CN210995626U - Chip dust removal equipment - Google Patents
Chip dust removal equipment Download PDFInfo
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- CN210995626U CN210995626U CN201921931899.3U CN201921931899U CN210995626U CN 210995626 U CN210995626 U CN 210995626U CN 201921931899 U CN201921931899 U CN 201921931899U CN 210995626 U CN210995626 U CN 210995626U
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- 239000000428 dust Substances 0.000 title claims abstract description 51
- 238000007664 blowing Methods 0.000 claims abstract description 97
- 238000004140 cleaning Methods 0.000 claims abstract description 50
- 239000004065 semiconductor Substances 0.000 claims abstract description 48
- 238000001514 detection method Methods 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009434 installation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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Abstract
The utility model discloses a chip dust collecting equipment, include: the bearing assembly comprises a bearing plate and a semiconductor chip, wherein the bearing plate is provided with bearing grooves and mounting grooves which are arranged at intervals, and the semiconductor chip is arranged in the bearing grooves; the cleaning structure is arranged opposite to the bearing plate and comprises an air blowing pipe with an air blowing opening, and the air blowing opening faces the bearing groove; and the pressure detection assembly is arranged in the mounting groove. The utility model aims at providing a can real-time supervision and control the chip dust collecting equipment of pressure of blowing, improve chip dust collecting equipment's convenience of use.
Description
Technical Field
The utility model relates to a dust collecting equipment technical field, in particular to chip dust collecting equipment.
Background
At present, in a substrate having a chip (MEMS, Micro-Electro-Mechanical System, which is called a Micro Electro-Mechanical System (MEMS), and is also called a Micro-Electro-Mechanical System (MEMS), a Micro System, a Micro machine, etc., and refers to a high-tech device with a size of several millimeters or less), foreign substances such as dust are often accumulated on the surface of the chip, thereby affecting normal operation of the chip and the substrate. In the prior art, the surface of the chip is usually cleaned by blowing clean air, but in order to protect the chip, the blowing pressure becomes a key control parameter. The pressure of compressed air in an air blowing pipe is usually controlled by the conventional cleaning equipment through a barometer valve, but the air blowing pressure cannot be monitored, so that the cleaning process has risks.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chip dust collecting equipment aims at providing one kind can real-time supervision and control the chip dust collecting equipment of pressure of blowing, provides chip dust collecting equipment's convenience of use.
In order to achieve the above object, the utility model provides a chip dust collecting equipment, include:
the bearing assembly comprises a bearing plate and a semiconductor chip, wherein the bearing plate is provided with bearing grooves and mounting grooves which are arranged at intervals, and the semiconductor chip is arranged in the bearing grooves;
the cleaning structure is arranged opposite to the bearing plate and comprises an air blowing pipe with an air blowing opening, and the air blowing opening faces the bearing groove; and
and the pressure detection assembly is arranged in the mounting groove.
In one embodiment, a surface of the pressure detection assembly facing the cleaning structure and a surface of the semiconductor chip facing the cleaning structure are on the same plane.
In one embodiment, the vertical distance between the surface of the semiconductor chip facing the cleaning structure and the air blowing opening is h1, and the vertical distance between the surface of the pressure detection assembly facing the cleaning structure and the air blowing opening is h 2;
h1 ═ h 2; and/or h1 is more than or equal to 1cm and less than or equal to 3cm, and h2 is more than or equal to 1cm and less than or equal to 3 cm.
In one embodiment, one of the pressure detection component and the groove wall of the mounting groove is provided with a buckle, the other of the pressure detection component and the groove wall of the mounting groove is provided with a buckle groove, and the pressure detection component is detachably mounted in the mounting groove through the clamping fit of the buckle and the buckle groove.
In one embodiment, the pressure detection assembly comprises a pressure sensor and a data processing terminal module, the pressure sensor and the data processing terminal module are arranged in the mounting groove, and the data processing terminal module is electrically connected with the pressure detection assembly.
In an embodiment, the pressure detection assembly further includes a display device, and the display device is electrically connected to the data processing terminal module.
In an embodiment, the supporting board is provided with a baffle protruding around the notch of the supporting groove, the semiconductor chip includes a substrate and a chip disposed on the substrate, the periphery of the substrate is in limit abutment with the baffle, and the chip is exposed at the notch of the supporting groove.
In an embodiment, the cleaning structure further comprises a blowing main pipe, the blowing pipe comprises a plurality of blowing pipes, and the plurality of blowing pipes are connected to the blowing main pipe at intervals.
In one embodiment, the orientation of the air blowing opening forms an included angle of 30-60 degrees with the horizontal plane.
In an embodiment, the cleaning structure further comprises a collecting device, the collecting device is located in the blowing direction of the blowing pipe, and the collecting device is a dust collector.
The chip dust removing equipment of the technical scheme of the utility model is provided with the pressure detection component, the bearing groove and the mounting groove are arranged on the bearing plate, the bearing groove is utilized to place the semiconductor chip, the pressure detection component is arranged by utilizing the mounting groove, when the cleaning structure blows the semiconductor chip in the bearing groove on the bearing plate through the blowing port of the blowing pipe, the foreign matter on the surface of the semiconductor chip is blown off by utilizing the blowing pipe, the cleaning and dust removing effect is realized, and the foreign matter fraction defective on the surface of the semiconductor chip is greatly reduced; meanwhile, real-time pressure monitoring and monitoring are achieved for airflow blown out of the air blowing port by the aid of the pressure detection assembly in the mounting groove, so that use risks of the chip dust removal equipment are effectively reduced, and use convenience of the chip dust removal equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the chip dust removing apparatus of the present invention;
FIG. 2 is a schematic view of a partial cross-section of an embodiment of the chip dust removing apparatus of the present invention;
fig. 3 is a schematic structural diagram of an embodiment of the loading plate of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Chip |
2 | Cleaning structure |
| 1 | |
21 | |
| 11 | |
22 | |
| 111 | Bearing groove | 3 | |
| 112 | |
31 | |
| 113 | |
32 | Data processing terminal module |
| 12 | |
33 | |
| 121 | Substrate | 4 | Collecting |
| 122 | Chip and method for manufacturing the same |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a chip dust collecting equipment 100. It is understood that the chip dust removing device 100 is used to perform cleaning dust removal on the semiconductor chip 12. Of course, in other embodiments, the chip dust removing apparatus 100 may also be used to remove dust from other chip products, and is not limited herein.
Referring to fig. 1, fig. 2 and fig. 3, in an embodiment of the present invention, the chip dust removing apparatus 100 includes a bearing assembly 1, a cleaning structure 2 and a pressure detecting assembly 3, wherein the bearing assembly 1 includes a bearing plate 11 and a semiconductor chip 12, the bearing plate 11 is provided with a bearing groove 111 and a mounting groove 113 that are arranged at intervals, and the semiconductor chip 12 is disposed in the bearing groove 111; the cleaning structure 2 is arranged opposite to the bearing plate 11, the cleaning structure 2 comprises an air blowing pipe 21 with an air blowing opening 22, and the air blowing opening 22 faces the bearing groove 111; the pressure detection component 3 is arranged in the mounting groove 113.
It can be understood that the carrier plate 11 is used for carrying and placing the semiconductor chip 12 and the pressure detection assembly 3, and the carrier plate 11 plays a role of supporting, mounting and fixing. In the present embodiment, the carrier plate 11 may be a supporting table, a mounting seat, a supporting plate, etc., and is not limited herein. Optionally, the carrier plate 11 is of plate-like construction.
In this embodiment, in order to stably mount the carrier plate 11 on the semiconductor chip 12 and the pressure detection assembly 3, the material of the carrier plate 11 may be wood, plastic or metal. In order to prevent the semiconductor chip 12 and the pressure detection assembly 3 from being damaged by the carrier plate 11 during the mounting process of the semiconductor chip 12 and the pressure detection assembly 3, the carrier plate 11 may be made of a hard plastic material. Of course, in other embodiments, in order to further prevent the semiconductor chip 12 and the pressure detection assembly 3 from being damaged during the mounting process, anti-collision structures, such as a cushion pad or a cushion ring or a protective layer with a cushion performance, are disposed in the bearing groove 111 and the mounting groove 113 of the carrier plate 11, which is not limited herein.
The utility model discloses chip dust collecting equipment 100 of technical scheme is through setting up pressure detection subassembly 3 to set up bearing groove 111 and mounting groove 113 on loading board 11, utilize bearing groove 111 to place semiconductor chip 2, utilize mounting groove 113 to install pressure detection subassembly 3, when cleaning structure 2 blows to the semiconductor chip 2 in bearing groove 111 on loading board 11 through the gas blow port 22 of gas blow pipe 21, utilize gas blow pipe 21 to blow off the foreign matter on semiconductor chip 2 surface, realize clean dust removal effect, greatly reduce the foreign matter defective rate on semiconductor chip 2 surface; meanwhile, real-time pressure monitoring and monitoring of the airflow blown out from the air blowing port 22 are realized by the pressure detection assembly 3 in the mounting groove 113, so that the use risk of the chip dust removing equipment 100 is effectively reduced, and the use convenience of the chip dust removing equipment 100 is improved.
In one embodiment, as shown in fig. 1 and 2, the surface of the pressure detection assembly 3 facing the cleaning structure 2 is on the same plane as the surface of the semiconductor chip 12 facing the cleaning structure 2.
It can be understood that, the pressure detection assembly 3 and the semiconductor chip 12 are disposed on the same plane, which is beneficial to the accurate detection of the pressure detection assembly 3, and the pressure of the air flow blown out from the air blowing opening 22 to the surface of the semiconductor chip 12, thereby realizing the real-time monitoring and control of the air flow pressure and effectively reducing the use risk of the chip dust removing device 100.
In the present embodiment, in order to ensure that the pressure detection assembly 3 and the semiconductor chip 12 are disposed on the same plane, the surface of the carrier plate 11 facing the cleaning structure 2 is taken as a reference, so that the surfaces of the pressure detection assembly 3 and the semiconductor chip 12 are flush with the surface of the carrier plate 11.
It can be understood that the depth of the carrying groove 111 is specifically set according to the thickness of the actual semiconductor chip 12, and in order to avoid the semiconductor chip 12 protruding out of the surface of the carrying plate 11 after being mounted in the carrying groove 111, the carrying groove 111 can be set to a through groove structure, and at this time, it is only necessary to ensure that the surface of the semiconductor chip 12 facing the cleaning structure 2 is flush with the surface of the carrying plate 11. Of course, the depth of the installation groove 113 is specifically set according to the thickness or height of the actual pressure detection assembly 3, and in order to avoid the pressure detection assembly 3 protruding out of the surface of the bearing plate 11 after being installed in the installation groove 113, the installation groove 113 may be a through groove structure, which is not limited herein.
In one embodiment, as shown in fig. 2, the vertical distance between the surface of the semiconductor chip 12 facing the cleaning structure 2 and the air blowing opening 22 is h1, and the vertical distance between the surface of the pressure detection assembly 3 facing the cleaning structure 2 and the air blowing opening 22 is h 2; alternatively, h1 ═ h 2. So set up, can be favorable to the pressure that detects the air current that blows to semiconductor chip 12 surface from blowing port 22 that pressure detection subassembly 3 can be accurate to realize the real-time supervision and the control to air current pressure, effectively reduce chip dust collecting equipment 100's use risk.
In the present embodiment, the vertical distance h1 between the surface of the semiconductor chip 12 facing the cleaning structure 2 and the air blowing port 22 is in the range of 1cm to 3 cm. Alternatively, h1 is 1cm, 2cm, 3 cm. The vertical distance h1 between the surface of the semiconductor chip 12 facing the cleaning structure 2 and the air blowing opening 22 is controlled within the range of 1 cm-3 cm, and the foreign matters on the surface of the semiconductor chip 12 can be dropped by the air blown from the air blowing opening 22 of the air blowing pipe 21, so that the cleaning effect of the surface of the semiconductor chip 12 is ensured.
It can be understood that the vertical distance h1 between the surface of the semiconductor chip 12 and the air blowing opening 22 is the same as the vertical distance h2 between the surface of the pressure detection assembly 3 and the air blowing opening 22, which is beneficial for the pressure detection assembly 3 to accurately detect the pressure of the air flow blown from the air blowing opening 22 to the surface of the semiconductor chip 12, so that the chip dust removing device 100 can control the flow rate of the air blown from the air blowing pipe 21 according to the real-time pressure. Alternatively, h2 is 1cm, 2cm, 3 cm.
In one embodiment, one of the pressure detection component 3 and the groove wall of the mounting groove 113 is provided with a buckle, and the other is provided with a buckle groove, and the pressure detection component 3 is detachably mounted in the mounting groove 113 through the clamping fit of the buckle and the buckle groove.
It can be understood that the pressure detection assembly 3 can be detachably mounted in the mounting groove 113, which is beneficial to the realization of the disassembly, assembly, replacement and maintenance of the pressure detection assembly 3, thereby being beneficial to the reduction of the cost and the use convenience of the chip dust removing device 100.
In this embodiment, the periphery of the pressure detecting component 3 is provided with a buckle, and the wall of the mounting groove 113 is provided with a buckle groove, so that when the pressure detecting component 3 is installed in the mounting groove 113, the connection and fixation are realized through the clamping fit of the buckle and the buckle groove. Of course, the buckle may also be disposed on a groove wall of the mounting groove 113, and the buckle groove is disposed on a periphery of the pressure detecting component 3, which is not limited herein.
In other embodiments, the pressure detecting element 3 may also be detachably mounted in the mounting groove 113 by other detachable connection methods, such as a plug-fit, a screw connection, or a pin connection.
In one embodiment, as shown in fig. 1, the pressure detecting assembly 3 includes a pressure sensor 31 disposed in the mounting groove 113 and a data processing terminal module 32, and the data processing terminal module 32 is electrically connected to the pressure detecting assembly 3.
It will be appreciated that the pressure sensor 31 is mounted in the mounting groove 113 and is flush with the surface of the carrier plate 11. The pressure sensor 31 and the data processing terminal module 32 may be integrally formed, for example, by welding, and the pressure sensor 31 and the data processing terminal module 32 are welded together to form an integral structure, so that the volume of the pressure detecting assembly 3 can be reduced, and the installation is facilitated. Of course, the pressure sensor 31 and the data processing terminal module 32 may be separately disposed, and at this time, the pressure sensor 31 and the data processing terminal module 32 are electrically connected through a wire or a data line.
In this embodiment, the pressure sensor 31 is used for detecting the pressure of the air flow and converting the pressure signal into an electrical signal, the pressure sensor 31 transmits the signal to the data processing terminal module 32 through a conducting wire or a data line, and the terminal displays the pressure value after the signal is processed by the data processing terminal module 32.
In an embodiment, as shown in fig. 1, the pressure detection assembly 3 further includes a display device 33, and the display device 33 is electrically connected to the data processing terminal module 32.
It can be understood that, by setting the display device 33, the pressure value obtained by the terminal after being processed by the data processing terminal module 32 is displayed in real time by the display device 33 to form a real-time data curve, so as to facilitate tracing and provide a reference for subsequent cleaning. Alternatively, the display device 33 may be a display screen, a computer, a display, etc., and is not limited herein.
In an embodiment, as shown in fig. 1, fig. 2 and fig. 3, a baffle 112 is convexly disposed on the loading plate 11 around the notch of the loading slot 111, the semiconductor chip 12 includes a substrate 121 and a chip 122 disposed on the substrate 121, a periphery of the substrate 121 is in limit abutment with the baffle 112, and the chip 122 is exposed at the notch of the loading slot 111.
It can be understood that the baffle 112 structure is provided, so that the carrier board 11 realizes the limited installation of the semiconductor chip 12 through the baffle 112, and at the same time, the surface of the chip 122 is ensured to be flush with the surface of the carrier board 11.
In an embodiment, the cleaning structure 2 further comprises a blowing main pipe, the blowing pipe 21 comprises a plurality of blowing pipes, and the plurality of blowing pipes 21 are connected to the blowing main pipe at intervals.
It will be appreciated that by providing a main gas blowing pipe and a plurality of gas blowing pipes 21, the cleaning structure 2 is enabled to simultaneously clean a plurality of chips 122 of a column of semiconductor chips 12.
In this embodiment, the set air pressure of the main blowing pipe may be 4MPa to 6MPa, and the set air pressure of the first blowing pipe may be 0.2MPa to 0.3 MPa.
In one embodiment, the cleaning structure 2 further comprises a second blowing pipe having a second blowing opening, and the orientation of the second blowing opening is perpendicular to the carrying plate 11. It should be noted that, since the specific structures of the main blowing pipe and the cleaning structure 2 are not shown, examples and reference numerals of specific structures such as the blowing pipe, the main blowing pipe, and the second blowing pipe of the second blowing port are omitted, but it is obvious to those skilled in the art that the specific structural forms of these components are easily understood based on the written description.
In one embodiment, as shown in fig. 2, the blowing openings 22 are oriented at an angle of 30 ° to 60 ° with respect to the horizontal plane. It can be understood that, by arranging the orientation of the air blowing openings 22 to be inclined, the air blowing openings 22 can be facilitated to blow the surface of the chip 122, so that the foreign matters on the surface of the chip 122 can be blown off. Of course, the inclination angle of the blowing port 22 may be 30 ° to 60 °, and the range of the inclination angle may be appropriately adjusted according to actual needs. Optionally, the inclination angle of the puffer ports 22 is 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, 60 °.
In one embodiment, as shown in fig. 1 and 2, the cleaning structure 2 further comprises a collecting device 4, the collecting device 4 is located in the blowing direction of the blowing pipe 21, and the collecting device 4 is a vacuum cleaner.
It can be understood that, by providing the collecting device 4, the foreign matters blown off by the blowing pipe 21 are collected at the front end of the blowing pipe 21 by the collecting device 4, so as to prevent the foreign matters from being re-adsorbed on the surface of the chip 122.
In this embodiment, the cleaning structure 2 and the collecting device 4 of the chip dust removing device 100 are sequentially arranged, and the blowing direction of the blowing port 22 of the blowing pipe 21 in the cleaning structure 2 is inclined to the direction in which the cleaning structure 2 and the collecting device 4 are sequentially arranged, so that the foreign matters on the chip 122 after being blown by the blowing pipe 21 of the cleaning structure 2 are conveniently collected in the collecting device 4.
Since the chip dust removing apparatus 100 has the cleaning structure 2 and the collecting device 4 arranged in sequence, the substrate 121 (e.g., a printed circuit board PCB) provided with the chip 122 may be subjected to chip 122 purging, for example, the cleaning structure 2 and the collecting device 4 may be arranged below the chip 122, so that the blowing direction of the blowing pipe 21 in the cleaning structure 2 is at an oblique angle to the substrate 121, and the blowing direction corresponds to the chip 122; after the chip dust removing equipment 100 is started, the chip dust removing equipment can move towards the direction of the collecting device 4 from the cleaning structure 2 so as to blow the chip 122, the collecting device 4 can collect blown foreign matters at the front end of the air blowing pipe 21, the second air blowing pipe can ensure that the foreign matters do not fall down any more at the rear end of the air blowing pipe 21, a protection effect is formed, the chip dust removing equipment 100 can effectively remove dust from the chip 122, and the foreign matter reject ratio on the surface of the chip 122 is greatly reduced.
Alternatively, the collecting device 4 may be a vacuum cleaner or the like, and the cleaning structure 2 may comprise a blow pipe 21 having a blow opening 22, the blow opening 22 being oriented at an oblique angle to the direction in which the collecting device 4 and the cleaning structure 2 are arranged in sequence, the blow opening 22 being oriented in the direction in which the blow pipe 21 blows.
In this embodiment, the pressure sensor 31 is fixed in the mounting groove 113 of the bearing plate 11, so that the distance between the pressure sensor 31 and the blowing pipe 21 is consistent with the distance between the chip 122 and the blowing pipe 21, when the stroke of the blowing pipe 21 reaches the position of the pressure sensor 31 during each blowing, the pressure sensor 31 senses the blowing pressure signal and converts the pressure signal into an electric signal, the signal is transmitted to the data processing terminal module 32 through a data transmission line, the processed pressure value is displayed, and simultaneously the pressure value is transmitted to the display device 33 in real time, the display device 33 displays data in real time, a real-time data curve is formed, and data is acquired into the system, so as to be traced back.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A chip dust removal apparatus, comprising:
the bearing assembly comprises a bearing plate and a semiconductor chip, wherein the bearing plate is provided with bearing grooves and mounting grooves which are arranged at intervals, and the semiconductor chip is arranged in the bearing grooves;
the cleaning structure is arranged opposite to the bearing plate and comprises an air blowing pipe with an air blowing opening, and the air blowing opening faces the bearing groove; and
and the pressure detection assembly is arranged in the mounting groove.
2. The wafer dust removing apparatus according to claim 1, wherein a surface of the pressure detecting assembly facing the cleaning structure is on the same plane as a surface of the semiconductor wafer facing the cleaning structure.
3. The chip dust removing device according to claim 2, wherein the vertical distance between the surface of the semiconductor chip facing the cleaning structure and the air blowing port is h1, and the vertical distance between the surface of the pressure detection assembly facing the cleaning structure and the air blowing port is h 2;
h1 ═ h 2; and/or h1 is more than or equal to 1cm and less than or equal to 3cm, and h2 is more than or equal to 1cm and less than or equal to 3 cm.
4. The apparatus for removing dust from a chip according to claim 1, wherein one of the pressure detecting member and the wall of the mounting groove is provided with a snap, and the other is provided with a snap groove, and the pressure detecting member is detachably mounted in the mounting groove by the snap fit of the snap and the snap groove.
5. The chip dust removing apparatus of claim 1, wherein the pressure detecting assembly comprises a pressure sensor and a data processing terminal module disposed in the mounting groove, and the data processing terminal module is electrically connected to the pressure detecting assembly.
6. The chip dust removal apparatus of claim 5, wherein the pressure detection assembly further comprises a display device, the display device being electrically connected to the data processing terminal module.
7. The chip dust removing device according to any one of claims 1 to 6, wherein the carrier plate is provided with a baffle plate protruding around the notch of the carrier groove, the semiconductor chip comprises a substrate and a chip arranged on the substrate, the periphery of the substrate is in limit abutment with the baffle plate, and the chip is exposed at the notch of the carrier groove.
8. The chip dust removing device according to any one of claims 1 to 6, wherein the cleaning structure further comprises a main blowing pipe, the blowing pipe comprises a plurality of blowing pipes, and the plurality of blowing pipes are connected to the main blowing pipe at intervals.
9. The apparatus for removing dust from a chip as claimed in any one of claims 1 to 6, wherein said blowing openings are oriented at an angle of 30 ° to 60 ° with respect to the horizontal plane.
10. The chip dust removing apparatus of any one of claims 1 to 6, wherein the cleaning structure further comprises a collecting device, the collecting device is located in the blowing direction of the blowing pipe, and the collecting device is a dust collector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921931899.3U CN210995626U (en) | 2019-11-08 | 2019-11-08 | Chip dust removal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921931899.3U CN210995626U (en) | 2019-11-08 | 2019-11-08 | Chip dust removal equipment |
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| Publication Number | Publication Date |
|---|---|
| CN210995626U true CN210995626U (en) | 2020-07-14 |
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|---|---|---|---|
| CN201921931899.3U Active CN210995626U (en) | 2019-11-08 | 2019-11-08 | Chip dust removal equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112291692A (en) * | 2020-10-13 | 2021-01-29 | 皓骏科技(北京)有限公司 | Detection device |
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2019
- 2019-11-08 CN CN201921931899.3U patent/CN210995626U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112291692A (en) * | 2020-10-13 | 2021-01-29 | 皓骏科技(北京)有限公司 | Detection device |
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Effective date of registration: 20200806 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |