CN215314417U - Dust collector for needle measuring machine - Google Patents
Dust collector for needle measuring machine Download PDFInfo
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- CN215314417U CN215314417U CN202121752060.0U CN202121752060U CN215314417U CN 215314417 U CN215314417 U CN 215314417U CN 202121752060 U CN202121752060 U CN 202121752060U CN 215314417 U CN215314417 U CN 215314417U
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Abstract
The utility model discloses a dust removal device for a probe tester, which comprises an air inlet pipeline and an air exhaust cover, wherein an air outlet communicated with the inside of the probe tester is formed in the air inlet pipeline, air flow generated by an air inlet device externally connected with the air inlet pipeline is blown to the surface of a wafer in the probe tester through the air inlet pipeline and the air outlet so as to blow up particles on the surface of the wafer, the air exhaust cover is installed in a matching way with an interface ring of the probe tester, and the air exhaust device externally connected with the air exhaust cover exhausts the blown particles through the air exhaust cover. According to the dust removal device for the prober, disclosed by the utility model, the wafer is subjected to dust removal, so that the influence on later wafer testing caused by particles on the surface of the wafer is reduced, the appearance detection yield of the wafer is improved, and the practicability is high.
Description
Technical Field
The utility model belongs to the field of automatic dust removal, and particularly relates to a dust removal device for a needle measuring machine.
Background
As the pitch between the contacts of the wafer is gradually reduced, particles on the surface of the wafer may cause the contacts to generate abnormalities such as bridging, deformation, etc., which may affect the yield of the product, and may even cause probe card burning or damage to the circuit board of the testing machine, and in addition, the remaining of particles such as aluminum chips, etc., may affect the yield of the appearance inspection of the wafer. Therefore, a dust removing apparatus for removing particles on the surface of the wafer is urgently needed.
Therefore, in order to solve the above technical problems, it is necessary to provide a dust removing device for a Prober (Prober).
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a dust removing device for a prober, so as to remove dust on a surface of a wafer.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
the utility model provides a dust collector for needle measuring machine, dust collector includes inlet channel and exhaust hood, set up the gas outlet with the inside intercommunication of needle measuring machine on the inlet channel, the produced air current of the external inlet device of inlet channel warp the inlet channel with the gas outlet blows to the surface of wafer in the needle measuring machine is surveyed to the needle, in order to blow up the granule on wafer surface, exhaust hood with the interface ring cooperation installation of needle measuring machine, the external exhaust device of exhaust hood passes through the exhaust hood takes out and is blown up the granule.
In one embodiment, the bottom of the suction hood has a bearing portion, and the bearing portion is installed in a matching manner with the interface ring of the probe testing machine part.
In one embodiment, the air inlet pipeline is arranged on the interface ring of the probe testing machine in a bridging mode, and the air inlet pipeline is horizontally arranged on the side wall of the air extraction cover.
In one embodiment, the air exhaust cover comprises a cavity and a connecting pipe, the cavity is hollow and semicircular, the cavity is mounted on the table top of the probe measuring machine and is communicated with the inside of the probe measuring machine, one end of the connecting pipe is communicated with the inside of the cavity, and the other end of the connecting pipe is connected with the air exhaust device.
In one embodiment, the air inlet pipeline is uniformly provided with a plurality of air inlets, and the air inlets are connected with the air inlet device through an air pipe assembly.
In one embodiment, the air inlets are sequentially arranged on the air inlet pipeline along the horizontal direction, the air pipe assembly comprises a plurality of first air guide pipes corresponding to the air inlets and second air guide pipes connected with the first air guide pipes, one ends of the first air guide pipes are connected with the air inlets, the other ends of the first air guide pipes are connected with each other, and the first air guide pipes and the second air guide pipes are simultaneously connected.
In one embodiment, the trachea assembly further comprises a third airway tube, the second airway tube is provided with two airway tubes which are respectively connected with the first airway tube on the outermost side, one end of the third airway tube is simultaneously connected with the two airway tubes, and the other end of the third airway tube is connected with the air inlet device.
In one embodiment, the first air duct and the second air duct, and the second air duct and the third air duct are connected by a tee joint.
In one embodiment, the third air duct is provided with a pressure flow control valve and an air filter element.
Compared with the prior art, the utility model has the following advantages:
according to the dust removal device for the prober, disclosed by the utility model, the wafer is subjected to dust removal, so that the influence on later wafer testing caused by particles on the surface of the wafer is reduced, the appearance detection yield of the wafer is improved, and the practicability is high.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic front view of a dust removing device for a prober in an embodiment of the present invention;
FIG. 2 is a top view of a dust removing apparatus for a prober in an embodiment of the present invention;
fig. 3 is a perspective view of a dust removing device for a prober in an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
The present invention is further illustrated by the following specific examples.
Referring to fig. 1 and 2, a dust removing apparatus for a prober includes an air inlet duct 10 and an air exhaust cover 20, wherein the air inlet duct 10 is communicated with the interior of the prober 100. The bottom of the hood 20 has a support portion 20A, and the support portion 20A is installed in cooperation with a hollow interface ring 102 of the prober 100, so that the interior of the hood 20 is communicated with the prober 100. The inlet duct 10 is disposed across the interface ring 102 of the prober 100 in a straight line and the inlet duct 10 is horizontally mounted on the planar sidewall 2011 of the pump housing 20.
In this embodiment, the air inlet pipe 10 is externally connected to an air inlet device, and the air inlet device generally adopts an existing gas compressor in a factory building to provide compressed gas for the air inlet pipe 10. On the other hand, the air exhaust pipeline 10 can also be externally connected with an air exhaust device, and the air exhaust device generally adopts the existing vacuum exhaust device in a factory building. A movable stage 110 is arranged in the prober 100, the wafer 200 is placed on the stage 110, the air flow of the air inlet pipe 10 blows to the surface of the wafer 200 in the prober 100 to blow up particles on the surface of the wafer 200, the air exhaust device exhausts the blown-up particles through the air exhaust cover 20, the wafer 200 is driven by the stage 110 to move back and forth, and the cleaning effect on the surface of the wafer 200 can be improved.
In this embodiment, the air inlet pipe 10 is horizontally disposed, the air inlet pipe 10 is provided with an air outlet 11 communicated with the interior of the needle measuring machine 100, the air outlet 11 is uniformly provided with a plurality of air outlets and is sequentially arranged on the air inlet pipe 10 along the horizontal direction, and the air outlet 11 is vertically and downwardly arranged.
Referring to fig. 2 and 3, a plurality of air inlets 12 are uniformly formed on the air inlet duct 10, the air inlets 12 are sequentially arranged on the air inlet duct 10 along a horizontal direction, and the air inlets 12 are connected with the air inlet device through the air pipe assembly 1A.
Specifically, trachea subassembly 1A includes a plurality of first air ducts 21 corresponding with air inlet 12 and the second air duct 22 of being connected with first air duct 21, first air duct 21 one end is connected with air inlet 12, other end interconnect and be connected with second air duct 22 simultaneously, thereby through offering a plurality of air inlets 12 and correspondingly connecting many first air ducts 21 dispersed air current that can be even, prevent to damage wafer 200 owing to blow to the air current inequality on wafer 200 surface, also improve clean effect simultaneously.
Meanwhile, the gas pipe assembly 1A further includes a third gas-guide tube 23, the second gas-guide tubes 22 are provided with two gas-guide tubes and respectively connected with the first gas-guide tube 21 at the outermost side, one end of the third gas-guide tube 23 is simultaneously connected with the two second gas-guide tubes 22, the other end is connected with the gas inlet device, the two ends of the third gas-guide tube 23 are respectively connected with the second gas-guide tubes 22, and gas is simultaneously supplied from the second gas-guide tubes 22, so that the gas flow blown to the surface of the wafer 200 is further uniformly dispersed.
In this embodiment, the third air duct 23 is provided with a pressure flow control valve 31 and an air filter 32, the air blown to the surface of the wafer 200 is filtered by the air filter 32, and the flow rate of the air blown to the surface of the wafer 200 is monitored by the pressure flow control valve 31, and the flow rate is controlled to be 25 to 40 psi.
In this embodiment, the first air ducts 21 and the second air ducts 22, and the second air ducts 22 and the third air ducts 23 are all connected by the three-way joints 3.
Referring to fig. 2 in combination with fig. 1, the hood 20 includes a cavity 201 and a connecting pipe 202, the cavity 201 is in a hollow semicircular shape, the cavity 201 is installed on the top surface of the prober 100 and is communicated with the inside of the prober 100, one end of the connecting pipe 202 is communicated with the inside of the cavity 201, and the other end of the connecting pipe 202 is connected with an air extractor.
Further, the chamber 201 has a vertically disposed side wall 2011, the air inlet duct 10 is horizontally installed on the side wall 2011, the air inlet duct 10 is embedded and installed on the side wall 2011, and the air inlet duct 10 can also be horizontally installed on the table top of the prober 100.
In this embodiment, the air flow generated by the air inlet device passes through the third air duct 21 and the second air duct 22 and then is dispersed into each first air duct 21, and finally is blown to the surface of the wafer 200 through the air outlet 11 of the air inlet duct 10 to blow up the particles on the surface of the wafer 200, and the air extractor sucks the blown particles through the air extracting hood 20 to be discharged and collected.
According to the technical scheme, the utility model has the following beneficial effects:
according to the dust removal device for the prober, disclosed by the utility model, the wafer is subjected to dust removal, so that the influence on later wafer testing caused by particles on the surface of the wafer is reduced, the appearance detection yield of the wafer is improved, and the practicability is high.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The utility model provides a dust collector for needle measuring machine, its characterized in that, dust collector includes inlet manifold and exhaust hood, set up the gas outlet with the inside intercommunication of needle measuring machine on the inlet manifold, the produced air current of the external inlet unit of inlet manifold through the inlet manifold with the gas outlet blows to the surface of wafer in the needle measuring machine is surveyed to the needle, in order to blow up the granule on wafer surface, exhaust hood with the interface ring cooperation installation of needle measuring machine, the external air exhaust unit of exhaust hood passes through the exhaust hood takes out the granule that is blown up.
2. The dust collector for a prober according to claim 1, wherein the bottom of the suction hood has a bearing portion, and the bearing portion is fitted with the interface ring of the prober.
3. The dust collector for a prober according to claim 1, wherein the air inlet duct is provided across the interface ring of the prober and horizontally mounted on a side wall of the suction hood.
4. The dust removing device for the prober according to claim 1, wherein the suction hood comprises a cavity and a connecting pipe, the cavity is in a hollow semicircular shape, the cavity is mounted on the top surface of the prober and is communicated with the inside of the prober, one end of the connecting pipe is communicated with the inside of the cavity, and the other end of the connecting pipe is connected with the suction device.
5. The dust collector for a probing measuring machine according to claim 1, wherein said air inlet duct has a plurality of air inlets uniformly formed thereon, and said air inlets are connected to said air inlet device through an air pipe assembly.
6. The dust collector for a probing measuring machine according to claim 5, wherein said air inlets are arranged in sequence on said air inlet duct along a horizontal direction, said air duct assembly comprises a plurality of first air ducts corresponding to said air inlets and second air ducts connected to said first air ducts, one end of said first air duct is connected to said air inlets, the other end is connected to each other and to said second air ducts at the same time.
7. The dust removing device for the needle measuring machine according to claim 6, wherein the air tube assembly further comprises a third air tube, the second air tube is provided with two air tubes and is respectively connected with the first air tube at the outermost side, one end of the third air tube is simultaneously connected with the two second air tubes, and the other end of the third air tube is connected with the air inlet device.
8. The dust collector for a probing measuring machine according to claim 7, wherein said first air duct, said first air duct and said second air duct, and said second air duct and said third air duct are connected by a tee joint.
9. The dust removing device for the needle measuring machine according to claim 8, wherein the third air duct is provided with a pressure flow control valve and an air filter element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121752060.0U CN215314417U (en) | 2021-07-29 | 2021-07-29 | Dust collector for needle measuring machine |
| TW110209095U TWM618778U (en) | 2021-07-29 | 2021-08-02 | Dust removal device for needle testing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121752060.0U CN215314417U (en) | 2021-07-29 | 2021-07-29 | Dust collector for needle measuring machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215314417U true CN215314417U (en) | 2021-12-28 |
Family
ID=79574216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121752060.0U Active CN215314417U (en) | 2021-07-29 | 2021-07-29 | Dust collector for needle measuring machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN215314417U (en) |
| TW (1) | TWM618778U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116469827A (en) * | 2023-04-28 | 2023-07-21 | 东莞平晶微电子科技有限公司 | Detection device for wafer substrate crystal defect for TOLL packaging processing |
-
2021
- 2021-07-29 CN CN202121752060.0U patent/CN215314417U/en active Active
- 2021-08-02 TW TW110209095U patent/TWM618778U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116469827A (en) * | 2023-04-28 | 2023-07-21 | 东莞平晶微电子科技有限公司 | Detection device for wafer substrate crystal defect for TOLL packaging processing |
| CN116469827B (en) * | 2023-04-28 | 2023-10-10 | 东莞平晶微电子科技有限公司 | Detection device for wafer substrate crystal defect for TOLL packaging processing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM618778U (en) | 2021-10-21 |
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