CN211005622U - Conductive diamond multilayer structure coating - Google Patents
Conductive diamond multilayer structure coating Download PDFInfo
- Publication number
- CN211005622U CN211005622U CN201920633626.4U CN201920633626U CN211005622U CN 211005622 U CN211005622 U CN 211005622U CN 201920633626 U CN201920633626 U CN 201920633626U CN 211005622 U CN211005622 U CN 211005622U
- Authority
- CN
- China
- Prior art keywords
- layer
- coating
- diamond
- deposited
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 57
- 239000011248 coating agent Substances 0.000 title claims abstract description 52
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 46
- 239000010432 diamond Substances 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000000956 alloy Substances 0.000 claims abstract description 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000007733 ion plating Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The utility model provides a conductive diamond multilayer structure coating, wherein a metal conductive layer is deposited on the surface of a cutter base body 101, a diamond coating is deposited on the surface of the metal conductive layer, a second metal conductive layer is deposited on the surface of the diamond coating, and the surface of the second metal conductive layer is coated to form a conductive wear-resistant layer; the composite coating structure with the metal conducting layer, the diamond coating, the second metal conducting layer and the conducting wear-resistant layer is deposited on the hard alloy cutter by adopting a multi-layer conducting diamond coating structure, the coating has good conducting performance and conducting wear-resistant performance, can be applied to circuit board processing equipment which needs to be electrified for carrying out broken cutter detection, and expands the conducting application function of the diamond coated cutter.
Description
Technical Field
The utility model relates to the technical field of coating film, in particular to a conductive diamond multilayer structure coating.
Background
The current circuit board drilling equipment detects a part of breaking cutters by electrifying current to the cutters, and the diamond coating cutters cannot be used on the part of the circuit board drilling equipment because the diamond coatings are not conductive. Along with the development of the communication industry, diamond coatings are more and more widely applied to the field of ceramic filler circuit board processing, line circuit board processing equipment on the market needs to supply current to a cutter for cutter breaking detection, and the diamond coatings limit the application of the coatings in the field of ceramic filler circuit board processing due to the insulating property of the diamond coatings.
The diamond coating deposited by the prior art is non-conductive and cannot be applied to circuit board processing equipment for conducting broken cutter detection. The coating deposited by the prior art in China cannot meet the functional requirements of electric conduction and wear resistance at the same time.
Disclosure of Invention
The utility model aims to solve the technical problem that a conductive diamond multilayer structure coating is provided, adopt the electrically conductive diamond coating structure of multilayer, have the composite coating structure of metal conducting layer, diamond coating and electrically conductive wearing layer at carbide cutter deposit, enlarged the electrically conductive application function of cutter.
In order to solve the technical problem, the utility model provides a conductive diamond multilayer structure coating, including the cutter base member, cutter base member surface deposit has the metal conducting layer, the diamond coating of metal conducting layer's surface redeposition, diamond coating surface deposit second layer metal conducting layer, second layer metal conducting layer surface coating is electrically conductive wearing layer.
Preferably, the diamond coating thickness is 7-10 um.
Preferably, the diamond coating is deposited on the metallic conductive layer by chemical vapor deposition.
Preferably, the thickness of the metal conductive layer is 0.5 um.
Preferably, the conductive layer contains elements of Cr and Ti.
Preferably, the conductive wear layer comprises: cr, Ti, Al, Si and N.
Preferably, the conductive wear-resistant layer is deposited by multi-arc ion plating, the thickness is 1um, and the hardness is 36 GPa.
Preferably, the metal conductive layer is deposited by means of unbalanced magnetron sputtering.
Preferably, the tool base body is a cemented carbide tool base body.
Compared with the prior art, the utility model beneficial effect be: the composite coating structure with the metal conducting layer, the diamond coating, the second metal conducting layer and the conducting wear-resistant layer is deposited on the hard alloy cutter by adopting a multi-layer conducting diamond coating structure, and the composite coating structure passes through the composite coating structure.
Drawings
Fig. 1 is a schematic structural diagram of a diamond stone conductive composite coating according to an embodiment of the present invention;
fig. 2 is a schematic view of the working principle of the embodiment of the present invention.
Reference numerals
101. A tool base; 102. a metal conductive layer; 103. coating diamond; 104. a second metal conductive layer; 105. a conductive wear layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the embodiment of the present invention includes a tool base 101, a metal conductive layer 102 is deposited on the surface of the tool base 101, a diamond coating 103 is deposited on the surface of the metal conductive layer 102, a second metal conductive layer 104 is deposited on the surface of the diamond coating 103, and a conductive wear-resistant layer 105 is coated on the surface of the second metal conductive layer 104.
Further, the diamond coating 103 has a thickness of 7-10 um.
Further, a diamond coating 103 is deposited on the metallic conductive layer 102 by chemical vapor deposition.
Further, the thickness of the metal conductive layer 102 is 0.5 um.
Further, the metal conductive layer 102 contains Cr or Ti, and has a conductive property.
Further, the conductive abrasion resistant layer 105102 includes: cr, Ti, Al, Si and N.
Further, the conductive wear-resistant layer 105 was deposited by multi-arc ion plating to a thickness of 1um and a hardness of 36 GPa.
Further, the metal conductive layer 102 and the second metal conductive layer 104 are deposited by an unbalanced magnetron sputtering apparatus.
Further, the tool base 101 is a cemented carbide tool base 101.
As shown in fig. 2, the working principle and the flow of the present invention are as follows:
s10, preprocessing a cutter base body 101;
s20, removing dirt on the surface of the cutter base body 101 by ultrasonic cleaning;
s30, depositing a metal conducting layer 102;
s40, depositing a diamond coating 103;
s50, etching metal ions;
s60, depositing a second metal conducting layer 104;
s70, depositing a conductive wear-resistant layer 105.
The utility model discloses a multilayer electrically conductive diamond coating 103 structure has the composite coating structure of metal conducting layer 102, diamond coating 103, second floor metal conducting layer 104 and electrically conductive wearing layer 105 and passes through at carbide cutter base member 101 deposit, and this coating has good electric conductive property and wear resistance, can use on the circuit board processing equipment that needs circular telegram to carry out the disconnected sword and detect, has enlarged the electrically conductive application function of diamond coating 103 cutter.
The above description is only a preferred embodiment of the present patent, and not intended to limit the scope of the present patent, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the specification and the drawings, and which are directly or indirectly applied to other related technical fields, belong to the scope of the present patent protection.
Claims (7)
1. An electrically conductive diamond multilayer coating, characterized by: the cutting tool comprises a cutting tool base body, wherein a metal conducting layer is deposited on the surface of the cutting tool base body, a diamond coating is deposited on the surface of the metal conducting layer, a second metal conducting layer is deposited on the surface of the diamond coating, and a conductive wear-resistant layer is coated on the surface of the second metal conducting layer.
2. The electrically conductive diamond multilayer coating of claim 1, wherein: the thickness of the diamond coating is 7-10 um.
3. The electrically conductive diamond multilayer coating of claim 1, wherein: the diamond coating is deposited on the metal conductive layer by chemical vapor deposition.
4. The electrically conductive diamond multilayer coating of claim 1, wherein: the thickness of metal conducting layer is 0.5 um.
5. The electrically conductive diamond multilayer coating of claim 1, wherein: the conductive wear-resistant layer is formed by multi-arc ion plating, the thickness of the conductive wear-resistant layer is 1um, and the hardness of the conductive wear-resistant layer is 36 GPa.
6. The electrically conductive diamond multilayer coating of claim 1, wherein: the metal conducting layer is manufactured by means of unbalanced magnetron sputtering.
7. The electrically conductive diamond multilayer coating of claim 1, wherein: the cutter base body is a hard alloy cutter base body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920633626.4U CN211005622U (en) | 2019-04-30 | 2019-04-30 | Conductive diamond multilayer structure coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920633626.4U CN211005622U (en) | 2019-04-30 | 2019-04-30 | Conductive diamond multilayer structure coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211005622U true CN211005622U (en) | 2020-07-14 |
Family
ID=71479445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920633626.4U Expired - Fee Related CN211005622U (en) | 2019-04-30 | 2019-04-30 | Conductive diamond multilayer structure coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211005622U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111910169A (en) * | 2020-07-16 | 2020-11-10 | 厦门厦芝科技工具有限公司 | Cutter with conductive diamond coating and preparation method thereof |
-
2019
- 2019-04-30 CN CN201920633626.4U patent/CN211005622U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111910169A (en) * | 2020-07-16 | 2020-11-10 | 厦门厦芝科技工具有限公司 | Cutter with conductive diamond coating and preparation method thereof |
| CN111910169B (en) * | 2020-07-16 | 2022-11-22 | 厦门厦芝科技工具有限公司 | Cutter with conductive diamond coating and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106795641B (en) | Nickel-chrome nanometer laminate coat or covering with high rigidity | |
| CN211005622U (en) | Conductive diamond multilayer structure coating | |
| US20110165433A1 (en) | Erosion and corrosion resistant coating system for compressor | |
| WO2007111676A3 (en) | Method of direct plating of copper on a substrate structure | |
| EP1762638A3 (en) | PVD coated cutting tool | |
| CN203451619U (en) | Sieve basket used for processing fiber material | |
| CN104011256A (en) | Coated cutting tool | |
| CN103052280A (en) | Method for manufacturing substrate with conductive through hole | |
| TW201811157A (en) | Near-field electromagnetic wave absorbing film | |
| CN105965043A (en) | Coated cutting tool and preparation method thereof | |
| CN1721113A (en) | Wire coated with diamond powder on surface for wire cutting machine | |
| CN102862339A (en) | Intelligent coating and preparation method thereof | |
| CN104269597A (en) | Method for manufacturing film attenuation piece | |
| CN210287497U (en) | Coating for processing flexible circuit board | |
| WO2008003973A1 (en) | A method and apparatus for the formation of coatings on drills | |
| CN110023052B (en) | Die for processing metal material and method for manufacturing same | |
| CN102335814A (en) | Method for manufacturing cutting blade | |
| CN101230459A (en) | Micro-drilling needle surface plating method and structure thereof | |
| DE50212372D1 (en) | Method for coating workpieces with a bearing metal | |
| CN208286454U (en) | A kind of wear-resisting medical rubber glove | |
| CN103008746A (en) | Super-hard wear-resisting chromium-based composite coating micro milling cutter used for PCB (Printed Circuit Board) and preparation method thereof | |
| CN202639428U (en) | Coated drill bit for printed circuit board (PCB) drilling hole | |
| KR102479383B1 (en) | Cutting tool having hard coating layer and cemented carbide coating layer and manufacturing method thereof | |
| US5494565A (en) | Method of producing workpieces of non-corrosion-resistant metals with wear-resistant coatings and articles | |
| CN103320766A (en) | Method for depositing diamond like carbon film on surface of hard alloy cutting tool, and hard alloy cutting tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200714 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |