CN101230459A - Micro-drilling needle surface plating method and structure thereof - Google Patents
Micro-drilling needle surface plating method and structure thereof Download PDFInfo
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- CN101230459A CN101230459A CNA2007100036658A CN200710003665A CN101230459A CN 101230459 A CN101230459 A CN 101230459A CN A2007100036658 A CNA2007100036658 A CN A2007100036658A CN 200710003665 A CN200710003665 A CN 200710003665A CN 101230459 A CN101230459 A CN 101230459A
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Abstract
The invention relates to a method of electroplating the surface of a micro-drill-point and the structure thereof. The invention includes the following steps: firstly, providing a micro-drill-point and a vacuum chamber and then arranging the micro-drill-point inside the vacuum chamber; secondly, depositing the surface of the micro-drill-point in a mode of electric arc deposition to form a first plated layer; and thirdly, depositing the surface of the first plated layer in a mode of sputtering deposition to form a second plated layer. Therefore, the invention provides the micro-drill-point with the mechanical properties of high hardness, small friction coefficient and high stability and has the advantages of abrasion resistance and improved machining precision.
Description
Technical field
The present invention is relevant with cutting tool, is meant a kind of micro-drilling needle surface plating method and structure thereof especially.
Background technology
General drill point can be divided into a shank and a blade, and shank is for the instrument mechanical grip, and blade is used for workpiece is processed.Because blade is the main position of processing of holing, and must will possess than the workpiece mechanical properties of high rigidity more, to reach the purpose of processing smoothly.
For improving the mechanical properties of drill point, conventional approaches is to adopt arc deposited (arc deposition) to plate the higher film of one deck hardness at drilling needle surface, to improve the hardness on drill point blade surface.Yet, if with arc deposited (arcdeposition) mode plated film, produce molten drop (metal droplet) in coated surface easily, cause coated surface unsmooth.Wherein, the size of molten drop is approximately between 0.7 μ m～2 μ m, for general drill point, because its sword footpath is bigger, and the precision requirement for boring is lower, molten drop is less for the precision influence of the boring of general drill point, and not remarkable in the influence of frictional coefficient, so the influence that molten drop caused is still in admissible scope.But,, can improve the hardness on little drill point blade surface equally if in the arc deposited mode little drill point (micro drill) is carried out plated film equally.But because its sword footpath is less below 3.175mm, and the precision requirement of boring is higher; It is excessive that molten drop then seems, not only significantly reduces precision, and the frictional coefficient influence of drill point also significantly improves relatively.Event is commonly used with arc deposited (arc deposition) mode plated film and is not suitable for little drill point.
For improving the problems referred to above, generally adopt the mode of sputtering sedimentation (sputter deposition) to carry out plated film, it can make the thickness of plated film comparatively on average and not can form molten drop, and coated surface is comparatively level and smooth.It can reduce frictional coefficient than arc deposited, improves the precision and the speed of boring.Yet, before carrying out plated film in the sputtering sedimentation mode, do not plant layer (under-layer) as ground, for example if do not make the high key of a degree of adhering in advance on drill point blade surface: titanium nitride (TiN), then plated film can produce the problem that the sticking power deficiency is easier to peel off.Little drill point of this type is shorter work-ing life, can not effectively reach the purpose that promotes little drill point mechanical properties, has the relatively poor shortcoming of mechanical properties and haves much room for improvement.
In sum, commonly using the micro-drilling needle surface film coating method has above-mentioned shortcoming and haves much room for improvement.
Summary of the invention
Main purpose of the present invention is to provide a kind of micro-drilling needle surface plating method and structure thereof, the characteristic that has abrasion performance and improve working accuracy.
For achieving the above object, a kind of micro-drilling needle surface plating method provided by the present invention is characterized in that comprising following each step: a little drill point and a vacuum chamber a) are provided, described little drill point is placed in the described vacuum chamber; B) in the arc deposited mode described micro-drilling needle surface is deposited, to form a first filming layer; C) in the sputtering sedimentation mode described the first filming laminar surface is deposited, to form one second coatings.
In the technical scheme of the invention described above, the described little drill point in the step a) after removing surface and oil contaminant and dry moisture with ultrasonic wave in advance, places in the described vacuum chamber again.
In the technical scheme of the invention described above, the described vacuum chamber in the step a) has a vacuum-lines, for state that described vacuum chamber is evacuated.
In the technical scheme of the invention described above, the described vacuum chamber in the step a) is evacuated to 8 * 10
-3Pa.
In the technical scheme of the invention described above, the arc deposited mode that step b) is addressed is rotary electric arc deposition.
In the technical scheme of the invention described above, the described the first filming layer of step b), its thickness is below 3 μ m.
In the technical scheme of the invention described above, the sputtering sedimentation mode that step c) is addressed is the non-balance magnetically controlled sputter deposition.
In the technical scheme of the invention described above, described second coatings of step c) is for carrying out sputtering sedimentation with non-conductive target.
In the technical scheme of the invention described above, the non-conductive target that step c) is addressed, it is wherein a kind of to be selected from TiB2, aluminium sesquioxide and boron nitride.
In the technical scheme of the invention described above, described second coatings of step c), its thickness is below 3 μ m.
A kind of film that makes with the described electro-plating method of claim 1 is characterized in that including: a little drill point; One the first filming layer is formed at described micro-drilling needle surface in the arc deposited mode; One second coatings is formed at the first filming laminar surface in the sputtering sedimentation mode.
The thickness of described the first filming layer is below 3 μ m.
The thickness of described second coatings is below 3 μ m.
Described second coatings is the alloy with carbon back, boryl, nitrogen base or titanium base.
Adopt above technical scheme, the present invention provides the mechanical properties of little drill point blade high rigidity earlier in the arc deposited mode, make its characteristic with abrasion performance, provides little drill point blade to form smooth surface in the sputtering sedimentation mode again, can reduce the formation of uneven sliding surface, have the characteristic of low-friction coefficient.Thus, the present invention is than commonly using the plated film mode, can overcome the shortcoming that the arc deposited coated surface is coarse and the sputtering sedimentation adhesion of coating film is not high, and further promote the mechanical properties of little drill point blade, make little drill point have advantages of higher stability and long work-ing life.Therefore the present invention can overcome the shortcoming of commonly using little drill point, and the mechanical properties of little drill point high rigidity, low-friction coefficient, high stability is provided, the characteristic that has abrasion performance and improve working accuracy.
Description of drawings
Fig. 1 is the plated film schema of a preferred embodiment of the present invention;
Fig. 2 is the front view of little drill point of a preferred embodiment of the present invention;
Fig. 3 is the processing synoptic diagram of a preferred embodiment of the present invention, and it discloses the structure of vacuum chamber;
Fig. 4 is the partial enlarged drawing of a preferred embodiment of the present invention, and it discloses the state of little drill point blade surface before plated film;
Fig. 5 is the structural representation of a preferred embodiment of the present invention, and it discloses the state after handle through arc deposited on little drill point blade surface;
Fig. 6 is the structural representation of a preferred embodiment of the present invention, and it discloses the state after handle through sputtering sedimentation on little drill point blade surface.
Embodiment
For the effect that describes structure of the present invention in detail and reached, existing following preferred embodiment of act and conjunction with figs. are described as follows.
As Fig. 1～shown in Figure 6, be a preferred embodiment of a kind of micro-drilling needle surface plating method provided by the present invention and structure thereof, its plated film program is as follows:
A) at first, provide a little drill point (micro drill) 10 and one vacuum chamber 20, little drill point 10 is placed in the vacuum chamber 20 (as shown in Figure 3).Wherein, little drill point 10 has a shank 12 and a blade 14.Little drill point 10 is removed surface and oil contaminant with ultrasonic wave in advance before being placed into vacuum chamber 20, to improve the sticking power of ion when depositing.Oven dry is attached to the moisture of little drill point 10 again, prevents to form oxide compound when little drill point 10 from depositing, and forms projection on little drill point 10 surfaces.Vacuum chamber 20 has a vacuum-lines 22, for vacuum chamber 20 is pumped into 8 * 10
-3The vacuum state of Pa.
B) in arc deposited (arc deposition) mode little drill point 10 surfaces are deposited, to form a first filming layer 30.Wherein the arc deposited mode includes cathodic arc deposition (cathodic arc deposition), filtering type cathodic arc deposition (filtered cathodic arc deposition) and rotary electric arc deposition (steering arcdeposition).In above-mentioned arc deposited mode, it is better to deposit formed film hardness effect with rotary electric arc.Therefore the arc deposited mode of present embodiment selects for use rotary electric arc to be deposited as example, and with the electroconductibility target arc deposited is carried out on little drill point 10 surfaces, to form 30 (as shown in Figure 5) of the first filming layer.The thickness of the first filming layer 30 is 3 μ m.Be anticipated that wherein the first filming layer 30 will have several molten drops and form projection on the surface, with rotary electric arc deposition, the lucky higher limit of its formed molten drop size in the admissible scope of little drill point.
C) in sputtering sedimentation (sputter deposition) mode sputtering sedimentation is carried out on the first filming layer 30 surface, to form one second coatings 40.The sputtering sedimentation mode comprises d.c. sputtering deposition (DC-diode Sputtering), magnetron sputtering deposition (magnetron sputtering), non-balance magnetically controlled sputter deposition (unbalanced magnetronsputtering), high frequency sputtering sedimentation (ratio-frequency sputtering) and reactant gas sputtering sedimentation (reactive gas sputtering).In above-mentioned sputtering sedimentation mode, because the sedimentary operating distance of non-balance magnetically controlled sputter is longer, make target comparatively average when sputtering sedimentation, and then can make plated film form comparatively level and smooth surface.Moreover, when carrying out sputtering sedimentation, can not be subject to the suitable kind of electroconductibility target and non-conductive target with the non-balance magnetically controlled sputter depositional mode, have suitability preferably.Therefore the sputtering sedimentation mode of present embodiment selects for use non-balance magnetically controlled sputter to be deposited as example.In the target kind, be best with the hardness of non-conductive target, from high to low first three of its hardness planted and is respectively TiB2 (TiB in regular turn
2), boron nitride (BN) and aluminium sesquioxide (Al
2O
3).Moreover, if consider to select target with ionic sticking power, wherein with titaniferous (Ti) person for well, can improve ionic sticking power, can ion more easily be adhered to.In addition, the cost of non-conductive target is lower than electroconductibility target, has the characteristic that reduces cost.Present embodiment is selected TiB2 (TiB for use
2) be target, sputtering sedimentation is carried out on blade 14 surfaces of little drill point 10, to form second coatings 40 (as shown in Figure 6), the thickness of second coatings 40 is 3 μ m.The experiment proved that, comparatively suitable when the coating film thickness of second coatings 40 is 3 μ m.Wherein be anticipated that, second coatings 40 forms high spot at molten drop can form comparatively smooth surface, can reduce the influence that molten drop causes, second coatings 40 can be taken into account simultaneously improve mechanical properties and the requirement of bore operation on precision, to obtain effect preferably.Second coatings 40 is for having the alloy of carbon back (carbon-base), boryl (boron-base), nitrogen base (nitrogen-base) or titanium base (titanic-base).
Thus, the present invention is via above-mentioned steps, it is handled in arc deposited (arc deposition) mode little drill point blade surface earlier, its preferable hardness is provided, then, carry out plated film in the mode of sputtering sedimentation (sputter deposition) again, can form smooth surface at little drill point blade, with the formation of the power of reducing friction.It can provide the mechanical properties of little drill point high rigidity, low-friction coefficient, high stability than traditional methods, the characteristic that has abrasion performance and improve working accuracy.
Moreover, commonly use micro-drilling needle surface with the sputtering sedimentation plated film before, need to make the program that the high key of a degree of adhering to be planted layer (under-layer) on little drill point blade surface in advance, be beneficial to second coatings and adhere to.The present invention do not need to make in advance key plant the layer (under-layer) second coatings is adhered to, when especially carrying out sputtering sedimentation with non-conductive target, its degree of adhering to is made key in advance to plant the mode of layer higher than commonly using, and has the characteristic of simplifying step sputter deposition process.In addition, when selecting for use the higher non-conductive target of hardness to carry out the sputtering sedimentation plated film, second coatings can further promote the mechanical properties of little drill point blade with high rigidity, anti abrasive characteristic equally, prolongs the work-ing life of little drill point.
Through as seen from the above embodiment, the present invention is via above-mentioned steps, the mechanical properties of little drill point blade high rigidity is provided in the arc deposited mode earlier, make it have the characteristic of abrasion performance, provide little drill point blade to form smooth surface in the sputtering sedimentation mode again, can reduce the formation of uneven sliding surface, have the characteristic of low-friction coefficient.Thus, the present invention is than commonly using the plated film mode, can overcome the shortcoming that the arc deposited coated surface is coarse and the sputtering sedimentation adhesion of coating film is not high, and further promote the mechanical properties of little drill point blade, make little drill point have advantages of higher stability and long work-ing life.Certainly, on the implementation, micro-drilling needle surface plating method of the present invention not only can be implemented processing to the drill point blade, is applicable to too whole drill point processed.
In sum; construction components that the present invention is disclosed in the above-described embodiments and method steps; only for illustrating; can not be used for limiting protection scope of the present invention; protection scope of the present invention should be as the criterion with claims; substituting or variation of other equivalent elements or step all should be included in the scope of patent protection of the present invention.
Claims (14)
1. micro-drilling needle surface plating method is characterized in that comprising following each step:
A) provide a little drill point and a vacuum chamber, described little drill point is placed in the described vacuum chamber;
B) in the arc deposited mode described micro-drilling needle surface is deposited, to form a first filming layer;
C) in the sputtering sedimentation mode described the first filming laminar surface is deposited, to form one second coatings.
2. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: the described little drill point in the step a) after removing surface and oil contaminant and dry moisture with ultrasonic wave in advance, places in the described vacuum chamber again.
3. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: the described vacuum chamber in the step a) has a vacuum-lines, for state that described vacuum chamber is evacuated.
4. micro-drilling needle surface plating method as claimed in claim 3 is characterized in that: the described vacuum chamber in the step a) is evacuated to 8 * 10
-3Pa.
5. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: the described arc deposited mode of step b) is rotary electric arc deposition.
6. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: the described the first filming layer of step b), its thickness is below 3 μ m.
7. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: the described sputtering sedimentation mode of step c) is the non-balance magnetically controlled sputter deposition.
8. micro-drilling needle surface plating method as claimed in claim 7 is characterized in that: described second coatings of step c), and for carrying out sputtering sedimentation with non-conductive target.
9. micro-drilling needle surface plating method as claimed in claim 8 is characterized in that: the described non-conductive target of step c), it is wherein a kind of to be selected from TiB2, aluminium sesquioxide and boron nitride.
10. micro-drilling needle surface plating method as claimed in claim 1 is characterized in that: described second coatings of step c), its thickness is below 3 μ m.
11. a film that makes with the described electro-plating method of claim 1 is characterized in that including:
One little drill point;
One the first filming layer is formed at described micro-drilling needle surface in the arc deposited mode;
One second coatings is formed at the first filming laminar surface in the sputtering sedimentation mode.
12. micro-drilling needle surface plating method as claimed in claim 11 is characterized in that: the thickness of described the first filming layer is below 3 μ m.
13. micro-drilling needle surface plating method as claimed in claim 11 is characterized in that: the thickness of described second coatings is below 3 μ m.
14. micro-drilling needle surface plating method as claimed in claim 11 is characterized in that: described second coatings is the alloy with carbon back, boryl, nitrogen base or titanium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100036658A CN101230459A (en) | 2007-01-23 | 2007-01-23 | Micro-drilling needle surface plating method and structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100036658A CN101230459A (en) | 2007-01-23 | 2007-01-23 | Micro-drilling needle surface plating method and structure thereof |
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| CN101230459A true CN101230459A (en) | 2008-07-30 |
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ID=39897263
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|---|---|---|---|
| CNA2007100036658A Pending CN101230459A (en) | 2007-01-23 | 2007-01-23 | Micro-drilling needle surface plating method and structure thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824618A (en) * | 2010-05-07 | 2010-09-08 | 武汉大学 | Superhard DLC (Diamond-like Carbon) base nano composite coating PCB (Printed Circuit Board) microdriller and manufacturing method thereof |
| CN103418987A (en) * | 2013-07-23 | 2013-12-04 | 太原科技大学 | Micro-hole grinding and drilling technology |
| CN106756849A (en) * | 2016-12-21 | 2017-05-31 | 深圳先进技术研究院 | A kind of PCB with transition metal boride coating micro- brills and preparation method thereof |
-
2007
- 2007-01-23 CN CNA2007100036658A patent/CN101230459A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824618A (en) * | 2010-05-07 | 2010-09-08 | 武汉大学 | Superhard DLC (Diamond-like Carbon) base nano composite coating PCB (Printed Circuit Board) microdriller and manufacturing method thereof |
| CN103418987A (en) * | 2013-07-23 | 2013-12-04 | 太原科技大学 | Micro-hole grinding and drilling technology |
| CN106756849A (en) * | 2016-12-21 | 2017-05-31 | 深圳先进技术研究院 | A kind of PCB with transition metal boride coating micro- brills and preparation method thereof |
| CN106756849B (en) * | 2016-12-21 | 2019-06-25 | 深圳先进技术研究院 | A kind of micro- brill and preparation method thereof of the PCB with transition metal boride coating |
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