CN211010830U

CN211010830U - L ED lamp

Info

Publication number: CN211010830U
Application number: CN201921641308.9U
Authority: CN
Inventors: 王名斌; 江涛; 熊爱明; 周林
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2017-12-08
Filing date: 2018-12-07
Publication date: 2020-07-14
Anticipated expiration: 2028-12-07
Also published as: CN209856801U; CN209856800U; CN210266762U; CN211010829U; CN210107087U; CN210141488U

Abstract

The utility model discloses an L ED lamp, which is characterized in that the lamp comprises a lamp shell, a passive heat dissipation assembly and a lamp plate, wherein the passive heat dissipation assembly comprises a heat radiator, the heat radiator comprises heat dissipation fins and a heat dissipation base, the heat radiator is connected with the lamp shell, a power supply is positioned in the lamp shell, the lamp plate is connected to the heat radiator, the lamp plate comprises a L ED chip group, the L ED chip group comprises a L ED chip, the power supply is electrically connected with the L ED chip, the heat dissipation fins and the heat dissipation base form a heat dissipation channel, the heat dissipation channel is provided with an air inlet hole, air flows out from the space between the heat dissipation fins through the heat dissipation channel after entering the air inlet hole, an opening is arranged in the central area of the lamp plate, and the opening is communicated with the air inlet hole to enable the air inlet hole to admit air from the opening.

Description

L ED lamp

The utility model discloses the application is that Chinese patent office, application number 201822047444.7, the new name "a L ED lamp"'s branch case application is filed on 2018 12 month 07 day.

Technical Field

The utility model relates to an L ED lamp, especially high power L ED lamp belong to the illumination field.

Background

L ED lamp is widely used in many lighting fields because of its advantages of energy saving, high efficiency, environmental protection, long life span, etc. L ED lamp is regarded as energy-saving green light source, the problem of heat dissipation of high power L ED is receiving attention, the excessive temperature will cause the light efficiency to be attenuated, if the waste heat generated by the operation of high power L ED can not be effectively dissipated, it will directly cause fatal influence to L ED life span, therefore, the solution of heat dissipation problem of high power L ED has become an important research and development subject of many relevant people in recent years.

L ED lamps in the prior art generally include a light source, a heat sink, a power source, a lamp housing, and a lamp cover, the light source is fixed to the heat sink, the power source is disposed in the lamp housing, the lamp housing is connected to the heat sink, the lamp housing includes a lamp head for connecting to a lamp socket, and L ED lamps in the prior art have the following disadvantages.

The heat radiator is unreasonable in design, and under the condition of only adopting passive heat radiation and certain weight limitation, the heat radiator cannot solve the heat radiation problem of L ED of a high-power L ED lamp, so that heat generated by L ED in working cannot be timely dissipated, and the service life of L ED can be influenced for a long time.

For another example, the convection design between the heat dissipation fins of the heat sink is not reasonable, for example, the fanless L ED spot light disclosed in the chinese utility model with the publication number CN 204717489U, the fins of the heat sink have no convection from bottom to top, which results in that the heat of the fins cannot be dissipated in time after being radiated to the air, so that the air temperature around the fins rises, and the important factor affecting the heat radiation efficiency of the fins is the temperature difference between the fins and the surrounding air, therefore, the rise of the air temperature can affect the subsequent heat radiation of the fins.

For another example, the design of the heat dissipation fins of the heat sink is not reasonable, for example, chinese patent publication No. CN 107345628A discloses a L ED lamp, in which the heat dissipation fins have the same width in the height direction of L ED lamp, and for the heat dissipation of the L ED lamp, the heat dissipation fins near L ED in the height direction of L ED lamp mainly conduct the heat generated by L ED to the heat dissipation fins, while the heat dissipation fins relatively far away from the L ED need to dissipate the heat to the surrounding environment through heat radiation and convection, that is, the heat dissipation fins far away from the L ED mainly dissipate the heat through heat radiation and convection, so that excessive fin area is not needed, while the design of the heat dissipation fins of the L ED lamp disclosed in the above patent cannot correspondingly increase the overall weight of the L ED lamp, but the heat dissipation efficiency cannot be increased.

In view of the above, the present invention and embodiments thereof are provided below.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a technical problem who mainly solves provides an L ED lamp to solve above-mentioned problem.

An embodiment of the utility model provides an L ED lamp, a serial communication port, include:

a lamp housing;

the passive heat dissipation assembly comprises a heat radiator, the heat radiator comprises heat dissipation fins and a heat dissipation base, and the heat radiator is connected with the lamp shell;

the power supply is positioned in the lamp shell; and

the lamp panel is connected to the radiator and comprises L ED chip groups, the L ED chip groups comprise L ED chips, and the power supply is electrically connected with the L ED chips;

the heat dissipation fins and the heat dissipation base form a heat dissipation channel, the heat dissipation channel is provided with an air inlet, and air enters from the air inlet, passes through the heat dissipation channel and finally flows out from the space between the heat dissipation fins;

the central region of lamp plate sets up the opening, the opening with the inlet port intercommunication, so that the inlet port is followed the opening part admits air.

In one embodiment, the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when the L ED lamp is supplied with less than 300 watts of power.

In one embodiment, the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when the L ED lamp is supplied with less than 250 watts of power.

In one embodiment, the lamp housing includes a neck, and the height of the neck is at least 80% or more of the height of the heat sink.

In one embodiment, the lamp neck is exposed outside the heat sink.

In one embodiment, the lamp housing has a current-limiting surface, and the current-limiting surface covers at least part of the heat dissipation fins.

In one embodiment, the upper side of the heat dissipation fins in the axial direction of the L ED lamp at least partially corresponds to the flow restriction surface.

In one embodiment, the lamp panel has an inner boundary and an outer boundary, the inner boundary and the outer boundary extend axially along the L ED lamp to form a region, and the surface area of the heat dissipation fins in the region is larger than the surface area outside the region.

In one embodiment, when at least one of the heat dissipation fins projects along the axial direction of the L ED lamp to the plane where the L ED chipset is located, the projection of the heat dissipation fin contacts at least one of the L ED chips in the L ED chipset.

In one embodiment, when the heat dissipation fins project along the axial direction of the L ED lamp to the plane where the L ED chipset is located, the projection of any one of the heat dissipation fins contacts at least one of the L ED chips in the L ED chipset.

In one embodiment, the L ED lamp has a profile that is 360 degrees around the axis of the L ED lamp to form the L ED lamp profile, the profile includes the profile of the neck and the profile of the heat sink, the profile of the neck has a slope a, the profile of the heat sink has a slope b, and the absolute value of the slope a is greater than the absolute value of the slope b.

In one embodiment, the value of the slope a is greater than 2.

In one embodiment, the slope a has a value of 2.5 to 5.

In one embodiment, the value of the slope b is less than 3.

In one embodiment, the slope b has a value of 1-2.5.

In one embodiment, the contour line of the neck is a concave curve.

In one embodiment, the outer contour of the heat sink is a convex curve.

In one embodiment, the heat sink fins include a first stage extending across the heat sink base and a second stage extending across the first stage, the first stage having a greater length in a radial direction than the second stage in a radial direction of the L ED lamp at L ED lamps.

In one embodiment, the height of the first stage in the axial direction of the L ED lamp is lower than the height of the second stage in the axial direction of the L ED lamp.

a lamp housing;

the power supply is positioned in the lamp shell; and

the lamp panel is connected to the radiator and comprises L ED chips, and the power supply is electrically connected with the L ED chips;

the outer contour of the side surface of the L ED lamp is rotated by 360 degrees around the axis of the L ED lamp by a contour line to form the outer contour of the L ED lamp, the contour line comprises the contour line of the lamp neck and the contour line of the heat sink, the contour line of the lamp neck has a slope a, the contour line of the heat sink has a slope b, and the absolute value of the slope a is greater than the absolute value of the slope b.

In one embodiment, the value of the slope a is greater than 2.

In one embodiment, the slope a has a value of 2.5 to 5.

In one embodiment, the value of the slope b is less than 3.

In one embodiment, the slope b has a value of 1-2.5.

In one embodiment, the contour line of the neck is a concave curve.

In one embodiment, the outer contour of the heat sink is a convex curve.

In one embodiment, the heat dissipation fins and the heat dissipation base form a heat dissipation channel, the heat dissipation channel has air inlets, and air enters from the air inlets, passes through the heat dissipation channel, and finally flows out from the space between the heat dissipation fins.

In one embodiment, an opening is formed in the central area of the lamp panel and communicated with the air inlet hole, so that the air inlet hole can admit air from the opening.

In one embodiment, the lamp neck is exposed outside the heat sink.

In one embodiment, the lamp housing has a current-limiting surface, and the current-limiting surface covers at least part of the heat dissipation fins. The third opening is arranged in the area of the center of the lamp panel, and the first air inlet hole and the second air inlet hole respectively admit air from the third opening.

In an embodiment, the lamp panel includes L ED chip groups, the L ED chip group includes the L ED chips, and when at least one of the heat dissipation fins projects to a plane where the L ED chip group is located along an axial direction of the L ED lamp, the projection of the heat dissipation fin contacts at least one of the L ED chips in the L ED chip group.

a lamp housing;

the power supply is positioned in the lamp shell; and

an opening is formed in the central area of the lamp panel and communicated with the air inlet hole, so that the air inlet hole can enter air from the opening;

the L ED lamp weighs less than 1.7kg, the L ED chip is lighted and emits at least 25000 lumens of luminous flux when the L ED lamp is supplied with electric energy of less than 300 watts, the lamp shell comprises a lamp neck, and the height of the lamp neck is at least more than 80% of the height of the heat sink;

the lamp neck is exposed outside the radiator, the lamp shell is provided with a flow limiting surface, the flow limiting surface covers at least part of radiating fins, the upper sides of the radiating fins in the axial direction of the L ED lamp at least partially correspond to the flow limiting surface, the lamp panel is provided with an inner side boundary and an outer side boundary, the inner side boundary and the outer side boundary extend upwards along the axial direction of the L ED lamp to form an area, and the surface area of the radiating fins in the area is larger than that in the area;

when at least one heat dissipation fin projects to the plane of the L ED chip group along the axial direction of L ED lamps, the projection of the heat dissipation fin at least contacts at least one L ED chip in the L ED chip group.

In one embodiment, the value of the slope a is greater than 2.

In one embodiment, the slope a has a value of 2.5 to 5.

In one embodiment, the value of the slope b is less than 3.

In one embodiment, the slope b has a value of 1-2.5.

In one embodiment, the contour line of the neck is a concave curve.

In one embodiment, the outer contour of the heat sink is a convex curve.

The utility model has the advantages that: compared with the prior art, the utility model discloses an arbitrary effect or its arbitrary combination below:

through the arrangement of the heat dissipation channel, the convection heat dissipation of the heat radiator can be increased, the natural convection efficiency of the whole lamp is increased, and the corresponding required heat dissipation area of the heat radiator is reduced.

The mouth is seted up in the region at the center of lamp plate, can avoid occupying the too much region of lamp plate to avoid the area in the region of setting L ED chip of lamp plate to reduce because of seting up a plurality of holes.

The heat sink has a first stage and a second stage, so that the heat sink has a stepped shape when viewed in a direction perpendicular to the axial direction, and the arrangement is such that the heat sink has a lower portion with a sufficient fin area for conducting L ED heat generated by the operation of the chips, and an upper portion with radiation and convection mainly, so that the fin area can be reduced appropriately from a weight reduction point.

By projecting the cooling fins to at least one L ED chip in the L ED chip group, the heat conduction path of the L ED chip is shortened, so that the thermal resistance is reduced, and the heat conduction is facilitated.

The arrangement of the flow limiting surface can change the flowing direction of hot air to make the hot air far away from the lamp shell when the heat radiating fins are radiating and the hot air which is partially covered by the flow limiting surface is blocked by the flow limiting surface in the process of rising.

Most of the radiating fins of the radiator correspond to the lamp panel (the heat conducting path is short), so that the utilization rate of the radiating fins can be improved, and the effective heat conducting area of the radiating fins to the L ED chip is increased

Drawings

FIG. 1 is a schematic front view of an L ED lamp in this embodiment;

FIG. 2 is a schematic cross-sectional view of the L ED lamp of FIG. 1;

FIG. 3 is an exploded schematic view of the L ED lamp of FIG. 1;

FIG. 4 is a schematic cross-sectional view of an L ED lamp showing a first heat dissipation channel and a second heat dissipation channel;

FIG. 5 is a schematic perspective view of the L ED lamp of FIG. 1;

FIG. 6 is a schematic view of the light output surface of FIG. 5 with the light output surface removed;

FIG. 7 is an exploded schematic view of an L ED lamp showing a light barrier ring in some embodiments;

FIG. 8 is a cross-sectional view of an L ED lamp in some embodiments, showing a flat light output surface;

FIG. 9 is a bottom view of the L ED lamp of FIG. 1 with the lamp cover removed;

FIG. 10 is a cross-sectional view of an L ED lamp in this embodiment;

FIG. 11 is a schematic view of a heat sink in one embodiment;

fig. 12 is a schematic diagram of the heat sink fins of the present embodiment cooperating with L ED chips;

fig. 13 is a schematic diagram of the cooperation of heat fins with L ED chips in some embodiments;

fig. 14 is a front view of an L ED lamp in the present embodiment;

Detailed Description

In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, but which may be embodied in many different forms and without limitation to the embodiments described hereinafter, rather than to provide a more complete understanding of the disclosure of the invention, reference will now be made to directions such as "axial direction", "above", "below", etc. for the purpose of more clearly indicating the structural positional relationship, and without limitation to the invention.

Fig. 1 is a front view of a L ED lamp according to an embodiment of the present invention, fig. 2 is a cross-sectional view of a L ED lamp of fig. 1, fig. 3 is an exploded schematic view of fig. 1, fig. 2 and fig. 3 show that the L ED lamp includes a heat sink 1, a lamp housing 2, a lamp panel 3, a lamp housing 4 and a power supply 5, in this embodiment, the lamp panel 3 is connected to the heat sink 1 in a fitting manner so as to facilitate rapid conduction of heat generated by the lamp panel 3 during operation to the heat sink 1, specifically, in some embodiments, the lamp panel 3 is riveted with the heat sink 1, in some embodiments, the lamp panel 3 is connected to the heat sink 3 by bolts, in some embodiments, the lamp panel 3 is fixed to the heat sink 1 by welding, in some embodiments, the lamp panel 3 is fixed to the heat sink 1 by bonding, in this embodiment, the heat sink 1 is connected to the lamp housing 2, the lamp housing 4 is covered outside the lamp housing 3 so that light generated by the light source of the lamp panel 3 is emitted through the lamp housing 4, the power supply 5 is located in an inner cavity.

Referring to fig. 4, a cross-sectional view of the L ED lamp in the present embodiment is shown, as shown in fig. 2 and 4, a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2 in the present embodiment, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and a heat dissipation hole 222 (specifically, disposed at the upper portion of the lamp neck 22) is formed at the opposite end of the lamp housing 2. air enters from the first air inlet 2201 and is exhausted from the heat dissipation hole 222, so as to take away heat in the first heat dissipation channel 7a (mainly, heat generated when the power supply 5 operates), specifically, from the heat dissipation path, heat generated when the heating component in the power supply 5 operates transfers heat to the air in the first heat dissipation channel 7a (air near the heating component) by heat radiation, and external air enters the first heat dissipation channel 7a by convection, so as to take away the internal air for heat dissipation.

As shown in fig. 1, 2 and 4, a second heat dissipation channel 7b is formed in the heat dissipation fins 11 and the heat dissipation base 13, the second heat dissipation channel 7b has a second air inlet hole 1301, and air enters from the second air inlet hole 1301, passes through the second heat dissipation channel 7b, and finally flows out from a space between the heat dissipation fins 11, so that heat on the heat dissipation fins 11 can be taken away, and heat dissipation of the heat dissipation fins 11 is accelerated.

As shown in fig. 1 and 4, the heat sink 1 is provided with a third heat dissipation channel 7c, the third heat dissipation channel 7c is formed in a space between two heat dissipation fins 11 or between two sheets from which the same heat dissipation fin 11 extends, a radially outer portion between the two heat dissipation fins 11 forms an inlet of the third heat dissipation channel 7c, and air enters the third heat dissipation channel 7c from a radially outer region of the L ED lamp and takes away heat radiated from the heat dissipation fins 11 to the air.

The "L ED chip" in all embodiments of the present invention refers to all light sources using L ED (light emitting diode) as main body, including but not limited to L ED lamp bead, L ED lamp strip or L ED filament, so the L ED chipset referred to in this specification can also be equal to L ED lamp bead group, L ED lamp strip group or L ED filament group.

As shown in fig. 2, 5 and 6, in this embodiment, in order to prevent dust from depositing on the surface of L ED chip 311 and reduce the light effect of L ED chip 311 or affect heat dissipation of L ED chip 311, L ED chip 311 may be disposed in a closed space to prevent dust from entering and depositing on the surface of L ED chip 311. for example, a sealed cavity 9 is formed between the lampshade 4 and the lamp panel 3, and specifically, a sealed cavity 9 is formed between the light output surface 43, the inner reflective surface 4301, the outer reflective surface 4302 and the lamp panel 3 (the sealing may refer to no obvious holes and does not include inevitable gaps in the assembly process).

For example, L ED lamps have a maximum weight limited to 1.7kg when E39 lamp heads are used for L ED lamps, so the weight of the heat sink is limited to 1.2 kg in some embodiments after removing the power supply, lamp housing, etc. for some high power L ED lamps, the power is 150W-300W, the lumen number can reach 20000 lumen to 45000 lumen, i.e., the heat sink needs to dissipate the heat generated from L ED lamps generating 20000 to 45000 lumen within its weight limit, in the case of natural convection heat dissipation, the power of 1W generally needs a heat dissipation area of 35 square centimeter or more, and the following embodiments are designed to reduce the heat dissipation area needed by 1W power, thereby achieving the best heat dissipation effect under the premise of ensuring the space for installation and heat dissipation of the power supply 5.

As shown in FIGS. 1 and 2, L ED comprises or consists of a passive heat sink assembly, which only radiates heat by natural convection and radiation, but not by active heat sink assemblies, such as fans, etc. the passive heat sink assembly of the present embodiment comprises a heat sink 1, the heat sink 1 comprises fins 11 and a base 13, the fins 11 are radially and uniformly distributed along the circumference of the base and are connected to the base 13. when the L ED lamp is in use, the heat generated by the L ED 311 conducts at least a portion of the heat to the heat sink 1 in a heat conduction manner, and at least a portion of the heat sink 1 is dissipated to the outside air by heat radiation and convection.

In the present embodiment, in the case of passive heat dissipation (without fan), the ratio of the power (watt) of L ED lamp to the heat dissipation area (square centimeter) of the heat sink 1 is 1: 20-30, i.e. 20 square centimeter to 30 square centimeter of heat dissipation area is required per watt, preferably, the ratio of the power of L ED lamp to the heat dissipation area of the heat sink 1 is 1: 22-26, more preferably, the ratio of the power of L ED lamp to the heat dissipation area of the heat sink 1 is 25. a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and the opposite end of the lamp housing 2 has a heat dissipation hole 222. air enters from the air inlet 2201 and exits from the air inlet 222, thereby, a second heat dissipation channel 7b is formed in the heat dissipation fins 11, the heat dissipation base 13, the second heat dissipation channel 7b has a second air inlet, and the air enters from the second heat dissipation hole 7b, and then passes through the second heat dissipation channel 7b, and the heat dissipation fins 11, thus the heat dissipation channel 7b is accelerated to the heat dissipation fins when the heat dissipation area of the lamp 1, the lamp is smaller than the power (300 kg) of the heat dissipation fins, the heat sink 1W, the heat dissipation channel 7b is increased by the heat dissipation fins, the heat sink 20W, the heat dissipation channel, the heat sink 1, the heat dissipation channel 7b is increased, the heat dissipation fins, the heat dissipation efficiency is increased, and the heat dissipation fins, and the heat dissipation fins is increased by the heat dissipation efficiency is increased by the heat sink.

As shown in fig. 1, in the present embodiment, the weight of the heat sink 1 accounts for more than 50% of the weight of the L ED lamp, in some embodiments, the weight of the heat sink 1 accounts for 55-65% of the weight of the L ED lamp, and at this time, the volume of the heat sink 1 accounts for more than 20% of the total volume of the L ED lamp, and in the case that the heat conductivity coefficients of the heat sinks 1 are the same (i.e., the heat sinks 1 are made of the same material or made of two different materials having approximately the same heat conductivity coefficients), the larger the volume of the heat sink 1 can be used as a heat dissipation area, so, to a certain extent, when the volume of the heat sink 1 accounts for more than 20% of the total volume of the L ED lamp, the heat sink 1 can have more available space to increase the heat dissipation area, and after considering the installation space of the power supply 5, the lamp housing 4 and the lamp housing 2, it is preferable that the volume of the heat sink 1 accounts for 20% -60% of the total volume of the L ED lamp, and more preferable, the volume of the heat sink 1, and the volume of the L ED lamp housing occupies more 25% -50% of the total volume of the ED lamp housing L ED lamp, thereby, which is beneficial for.

Fig. 11 is a schematic diagram of a heat sink in an embodiment, which can be applied to L ED lamp to replace the heat sink 1 of L ED lamp shown in fig. 1.

As shown in fig. 11, in one embodiment, the heat dissipation fins of the heat sink 1, including the first heat dissipation fin 101 to the nth heat dissipation fin, may be configured as a two-stage drop, the first stage 1011 extends over the heat dissipation base 130, the second stage 1012 extends over the first stage 1011, the length of the first stage 1011 in the radial direction of the L ED lamp is greater than the length of the second stage 1012 in the radial direction of the L ED lamp, the height of the first stage 1011 in the axial direction of the L ED lamp is less than the height of the second stage 1012 in the axial direction of the L ED lamp, so that the first heat dissipation fin 101 is in a step shape when viewed in the direction perpendicular to the axial direction, such configuration ensures that the lower portion has sufficient fin area for conducting heat generated by the operation of the L ED chip 311, while the upper portion is primarily by radiation and convection, thereby reducing the fin area appropriately from a reduced weight angle.

L ED generates heat when it emits light, in L ED, one of the key parameters is thermal resistance, which is the better the thermal conductivity is when the thermal resistance is smaller, the factors that affect thermal resistance are roughly the length of the thermal path, the thermal area and the thermal conductivity of the thermal conductive material, and the formula is as follows:

thermal resistance (heat conduction path length L/(heat conduction area S) thermal conductivity).

That is, the smaller the heat conduction path, the larger the heat conduction area, and the higher the heat conductivity, the lower the thermal resistance.

As shown in fig. 9, in this embodiment, the light panel 3 includes at least an L ED chipset 31, and the L ED chipset 31 includes a L ED chip 311.

In the present embodiment, as shown in fig. 9, the lamp panel 3 is divided into an inner circle, a middle circle and an outer circle in the radial direction, and the L ED chip sets 31 are respectively disposed on the inner circle, the middle circle and the outer circle, that is, the inner circle, the middle circle and the outer circle are all provided with corresponding L ED chip sets 31. in another aspect, the lamp panel 3 includes three L ED chip sets 31, the three L ED chip sets 31 are respectively disposed on the inner circle, the middle circle and the outer circle of the lamp panel 3, the L ED chip sets 31 on the inner circle, the middle circle and the outer circle each include at least one L ED chip 311, as shown in fig. 9, 4 dotted lines are defined, the range defined between the two outermost dotted lines is the range of the outer circle, the range defined between the two innermost dotted lines is the range of the inner circle, and the range defined between the two middle dotted lines is the range of the middle circle.

Fig. 12 is a schematic diagram of the heat dissipation fins 11 and L ED chips 311 in this embodiment, as shown in fig. 9 and 12, when at least one heat dissipation fin 11 projects along an axial direction of L ED lamp to a plane of L ED chipset 31, the projection of the heat dissipation fin 11 contacts at least L2 ED chip 311 in L1 ED chipset 31 in this embodiment, specifically, when at least one heat dissipation fin 11 projects along an axial direction of L ED lamp to a plane of 854 ED chipset 31, the projection of the heat dissipation fin 11 contacts at least one L6 ED chip 311 in L ED chipset 31 of inner, middle, or outer circumference ring, as shown in fig. 12, the projection of the heat dissipation fin 11 contacts a L ED chip 311, as shown in fig. 13, the heat dissipation path between the L ED chip 311 and the heat dissipation fin 11 is not in the drawing, as shown in fig. 13, the projection of the heat dissipation fin 11 does not contact L ED chip 311 in the drawing, as shown in fig. 11, the heat dissipation fin 11 contacts at least one heat dissipation fin 11 along a heat conduction path between the inner circumference of the heat dissipation ring of the heat dissipation fin 11 and the heat dissipation chip 31, so that the heat dissipation fin 11 contacts at least one heat dissipation fin 11, the heat dissipation fin 11 is more effectively, and the heat dissipation fin 11 contacts at least one heat dissipation chip 11 along a heat conduction path of the heat dissipation ring before the heat dissipation fin 11, at least one heat dissipation fin 11, so that the heat dissipation fin 11 contacts the heat dissipation fin 11, at least one heat dissipation fin 11, the heat dissipation ring before the heat dissipation chip 11 contacts the heat dissipation chip 11, the heat conduction path of the heat dissipation chip 11, the heat dissipation chip 11 contacts the heat.

In this embodiment, the number of the heat dissipation fins 11 corresponding to the L ED chip sets 31 on the outer circumference is greater than the number of the heat dissipation fins 11 corresponding to the L ED chip sets 31 on the inner circumference, the correspondence here refers to the axial projection relationship of the L ED lamp, for example, when the L ED chip sets 31 on the outer circumference project to the heat dissipation fins 11 in the axial direction of the L ED lamp, the L ED chip sets 31 on the outer circumference correspond to the heat dissipation fins 11 of the heat sink 1 on the outer side, the L ED chip sets 31 on the outer circumference have a greater number of L ED chips 311, and therefore, more heat dissipation fins 11 (area) are needed for heat dissipation.

As shown in fig. 1 and 9, the lamp panel 3 has an inner boundary 3002 and an outer boundary 3003, and the inner boundary 3002 and the outer boundary 3003 extend upward along the L ED lamp axis to form an area, and the area of the heat sink fins 11 located in the area is larger than the area located outside the area, so that most of the heat sink fins 11 of the heat sink 1 correspond to the lamp panel 3 (the heat conduction path is short), thereby increasing the utilization rate of the heat sink fins 11 and increasing the effective heat conduction area of the heat sink fins 11 to the L ED chip 311.

As shown in fig. 3, 5 and 9, a light reflection area 3001 is disposed in an area between the inner circumference and the outer edge of the lamp panel 3, and the light reflection area 3001 can reflect upward light to the light output surface 43, so that loss of the light in the direction opposite to the light outgoing direction in the axial direction of the L ED lamp can be reduced, and the overall light outgoing intensity can be increased.

As shown in fig. 4 and 7, the lamp panel 3 is provided with a third opening 32, the third opening 32 is respectively communicated with the first heat dissipation channel 7a and the second heat dissipation channel 7b, that is, the third opening 32 is simultaneously communicated with the space between the heat dissipation fins 11 of the heat sink 1 and the cavity of the lamp housing 2, so that the space between the heat dissipation fins 11 and the cavity of the lamp housing 2 and the exterior of the L ED lamp form an air convection path, the third opening 32 is located more inside the inner circumferential ring in the radial direction of the L ED lamp, so that the space of the light reflection area 3001 is not occupied and the reflection efficiency is not affected, specifically, the third opening 32 is provided in the central area of the lamp panel 3, and the first opening 2201 and the second air inlet hole 1301 are respectively provided in the central area of the lamp panel 3 from the same opening (the third opening 32), that is, after the air convected passes through the third opening 32, the air enters the first opening 2201 and the second air inlet hole 1301, the third opening 32 is provided in the central area of the lamp panel 3, so that the first opening 1 and the second air inlet hole 2201 and the inner heat insulation hole can share the air inlet hole, thereby preventing the heat insulation area of the inner sleeve 21 from occupying the inner sleeve 3, and preventing the heat insulation core plate 21 from affecting the heat insulation chip, thereby preventing the heat inlet hole from occupying the heat insulation area of the inner sleeve 21.

As shown in fig. 12, an insulating coating 34 is disposed on the upper surface of the lamp panel 3, and the insulating coating 34 is configured to have high reflectivity, and a material having high reflectivity in the prior art, such as heat conductive silicone grease, may be used, when the insulating coating 34 is disposed, the insulating coating 34 is applied to the edge of the lamp panel 3, and the distance from the L ED chip 311 on the radially outermost side of the lamp panel 3 to the edge of the lamp panel 3 is greater than 4mm, preferably, the distance from the L ED chip 311 on the lamp panel 3 to the edge of the lamp panel 3 is greater than 6.5mm and less than 35mm, so that the creepage distance between the outermost side L ED chip 311 and the heat sink 1 can be ensured, and the outermost side L ED chip 311 and the heat sink 1 are prevented from being ignited to affect personal safety.

As shown in fig. 1, 2, 3 and 4, the lamp envelope 2 comprises a lamp base 23, a neck 22 and an inner envelope 21, the lamp base 23 is connected to the neck 22, and the neck 22 is connected to the inner envelope 21, wherein the inner envelope 21 is located inside the heat sink 1 (L ED lamp axial direction, the inner envelope 21 is all or most, for example, more than 80% of the height of the inner envelope is not more than the heat sink 1), and the neck 22 is exposed outside the heat sink 1. by the arrangement of the inner envelope 21, the neck 22, sufficient space is provided to accommodate the power source 5 and dissipate heat, particularly the power source 5 of a high power ED 56 lamp (a relatively low power L ED lamp whose power source is more complex in composition and larger in overall size) is provided by the inner envelope 21, the sum of the heights of the neck 22 and the lamp base 23 is greater than the height of the heat sink 1, to provide more space for disposing the power source 5, and the neck 22 and lamp base 23 are separated from the heat sink 1 (axially non-overlapping, the

inner envelope

21, 21 and inner envelope 23 are covered by the heat sink 22, the heat sink 22 and heat sink 22 are disposed at least as a heat sink 1, the heat sink 1 is prevented from affecting the heat sink 1.

As shown in fig. 2, the second air inlet hole 1301 is located at the lower side of the heat sink 1 and corresponds to the inner side or the inner side of the heat sink 1 in the radial direction, that is, the second air inlet hole 1301 corresponds to the inner side or the inner side of the heat sink 11, and the inner side or the inner side of the heat sink 11 corresponds to the outer wall of the inner sleeve 21 of the lamp housing 2 (the radial inner side of the heat sink 11 is close to or directly abutted against the inner sleeve 21), so that after entering from the second air inlet hole 1301, the convective air is convected along the outer wall of the inner sleeve 21 during the ascending process, and at the same time, the inner side or the inner side of the heat sink 11 and the outer wall of the inner sleeve 21 radiate heat in the radial direction, thereby playing a role of thermal insulation, that is, the heat of the heat sink 1 can be prevented from being conducted to the inner side of the inner sleeve 21 through the outer wall of the inner sleeve 21, thereby affecting the power source 5.

As shown in fig. 1 and 10, the lamp housing 2 has a current-limiting surface 214, which extends outward in the radial direction of the L ED lamp and is radially away from the heat dissipation hole 222, and the current-limiting surface 214 covers at least a portion of the heat dissipation fins 11. when the heat dissipation fins 11 dissipate heat, the heat dissipated by the heat dissipation fins 11 covered by the current-limiting surface 214 is blocked by the current-limiting surface 214 to change the flow direction of the heat (going outward along the current-limiting surface 214) so that the heat is away from the heat dissipation hole 222 when the heat is rising, thereby avoiding the formation of high temperature near the heat dissipation hole 222 and affecting the convection velocity of the first heat dissipation channel 7a itself, and avoiding the heat from entering the inner cavity of the lamp housing 2 through the heat dissipation hole 222 when the heat rises, thereby affecting the power supply 5, and finally avoiding the heat from rising to contact the metal portion 231 of the lamp cap 23 and affecting the heat dissipation of the metal portion 231, even the heat is directly conducted into the inner cavity of the lamp housing 2 through the metal portion 231. the current-limiting surface 214 can be formed on the inner sleeve 21.

As shown in fig. 10, in the present embodiment, the upper side of the heat dissipation fins 11 in the axial direction of the L ED lamp at least partially corresponds to the current limiting surface 214, and when the lamp housing 2 is inserted into the heat sink 1, the heat dissipation fins 11 limit the position of the lamp housing 2.

Referring to fig. 14, an outer contour of the L ED lamp in this embodiment is shown, a rectangular coordinate system is established, the axial direction of the L ED lamp is taken as the y-axis, the radial direction of the L ED is taken as the x-axis, the center of the bottom surface of the L ED lamp is taken as the origin, the outer contour of the side surface of the L ED lamp is rotated 360 degrees around the axis of the L ED lamp by a contour line to form the outer contour of the L ED lamp (not including the base 23), and the contour line includes the contour line of the neck 22 and the contour line of the heat sink 1.

The neck 22 is used for accommodating the power source 5 and mainly radiates the power source 5 therein in a convection manner, the contour of the neck 22 has a slope a, a is a constant, as shown in fig. 14, when the contour of the neck 22 is a curve, a straight line can be assumed to represent the rough slope of the contour of the neck 22. for example, a connection line L1 from the top to the bottom of the contour of the neck 22 is taken to represent the contour of the neck 22, or a connection line L2 from the center to the bottom of the top of the neck 22 is taken to represent the contour of the neck 22. in this embodiment, a connection line L1 from the top to the bottom of the contour of the neck 22 is taken to represent the contour of the neck 22, for illustration.

For example, a connecting line L from a top point to a bottom point of the contour line of the heat sink 1 is taken to represent the contour line of the heat sink 1, or a connecting line L from a center of a top portion of the heat sink 1 to a bottom point of the contour line of the heat sink 1 is taken to represent the contour line of the heat sink 1, and a connecting line L from the top point to the bottom point of the contour line of the heat sink 1 is taken to represent the contour line of the heat sink 1 for illustration.

In the present embodiment, the slope a is greater than the slope b, or the absolute value of the slope a is greater than the absolute value of the slope b, so that, in general, the contour of the neck 22 is steeper than the contour of the heat sink 1. in the case of the neck 22, in order to ensure the chimney effect during convection in the neck 22, if the contour of the neck 22 is flatter (the slope is small), the internal volume of the neck 22 is increased while maintaining the same height, but there is no practical help for the actual space of the power source, in the case of the heat sink 1, in order to ensure the heat dissipation effect, the height of the entire lamp is controlled, and therefore, the heat sink 1 needs to be flatter (the slope is small) to control the overall height, and in addition, when the heat sink 1 is flatter (the slope is small), the lower portion of the heat sink 1 has more area for heat dissipation and conduction of the ED chips L on the premise that the heat dissipation area is the same.

In the present embodiment, the value of the slope a is greater than 2, preferably 2.5 to 5, more preferably 3 to 4, and most preferably 3.2 to 3.8. So that a better chimney effect is achieved in the lamp neck 22 when heat is dissipated by convection.

In the present embodiment, the value of the slope b is less than 3, preferably 1 to 2.5, more preferably 1.4 to 2, and most preferably 1.5 to 1.9. So that the lower part of the heat sink 1 has more area for conduction.

In this embodiment, the contour of the L ED lamp is a continuous line, i.e., the bottom of the contour of the neck 22 is contiguous with the top of the contour of the heat sink 1. in other embodiments, the contour may be a multi-segment line, e.g., the bottom of the contour of the neck 22 is spaced from the top of the contour of the heat sink 1, so that the contour is generally discontinuous.

In this embodiment, the contour of the neck 22 is a concave curve, i.e. the line connecting the apex and the bottom of the contour of the neck 22 is virtually a straight line, the contour of the neck 22 is entirely inside the straight line (the side closer to the axis of the L ED lamp), while the contour of the heat sink 1 is a convex curve, the line connecting the apex and the bottom of the contour of the heat sink 1 is virtually a straight line, the contour of the heat sink 1 is entirely outside the straight line (the side further away from the axis of the L ED lamp), and the contour is a smooth or substantially smooth curve to avoid the formation of an included angle, on the other hand, to make convection of the convected air along the exterior of the L ED lamp more smooth, the contour of the L ED lamp in this embodiment is a "S" or an inverted "S" curve, which includes the curve on the neck 22 and the curve on the heat sink 1, the curve on the neck 22 and the heat sink 1 together form a "S" or "S" curve "as a curve" at the neck 22 and the heat sink neck 22 at the lower portion of the heat sink 1, and the heat sink neck 22 at a straight line at a smaller or at the lower portion of the heat sink neck, thus the heat sink neck 22 may be a straight line, or at a straight line, and the heat sink neck may be a heat sink neck 1, and the heat sink neck 22 at a heat sink neck may be at a smaller size, or at a smaller size, which may be a larger size, or a larger size, which may be a straight line, or a straight line, which may be more gradual increase, and a straight line, and a more gradual increase in the heat sink neck 1, and a more gradual increase in the heat sink neck 22, and a more gradual increase in the size, and a more gradual increase in the heat sink neck 1.

Any point on the contour of the neck 22 in this embodiment conforms to the following formula:

y＝-ax+k1+h，

where k1 is a constant and h is the height of the heat sink 1.

Any point of the contour line of the heat sink 1 conforms to the following formula:

y＝-bx+k2，

where k2 is a constant.

In the present embodiment, when the width of the L ED lamp is controlled to 100mm to 220mm, the value of k1 is 100 to 200, the value of k2 is 100 to 200, for example, when the width of L ED lamp is 200mm at most, the value of k1 is 140 to 150, and the value of k2 is 170 to 200.

In this embodiment, the height of the neck 22 is greater than 80% of the height of the heat sink 1. Since the neck 22 is axially spaced from the heat sink 1 without overlapping the neck and the heat sink 1, the power supply 5 in the neck 22 is less affected by the heat sink 1, and therefore, when the height of the neck 22 is greater than 80% of the height of the heat sink 1, more space is available for the power supply 5 to be disposed, and this portion of the power supply is less affected by the heat sink 1. In addition, when the power supply 5 in the lamp housing 2 achieves the heat dissipation effect through the convection mode, the height of the lamp housing 2 can be ensured by the arrangement of the height of the lamp neck 22, so as to ensure the chimney effect during the convection heat dissipation.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should it be construed that the utility model does not contemplate that such subject matter is part of the disclosed utility model subject matter.

Claims

1. An L ED lamp, comprising:

a lamp housing;

the power supply is positioned in the lamp shell; and

2. The L ED lamp of claim 1, wherein the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when less than 300 watts of power is supplied to the L ED lamp.

3. The L ED lamp of claim 1, wherein the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when less than 250 watts of power is supplied to the L ED lamp.

4. The L ED lamp of claim 1, wherein the envelope includes a neck having a height that is at least 80% or more of the height of the heat sink.

5. The L ED lamp of claim 4, wherein the lamp neck is exposed to the exterior of the heat sink.

6. The L ED lamp of claim 1, wherein the lamp housing has a current-limiting surface that covers at least part of the heat sink fins.

7. The L ED lamp of claim 6, wherein the upper side of the heat sink fins in the axial direction of the L ED lamp at least partially corresponds to the current-limiting surface.

8. The L ED lamp of claim 1, wherein the lamp panel has an inner boundary and an outer boundary, the inner and outer boundaries extending axially along the L ED lamp to form a region, the heat dissipating fins having a larger surface area within the region than outside the region.

9. The L ED lamp of claim 1, wherein at least one of the heat fins projects along the axis of the L ED lamp to the plane of the L ED chipset, the projection of the heat fins contacting at least one of the L ED chips in the L ED chipset.

10. The L ED lamp of claim 9, wherein the heat fins project along the L ED lamp axis to the plane of the L ED chipset, any projection of the heat fins contacting at least one of the L ED chips in the L ED chipset.

11. The L ED lamp of claim 1, wherein the housing includes a neck, the L ED lamp has a profile that revolves 360 degrees around the axis of the L ED lamp to form the L ED lamp profile, the profile includes the profile of the neck and the profile of the heat sink, the profile of the neck has a slope a, the profile of the heat sink has a slope b, and the absolute value of the slope a is greater than the absolute value of the slope b.

12. The L ED lamp of claim 11, wherein the slope a has a value greater than 2.

13. The L ED lamp of claim 12, wherein the slope a has a value of 2.5 ~ 5.

14. The L ED lamp of claim 11, wherein the slope b has a value less than 3.

15. The L ED lamp of claim 12, wherein the slope b has a value of 1 ~ 2.5.

16. The L ED lamp of claim 11, wherein the contour of the neck is concave.

17. The L ED lamp of claim 11, wherein the outer profile of the heat sink is a convex curve.

18. The L ED lamp of claim 1, wherein the heat fins comprise a first stage and a second stage, the first stage extending across the heat sink base, the second stage extending across the first stage, the first stage having a greater length in a radial direction from the L ED lamp than the second stage having a greater length in a radial direction from the L ED lamp.

19. The L ED lamp of claim 18, wherein the first stage has a height in the L ED lamp axial direction that is less than the height of the second stage in the L ED lamp axial direction.

20. An L ED lamp, comprising:

a lamp housing comprising a neck;

the power supply is positioned in the lamp shell; and

21. The L ED lamp of claim 20, wherein the slope a has a value greater than 2.

22. The L ED lamp of claim 21, wherein the slope a has a value of 2.5 ~ 5.

23. The L ED lamp of claim 20, wherein the slope b has a value less than 3.

24. The L ED lamp of claim 23, wherein the slope b has a value of 1-2.5.

25. The L ED lamp of claim 20, wherein the contour of the neck is concave.

26. The L ED lamp of claim 20, wherein the outer profile of the heat sink is a convex curve.

27. The L ED lamp of claim 20, wherein the heat dissipating fins and the heat dissipating base form a heat dissipating channel therein, the heat dissipating channel having air inlets, air entering through the air inlets passing through the heat dissipating channel and finally exiting through spaces between the heat dissipating fins.

28. The L ED lamp of claim 27, wherein the central region of the lamp panel is provided with an opening that communicates with the air intake holes so that the air intake holes admit air from the opening.

29. The L ED lamp of claim 27, wherein the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when less than 300 watts of power is supplied to the L ED lamp.

30. The L ED lamp of claim 27, wherein the L ED lamp weighs less than 1.7kg, and the L ED chip is illuminated and emits at least 25000 lumens when less than 250 watts of power is supplied to the L ED lamp.

31. The L ED lamp of claim 20 wherein the housing includes a neck having a height that is at least 80% or more of the height of the heat sink.

32. The L ED lamp of claim 31, wherein the lamp neck is exposed to the exterior of the heat sink.

33. The L ED lamp of claim 20, wherein the lamp housing has a current-limiting surface that covers at least part of the heat sink fins.

34. The L ED lamp of claim 33, wherein the upper side of the heat sink fins in the axial direction of the L ED lamp at least partially corresponds to the current-limiting surface.

35. The L ED lamp of claim 28, wherein the lamp panel has an inner boundary and an outer boundary, the inner and outer boundaries extending axially along the L ED lamp to form a region, the heat fins having a larger surface area within the region than outside the region.

36. The L ED lamp of claim 21, wherein the lamp panel includes a L ED chipset, the L ED chipset includes the L ED chips, and at least one heat sink fin projects along an axial direction of the L ED lamp to a plane in which the L ED chipset lies, the projection of the heat sink fin contacting at least one of the L ED chips in the L ED chipset.

37. The L ED lamp of claim 36, wherein the heat fins project along the L ED lamp axis to the plane of the L ED chipset, any projection of the heat fins contacting at least one of the L ED chips in the L ED chipset.

38. The L ED lamp of claim 20, wherein the heat fins comprise a first stage and a second stage, the first stage extending across the heat sink base, the second stage extending across the first stage, the first stage having a greater length in a radial direction from the L ED lamp than the second stage having a greater length in a radial direction from the L ED lamp.

39. The L ED lamp of claim 38, wherein the first stage has a height in the L ED lamp axial direction that is less than the height of the second stage in the L ED lamp axial direction.

40. An L ED lamp, comprising:

a lamp housing;

the power supply is positioned in the lamp shell; and

41. The L ED lamp of claim 40, wherein the heat fins project along the L ED lamp axis to the plane of the L ED chipset, any projection of the heat fins contacting at least one of the L ED chips in the L ED chipset.

42. The L ED lamp of claim 40, wherein the L ED lamp has an outer profile of sides that are rotated 360 degrees around the axis of the L ED lamp with a contour that forms the outer profile of the L ED lamp, the contour including the contour of the neck and the contour of the heat sink, the contour of the neck having a slope a, the contour of the heat sink having a slope b, the absolute value of the slope a being greater than the absolute value of the slope b.

43. The L ED lamp of claim 42, wherein the slope a has a value greater than 2.

44. The L ED lamp of claim 43, wherein the slope a has a value of 2.5 ~ 5.

45. The L ED lamp of claim 42, wherein the slope b has a value less than 3.

46. The L ED lamp of claim 43, wherein the slope b has a value of 1-2.5.

47. The L ED lamp of claim 42, wherein the contour of the neck is concave.

48. The L ED lamp of claim 42, wherein the outer profile of the heat sink is a convex curve.

49. The L ED lamp of claim 40, wherein the heat fins comprise a first stage and a second stage, the first stage extending across the heat sink base, the second stage extending across the first stage, the first stage having a greater length in a radial direction from the L ED lamp than the second stage having a greater length in a radial direction from the L ED lamp.

50. The L ED lamp of claim 49, wherein the height of the first stage in the L ED lamp axial direction is less than the height of the second stage in the L ED lamp axial direction.