CN210266762U

CN210266762U - LED lamp

Info

Publication number: CN210266762U
Application number: CN201920708835.0U
Authority: CN
Inventors: 王名斌; 江涛
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2017-12-08
Filing date: 2018-12-07
Publication date: 2020-04-07
Anticipated expiration: 2028-12-07
Also published as: CN210107087U; CN209856800U; CN209856801U; CN210141488U; CN211010830U; CN211010829U

Abstract

An LED lamp, comprising: a lamp housing; the radiator is connected with the lamp shell; the power supply is positioned in the lamp shell and comprises a power supply board and an electronic assembly, and the electronic assembly is arranged on the power supply board; the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip; the power panel is divided into a first setting area and a second setting area by an axis, the axis is parallel to the length extending direction of the power panel, the sum of the weights of the electronic assemblies on the second setting area is larger than the sum of the weights of the electronic assemblies on the first setting area, and the first setting area is provided with a balancing weight.

Description

LED lamp

The utility model discloses the application is that 2018 the 12 months 07 days submit the branch case application of the chinese patent office, application number 201822047444.7, new and novel name "a LED lamp".

Technical Field

The utility model relates to a LED lamp belongs to the illumination field.

Background

The LED lamp is widely applied to various illumination fields because of the advantages of energy conservation, high efficiency, environmental protection, long service life and the like. The heat dissipation problem of the high-power LED is receiving attention as an energy-saving green light source, and the excessive temperature may cause the light emitting efficiency to be attenuated, and if the waste heat generated by the operation of the high-power LED cannot be effectively dissipated, the waste heat may directly affect the life of the LED, so the solution of the heat dissipation problem of the high-power LED has become an important research and development subject of many related people in recent years.

An LED lamp in the prior art generally includes a light source, a heat sink, a power source, a lamp housing, and a lamp cover, the light source is fixed to the heat sink, the power source is disposed in the lamp housing, the lamp housing is connected to the heat sink, and the lamp housing includes a lamp cap for connecting to a lamp holder. The prior art LED lamp has the following disadvantages.

Because some LED lamps are used in a suspended mode, the lamp head has certain limitation on weight bearing. For example: the E39 specification lamp holder that high-power LED lamp often adopted, its restriction to weight bearing is 1.7 kilograms, that is to say when the whole weight of LED lamp exceedes 1.7 kilograms the risk that probably takes place the lamp holder to drop or even lamps and lanterns wholly fall promptly, consequently can't continue to expand the mode of radiating component surface area to the holistic heat dissipation solution of LED and satisfy.

Unreasonable setting of power supply: for some high-power LED lamps, if the power reaches 150W-300W, the heat dissipation of the power supply is also important, and if the heat generated by the power supply cannot be dissipated in time when the LED lamp works, the service life of some electronic components (especially components with high heat sensitivity, such as a capacitor) can be influenced, so that the service life of the whole lamp is influenced.

In addition, if the layout of the electronic components of the power supply is not reasonable, for example, the heating components (such as resistors, inductors, and transformers) are arranged together, the temperature gradient between the heating components and the surrounding air is not easily formed, and the efficiency of heat radiation from the heating components to the air is affected.

In view of the above, the present invention and embodiments thereof are provided below.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a LED lamp to solve above-mentioned problem.

The utility model provides a LED lamp, a serial communication port, include:

a lamp housing;

the radiator is connected with the lamp shell;

the power supply is positioned in the lamp shell and comprises a power supply board and an electronic assembly, and the electronic assembly is arranged on the power supply board; and

the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip;

the power panel is divided into a first setting area and a second setting area by an axis, the axis is parallel to the length extending direction of the power panel, the sum of the weights of the electronic assemblies on the second setting area is larger than the sum of the weights of the electronic assemblies on the first setting area, and the first setting area is provided with a balancing weight.

The balancing weight is the radiator unit who has the heat dissipation function.

Have a plurality of fin on the radiator unit, the fin is followed the axial direction of LED lamp extends the setting, just form the passageway between the fin.

The balancing weight includes long limit and minor face, long limit with the passageway is parallel, long limit with the axial direction of LED lamp is parallel.

Electronic component includes at least one heating element, the direct thermal contact of at least one heating element radiating component.

Transformer, inductance, resistance, diode, transistor or integrated circuit among the heating element are direct thermal contact radiating component.

The second sets up regional electronic component's quantity is more than first sets up regional electronic component's quantity.

First set up regional with the second sets up all to have heating element on the region.

Form first heat dissipation channel in the inner chamber of lamp body, first heat dissipation channel is in the one end of lamp body has first inlet port, and the relative other end has the louvre on the lamp body, chimney effect when first heat dissipation channel is with the convection current is with right the power dispels the heat.

The radiator includes heat dissipation base and heat radiation fins, heat radiation fins with form second heat dissipation channel in the heat dissipation base, second heat dissipation channel has the second inlet port, and the air is followed the second inlet port gets into the back, through second heat dissipation channel follows at last space outflow between the heat radiation fins.

First heat dissipation channel includes inner channel and outer passageway, the outer passageway form in the power supply board edge the electronic component with between the inner wall of the inner chamber of lamp body, the inner channel form in the clearance between the electronic component.

Electronic component includes the transformer, the transformer includes magnetic core and coil, the magnetic core has a cavity, the coil is located in the cavity, the cavity is in the uncovered setting in radial at least one side of LED lamp.

The uncovered side of cavity corresponds interior passageway or outer passageway.

The cavity is in the equal uncovered setting in radial ascending both sides of LED lamp, wherein the uncovered department of one side of cavity corresponds to interior passageway, the uncovered department of opposite side corresponds to outer passageway.

The lamp body includes lamp holder, lamp neck and endotheca, the lamp holder is connected with the lamp neck, the lamp neck is connected the endotheca, the power strip is including being located first portion in the lamp neck with be located second portion in the endotheca, the second portion is compared first portion is more close to first inlet port.

The electrolytic capacitor in the electronic component is arranged on the second part of the power panel.

The whole electrolytic capacitor in the electronic component is arranged on the second part of the power panel.

The area of the second part of the power panel is larger than that of the first part.

Transformer, inductance, resistance, integrated circuit or transistor among the electronic component locate on the second portion.

The electronic component comprises a heating component and at least one heating component in thermal contact with the lamp holder.

The utility model discloses at least one heating element pass through the heat conduction material with the lamp holder contact is fixed.

The utility model discloses at least one heating element is resistance, inductance, integrated circuit, transformer or rectifier bridge.

The heat conduction material in the position after the LED lamp installation is higher than the position of louvre.

The lamp holder of the present invention includes a metal portion, and the heat conductive material thermally contacts the metal portion.

The utility model also provides a LED lamp, a serial communication port, include:

a lamp housing;

the radiator is connected with the lamp shell;

the power panel is divided into a first setting area and a second setting area by the axis of the LED lamp, the sum of the weights of the electronic assemblies on the second setting area is larger than the sum of the weights of the electronic assemblies on the first setting area, and the first setting area is provided with a balancing weight.

The utility model has the advantages that: compared with the prior art, the utility model discloses an arbitrary effect or its arbitrary combination below:

(1) through the setting of first heat dissipation channel, can take away the heat in the first heat dissipation channel (mainly be the heat that the power during operation produced), increased the efficiency of whole lamp natural convection, prevent that the heat that the power during operation produced from influencing some electronic component that are not heat-resistant.

(2) The arrangement of the inner channel and the outer channel further improves the heat dissipation effect of the power supply.

(3) The coil of the transformer corresponds to the inner channel or the outer channel, so that heat generated by the coil is rapidly discharged through convection of the inner channel or the outer channel.

(4) The arrangement of the balancing weight can balance the weight of two sides of the power panel, prevent the influence of the two sides of the power panel due to uneven weight of the electronic assembly, and prevent the LED lamp from inclining due to uneven weight of the two sides of the power panel under the hanging state of the LED lamp.

(5) At least one heating element is arranged in the lamp holder, and the heating element is contacted and fixed with the lamp holder through the heat conduction material, so that the effect of heat conduction to the lamp holder can be achieved through the arrangement of the heat conduction material, the effect of fixing the heating element can also be achieved, and the loosening of the heating element is avoided.

Drawings

FIG. 1 is a schematic front view of an LED lamp according to the present embodiment;

FIG. 2 is a schematic cross-sectional view of the LED lamp of FIG. 1;

FIG. 3 is an exploded schematic view of the LED lamp of FIG. 1;

FIG. 4 is a schematic cross-sectional view of an LED lamp showing a first heat dissipation channel and a second heat dissipation channel;

FIG. 5 is a schematic perspective view I of the LED lamp of FIG. 1;

FIG. 6 is a schematic view of the light output surface of FIG. 5 with the light output surface removed;

fig. 7 is a sectional view of the LED lamp in the present embodiment;

FIG. 8 is a bottom view of the LED lamp of FIG. 1 with the lamp housing removed;

FIG. 9 is a sectional view of the LED lamp of this embodiment;

fig. 10 is a schematic view of the heat dissipation fins and the LED chip of the present embodiment;

FIG. 11 is a schematic view of the heat sink fins and LED chips in some embodiments;

FIG. 12a is a first perspective view of the power supply of the present embodiment;

FIG. 12b is a second perspective view of the power supply of the present embodiment;

FIG. 12c is a perspective view of the power supply of this embodiment;

FIG. 12d is a front view of the power supply in this embodiment;

FIG. 13 is a schematic diagram of a power supply in some embodiments;

FIG. 14 is a front view of the weight of FIG. 13;

FIG. 15 is an illustration of FIG. 14;

FIG. 16 is a schematic diagram of a transformer;

FIG. 17 is a schematic diagram of a power supply in some embodiments;

FIG. 18 is an enlarged view at B in FIG. 2;

FIG. 19 is a partial schematic view of an LED lamp.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. In addition, in the utility model, the service condition, the user state of LED light refer to the LED lamp with the vertical ascending hanging mode's of lamp holder use situation, have other exceptional cases to explain in addition.

Fig. 1 is a front view of an LED lamp in an embodiment of the present invention. Fig. 2 is a cross-sectional view of the LED lamp of fig. 1. Fig. 3 is an exploded view of fig. 1. As shown in fig. 1, 2 and 3, the LED lamp includes: radiator 1, lamp body 2, lamp plate 3, lamp shade 4 and power 5. In this embodiment, lamp plate 3 is connected on radiator 1 with the mode of laminating to do benefit to the heat that lamp plate 3 during operation produced and conduct to radiator 1 fast. Specifically, in some embodiments, the lamp panel 3 is riveted to the heat sink 1, in some embodiments, the lamp panel 3 is connected to the heat sink through a bolt, in some embodiments, the lamp panel 3 is welded to the heat sink 1, and in some embodiments, the lamp panel 3 is adhered to the heat sink 1. In this embodiment, the heat sink 1 is connected to the lamp housing 2, the lamp shade 4 covers the lamp panel 3, so that light generated by the light source of the lamp panel 3 is emitted through the lamp shade 4, the power source 5 is located in the inner cavity of the lamp housing 2, and the power source 5 is electrically connected to the LED chip 311 to supply power to the LED chip 311.

As shown in fig. 4, a cross-sectional view of the LED lamp in this embodiment is shown. As shown in fig. 2 and 4, a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2 in the present embodiment, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and a heat dissipation hole 222 (specifically, opened at the upper portion of the neck 22) is formed at the other end of the lamp housing 2. Air enters from the first air inlet 2201 and is exhausted from the heat dissipating hole 222, so that heat (mainly generated by the power supply 5 during operation) in the first heat dissipating channel 7a can be taken away. Specifically, in terms of the heat dissipation path, heat generated by the heating component in the power supply 5 during operation is firstly transferred to the air in the first heat dissipation channel 7a (air near the heating component) in a heat radiation manner, and the external air enters the first heat dissipation channel 7a in a convection manner, so as to take away the internal air for heat dissipation. In other embodiments, the heat dissipation holes 222 may be formed in the neck 22 for direct heat dissipation.

As shown in fig. 1, 2 and 4, a second heat dissipation channel 7b is formed in the heat dissipation fins 11 and the heat dissipation base 13, the second heat dissipation channel 7b has a second air inlet hole 1301, and air enters from the second air inlet hole 1301, passes through the second heat dissipation channel 7b, and finally flows out from the space between the heat dissipation fins 11. Therefore, the heat on the heat dissipation fins 11 can be taken away, and the heat dissipation of the heat dissipation fins 11 is accelerated. Specifically, in the heat dissipation path, heat generated by the LED chip 311 is conducted to the heat sink 1, the heat dissipation fins 11 of the heat sink 1 radiate the heat to the ambient air, and the second heat dissipation channel 7b carries away the air in the heat sink 1 for heat dissipation when performing convection heat dissipation.

Fig. 5 is a schematic perspective view of the LED lamp in this embodiment, showing the combination of the heat sink 1 and the lamp cover 4. Fig. 6 is a schematic view of the structure of fig. 5 with the light output surface 43 removed. As shown in fig. 5 and 6, in the present embodiment, the lamp housing 4 includes a light output surface 43 and an end surface 44, the end surface 44 is provided with ventilation holes 41, and air enters the first heat dissipation channel 7a and the second heat dissipation channel 7b through the ventilation holes 41. When the LED chip 311 (shown in fig. 6) emits light, light passes through the light output surface 43 and exits the lamp housing 4. In this embodiment, the light output surface 43 can be made of a transparent material in the prior art, such as glass, PC material, etc. The utility model discloses all embodiments call "LED chip", generally indicate all luminous sources that use LED (emitting diode) as the main part, including but not limited to LED lamp pearl, LED lamp strip or LED filament etc. consequently the LED chipset that this specification indicates does also equal to LED lamp pearl group, LED lamp strip group or LED filament group etc..

As shown in fig. 1 and fig. 2, in the present embodiment, the LED includes or only includes a passive heat dissipation assembly, which only uses natural convection and radiation to dissipate heat, but does not use an active heat dissipation assembly, such as a fan. The passive heat dissipation assembly in this embodiment includes a heat sink 1, the heat sink 1 includes heat dissipation fins 11 and a heat dissipation base 13, the heat dissipation fins 11 are radially and uniformly distributed along the circumference of the heat dissipation base, and are connected to the heat dissipation base 13. When the LED lamp is used, the heat generated by the LED chip 311 conducts at least a portion of the heat to the heat sink 1 in a heat conduction manner, and at least a portion of the heat sink 1 is dissipated to the outside air by heat radiation and convection.

As shown in fig. 8, in this embodiment, the lamp panel 3 includes at least one LED chip set 31, and the LED chip set 31 includes an LED chip 311.

Fig. 10 is a schematic diagram of the heat dissipation fins 11 and the LED chip 311 in this embodiment. As shown in fig. 8 and 10, in the present embodiment, when at least one heat dissipation fin 11 projects to the plane of the LED chip set 31 along the axial direction of the LED lamp, the projection of the heat dissipation fin 11 at least contacts at least one LED chip 311 in the LED chip set 31. Specifically, when at least one heat dissipation fin 11 projects to the plane where the LED chip set 31 is located along the axial direction of the LED lamp, the projection of the heat dissipation fin 11 at least contacts with at least one LED chip 311 in the LED chip set 31 at the inner circumference, the middle circumference or the outer circumference. As shown in fig. 10, the projection of the heat sink fin 11 in the figure contacts an LED chip 311, as indicated by the arrow in the figure, the heat dissipation path between the LED chip 311 and the heat sink fin 11 is shown, as shown in fig. 11, the projection of the heat sink fin 11 in the figure does not contact the LED chip 311 in the figure, as indicated by the arrow in the figure, the heat dissipation path between the LED chip 311 and the heat sink fin 11 is obviously shown to be farther than the former, so that by making the projection of the heat sink fin at least contact with at least one LED chip 311 in the LED chip set 31 of the inner circumference, the middle circumference or the outer circumference, the heat conduction path of the LED chip 311 is shortened, thereby reducing the thermal resistance and facilitating the heat conduction. Preferably, when the heat dissipation fins 11 project to the plane of the LED chip set 31 along the axial direction of the LED lamp, the projection of any one of the heat dissipation fins 11 (the first heat dissipation fin 111 or the second heat dissipation fin 112) contacts at least one LED chip 311 in the LED chip set 31.

In this embodiment, the number of the heat dissipation fins 11 corresponding to the LED chip sets 31 on the outer circumference is greater than the number of the heat dissipation fins 11 corresponding to the LED chip sets 31 on the inner circumference. The correspondence referred to herein refers to the axial direction projection relationship of the LED lamp, for example, when the LED chip sets 31 on the outer circumference are projected to the heat dissipation fins 11 in the axial direction of the LED lamp, the LED chip sets 31 on the outer circumference correspond to the heat dissipation fins 11 of the heat sink 1 on the opposite outer side. The LED chip set 31 at the periphery has a larger number of LED chips 311, so that more heat dissipation fins 11 (area) are required for heat dissipation.

Fig. 12a to 12c are perspective views of the power supply 5 in this embodiment in various directions, and fig. 12d is a front view of the power supply 5 in this embodiment. The power supply 5 is electrically connected to the LED chip 311 and is used to supply power to the LED chip 311. As shown in fig. 12a to 12c, the power supply 5 includes a power supply board 51 and electronic components provided on the power supply board 51.

As shown in fig. 12c, the transformer 54 in the electronic assembly includes a magnetic core 541 and a coil 542, the magnetic core 541 has a cavity, the coil is disposed in the cavity, and the upper side of the cavity in the axial direction of the LED lamp is open, so that, during operation, heat generated by the coil can be upward, and the heat dissipation direction of the coil is the same as the direction of the convection path of the first heat dissipation channel 7a, so as to facilitate heat dissipation.

As shown in fig. 12b and 12c, the two sides of the cavity in the axial direction of the LED lamp are both opened, so that the heat dissipation effect on the coil can be further increased. In addition, after the coil is installed in the cavity, a gap can be kept between the coil and the inner wall of the cavity, so that air can flow through the gap, and the heat dissipation effect of the coil can be further improved.

As shown in fig. 12b, the transformer 54 has a first face 5401 and a second face 5402, both of which are perpendicular to the power supply board, wherein the first face 5401 is perpendicular to the axial direction of the lamp, and the area of the first face 5401 is smaller than that of the second face 5402, so that the resistance to convection of the first heat dissipation channel 7a can be reduced by disposing the face having a small area in this manner.

As shown in fig. 12c, the electronic component includes at least one inductor 55, the at least one inductor includes a ring-shaped core 551, the coil is wound on the ring-shaped core 551 (not shown), and the axial direction of the ring-shaped core 551 is parallel to the axial direction of the LED lamp, so that the coil can contact with the convective air in a larger area, thereby increasing the heat dissipation of the inductor. In addition, since the annular core 551 has an annular shape and corresponds to the convection path of the first heat dissipation channel 7a, the air convected can pass through the annular core 551, and the heat dissipation of the inductor 55 can be further increased.

As shown in fig. 12a and 12b, the heat generating components of the electronic components include an Integrated Circuit (IC)56, a diode, a transistor, a transformer 54, an inductor 55, and a resistor, which are respectively disposed on different surfaces of the power board 51, so that the heat sources can be separately disposed to prevent the formation of a local high temperature. In addition, heat dissipation components may be disposed on different surfaces of the power board 51 to dissipate heat from the heat generating components, and at this time, the corresponding heat generating components are in thermal contact with the heat dissipation components.

As shown in fig. 12a and 12b, at least one integrated circuit 56 and other heat generating components are disposed on different surfaces of the power board 51. Thus, on the one hand, the heat source can be separately disposed to avoid the formation of local high temperature, and on the other hand, the influence of other heat generating components on the integrated circuit 56 can be avoided.

As shown in fig. 12a and 12b, the integrated circuit 56 does not overlap any heat generating component in a direction perpendicular to the power supply board 51 (i.e., a projection relationship in a direction perpendicular to the power supply board 51), so as to avoid heat superposition. Preferably, the integrated circuit 56 does not overlap the transformer 54.

As shown in fig. 7, the power supply board 51 is parallel to the axial direction of the LED lamp, so that, in the axial direction of the LED lamp, the power supply board 51 is divided into an upper half portion and a lower half portion, and the arrangement spaces of the electronic components of the upper half portion and the lower half portion are consistent or approximately consistent, which is beneficial to better arrangement of the electronic components, and in addition, if the power supply board 51 is inclined relative to the axial direction of the LED lamp, the circulation of air is hindered to a certain extent, which is not beneficial to heat dissipation of the power supply 5.

As shown in fig. 7, the power panel 51 divides the lamp housing 2 into a first portion 201 and a second portion 202, and the area of the corresponding heat dissipation hole 222 on the first portion 201 is larger than the area of the corresponding heat dissipation hole 222 on the second portion 202, so that most or all of the electronic components can be disposed in the first portion 201, or components with large heat generation, such as inductors, resistors, transformers, rectifier bridges or transistors, can be disposed in the first portion 201 when the electronic components are arranged.

As shown in fig. 7, the power panel 51 divides the inner cavity of the lamp housing 2 into a first portion 201 and a second portion 202, the volume of the first portion 201 is larger than that of the second portion 202, when the electronic components are arranged, most or all of the electronic components are disposed in the first portion 201, or the components with larger volume, such as a capacitor, an inductor, a resistor, a transformer, a rectifier bridge or a transistor, are disposed in the first portion 201.

Further, the area of the corresponding first air intake hole 2201 on the first portion 201 is larger than that of the corresponding first air intake hole 2201 on the second portion 202, so that more air enters the first portion 201, and the heat of the electronic component is dissipated. The relationship with the first air intake hole 2201, specifically, the first air intake hole 2201 is substantially divided into two parts by the power supply board 51, that is, one part corresponds to the first part 201, and the other part corresponds to the second part 202, so that more air enters the first part 201 through the first air intake hole 2201.

As shown in fig. 7, the electronic components include heat generating components 501, wherein at least one of the heat generating components 501 is close to the lamp head 23 and radiates heat through the lamp head 23 without occupying heat radiation resources of the first heat radiation channel 7 a. The at least one heating element 501 near the lamp head 23 is an inductor, a resistor, a rectifier bridge or a control circuit.

As shown in fig. 7, at least one of the heat generating components 501 transfers heat to the lamp head 23 by means of heat conduction or heat radiation, and dissipates heat to the air through the lamp head 23.

As shown in fig. 7, at least one heat generating component 501 is in thermal contact with the lamp head 23, specifically, at least one heat generating component 501 is located in the lamp head 23, and the heat generating component 501 is in contact with the lamp head through the heat conducting material 53, and the heat generating component 501 is fixed with the lamp head 23 through the heat conducting material 53. Therefore, through the arrangement of the heat conduction material 53, the effect of heat conduction to the lamp cap can be achieved, the effect of fixing the heating component can also be achieved, and the heating component 501 is prevented from loosening. The heating element 501 is located in the lamp head 23, and the lamp head 23 and the heating element 501 have an overlapping region in a projection perpendicular to the axial direction of the LED lamp.

As shown in fig. 7, the heat conducting material 53 is disposed in the lamp head 23 by glue filling, so as to connect the lamp head 23 and the heat generating component 501, the heat conducting material 53 only covers the area of the end of the power supply 5, and the position of the heat conducting material 53 is higher than the position of the heat dissipation hole 22, so as to prevent the heat conducting material 53 from excessively increasing weight. In addition, the heat conducting material 53 is an insulating material to ensure safety and prevent the electronic components from contacting the metal part 231 of the lamp cap 23. In other embodiments, the heat conductive material 53 may be a wire or the like (not shown) connecting the power source 5 and the conductive pins of the lamp head 23.

As shown in fig. 7, the base 23 includes a metal portion 231, and the heat conductive material 53 thermally contacts the metal portion 231. That is, at least a part of the inner wall of the metal part 231 forms the wall of the inner cavity of the lamp housing 2, so that the heat conducting material is directly connected to the metal part 231, and the metal part 231 is used for heat dissipation. The metal part 231 is partially radiated by air, and partially radiated by a lamp socket connected to the metal part 231.

As shown in fig. 2 and fig. 12a, in the present embodiment, of the electronic components in the power supply 5, the electronic component closest to the first air intake hole 2201 of the first heat dissipation channel 7a is a thermolabile component, such as a capacitor, especially an electrolytic capacitor 502, and the thermolabile component is close to the first air intake hole 2201 to avoid the thermolabile component from having too high temperature to affect the performance thereof.

In addition, in order to reduce the influence of the heating element on the electrolytic capacitor 502, a radiation-resistant layer or a thermal insulation layer (not shown) may be disposed on the surface of the electrolytic capacitor 502 to prevent the heating element from radiating heat to influence the electrolytic capacitor 502. The heat insulating layer can be made of plastic materials in the prior art, and the anti-radiation layer can be made of paint, a silver coating, aluminum foil or other anti-radiation materials in the prior art.

As shown in fig. 12a, in the present embodiment, at least a portion of at least one electrolytic capacitor is not within the range defined by the power board 51, that is, at least a portion of the electrolytic capacitor exceeds the power board 51 in the axial direction of the LED lamp, and when the same number of electronic components are carried, the length of the power board 51 can be reduced, and the material cost of the power board 51 can be reduced. In addition, the electrolytic capacitor can be further close to the first air inlet 2201, so that the electrolytic capacitor is ensured to be in a relatively low-temperature area.

As shown in fig. 7, the position of the at least one heat generating component 501 in the axial direction of the LED lamp is higher than the position of the heat dissipation hole 222, and most of the heat generating component 501 higher than the heat dissipation hole 222 is dissipated through the lamp head 2 or other means. Therefore, most of the generated heat is not dissipated through the heat dissipating holes 222, and the convection velocity of the first heat dissipating channel 7a is not affected. The heat generating component 501 is a resistor, an inductor, an integrated circuit, a voltage transformer, or a rectifier bridge.

As shown in fig. 7, the power supply board 51 has an upper portion and a lower portion in the axial direction of the LED lamp, and the upper portion and the lower portion are provided with heat generating components, wherein at least one of the heat generating components of the upper portion is located above the heat dissipating hole 222, so that the problem that the upper portion is located near the heat dissipating hole 222 can be reduced, the temperature difference between the lower portion and the upper portion near the heat dissipating hole 222 is increased, and convection is accelerated.

As shown in fig. 2, 3 and 12a, the power supply board 51 has a portion located in the lamp neck 22 and a portion located in the inner sleeve 21 when assembled to the lamp housing 2, the portion of the power supply board 51 located in the lamp neck 22 is a first portion, the portion of the power supply board 51 located in the inner sleeve is a second portion, the second portion is closer to the first air intake hole 2201 of the first heat dissipation channel 7a than the first portion, and due to the closer proximity to the first air intake hole 2201, the convected air reaches the second portion first, that is, the second portion has a better heat dissipation effect than the first portion, so that at least part of the heat-labile components (such as electrolytic capacitors, or components sensitive to high temperature) are disposed on the second portion. Preferably, all electrolytic capacitors are provided on the second portion. The power strip 51 of the second portion has a larger area than the first portion, so that the second portion of the power strip 51 has more space for disposing electronic components, which is beneficial for disposing more thermolabile/heat-sensitive components on the second portion. In this embodiment, the thermolabile/heat sensitive elements may be provided on the front and back sides of the second portion, respectively. In other embodiments, the electronic component that generates more heat (e.g., transformer, inductor, resistor, integrated circuit, or transistor) may be disposed on the second portion to dissipate heat more quickly.

As shown in fig. 12d, the power panel 51 has three electronic components 503, 504,505, and the projections of the three electronic components 503, 504,505 in the radial direction of the LED lamp (or the width direction of the power panel 51) at least partially overlap, wherein one electronic component 504 is spaced between the other two electronic components 503,505, i.e. one electronic component 504 is located between the other two electronic components 503,505, so as to avoid heat radiation between the other two electronic components 503,505, thereby facilitating a larger temperature difference between the heat generating component and the nearby air, and facilitating heat radiation of the heat generating component to the air. The other two electronic components 503,505 are a heat generating component (such as a transformer, resistor, inductor or transistor) and a thermolabile/heat sensitive component (such as an electrolytic capacitor), so that when the heat generating component generates heat, at least a portion of the heat is radiated to the middle electronic component 504, thereby reducing the radiation effect of the heat generated by the heat generating component on the thermolabile/heat sensitive component.

In other embodiments, the power board 51 has three electronic components 503, 504,505, and the three electronic components 503, 504,505 are located in the radial direction of the LED lamp (504 is located between the other two electronic components 503,505 to avoid heat radiation between the other two electronic components 503,505, so as to facilitate the heat radiation of the heating components and the nearby air, and to facilitate the heat radiation of the heating components into the air, the above mentioned other two electronic components 503,505 are both the heating components (such as transformer, resistor, inductor, or electric crystal) defined above, so that when the two heating components 503,505 generate heat, at least a portion of the heat is radiated to the middle electronic component 504, thereby reducing the heat superposition generated between the two heating components, causing the temperature in the area of the power board 51 to be too high to affect the operating quality of the LED lamp, and facilitating the formation of a large temperature difference between the heating components and the nearby air, so as to facilitate the heat radiation of the heat generating component to the air.

Preferably, the electronic component 504 located in the middle is selected from a non-heat generating or heat resisting electronic component, such as a temperature sensor, a capacitor, and the like.

As shown in fig. 12d, the power supply board 51 has three electronic components 506, 507,508, and the projections of the three electronic components 506, 507,508 in the axial direction of the LED lamp (or the length direction of the power supply board 51, i.e. in the convection direction of the first heat dissipation channel 7 a) at least partially overlap, wherein one electronic component 507 is spaced between the other two electronic components 506,508, i.e. one electronic component 507 is located between the other two electronic components 506,508, so as to avoid heat radiation between the other two electronic components 506,508, thereby facilitating a larger temperature difference between the heating component and the nearby air, and facilitating heat radiation of the heating component to the air. The two other electronic components 506,508 are both heat generating components (such as transformers, resistors, inductors, or transistors), so that when the two heat generating components 506,508 generate heat, at least a portion of the heat is radiated to the middle electronic component 504, thereby reducing the heat radiation between the two heat generating components, avoiding the heat superposition, and facilitating the formation of a large temperature difference between the heat generating components and the nearby air, so as to facilitate the heat radiation of the heat generating components to the air. In this embodiment, due to the arrangement of the electronic component 507, when the convective air flows upward, the convective air is blocked within a certain range, that is, after the heat of the electronic component 503 located below dissipates with the convective air, the heat needs to bypass the electronic component 507 in the middle, and the convective air is prevented from directly contacting the electronic component 508 above. In this embodiment, the middle electronic component 507 is a non-heat generating component (such as a capacitor). In other embodiments, one of the other two electronic components 506,508 is a heat generating component (e.g., a resistor, an inductor, a transformer, etc.) and the other is a thermolabile component (e.g., a capacitor, etc.).

Fig. 17 is a schematic diagram of power supply 5 in some embodiments. As shown in fig. 17, in some embodiments, in order to increase the radiation efficiency of the heat generating element of the power supply 5, a radiation layer 509 may be disposed on the surface of the heat generating element, the heat generated by the heat generating element during operation may be conducted onto the radiation layer 509 in a heat conduction manner, and the radiation layer 509 then radiates the heat to the surrounding air so as to carry away the hot air when the first heat dissipation channel 7a performs convection. The radiation efficiency of the radiation layer 509 is greater than that of the heating component, and therefore, the heat dissipation efficiency of the heating component is greatly improved after the radiation layer 509 is arranged. The radiation material 509 in this embodiment may be selected from black glue in the prior art to increase the effect of heat radiation to the air. When the black glue is disposed, the black glue covers the surface of the power supply 5, and the black glue can be directly in thermal contact with the lamp cap 23, that is, a part of the heat of the heating element of the power supply 5 is radiated to the surrounding air, and the other part of the heat is directly conducted to the lamp cap 23 through the black glue (not shown), and the lamp cap 23 is a metal lamp cap and can be further dissipated to the outside through the lamp cap 23. The black glue in this embodiment is a thin layer structure, and is disposed on the surface of the heating element, so that convection of the first heat dissipation channel 7a is not hindered, the increased weight is limited, and the influence on the overall weight of the LED lamp is small.

In addition, in the above embodiment, in order to further improve the radiation efficiency of the radiation material 509, the surface of the radiation material 509 may be provided as a rough surface to increase the surface area of the radiation material 509.

Fig. 13 is a schematic diagram of a power supply 5 in some embodiments, which can be applied to the LED lamp of fig. 4 to replace the power supply 5 of the LED lamp of fig. 4. As shown in fig. 13, in some embodiments, the power panel 51 is divided into a first setting area 511 and a second setting area 512 by an axis X, the first setting area 511 and the second setting area 512 are bounded by the axis X, and the sum of the weights of the electronic components on the second setting area 512 is greater than the sum of the weights of the electronic components on the first setting area 511. The first installation area 511 is provided with the balancing weight 52, so that the weight of the two sides of the power panel 51 is balanced, the influence of the weight unevenness of the electronic components on the two sides of the power panel 51 is prevented, and the inclination of the LED lamp caused by the weight unevenness of the two sides of the power panel 51 in a hanging state of the LED lamp is prevented.

Fig. 14 is a front view of the weight of fig. 13. Fig. 15 is a bottom view of fig. 14. As shown in fig. 14 and 15, in some embodiments, the weight 52 is a heat dissipation component with a heat dissipation function, and is disposed on the power board 51. In some embodiments, the heat sink assembly has heat sinks 521 to increase the heat dissipation area. The weight 52 is made of a metal material with high thermal conductivity, such as aluminum, copper, etc. In this embodiment, the heat dissipating fins 521 extend along the axial direction of the LED lamp, and a channel is formed between the heat dissipating fins 521 for providing an air channel, and in this way, the heat dissipating area of the weight 52 can be increased. In addition, the weight 52 includes a long side and a short side, the channel and the long side are parallel to each other, and the long side is disposed parallel to the axial direction of the LED lamp or substantially parallel to the airflow direction, so as to make the airflow flow more smoothly.

As shown in fig. 13, the electronic components include heat generating components that generate heat at a higher temperature during operation, and at least one of the heat generating components is close to the heat dissipating component to dissipate a portion of the heat through the heat dissipating component. Preferably, the transformer, inductor, resistor, diode, transistor or Integrated Circuit (IC) in the heat generating component is adjacent to the heat dissipating component. More preferably, the transformer, inductor, resistor, diode, transistor or Integrated Circuit (IC) in the heat generating component is in direct thermal contact with the heat dissipating component.

As shown in fig. 13, 14 and 15, in some embodiments, the electronic components include heat generating components that generate heat at a higher temperature during operation, and at least one of the heat generating components is close to the heat dissipation component 52 to dissipate a portion of the heat through the heat dissipation component 52. Preferably, the transformer, inductor, resistor, diode, transistor or Integrated Circuit (IC) in the heat generating component is adjacent to the heat dissipating component. More preferably, the transformer, inductor, resistor, diode, transistor or Integrated Circuit (IC) in the heat generating component is in direct thermal contact with the heat dissipating component. Preferably, the heat sink assembly 52 has heat sinks 521 to increase the heat dissipation area. The heat sink 52 is made of a metal material with high thermal conductivity, such as aluminum, copper, etc. In this embodiment, the heat dissipating fins 521 extend along the axial direction of the LED lamp, and a channel is formed between the heat dissipating fins 521 for providing an air channel, and in this way, the heat dissipating area of the weight 52 can be increased. In addition, the heat sink 52 includes a long side and a short side, the channel and the long side are parallel to each other, and the long side is disposed parallel to the axial direction of the LED lamp or substantially parallel to the airflow direction, so as to make the airflow flow more smoothly. In some embodiments, the heat dissipation assembly 52 may be disposed on both front and back sides of the power board 51, so as to dissipate heat from both sides of the power board 51, respectively, and balance the weight of both sides of the power board 51.

As shown in fig. 13, in some embodiments, the power panel 51 is divided into a first setting area 511 and a second setting area 512 by an axis X, the first setting area 511 and the second setting area 512 are bounded by the axis X, and the number of electronic components in the second setting area 512 is greater than that in the first setting area 511, so that the airflow at the first setting area 511 is smoother, and the obstruction of the electronic components is reduced. In the present embodiment, the first disposition region 511 and the second disposition region 512 each have a heat generating element to separate heat sources.

As shown in fig. 4, 13 and 16, in some embodiments, the first heat dissipation channel 7a includes an inner channel 7a1 and an outer channel 7a2, the outer channel 7a2 is formed between the electronic components at the edge of the power board 51 and the inner wall of the inner cavity of the lamp housing 2, and the inner channel 7a1 is formed in the gap between the electronic components. Thereby improving the heat dissipation effect of the power supply 5. Specifically, the power board 51 in fig. 13 is divided into two parts (left and right parts, which are not necessarily symmetrical), that is, a first part and a second part, both of which have electronic components, the electronic components of the first part and the second part respectively form an outer channel 7a2 with the inner wall of the lamp housing 2, and an inner channel 7a1 is formed between the electronic components of the first part and the electronic components of the second part. In this embodiment, the transformer 54 of the electronic component includes a magnetic core 541 and a coil 542, the magnetic core 541 has a cavity, and the coil 542 is disposed in the cavity, and at least one side of the cavity in the radial direction of the LED lamp is open to expose the coil, and the open side corresponds to the inner passage 7a1 or the outer passage 7a2, so that heat generated by the coil 542 is rapidly discharged by convection of the inner passage 7a1 or the outer passage 7a 2. Preferably, the cavity is open at two sides in the radial direction of the LED lamp, wherein one side is open and corresponds to the inner channel 7a1, and the other side is open and corresponds to the outer channel 7a2, so as to further increase the heat dissipation of the transformer.

As shown in fig. 1, 2, 3 and 4, the lamp housing 2 includes a lamp base 23, a neck 22 and an inner sleeve 21; the base 23 is connected to the neck 22, and the neck 22 is connected to the inner envelope 21. The inner housing 21 is located inside the heat sink 1 (in the axial direction of the LED lamp, all or most of the inner housing 21, for example, more than 80% of the height of the inner housing, does not exceed the heat sink 1), and the neck 22 is exposed outside the heat sink 1. By the arrangement of the inner sleeve 21 and the neck 22, enough space is provided for accommodating the power supply 5 and heat dissipation, especially for the power supply 5 of a high-power LED lamp (the power supply of the high-power LED lamp is relatively complex compared with the power supply of a low-power LED lamp, and the power supply is more complex and has larger overall size). The power supply 5 is included in each of the neck 22 and the base 23, the sum of the heights of the neck 22 and the base 23 is greater than the height of the heat sink 1, so as to provide more space for disposing the power supply 5, and the neck 22 and the base 23 are separated from the heat sink 1 (axially non-overlapping, in contrast, the inner sleeve 21 is covered in the heat sink 1), so that the power supply 5 in the neck 22 and the base 23 is less affected by the heat sink 1 (the heat of the heat sink 1 is not conducted into the neck 22 and the base 23 in the radial direction). In addition, the height of the neck 22 is set to facilitate the chimney effect of the first heat dissipation channel 7a, so as to ensure the convection efficiency in the first heat dissipation channel 7 a. In other embodiments, the height of the neck 22 is at least 80% of the height of the heat sink 1 to achieve the above-mentioned effects. The inner jacket 21 is a heat insulating material for preventing heat of the heat radiating fins from affecting heat of the power supply.

As shown in fig. 2, the second air inlet hole 1301 is located at the lower side of the heat sink 1 and corresponds to the inner side or the inner side of the heat sink 1 in the radial direction, that is, the second air inlet hole 1301 corresponds to the inner side or the inner side of the heat sink 11, and the inner side or the inner side of the heat sink 11 corresponds to the outer wall of the inner sleeve 21 of the lamp housing 2 (the radial inner side of the heat sink 11 is close to or directly abutted against the inner sleeve 21), so that after entering from the second air inlet hole 1301, the convective air is convected along the outer wall of the inner sleeve 21 during the ascending process, and at the same time, the inner side or the inner side of the heat sink 11 and the outer wall of the inner sleeve 21 radiate heat in the radial direction, thereby playing a role of heat insulation, that is, the heat of the heat sink. As can be seen from the above, the second heat dissipation channel 7b not only can accelerate the heat dissipation of the heat dissipation fins 11, but also can perform the function of heat insulation. The second air inlet hole 1301 is closer to the inner side of the LED lamp in the radial direction than any one of the LED chips 311, compared to the LED chip 311.

Fig. 18 is an enlarged view at B in fig. 2. As shown in fig. 18, the base 23 includes a metal portion 231 and an insulating portion 232, and the lead of the power supply 5 is connected to the external power supply unit through the insulating portion 232. The metal part 231 is coupled to the neck 22, and specifically, as shown in fig. 19, the inner surface of the metal part 231 is provided with a screw thread, and the screw thread is coupled to the neck 22. When the power source 5 in the lamp housing 2 is radiated by the metal part 231 (as described in the foregoing embodiment, at least a part of the inner wall of the metal part 231 constitutes the wall of the inner cavity of the lamp housing 2, so that the metal part 231 is directly connected to the heat conductive material and the metal part 231 radiates heat). For the power source 5, at least a portion of the power source 5 is located in the lamp head 23, and the lamp head 23 is used for dissipating heat of at least a portion of the power source 5. The inner wall of the metal part 231 may also be provided with a convex structure to increase the surface area of the inner wall corresponding to the inner cavity of the lamp housing 2. In the present embodiment, the screw thread is provided on the inner surface of the metal part 231 of the base 23 to form the above-mentioned convex structure, thereby increasing the surface area.

As shown in fig. 9, in the present embodiment, the wall of the inner sleeve 21 and the wall of the neck 22 jointly form the wall of the inner cavity of the lamp housing 2, and the height of the heat sink 1 in the axial direction does not exceed the height of the inner sleeve 21, so that the heat sink 1 corresponds to the inner sleeve 21 in the radial direction of the LED lamp, that is, the inner sleeve 21 plays a role of heat insulation, and the heat of the heat sink 1 is prevented from being conducted into the inner sleeve 1 to affect the electronic components of the power supply 5 therein. The entire lamp neck 22 is higher than the heat sink 1, that is, the heat sink 1 and the lamp neck 22 do not overlap in the radial direction of the LED lamp, so as to avoid heat conduction between the heat sink 1 and the lamp neck 22 as much as possible, and prevent the heat sink 1 from conducting heat to the inside of the lamp neck 22 through heat conduction, thereby affecting electronic components therein. Because of this, the present embodiment can set the heat transfer efficiency of the wall portion of the inner sleeve 21 to be lower than that of the wall portion of the lamp neck 22, and this arrangement has the advantages that, on one hand, the heat conduction from the heat sink 1 to the inner sleeve 21 can be reduced by setting the inner sleeve 21 to have low heat transfer efficiency, thereby preventing the heat sink 1 from affecting the electronic components inside the inner sleeve 21, and on the other hand, the heat transfer from the heat sink 1 to the lamp neck 22 is not required to be considered, thereby improving the heat transfer efficiency of the lamp neck 22, facilitating the heat generated by the electronic components of the internal power supply 5 during operation, and being dissipated through the lamp neck 22, thereby preventing the service life of the electronic components from being affected by the over. In this embodiment, in order to set the heat transfer efficiency of the wall of the inner sleeve 21 to be lower than that of the wall of the neck 22, the inner sleeve 21 may be made of a material with a low thermal conductivity, and the neck 22 may be made of a material with a relatively high thermal conductivity, and in order to increase the thermal conductivity of the neck 22, the neck 22 may be provided with heat dissipation holes 222, or the neck 22 may be provided with a heat conduction portion (not shown), such as a metal material with a high thermal conductivity.

As shown in fig. 9, the neck 22 has an upper portion and a lower portion, wherein the heat dissipation hole 222 is formed in the upper portion, the cross-sectional area of the upper portion is smaller than that of the lower portion, and the air velocity in the upper portion is faster than that in the lower portion, so that the initial velocity of the air discharged from the heat dissipation hole 222 is increased, and the hot air is prevented from accumulating around the heat dissipation hole 222. In this embodiment, the cross-sectional area of the neck 22 decreases in the upward axial direction of the LED lamp, thereby preventing obstruction to air flow. In this embodiment, the cross-sectional area of the entrance of the lower portion of the inner envelope 21 is larger than the cross-sectional area of the upper portion of the neck 22.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should it be construed that the utility model does not contemplate that such subject matter is part of the disclosed utility model subject matter.

Claims

1. An LED lamp, comprising:

a lamp housing;

the radiator is connected with the lamp shell;

the power panel comprises a first setting area and a second setting area, the sum of the weights of the electronic assemblies in the second setting area is larger than the sum of the weights of the electronic assemblies in the first setting area, and the first setting area is provided with a balancing weight.

2. The LED lamp of claim 1, wherein the power strip divides the power strip into the first and second mounting regions with an axis parallel to a lengthwise extension of the power strip.

3. The LED lamp of claim 1, wherein the power strip divides the power strip into a first area and a second area about an axis of the LED lamp.

4. The LED lamp of claim 1, wherein the weight is a heat sink assembly having a heat sink function.

5. The LED lamp of claim 4, wherein the heat sink assembly has a plurality of fins extending in an axial direction of the LED lamp, the fins defining channels therebetween.

6. The LED lamp of claim 5, wherein the weight includes a long side and a short side, the long side being parallel to the channel, the long side being parallel to an axial direction of the LED lamp.

7. The LED lamp of claim 4 or 5, wherein the electronic component comprises at least one heat generating component in direct thermal contact with the heat dissipating component.

8. The LED lamp of claim 7, wherein a transformer, inductor, resistor, diode, transistor, or integrated circuit in the heat generating component is in direct thermal contact with the heat dissipating component.

9. The LED lamp of claim 1, wherein the number of electronic components on the second placement area is greater than the number of electronic components on the first placement area.

10. The LED lamp of claim 1, wherein the first and second mounting regions each have a heat generating component thereon.

11. The LED lamp of claim 1, wherein a first heat dissipation channel is formed in the inner cavity of the lamp housing, the first heat dissipation channel has a first air inlet hole at one end of the lamp housing, and a heat dissipation hole at an opposite end of the lamp housing, the first heat dissipation channel dissipates heat from the power supply by a chimney effect during convection.

12. The LED lamp of claim 1, wherein the heat sink comprises a heat sink base and heat sink fins, the heat sink fins and the heat sink base forming a second heat sink channel therein, the second heat sink channel having a second air inlet hole, air entering through the second air inlet hole, passing through the second heat sink channel, and finally exiting through a space between the heat sink fins.

13. The LED lamp of claim 11, wherein the first heat dissipation channel comprises an inner channel and an outer channel, the outer channel being formed between the electronic components at the edge of the power board and an inner wall of the interior cavity of the lamp housing, the inner channel being formed in a gap between the electronic components.

14. The LED lamp of claim 13, wherein the electronic assembly comprises a transformer, the transformer comprising a core and a coil, the core having a cavity, the coil being disposed within the cavity, the cavity being open on at least one side in a radial direction of the LED lamp.

15. The LED lamp of claim 14, wherein the open side of the cavity corresponds to the inner channel or the outer channel.

16. The LED lamp of claim 14, wherein the cavity is open at both sides in a radial direction of the LED lamp, and one opening of the cavity corresponds to the inner channel and the other opening corresponds to the outer channel.

17. The LED lamp of claim 11, wherein the lamp housing includes a lamp head, a neck and an inner envelope, the lamp head coupled to the neck, the neck coupled to the inner envelope, the power strip including a first portion positioned within the neck and a second portion positioned within the inner envelope, the second portion being closer to the first air intake aperture than the first portion.

18. The LED lamp of claim 17, wherein the electrolytic capacitor in the electronics assembly is disposed on the second portion of the power strip.

19. The LED lamp of claim 17, wherein all of the electrolytic capacitors in the electronic assembly are disposed on the second portion of the power strip.

20. The LED lamp of claim 17, wherein the second portion of the power strip has an area greater than an area of the first portion.

21. The LED lamp of claim 17, wherein a transformer, inductor, resistor, integrated circuit, or transistor in the electronic assembly is disposed on the second portion.

22. The LED lamp of claim 17, wherein the electronic components include heat generating components, at least one of the heat generating components being in thermal contact with the lamp head.

23. The LED lamp of claim 22, wherein at least one of the heat generating components is in contact with and secured to the lamp head by a thermally conductive material.

24. The LED lamp of claim 22 or 23, wherein at least one of the heat generating components is a resistor, an inductor, an integrated circuit, a transformer, or a rectifier bridge.

25. The LED lamp of claim 23, wherein the thermally conductive material is positioned higher than the heat dissipation aperture after the LED lamp is mounted.

26. The LED lamp of claim 23, wherein the lamp cap comprises a metal portion, the thermally conductive material in thermal contact with the metal portion.