CN211016582U - 一种中压防水直流电缆 - Google Patents
一种中压防水直流电缆 Download PDFInfo
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- CN211016582U CN211016582U CN201921584648.2U CN201921584648U CN211016582U CN 211016582 U CN211016582 U CN 211016582U CN 201921584648 U CN201921584648 U CN 201921584648U CN 211016582 U CN211016582 U CN 211016582U
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- conductor
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- 238000009413 insulation Methods 0.000 claims abstract description 52
- 239000004020 conductor Substances 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000872 buffer Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- -1 polypropylene Polymers 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229920001155 polypropylene Polymers 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 238000004049 embossing Methods 0.000 claims description 5
- 229920001903 high density polyethylene Polymers 0.000 claims description 5
- 239000004700 high-density polyethylene Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 3
- 230000005684 electric field Effects 0.000 abstract description 13
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910052755 nonmetal Inorganic materials 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921584648.2U CN211016582U (zh) | 2019-09-23 | 2019-09-23 | 一种中压防水直流电缆 |
Applications Claiming Priority (1)
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CN201921584648.2U CN211016582U (zh) | 2019-09-23 | 2019-09-23 | 一种中压防水直流电缆 |
Publications (1)
Publication Number | Publication Date |
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CN211016582U true CN211016582U (zh) | 2020-07-14 |
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CN201921584648.2U Active CN211016582U (zh) | 2019-09-23 | 2019-09-23 | 一种中压防水直流电缆 |
Country Status (1)
Country | Link |
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CN (1) | CN211016582U (zh) |
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2019
- 2019-09-23 CN CN201921584648.2U patent/CN211016582U/zh active Active
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Effective date of registration: 20231115 Address after: Room 208, Building F, Haitai Information Plaza, No. 8 Huatian Road, Huayuan Industrial Zone, Xiqing District, Tianjin, 300392 Patentee after: TIANJIN ENGICO TECHNOLOGY DEVELOPMENT Co.,Ltd. Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Effective date of registration: 20231115 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: No.99 Jingyi South Road, Yicheng Town, Yixing City, Wuxi City, Jiangsu Province 214200 Patentee before: WUXI INSTITUTE OF ARTS AND TECHNOLOGY |