CN210986563U - Multilayer composite circuit board for microwave high-frequency circuit - Google Patents
Multilayer composite circuit board for microwave high-frequency circuit Download PDFInfo
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- CN210986563U CN210986563U CN201921543066.XU CN201921543066U CN210986563U CN 210986563 U CN210986563 U CN 210986563U CN 201921543066 U CN201921543066 U CN 201921543066U CN 210986563 U CN210986563 U CN 210986563U
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Abstract
The utility model discloses a multilayer composite circuit board for microwave high-frequency circuit in the technical field of circuit board equipment, which comprises two circuit boards, an insulating device and a static removing device, wherein the two circuit boards are distributed in parallel, the bottom of the circuit board at the upper part is provided with a concave groove, the top of the circuit board at the lower part is provided with the concave groove, the insulating device is arranged between the two circuit boards, the front side wall and the rear side wall of the insulating device are respectively welded and fixed with two side edges, the inside of each side edge is provided with a bolt, and the side edges are matched and connected with the concave grooves through the bolts; this a setting for microwave high frequency circuit's multilayer composite circuit board, structural design is reasonable, installs static-removing device between two adjacent circuit boards, and the static that the circuit board produced when circular telegram work is absorbed the back by the sheetmetal and is transmitted the ground wire to the normal use of static influence circuit board that has produced between two circuit boards and the insulator arrangement has been avoided.
Description
Technical Field
The utility model relates to a circuit board equipment technical field specifically is a multilayer composite circuit board for microwave high frequency circuit.
Background
With the continuous progress of electronic design and manufacturing process, electronic products are also gradually developing towards high functionality, high density and high transmission rate. Meanwhile, due to rapid development of chip miniaturization and increase of data transmission quantity, the working frequency of the system is higher and higher. The existing composite circuit board has a serious problem that static electricity can be generated between every two layers of circuit boards when the composite circuit board is used, and the normal work of the circuit boards can be influenced by the long-time existence of the static electricity.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer composite circuit board for microwave high frequency circuit to the composite circuit board who proposes in solving above-mentioned background art can produce static when using between every layer circuit board, and the long-time existence of static can lead to the fact the problem of influence to the normal work of circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: a multilayer composite circuit board for a microwave high-frequency circuit comprises two circuit boards, an insulating device and a static removing device, wherein the two circuit boards are distributed in parallel, a concave groove is formed in the bottom of the circuit board at the upper part, the concave groove is formed in the top of the circuit board at the lower part, the insulating device is arranged between the two circuit boards, two side edges are respectively fixedly welded on the front side wall and the rear side wall of the insulating device, bolts are arranged inside the side edges, the side edges are matched and connected with the concave grooves through the bolts, the insulating device comprises a vertical plate and a transverse plate, the transverse plate penetrates through the vertical plate, the static removing device is arranged inside the insulating device, the static removing device comprises two metal sheets which are distributed in parallel, and the two metal sheets are distributed on the upper part and the lower part of the transverse plate, the two metal sheets are communicated through a lead, and the lead is communicated with a ground wire.
Preferably, the number of the vertical plates is five, the five vertical plates are distributed in parallel, through holes are formed in the vertical plates, and the transverse plates are embedded in the through holes.
Preferably, the upright columns are welded at the bottoms of the upper metal sheets, the upright columns are welded at the tops of the lower metal sheets, and the metal sheets are connected with the transverse plates through the upright columns.
Preferably, two screw holes are formed in the inner part of the side edge, and the bolt is connected with the side edge through the screw holes.
Compared with the prior art, the beneficial effects of the utility model are that: this a setting for microwave high frequency circuit's multilayer composite circuit board, structural design is reasonable, installs static-removing device between two adjacent circuit boards, and the static that the circuit board produced when circular telegram work is absorbed the back by the sheetmetal and is transmitted the ground wire to the normal use of static influence circuit board that has produced between two circuit boards and the insulator arrangement has been avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a right side schematic view of the present invention;
fig. 3 is a schematic structural view of the static electricity removing device of the present invention.
In the figure: the electrostatic precipitator comprises a circuit board 100, a concave groove 110, an insulating device 200, a side edge 210, a bolt 211, a vertical plate 220, a horizontal plate 230, an electrostatic precipitator 300, a metal sheet 310 and a vertical column 311.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a multilayer composite circuit board for microwave high frequency circuit for the static that produces the circuit board circular telegram during operation is absorbed the back by the sheetmetal and is transmitted for the ground wire, thereby has avoided the static that produces between two circuit boards and the insulator arrangement to influence the normal use of circuit board, please refer to fig. 1-3, including two circuit boards 100, insulator arrangement 200 and static-removing device 300.
Referring to fig. 1-2, two circuit boards 100 are arranged in parallel, a concave groove 110 is formed at the bottom of the upper circuit board 100, a concave groove 110 is formed at the top of the lower circuit board 100, the circuit board 100 is used for controlling the operation of the device, and the concave groove 110 is used for installing and fixing the insulating device 200.
Referring to fig. 1-2, the insulating device 200 is installed between the two circuit boards 100, the front side wall and the rear side wall of the insulating device 200 are respectively fixed with two side edges 210 in a melting manner, the side edges 210 are internally installed with bolts 211, the side edges 210 are connected with the concave grooves 110 in a matching manner through the bolts 211, the insulating device 200 includes a vertical plate 220 and a horizontal plate 230, the horizontal plate 230 penetrates through the vertical plate 220, and the insulating device 200 is used for separating the two circuit boards 100 to prevent short circuit due to direct contact.
Referring to fig. 1-3 again, the static eliminator 300 is installed inside the insulation device 200, the static eliminator 300 includes two metal sheets 310, the two metal sheets 310 are distributed in parallel, the two metal sheets 310 are distributed on the upper portion and the lower portion of the horizontal plate 230, the two metal sheets 310 are communicated through a conducting wire, the conducting wire is communicated with a ground wire, the circuit board 300 is used for absorbing static electricity generated between the circuit board 100 and the insulation device 200 and transmitting the static electricity to the ground wire through the conducting wire, so as to prevent the static electricity from affecting the normal use of the circuit board 100.
Referring to fig. 2 again, in order to generate a channel inside the insulating device 200, the number of the vertical plates 220 is five, the five vertical plates 220 are distributed in parallel, through holes are formed inside the vertical plates 220, the horizontal plate 230 is embedded in the through holes, and the five vertical plates 220 are distributed at equal intervals to facilitate the flow of the air flow.
Referring to fig. 2-3 again, in order to improve the stability of the connection between the static electricity removing device 300 and the insulating device 200, the bottom of the upper metal sheet 310 is welded with a vertical post 311, the top of the lower metal sheet 310 is welded with a vertical post 311, the metal sheet 310 is connected with the transverse plate 230 through the vertical post 311, and the vertical post 311 is used for fixing the position of the metal sheet 310, so that the metal sheet 310 can absorb static electricity.
Referring to fig. 1-2, in order to improve the stability of the connection between the insulating device 200 and the circuit board 100, two screw holes are formed inside the side 210, and the bolt 211 is connected to the side 210 through the screw holes.
The number of the bolts 211, the vertical plate 220, and the columns 311 is not limited to the specific number described in the embodiment, and those skilled in the art can increase or decrease the number as needed on the premise that the device can perform the static electricity removing function.
The working principle is as follows: after the two circuit boards 100 are communicated with the circuit, the circuit boards 100 work normally, because the insulation device 200 is positioned in the middle of the two circuit boards 100, the vertical plate 220 and the horizontal plate 230 in the insulation device 200 isolate the two circuit boards 100, because the insulation device 200 has good insulation, static electricity can be generated between the circuit boards 100 and the insulation device 200, the generated static electricity is absorbed by the insulating device 310 and then is transmitted to the ground wire through a conducting wire, the effect of eliminating the static electricity is achieved, and the accumulation of the static electricity is prevented from influencing the normal use of the circuit boards 100.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (4)
1. A multilayer composite circuit board for a microwave high-frequency circuit, characterized in that: the anti-static circuit board comprises two circuit boards (100), an insulating device (200) and a static electricity removing device (300), wherein the two circuit boards (100) are distributed in parallel, a concave groove (110) is formed in the bottom of the circuit board (100) at the upper part of the circuit board, the concave groove (110) is formed in the top of the circuit board (100) at the lower part of the circuit board, the insulating device (200) is arranged between the two circuit boards (100), two side edges (210) are respectively welded and fixed on the front side wall and the rear side wall of the insulating device (200), a bolt (211) is arranged inside each side edge (210), each side edge (210) is matched and connected with the concave groove (110) through the bolt (211), the insulating device (200) comprises a vertical plate (220) and a horizontal plate (230), the horizontal plate (230) penetrates through the vertical plate (220), and the static electricity removing device (300) is arranged inside the insulating, the static electricity removing device (300) comprises two metal sheets (310), wherein the two metal sheets (310) are distributed in parallel, the two metal sheets (310) are distributed at the upper part and the lower part of the transverse plate (230), the two metal sheets (310) are communicated through a conducting wire, and the conducting wire is communicated with a ground wire.
2. A multilayer composite circuit board for a microwave high-frequency circuit according to claim 1, characterized in that: the number of the vertical plates (220) is five, the five vertical plates (220) are distributed in parallel, through holes are formed in the vertical plates (220), and the transverse plates (230) are embedded in the through holes.
3. A multilayer composite circuit board for a microwave high-frequency circuit according to claim 1, characterized in that: the bottom of the upper metal sheet (310) is welded with a stand column (311), the top of the lower metal sheet (310) is welded with the stand column (311), and the metal sheet (310) is connected with the transverse plate (230) through the stand column (311).
4. A multilayer composite circuit board for a microwave high-frequency circuit according to claim 1, characterized in that: two screw holes are formed in the inner portion of the side edge (210), and the bolt (211) is connected with the side edge (210) through the screw holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921543066.XU CN210986563U (en) | 2019-09-17 | 2019-09-17 | Multilayer composite circuit board for microwave high-frequency circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921543066.XU CN210986563U (en) | 2019-09-17 | 2019-09-17 | Multilayer composite circuit board for microwave high-frequency circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986563U true CN210986563U (en) | 2020-07-10 |
Family
ID=71416234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921543066.XU Active CN210986563U (en) | 2019-09-17 | 2019-09-17 | Multilayer composite circuit board for microwave high-frequency circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986563U (en) |
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2019
- 2019-09-17 CN CN201921543066.XU patent/CN210986563U/en active Active
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