packaging products are required to have the characteristics of high heat dissipation and high reliability. In the production process, a small amount of defective products are generated in a 5GGaN radio frequency chip packaging product due to a glue layer cavity, and the glue layer cavity has fatal hidden quality danger to the reliability of the packaging product, so that in the production process of a packaging process technology, glue layer cavity detection needs to be carried out on the packaging product subjected to whole-plate mounting and curing through X-Ray detection equipment, and the detected defective products need to be picked out for scrapping; the existing testing method is to directly place the whole packaged product on a workbench of an X-Ray device, then carry out focusing check, manually count when a defective product is detected in the detection process, count the corresponding row number on paper, and find out the corresponding defective product at the position of the corresponding record on the product after the detection is finished.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can improve detection efficiency's the hollow quick positioning jig of detection 5GGaN radio frequency chip glue film.

The utility model discloses a realize like this: the utility model provides a detect hollow quick positioning jig of 5GGaN radio frequency chip glue film for detect full position chip product, includes bottom plate and apron, bottom plate and apron are non-metallic material, be equipped with a plurality of product pilot pins on the bottom plate, all correspond on full position chip product and the apron and be equipped with the locating hole, the product pilot pin passes full position chip product and the locating hole on the apron, makes the three realize the location, it is equipped with a plurality of metal wire characters that are used for the single chip of sign still to array on the apron, the position one-to-one of metal wire character and the position of single chip.

Wherein the line width of the metal line character is 0.30mm-0.50 mm.

The cover plate is a copper-clad plate, and copper except metal wire characters is corroded.

The metal wire characters are copper wire characters or aluminum wire characters.

The metal wire characters comprise three digits, the first digit is a vertical mark, 26 English letters are used for marking from top to bottom in sequence, the second digit and the third digit are horizontal marks, and 01, 02 and 03 … … digits are used for marking from left to right in sequence.

The middle parts of the two sides of the bottom plate are also provided with taking and placing gaps for accommodating fingers so as to conveniently take and place full-page chip products.

The utility model has the advantages that: the base of the rapid positioning jig is mainly used for placing and positioning full-page chip products and positioning the cover plate, the cover plate covers the full-page chip products, the positions of metal wire characters on the cover plate correspond to the positions of single chips one by one, when X-Ray equipment is used for detection, the X-Ray is used for reflecting and imaging the high-density metal, corresponding metal wire characters can be displayed at the corresponding positions of the products by imaging photos, after the defective products are confirmed, the contents of the metal wire characters corresponding to the single chips are directly read and recorded, the coordinates of the defective products can be immediately positioned, inaccurate product finding and repeated position confirmation of artificial records can be avoided, and the detection efficiency is greatly improved.

Drawings

FIG. 1 is a cross-sectional view of an embodiment of the rapid positioning jig for detecting voids in the rubber layer of a 5GGaN radio frequency chip according to the present invention;

fig. 2 is a top view of the base plate of the present invention;

fig. 3 is a top view of the cover plate of the present invention;

FIG. 4 is an enlarged view at A in FIG. 3;

fig. 5 is a partial schematic view of an entire chip product according to the present invention.

Wherein, 1, a bottom plate; 11. taking and placing the notch; 2. a cover plate; 21. positioning holes; 22. a metal line character; 3. a product positioning pin; 4. full-page chip products; 41. positioning holes; 42. a single chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As detect the hollow quick positioning jig embodiment of 5GGaN radio frequency chip glue film, as shown in fig. 1 to 5 for detect full page chip product 4, including bottom plate 1 and apron 2, bottom plate 1 and apron 2 are non-metallic material, be equipped with a plurality of product pilot pin 3 on the bottom plate 1, all correspond on full page chip product 4 and the apron 2 and be equipped with locating

hole

41, 21, product pilot pin 3 passes locating

hole

41, 21 on full page chip product 4 and the apron 2, makes the three realize the location, it is equipped with a plurality of metal wire characters 22 that are used for marking single chip 42 to go back the array on the apron 2, metal wire character 22's position and single chip 42's position one-to-one.

The base 1 of the rapid positioning jig is mainly used for placing and positioning the full-page chip product 4 and positioning the cover plate 2, the cover plate 2 covers the full-page chip product 4, the positions of the metal wire characters 22 on the cover plate 2 correspond to the positions of the single chips 42 one by one, when X-Ray equipment is used for detection, the X-Ray is used for reflecting and imaging the high-density metal, corresponding metal wire characters 22 can be displayed at the corresponding positions of the product by imaging photos, after the defective products are confirmed, the coordinates of the defective products can be immediately positioned by directly reading and recording the contents of the metal wire characters 22 corresponding to the single chips 42, the inaccurate product finding and repeated position confirmation of manual records can be avoided, and the detection efficiency is greatly improved.

In this embodiment, the line width of the metal line character 22 is preferably 0.30mm to 0.50mm, which does not affect the determination of the voids in the glue layer and can be developed. Of course, the width of the line can be adjusted according to the specific size of the chip product, and the line width can even reach 1.0 mm.

In the present embodiment, the metal line characters 22 are copper line characters or aluminum line characters, which are all high-density metals. More specifically, the cover plate 2 may be a copper clad plate, and copper except for copper wire characters is etched away, so that finer metal wire characters 22 can be manufactured. Of course, the character grooves can be etched on the cover plate by laser, and then the metal wire characters can be manufactured by filling metal wires, which is generally suitable for manufacturing characters with a line width of more than 0.2 mm. The metal wire characters 22 comprise three digits, the first digit is a vertical mark and is marked by 26 English letters from top to bottom, the second digit and the third digit are horizontal marks and are marked by 01, 02 and 03 … … digits from left to right.

In this embodiment, the middle portions of the two sides of the bottom plate 1 are further provided with a pick-and-place gap 11 for accommodating fingers to facilitate picking and placing of the full-page chip product 4.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a detect hollow quick positioning jig of 5G GaN radio frequency chip glue film for detect full page chip product, its characterized in that, includes bottom plate and apron, bottom plate and apron are non-metallic material, be equipped with a plurality of product location needles on the bottom plate, all correspond on full page chip product and the apron and be equipped with the locating hole, the product location needle passes full page chip product and the locating hole on the apron, makes the three realize the location, it is equipped with a plurality of metal wire characters that are used for the single chip of sign still to array on the apron, the position one-to-one of metal wire character and the position of single chip.

2. The fixture of claim 1, wherein the metal line has a width of 0.30mm-0.50 mm.

3. The fixture for detecting cavities in adhesive layers of 5G GaN radio frequency chips according to claim 1, wherein the cover plate is a copper-clad plate, and copper except for the metal wire characters is etched away.

4. The fixture of claim 1, wherein the metal line characters are copper line characters or aluminum line characters.

5. The tool of claim 1, wherein the metal line characters include three digits, the first digit is a vertical mark and is marked with 26 English letters from top to bottom, the second digit and the third digit are horizontal marks and are marked with two digits of 01, 02 and 03 … … from left to right.

6. The tool of claim 1, wherein the middle of the two sides of the bottom plate is further provided with a pick-and-place gap for accommodating fingers to facilitate pick-and-place of the full-page chip product.