CN209856801U - LED lamp - Google Patents

Abstract

The utility model discloses a LED lamp, a serial communication port, include: the lamp shell comprises an inner sleeve, a lamp neck and a lamp cap, wherein the lamp cap is connected with the lamp neck, and the lamp neck is connected with the inner sleeve; the radiator comprises radiating fins and a radiating base, and is connected with the lamp shell; the power supply is positioned in the lamp shell; the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip; the inner sleeve is arranged inside the radiator, the lamp neck is exposed outside the radiator, and the power supply is arranged in the inner sleeve and the lamp neck.

Description

LED lamp

The utility model discloses the application is that Chinese patent office, application number 201822047444.7, the new name "a LED lamp"'s branch case application is filed on 2018 12 month 07 day.

Technical Field

The utility model relates to a LED lamp belongs to the illumination field.

Background

The LED lamp is widely applied to various illumination fields because of the advantages of energy conservation, high efficiency, environmental protection, long service life and the like. The heat dissipation problem of the high-power LED is receiving attention as an energy-saving green light source, and the excessive temperature may cause the light emitting efficiency to be attenuated, and if the waste heat generated by the operation of the high-power LED cannot be effectively dissipated, the waste heat may directly affect the life of the LED, so the solution of the heat dissipation problem of the high-power LED has become an important research and development subject of many related people in recent years.

An LED lamp in the prior art generally includes a light source, a heat sink, a power source, a lamp housing, and a lamp cover, the light source is fixed to the heat sink, the power source is disposed in the lamp housing, the lamp housing is connected to the heat sink, and the lamp housing includes a lamp cap for connecting to a lamp holder. The prior art LED lamp has the following disadvantages.

Unreasonable setting of power supply: the lamp housing and the heat sink of the prior art LED lamp are not overlapped in the axial direction, and for some high-power LED lamps, the power supply has a larger volume (length), so that a larger (longer) lamp housing is required to accommodate the power supply, which is not beneficial to control of the volume (height) of the whole lamp; for example, in the chinese utility model patent with the publication number of CN 203190364U, a dual-channel air convection lamp heat dissipation structure and a PAR lamp using the same are disclosed, between the heat dissipation fins and the cavity (a part of the cavity is directly formed on the heat sink) that holds the power supply, there is no effective thermal isolation between the light source and the cavity that holds the power supply, and the heat-prone capacities generated by the heat dissipation fins and the light source directly enter the cavity through thermal conduction, thereby affecting the power supply in the cavity.

In view of the above, the present invention and embodiments thereof are provided below.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a LED lamp to solve above-mentioned problem.

The utility model provides a LED lamp, a serial communication port, include: the lamp shell comprises an inner sleeve, a lamp neck and a lamp cap, wherein the lamp cap is connected with the lamp neck, and the lamp neck is connected with the inner sleeve; the radiator comprises radiating fins and a radiating base, and is connected with the lamp shell; the power supply is positioned in the lamp shell; the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip; the inner sleeve is arranged inside the radiator, the lamp neck is exposed outside the radiator, and the power supply is arranged in the inner sleeve and the lamp neck.

Optionally, more than 80% of the height of the inner sleeve does not exceed the radiator.

Optionally, the sum of the heights of the lamp neck and the lamp cap is greater than the height of the heat sink.

Optionally, the height of the neck is at least 80% or more of the height of the heat sink.

Optionally, a second heat dissipation channel is formed between the heat dissipation fins and the heat dissipation base, and the heat dissipation base is provided with a second air inlet of the second heat dissipation channel, so that air enters from the second air inlet, passes through the second heat dissipation channel, and finally flows out from a space between the heat dissipation fins.

Optionally, the second air inlet hole corresponds to an inner side or an inner portion of the heat dissipation fin, and the inner side or the inner portion of the heat dissipation fin corresponds to an outer wall of the inner sleeve of the lamp housing.

Optionally, a first heat dissipation channel is formed in the inner cavity of the lamp housing to perform convection heat dissipation on the power supply, the first heat dissipation channel is provided with a first air inlet at one end of the lamp housing, and a heat dissipation hole is formed at the other end opposite to the lamp housing.

Optionally, the inner side wall of the heat dissipation fin in the radial direction of the LED lamp is spaced from the inner sleeve of the lamp housing.

Optionally, a distance is kept between an inner side wall of a part of the heat dissipation fins in the radial direction of the LED lamp and the inner sleeve of the lamp housing.

Optionally, the lamp housing has a flow limiting surface, the flow limiting surface is installed on the LED lamp and extends outward in the radial direction and is away from the heat dissipation hole in the radial direction, and the flow limiting surface covers at least part of the heat dissipation fins.

Optionally, the flow restricting surface is formed on the inner sleeve.

Optionally, the power supply includes electronic components including heat generating components, wherein at least one of the heat generating components thermally contacts the lamp head and dissipates heat through the lamp head.

Optionally, at least one of the heating assemblies is located in the lamp head, and the heating assembly is in contact with the lamp head through a heat conducting material, and the heating assembly is fixed to the lamp head through the heat conducting material.

Optionally, the heat conducting material covers only an area of an end of the power supply, and a position of the heat conducting material is higher than a position of the heat dissipation hole.

The utility model has the advantages that: compared with the prior art, the utility model has simple structure and reasonable design; the inner sleeve and the lamp neck are arranged, so that enough space is provided for accommodating a power supply and radiating, and particularly the power supply of a high-power LED lamp; the lamp neck is exposed outside the radiator, so that the power supply in the lamp neck is less influenced by the radiator; the inner sleeve is used for preventing the heat of the radiating fins from influencing the heat of the power supply; the arrangement of the first heat dissipation channel can take away the heat in the first heat dissipation channel (the heat generated by the power supply during working can increase the convection heat dissipation of the radiator through the arrangement of the second heat dissipation channel, the arrangement of the first heat dissipation channel and the second heat dissipation channel increases the efficiency of natural convection of the whole lamp, the corresponding required heat dissipation area of the heat sink is reduced; the second air inlet hole corresponds to the inner side or the inner part of the radiating fin, the inner side or the inner part of the radiating fin corresponds to the outer wall of the inner sleeve of the lamp shell, so after the air in convection enters from the second air inlet hole, convection along the outer wall of the inner sleeve in the ascending process, and radial heat dissipation on the inner side or the inner part of the heat dissipation fins and the outer wall of the inner sleeve, thereby, the heat insulation effect is achieved, namely, the heat of the radiator 1 can be prevented from being conducted to the inner part of the inner sleeve through the outer wall of the inner sleeve, and further the power supply is prevented from being influenced.

Drawings

FIG. 1 is a schematic front view of an LED lamp according to the present embodiment;

FIG. 2 is a schematic cross-sectional view of the LED lamp of FIG. 1;

FIG. 3 is an exploded schematic view of the LED lamp of FIG. 1;

FIG. 4 is a schematic cross-sectional view of an LED lamp showing a first heat dissipation channel and a second heat dissipation channel;

FIG. 5 is a schematic perspective view I of the LED lamp of FIG. 1;

FIG. 6 is a schematic view of the light output surface of FIG. 5 with the light output surface removed;

FIG. 7 is an exploded schematic view of an LED lamp in some embodiments, showing a light barrier ring;

FIG. 8 is a schematic perspective view of an LED lamp in some embodiments;

FIG. 9 is a schematic view of the light output surface of FIG. 8 taken away;

FIG. 10 is a cross-sectional view of an LED lamp in some embodiments, showing a flat light output surface;

fig. 11 is a schematic view of an end face of a lamp cover in the present embodiment;

figures 12a to 12g are schematic views of lampshades in some embodiments;

FIG. 13 is a perspective view of an LED lamp of the present embodiment;

fig. 14 is a sectional view of the LED lamp in the present embodiment;

fig. 15 is a plan view of the heat sink in the present embodiment;

FIG. 16 is an enlarged schematic view at E in FIG. 15;

fig. 17 is a schematic view of air swirling at the second fin;

FIG. 18 is a partial schematic view of a heat sink in some embodiments;

FIG. 19 is a bottom view of the LED lamp of FIG. 1 with the lamp housing removed;

FIG. 20 is an enlarged schematic view at A of FIG. 19;

FIG. 21 is a sectional view of an LED lamp in this embodiment;

FIG. 22 is a sectional view of the LED lamp of this embodiment;

FIG. 23 is an enlarged view at B in FIG. 2;

FIG. 24 is a partial schematic view of an LED lamp.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The following directions such as "axial direction", "above", "below", etc. are all for showing the structural position relationship more clearly, and are not limiting to the present invention.

Fig. 1 is a front view of an LED lamp in an embodiment of the present invention. Fig. 2 is a cross-sectional view of the LED lamp of fig. 1. Fig. 3 is an exploded view of fig. 1. As shown in fig. 1, 2 and 3, the LED lamp includes: radiator 1, lamp body 2, lamp plate 3, lamp shade 4 and power 5. In this embodiment, lamp plate 3 is connected on radiator 1 with the mode of laminating to do benefit to the heat that lamp plate 3 during operation produced and conduct to radiator 1 fast. Specifically, in some embodiments, the lamp panel 3 is riveted to the heat sink 1, in some embodiments, the lamp panel 3 is connected to the heat sink through a bolt, in some embodiments, the lamp panel 3 is welded to the heat sink 1, and in some embodiments, the lamp panel 3 is adhered to the heat sink 1. In this embodiment, the heat sink 1 is connected to the lamp housing 2, the lamp shade 4 covers the lamp panel 3, so that light generated by the light source of the lamp panel 3 is emitted through the lamp shade 4, the power source 5 is located in the inner cavity of the lamp housing 2, and the power source 5 is electrically connected to the LED chip 311 to supply power to the LED chip 311.

As shown in fig. 4, a cross-sectional view of the LED lamp in this embodiment is shown. As shown in fig. 2 and 4, a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2 in the present embodiment, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and a heat dissipation hole 222 (specifically, opened at the upper portion of the neck 22) is formed at the other end of the lamp housing 2. Air enters from the first air inlet 2201 and is exhausted from the heat dissipating hole 222, so that heat (mainly generated by the power supply 5 during operation) in the first heat dissipating channel 7a can be taken away. Specifically, in terms of the heat dissipation path, heat generated by the heating component in the power supply 5 during operation is firstly transferred to the air in the first heat dissipation channel 7a (air near the heating component) in a heat radiation manner, and the external air enters the first heat dissipation channel 7a in a convection manner, so as to take away the internal air for heat dissipation. In other embodiments, the heat dissipation holes 222 may be formed in the neck 22 for direct heat dissipation.

As shown in fig. 1, 2 and 4, a second heat dissipation channel 7b is formed in the heat dissipation fins 11 and the heat dissipation base 13, the second heat dissipation channel 7b has a second air inlet hole 1301, and air enters from the second air inlet hole 1301, passes through the second heat dissipation channel 7b, and finally flows out from the space between the heat dissipation fins 11. Therefore, the heat on the heat dissipation fins 11 can be taken away, and the heat dissipation of the heat dissipation fins 11 is accelerated. Specifically, in the heat dissipation path, heat generated by the LED chip 311 is conducted to the heat sink 1, the heat dissipation fins 11 of the heat sink 1 radiate the heat to the ambient air, and the second heat dissipation channel 7b carries away the air in the heat sink 1 for heat dissipation when performing convection heat dissipation.

Fig. 5 is a schematic perspective view of the LED lamp in this embodiment, showing the combination of the heat sink 1 and the lamp cover 4. Fig. 6 is a schematic view of the structure of fig. 5 with the light output surface 43 removed. As shown in fig. 5 and 6, in the present embodiment, the lamp housing 4 includes a light output surface 43 and an end surface 44, the end surface 44 is provided with ventilation holes 41, and air enters the first heat dissipation channel 7a and the second heat dissipation channel 7b through the ventilation holes 41. When the LED chip 311 (shown in fig. 6) emits light, light passes through the light output surface 43 and exits the lamp housing 4. In this embodiment, the light output surface 43 can be made of a transparent material in the prior art, such as glass, PC material, etc. The utility model discloses all embodiments call "LED chip", generally indicate all luminous sources that use LED (emitting diode) as the main part, including but not limited to LED lamp pearl, LED lamp strip or LED filament etc. consequently the LED chipset that this specification indicates does also equal to LED lamp pearl group, LED lamp strip group or LED filament group etc..

As shown in fig. 5 and fig. 6, in the present embodiment, an inner reflective surface 4301 is disposed on the inner side of the light output surface 43 of the lampshade 4 in the radial direction of the LED lamp, the inner reflective surface 4301 is opposite to the LED chips 311 on the lamp panel 3, and the inner reflective surface 4301 is located on the inner side of the lamp in the radial direction of the LED lamp, opposite to any one of the LED chips 311. In one embodiment, the outer reflecting surface 4302 is disposed on the outer side of the light output surface 43 in the radial direction of the LED lamp, the outer reflecting surface 4302 corresponds to the LED chip 311 on the lamp panel 3, and the outer reflecting surface 4302 is located on the outer side of the LED lamp in the radial direction with respect to any one of the LED chips 311. The arrangement of the inner reflecting surface 4301 and the outer reflecting surface 4302 is used to adjust the light emitting range of the LED chip set 31, so that the light is more concentrated, thereby improving the local brightness.

Fig. 11 shows a schematic view of the end face 44 of the lamp housing 4 in this embodiment. As shown in fig. 11, the ratio of the total cross-sectional area of the air holes 41 to the total area of the end surface 44 (the area of a single side of the end surface 44, e.g., the side away from the LED chip 311) is 0.01 to 0.7, preferably, the ratio of the total cross-sectional area of the air holes 41 to the total area of the end surface 44 is 0.3 to 0.6, and more preferably, the ratio of the total cross-sectional area of the air holes 41 to the total area of the end surface 44 is 0.4 to 0.55, and by limiting the ratio of the area of the air holes 41 to the area of the end surface 44 within the above range, the air inflow of the air holes 41 can be ensured, and the area of the air holes 41 can be adjusted while the structural strength of the end surface 44 is ensured. When the ratio of the area of the air hole 41 to the area of the end face 44 is 0.4-0.55, the air inflow of the air hole 41 can be ensured to meet the heat dissipation requirement of the LED lamp, the structural strength of the end face 44 can not be affected by the air hole 41, and the end face 44 is prevented from being easily damaged due to collision or extrusion after the air hole 41 is formed.

As shown in fig. 11, the maximum inscribed circle diameter of the airing hole 41 is less than 2mm, preferably 1 to 1.9 mm. In this way, on one hand, insects can be prevented from entering and most of dust can be prevented from passing through, and on the other hand, the air holes 41 can keep good air circulation efficiency. In other words, the vent 41 may define a length direction and a width direction, that is, the vent has a length and a width, the length dimension is greater than the width dimension, and the width of the widest portion of the vent is less than 2mm, and in one embodiment, the width of the widest portion is 1mm to 1.9 mm. In addition, the maximum width of the air holes 41 is greater than 1mm, and if the maximum width is less than 1mm, the air needs a larger pressure to enter the air holes 41, and thus the air circulation is not facilitated.

Fig. 12a to 12g show the shape of various vents 41 in some embodiments. As shown in fig. 12a to 12g, the ventilation holes 41 may be formed in a combination of one or more of a circle, a strip, an arc, a trapezoid, and a diamond. As shown in fig. 12a, if the air holes 41 are circular, their diameter is less than 2mm, so as to prevent insects from entering, prevent most dust from passing through, and maintain good air circulation efficiency. As shown in fig. 12b and 12c, if the air holes 41 are in the shape of a long strip or an arc, the width thereof is less than 2mm, so as to achieve the above technical effects. As shown in FIG. 12d, if the air holes 11d are trapezoidal, the bottom of the air holes is smaller than 2mm, so as to achieve the above technical effects. As shown in fig. 12e, if the ventilation holes 41 are rectangular with rounded corners, the width is less than 2mm, so as to achieve the above technical effect. As shown in FIGS. 12f and 12g, the air holes 41 may be triangular or drop-shaped, and the maximum inscribed circle thereof is smaller than 2 mm.

In some embodiments, the plurality of air holes 41 are distributed on the end surface 44. For example, the air holes 41 may be annularly distributed along the circumference of the end surface 44, so that the air flow can enter more uniformly. For another example, the plurality of air holes 41 may be distributed in the radial direction of the end surface 44. The ventilation holes 41 may also be distributed in an asymmetrical manner.

Taking fig. 12a as an example, in fig. 12a, two dotted lines are provided on the end surface 44, the dotted line of the inner ring represents the position of the first air inlet hole 2201 projected onto the end surface 44, the area inside the dotted line of the inner ring is a first portion (a first opening area 433), the area between the outer ring and the inner ring is a second portion (a second opening area 434), in this embodiment, the area occupied by the first air inlet hole 2201 projected onto the end surface 44 in the axial direction of the LED lamp forms the first portion (the first opening area 433), while the other area on the end surface 44 forms the second portion (the second opening area 434), and the area of the air vent 41 on the first portion is larger than the area of the air vent 41 on the second portion. This kind of arrangement, do benefit to and make most air get into first heat dissipation channel 7a to better dispel the heat to power 5, prevent that the electronic component of power 5 from being heated and ageing with higher speed. The above-described features are also applicable to the ventilation holes 41 in the other embodiments described above.

In other embodiments, the area occupied by the first air inlet hole 2201 projected to the end surface 44 in the axial direction of the LED lamp forms a first portion (first opening area 433), and the other area on the end surface 44 forms a second portion (second opening area 434), and the area of the air hole 41 on the first portion is smaller than the area of the air hole 41 on the second portion. Therefore, the heat dissipation fins 11 can be better dissipated to facilitate heat dissipation of the LED chip 311, and a local high temperature region is prevented from being formed at the LED chip 311.

As shown in fig. 1 and fig. 2, in the present embodiment, the LED includes or only includes a passive heat dissipation assembly, which only uses natural convection and radiation to dissipate heat, but does not use an active heat dissipation assembly, such as a fan. The passive heat dissipation assembly in this embodiment includes a heat sink 1, the heat sink 1 includes heat dissipation fins 11 and a heat dissipation base 13, the heat dissipation fins 11 are radially and uniformly distributed along the circumference of the heat dissipation base, and are connected to the heat dissipation base 13. When the LED lamp is used, the heat generated by the LED chip 311 conducts at least a portion of the heat to the heat sink 1 in a heat conduction manner, and at least a portion of the heat sink 1 is dissipated to the outside air by heat radiation and convection.

As shown in fig. 2, 4 and 5, the end surface 44 is spaced from the lamp panel 3 to form a cavity 8, the cavity 8 is respectively communicated with the first air inlet 2201 of the first heat dissipation channel 7a and the second air inlet 1301 of the second heat dissipation channel 7b, and air enters the cavity 8 from the air holes 41 of the end surface 44 and then enters the first heat dissipation channel 7a and the second heat dissipation channel 7 b. The cavity 8 is arranged, so that after air enters, a mixing process is carried out in the cavity, and then the air is distributed according to the negative pressure (the negative pressure generated due to temperature difference) condition of the first heat dissipation channel 7a and the second heat dissipation channel 7b, so that the distribution of air flow is more reasonable.

As shown in fig. 15, the heat sink fins 11 include first heat sink fins 111 and second heat sink fins 112, the bottom portions of the first heat sink fins 111 and the second heat sink fins 112 in the axial direction of the LED lamp are both connected to the heat sink base 13, and the first heat sink fins 111 and the second heat sink fins 112 are alternately arranged at intervals. The second heat dissipating fins 112 are Y-shaped, and the second heat dissipating fins 112 are divided into two, so that the heat sink 1 has more heat dissipating areas while occupying the same volume. In this embodiment, the first heat dissipation fins 111 and the second heat dissipation fins 112 are disposed at intervals, each first heat dissipation fin 111 is uniformly distributed on the circumference, each second heat dissipation fin 112 is uniformly distributed on the circumference, and two adjacent second heat dissipation fins 112 are symmetrically disposed with one first heat dissipation fin 111. In this embodiment, the distance between the first heat dissipation fins 111 and the second heat dissipation fins 112 is 8-12 mm, and in order to make the air in the heat sink 1 smoothly circulate and further make the heat sink 1 exert the maximum heat dissipation effect, the distance between the heat dissipation fins should be designed to be uniform.

As shown in fig. 15, at least one heat dissipation fin 11 is divided into two parts in the radial direction of the LED lamp, and the two parts are spaced apart from each other, so that a flow channel is formed at the space, so that air can be convected at the space. In addition, when the above-mentioned gap is projected to the lamp panel 3 in the axial direction of the LED lamp, the position of the above-mentioned gap corresponds to the region on the lamp panel 3 where the LED chip 311 is disposed, so that the increased convection current at this position can improve the heat dissipation effect on the LED chip 311. From the viewpoint of the limited overall weight of the LED lamp, the heat dissipation bass piece 11 is arranged at intervals, so that the amount of the heat dissipation bass piece 11 is reduced, the overall weight of the heat sink 1 is reduced, and an extra design space is provided for other parts of the LED lamp.

Fig. 16 is an enlarged schematic view at E in fig. 15. As shown in fig. 15 and 16, specifically, the heat dissipating fins 11 include first heat dissipating fins 111 and second heat dissipating fins 112, and the first heat dissipating fins 111 are divided into two parts, i.e., a first part 111a and a second part 111b, in the radial direction of the LED lamp, and the two parts are spaced apart in the radial direction of the LED lamp, and a space 111c is formed at the space. The first portion 111a is located radially inward of the second portion 111 b. The second radiator fin 112 has a third portion 112a and a fourth portion 112b, the fourth portion 112b extends from the third portion 112a, the position of the fourth portion 112b in the circumferential direction is changed compared with the third portion 112a, and the fourth portion 112b is located at the radial outer side of the heat sink 1 relative to the third portion 112a, so as to improve the space utilization rate, and thus, the area of the radiator fin 11 capable of dissipating heat is increased. As shown in fig. 16, the third portion 112a and the fourth portion 112b are connected by a transition section 113, the transition section 113 has a buffer section 113a and a guide section 113b, the buffer section 113a and the guide section 113b are both arc-shaped, and both form an "S" shape or an inverted "S" shape. The buffer section 113a is disposed to prevent air from forming a vortex when the air is convected radially outward on the surface of the second heat dissipating fin 112 as shown in fig. 17, and further prevent the convection, but the guide section 113b guides the convected air to continuously flow radially outward along the surface of the second heat dissipating fin 112.

As shown in fig. 16, a second finstock 112 includes a third portion 112a and two fourth portions 112b, and the two fourth portions 112b are symmetrically arranged with the third portion 112a as a symmetry axis. In other embodiments, a second heat sink fin 112 may also include a third portion 112a and a plurality of fourth portions 112b, such as three or four fourth portions 112b (not shown), and the fourth portions 112b of the second heat sink fin 112 on two sides of the LED lamp in the circumferential direction are adjacent to the first heat sink fins 111.

As shown in fig. 16, the direction pointed by any tangent of the guiding section 113b is offset from the spacer 111c, so as to prevent the convective air from entering the spacer 111c through the guiding section 113b, so that the convective path is lengthened to affect the heat dissipation efficiency. Preferably, a direction in which any tangent line of the guide section 113b is directed is located radially outward of the spacer 111 c. In other embodiments, at least a part of the tangent line of the guide segment 113b is directed in a direction radially inward of the spacer 111 c.

As shown in fig. 18, in other embodiments, at least a portion of the tangent of the guiding segment 113b is directed in a direction falling into the space 111c to make the convection flow more sufficient, but to increase the path of the convection flow accordingly.

Fig. 19 is a bottom view of the LED lamp of fig. 1 with the lamp housing 4 removed. Fig. 20 is an enlarged view at a in fig. 19. As shown in fig. 19 and 20, the heat sink 1 is sleeved on the radial periphery of the inner sleeve 21, and the inner side wall of the heat dissipation fins 11 in the radial direction of the LED lamp keeps a distance from the inner sleeve 21 of the lamp housing 2, so that, on one hand, the inner sleeve is prevented from being damaged due to thermal expansion and extrusion of the inner side wall of the heat dissipation fins 11 during operation, and on the other hand, the inner side wall of the heat dissipation fins 11 is prevented from directly contacting the inner sleeve 21 to form heat conduction, so that the heat of the heat dissipation fins 11 is conducted to the inside of the inner sleeve 21 to affect the electronic components of the power supply 5 in the lamp housing 2, and finally, the heat dissipation fins 11 have air in the distance between the inner side wall of the LED lamp in the radial direction and the inner sleeve of the lamp housing 2, and. In other embodiments, in order to make the heat dissipation fins 11 have radial support property to the inner sleeve 21, a portion of the heat dissipation fins 11 may be disposed to contact with the radial inner sidewall of the inner sleeve 21 and support the outer peripheral surface of the inner sleeve 21, and a portion of the heat dissipation fins 11 may be spaced apart from the inner sleeve 21, which may be applied to the LED lamp in fig. 19. As shown in fig. 19, the lamp panel 3 includes a third opening 32 to expose the first air inlet hole 2201 and the second air inlet hole 1301. In some embodiments, in order to rapidly discharge the thermal energy generated by the power source 5, the ratio of the sectional area of the first intake hole 2201 to the sectional area of the second intake hole 1301 is greater than 1 and less than or equal to 2. In some embodiments, in order to rapidly discharge heat generated by the LEDs of the lamp plate 3, the ratio of the cross-sectional area of the second air intake hole 1301 to the cross-sectional area of the first air intake hole 2201 is greater than 1 and less than or equal to 1.5.

As shown in fig. 13 and 14, the innermost position of the heat radiation fin 11 in the radial direction of the LED lamp is located further outside the heat radiation hole 222 in the radial direction of the LED lamp, that is, the innermost position of the heat radiation fin 11 in the radial direction of the LED lamp and the position of the heat radiation hole 222 maintain a space in the radial direction of the LED lamp. Therefore, when the heat emitted from the heat dissipation fins 11 is upward, the heat is not collected at the heat dissipation hole 222, and a certain distance is kept between the heat dissipation hole 222 and the heat dissipation hole 222, so as to avoid the influence of the hot air, which increases the temperature near the heat dissipation hole 222 and affects the convection speed of the first heat dissipation channel 7a (the convection speed depends on the temperature difference at the two sides of the first heat dissipation channel 7a, and when the temperature near the heat dissipation hole 222 increases, the convection speed is correspondingly reduced).

As shown in fig. 19, in this embodiment, the lamp panel 3 includes at least one LED chip set 31, and the LED chip set 31 includes an LED chip 311.

As shown in fig. 19, in the present embodiment, the lamp panel 3 is divided into an inner circumference, a middle circumference and an outer circumference in the radial direction, and the LED chip sets 31 are correspondingly disposed on the inner circumference, the middle circumference and the outer circumference, that is, the inner circumference, the middle circumference and the outer circumference are all provided with the corresponding LED chip sets 31. In another aspect, the lamp panel 3 includes three LED chip sets 31, and the three LED chip sets 31 are respectively disposed on the inner periphery, the middle periphery and the outer periphery of the lamp panel 3. The LED chip groups 31 on the inner, middle and outer circumferential rings each include at least one LED chip 311.

As shown in fig. 4 and 7, the lamp panel 3 is provided with a third opening 32, and the third opening 32 is respectively communicated with the first heat dissipation channel 7a and the second heat dissipation channel 7b, that is, the third opening 32 is simultaneously communicated with the space between the heat dissipation fins 11 of the heat sink 1 and the cavity of the lamp housing 2, so that the space between the heat dissipation fins 11 and the cavity of the lamp housing 2 form an air convection path with the outside of the LED lamp. The third opening 32 is located further inward of the inner peripheral ring in the radial direction of the LED lamp. Therefore, the space of the light reflection area 3001 is not occupied, and the reflection efficiency is not affected. Specifically, the third opening 32 is disposed in a central area of the lamp panel 3, and the first air inlet hole 2201 and the second air inlet hole 1301 are respectively provided with air from the same opening (the third opening 32), that is, the convective air enters the first air inlet hole 2201 and the second air inlet hole 1301 after passing through the third opening 32. The third opening 32 is provided in the center of the lamp panel 3, so that the first air inlet hole 2201 and the second air inlet hole 1301 can share one air inlet, and therefore, the occupation of an excessive area of the lamp panel 3 can be avoided, and the area of the lamp panel 3 where the LED chip 311 is provided is reduced by providing a plurality of holes. On the other hand, since the inner case 21 corresponds to the third opening 32, the air convected during the intake air plays a role of heat insulation, that is, prevents the temperatures inside and outside the inner case 21 from affecting each other.

As shown in fig. 14, the electronic components include heat generating components 501, wherein at least one of the heat generating components 501 is close to the lamp head 23 and radiates heat through the lamp head 23 without occupying heat radiation resources of the first heat radiation channel 7 a. The at least one heating element 501 near the lamp head 23 is an inductor, a resistor, a rectifier bridge or a control circuit.

As shown in fig. 14, at least one of the heat generating components 501 transfers heat to the lamp head 23 by means of heat conduction or heat radiation, and dissipates heat to the air through the lamp head 23.

As shown in fig. 14, at least one heat generating component 501 is in thermal contact with the lamp head 23, specifically, at least one heat generating component 501 is located in the lamp head 23, and the heat generating component 501 is in contact with the lamp head through the heat conducting material 53, and the heat generating component 501 is fixed with the lamp head 23 through the heat conducting material 53. Therefore, through the arrangement of the heat conduction material 53, the effect of heat conduction to the lamp cap can be achieved, the effect of fixing the heating component can also be achieved, and the heating component 501 is prevented from loosening. The heating element 501 is located in the lamp head 23, and the lamp head 23 and the heating element 501 have an overlapping region in a projection perpendicular to the axial direction of the LED lamp.

As shown in fig. 14, the heat conducting material 53 is disposed in the lamp head 23 by glue filling, so as to connect the lamp head 23 and the heat generating component 501, the heat conducting material 53 only covers the area of the end of the power supply 5, and the position of the heat conducting material 53 is higher than the position of the heat dissipation hole 22, so as to prevent the heat conducting material 53 from excessively increasing weight. In addition, the heat conducting material 53 is an insulating material to ensure safety and prevent the electronic components from contacting the metal part 231 of the lamp cap 23. In other embodiments, the heat conductive material 53 may be a wire or the like (not shown) connecting the power source 5 and the conductive pins of the lamp head 23.

As shown in fig. 14, the base 23 includes a metal portion 231, and the heat conductive material 53 thermally contacts the metal portion 231. That is, at least a part of the inner wall of the metal part 231 forms the wall of the inner cavity of the lamp housing 2, so that the heat conducting material is directly connected to the metal part 231, and the metal part 231 is used for heat dissipation. The metal part 231 is partially radiated by air, and partially radiated by a lamp socket connected to the metal part 231.

As shown in fig. 14, the position of the at least one heat generating component 501 in the axial direction of the LED lamp is higher than the position of the heat dissipation hole 222, and most of the heat generating component 501 higher than the heat dissipation hole 222 is dissipated through the lamp head 2 or other means. Therefore, most of the generated heat is not dissipated through the heat dissipating holes 222, and the convection velocity of the first heat dissipating channel 7a is not affected. The heat generating component 501 is a resistor, an inductor, an integrated circuit, a voltage transformer, or a rectifier bridge.

As shown in fig. 1, 2, 3 and 4, the lamp housing 2 includes a lamp base 23, a neck 22 and an inner sleeve 21; the base 23 is connected to the neck 22, and the neck 22 is connected to the inner envelope 21. The inner housing 21 is located inside the heat sink 1 (in the axial direction of the LED lamp, all or most of the inner housing 21, for example, more than 80% of the height of the inner housing, does not exceed the heat sink 1), and the neck 22 is exposed outside the heat sink 1. By the arrangement of the inner sleeve 21 and the neck 22, enough space is provided for accommodating the power supply 5 and heat dissipation, especially for the power supply 5 of a high-power LED lamp (the power supply of the high-power LED lamp is relatively complex compared with the power supply of a low-power LED lamp, and the power supply is more complex and has larger overall size). The power supply 5 is included in each of the neck 22 and the base 23, the sum of the heights of the neck 22 and the base 23 is greater than the height of the heat sink 1, so as to provide more space for disposing the power supply 5, and the neck 22 and the base 23 are separated from the heat sink 1 (axially non-overlapping, in contrast, the inner sleeve 21 is covered in the heat sink 1), so that the power supply 5 in the neck 22 and the base 23 is less affected by the heat sink 1 (the heat of the heat sink 1 is not conducted into the neck 22 and the base 23 in the radial direction). In addition, the height of the neck 22 is set to facilitate the chimney effect of the first heat dissipation channel 7a, so as to ensure the convection efficiency in the first heat dissipation channel 7 a. In other embodiments, the height of the neck 22 is at least 80% of the height of the heat sink 1 to achieve the above-mentioned effects. The inner jacket 21 is a heat insulating material for preventing heat of the heat radiating fins from affecting heat of the power supply.

As shown in fig. 2, the second air inlet hole 1301 is located at the lower side of the heat sink 1 and corresponds to the inner side or the inner side of the heat sink 1 in the radial direction, that is, the second air inlet hole 1301 corresponds to the inner side or the inner side of the heat sink 11, and the inner side or the inner side of the heat sink 11 corresponds to the outer wall of the inner sleeve 21 of the lamp housing 2 (the radial inner side of the heat sink 11 is close to or directly abutted against the inner sleeve 21), so that after entering from the second air inlet hole 1301, the convective air is convected along the outer wall of the inner sleeve 21 during the ascending process, and at the same time, the inner side or the inner side of the heat sink 11 and the outer wall of the inner sleeve 21 radiate heat in the radial direction, thereby playing a role of heat insulation, that is, the heat of the heat sink. As can be seen from the above, the second heat dissipation channel 7b not only can accelerate the heat dissipation of the heat dissipation fins 11, but also can perform the function of heat insulation. The second air inlet hole 1301 is closer to the inner side of the LED lamp in the radial direction than any one of the LED chips 311, compared to the LED chip 311.

Fig. 23 is an enlarged view at B in fig. 2. As shown in fig. 23, the base 23 includes a metal portion 231 and an insulating portion 232, and the lead of the power supply 5 is connected to the external power supply unit through the insulating portion 232. The metal part 231 is coupled to the neck 22, and specifically, as shown in fig. 24, the inner surface of the metal part 231 is provided with a screw thread, and the screw thread is coupled to the neck 22. When the power supply 5 in the lamp housing 2 dissipates heat through the metal portion 231 (as described in the foregoing embodiment, at least a portion of the inner wall of the metal portion 231 forms the wall of the inner cavity of the lamp housing 2, so that the heat conduction material is directly connected to the metal portion 231 and the metal portion 231 dissipates heat), the outer surface of the metal portion 231 is provided with a protrusion 2311 (as shown in fig. 24) to increase the surface area of the outer surface of the metal portion 231, thereby increasing the heat dissipation area of the metal portion 231 and improving the heat dissipation efficiency thereof. For the power source 5, at least a portion of the power source 5 is located in the lamp head 23, and the lamp head 23 is used for dissipating heat of at least a portion of the power source 5. The inner wall of the metal part 231 may also be provided with a convex structure to increase the surface area of the inner wall corresponding to the inner cavity of the lamp housing 2.

As shown in fig. 1 and 21, the lamp housing 2 has a flow restriction surface 214 extending outward in the radial direction of the LED lamp and away from the heat dissipation hole 222 in the radial direction, and the flow restriction surface 214 covers at least a part of the heat dissipation fin 11. When the heat dissipation fins 11 dissipate heat, the heat dissipated by the heat dissipation fins 11 covered by the current-limiting surface 214 is blocked by the current-limiting surface 214 in the process of rising, and the flowing direction of the heat is changed (going outward along the current-limiting surface 214), so that the heat is far away from the heat dissipation holes 222 when rising, and the heat is prevented from being accumulated near the heat dissipation holes 222 to form high temperature, thereby affecting the convection velocity of the first heat dissipation channel 7a itself, and preventing the heat from entering the inner cavity of the lamp housing 2 through the heat dissipation holes 222 when rising, thereby affecting the power supply 5, and finally, preventing the heat from rising to contact the metal part 231 of the lamp cap 23, affecting the heat dissipation of the metal part 231, and even directly conducting the heat into the inner cavity of the lamp housing 2. The current-restricting surface 214 may be formed on the inner sleeve 21. In other embodiments, as shown in fig. 10, the flow-restricting surface 214 may be formed on the neck 22.

As shown in fig. 21, in the present embodiment, at least a portion of the upper side of the heat dissipation fins 11 in the axial direction of the LED lamp corresponds to the current limiting surface 214, and when the lamp housing 2 is inserted into the heat sink 1, the heat dissipation fins act as a limit to the lamp housing 2. In this embodiment, the heat dissipation fins 11 are abutted against the current limiting surface 214.

As shown in fig. 21, in the present embodiment, the inner sleeve 21 is made of a material having a thermal conductivity smaller than that of the material of the neck 22, the current-limiting surface 214 is formed on the inner sleeve 21, and the height of the heat sink 1 in the axial direction does not exceed the current-limiting surface 214, so as to reduce the contact area between the heat sink 1 and the neck 22. The lower the thermal conductivity of the material of the inner envelope 21, the less heat the heat sink 1 conducts to the interior of the inner envelope 21 and the less influence it has on the power supply 5, while the lower the contact area of the neck 22 with the heat sink 1, the lower the thermal conductivity of the material of the neck 22 itself, which is higher than the material of the inner envelope 21, the neck 22 itself can dissipate at least a part of the heat generated by the internal power supply 5 through the neck 22. In other embodiments, the material used for the inner sleeve 21 and the material used for the neck 22 may be the same material, for example, a material with a low thermal conductivity, such as plastic.

As shown in fig. 21, in the present embodiment, the wall of the inner sleeve 21 and the wall of the neck 22 jointly form the wall of the inner cavity of the lamp housing 2, and the height of the heat sink 1 in the axial direction does not exceed the height of the inner sleeve 21, so that the heat sink 1 corresponds to the inner sleeve 21 in the radial direction of the LED lamp, that is, the inner sleeve 21 plays a role of heat insulation, and the heat of the heat sink 1 is prevented from being conducted into the inner sleeve 1 to affect the electronic components of the power supply 5 therein. The entire lamp neck 22 is higher than the heat sink 1, that is, the heat sink 1 and the lamp neck 22 do not overlap in the radial direction of the LED lamp, so as to avoid heat conduction between the heat sink 1 and the lamp neck 22 as much as possible, and prevent the heat sink 1 from conducting heat to the inside of the lamp neck 22 through heat conduction, thereby affecting electronic components therein. Because of this, the present embodiment can set the heat transfer efficiency of the wall portion of the inner sleeve 21 to be lower than that of the wall portion of the lamp neck 22, and this arrangement has the advantages that, on one hand, the heat conduction from the heat sink 1 to the inner sleeve 21 can be reduced by setting the inner sleeve 21 to have low heat transfer efficiency, thereby preventing the heat sink 1 from affecting the electronic components inside the inner sleeve 21, and on the other hand, the heat transfer from the heat sink 1 to the lamp neck 22 is not required to be considered, thereby improving the heat transfer efficiency of the lamp neck 22, facilitating the heat generated by the electronic components of the internal power supply 5 during operation, and being dissipated through the lamp neck 22, thereby preventing the service life of the electronic components from being affected by the over. In this embodiment, in order to set the heat transfer efficiency of the wall of the inner sleeve 21 to be lower than that of the wall of the neck 22, the inner sleeve 21 may be made of a material with a low thermal conductivity, and the neck 22 may be made of a material with a relatively high thermal conductivity, and in order to increase the thermal conductivity of the neck 22, the neck 22 may be provided with heat dissipation holes 222, or the neck 22 may be provided with a heat conduction portion (not shown), such as a metal material with a high thermal conductivity.

As shown in fig. 21, the neck 22 has an upper portion and a lower portion, wherein the heat dissipation hole 222 is formed in the upper portion, the cross-sectional area of the upper portion is smaller than the cross-sectional area of the lower portion, and the air velocity in the upper portion is faster than the air velocity in the lower portion, so that the initial velocity of the air discharged from the heat dissipation hole 222 is increased, thereby preventing hot air from accumulating around the heat dissipation hole 222. In this embodiment, the cross-sectional area of the neck 22 decreases in the upward axial direction of the LED lamp, thereby preventing obstruction to air flow. In this embodiment, the cross-sectional area of the entrance of the lower portion of the inner envelope 21 is larger than the cross-sectional area of the upper portion of the neck 22.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims (14)

1. An LED lamp, comprising:

the lamp shell comprises an inner sleeve, a lamp neck and a lamp cap, wherein the lamp cap is connected with the lamp neck, and the lamp neck is connected with the inner sleeve;

the radiator comprises radiating fins and a radiating base, and is connected with the lamp shell;

the power supply is positioned in the lamp shell; and

the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip;

the inner sleeve is arranged inside the radiator, the lamp neck is exposed outside the radiator, and the power supply is arranged in the inner sleeve and the lamp neck.

2. The LED lamp of claim 1, wherein more than 80% of the height of the inner sleeve does not exceed the heat sink.

3. The LED lamp of claim 1, wherein the sum of the heights of the neck and the base is greater than the height of the heat sink.

4. The LED lamp of claim 1 or 3, wherein the height of the neck is at least 80% or more of the height of the heat sink.

5. The LED lamp of claim 1, wherein a second heat dissipation channel is formed in the heat dissipation fins and the heat dissipation base, the heat dissipation base having a second air inlet hole of the second heat dissipation channel, such that air enters from the second air inlet hole, passes through the second heat dissipation channel, and finally flows out from a space between the heat dissipation fins.

6. The LED lamp of claim 5, wherein the second air intake holes correspond to an inside or interior of the heat dissipating fins corresponding to an outer wall of the inner sleeve of the lamp housing.

7. The LED lamp of claim 1, wherein a first heat dissipation channel is formed in the inner cavity of the lamp housing for convectively dissipating heat from the power source, the first heat dissipation channel having a first air inlet at one end of the lamp housing and a heat dissipation hole at an opposite end of the lamp housing.

8. The LED lamp according to claim 1 or 6, wherein the inner side wall of the heat dissipation fin in the radial direction of the LED lamp is spaced from the inner sleeve of the lamp housing.

9. The LED lamp according to claim 1 or 6, wherein a portion of the heat dissipating fins is spaced apart from the inner sleeve of the lamp housing at an inner sidewall of the LED lamp in a radial direction.

10. The LED lamp of claim 7, wherein the lamp housing has a flow-restricting surface extending radially outward of the LED lamp and radially away from the heat sink, the flow-restricting surface covering at least a portion of the heat sink fins.

11. The LED lamp of claim 10, wherein the current-limiting surface is formed on the inner jacket.

12. The LED lamp of claim 7, wherein the power source comprises electronic components including heat generating components, wherein at least one of the heat generating components thermally contacts the base and dissipates heat through the base.

13. The LED lamp of claim 12, wherein at least one of the heat generating components is located in the lamp head and is in contact with the lamp head through a thermally conductive material, the heat generating component being secured to the lamp head through the thermally conductive material.

14. The LED lamp of claim 13, wherein the thermally conductive material covers only an area of an end of the power supply, and the thermally conductive material is located higher than the heat dissipation hole.