CN210985179U

CN210985179U - Athermal resonant cavity structure capable of being adjusted in two directions

Info

Publication number: CN210985179U
Application number: CN201921970587.3U
Authority: CN
Inventors: 黄晓婧; 张玉成; 李小明; 李阳阳; 任方宇
Original assignee: Luoyang Institute of Electro Optical Equipment AVIC
Current assignee: Luoyang Institute of Electro Optical Equipment AVIC
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2020-07-10
Anticipated expiration: 2029-11-15

Abstract

The utility model provides a can two-way dress transfer do not have thermalization resonant cavity configuration, the laser instrument casing is two-way cavity structures, the lath laser rod welds on the lath is heat sink through the welding mode, the lath is heat sink and is located lath laser rod top, lath radiating fin dispels the heat to the lath laser rod, semiconductor array is located lath laser rod below, the array is heat sink and is located semiconductor array below, the TEC is located between the array is heat sink, the array is heat sink the heat insulating mattress and is located between isolated array is heat sink and the laser instrument casing. The utility model discloses a laser instrument casing no longer is as the radiating medium of lath laser rod, and lath laser rod's heat directly dispels the heat through the radiating fin who installs at the lath heat sink another side, and the array that has significantly reduced and the laser rod influence to other optical devices that generate heat, laser instrument casing change two-way cavity structures into from unilateral cavity structure, and lath laser rod changes two-way installation into, need not to dismantle the array part, and real-time installation and debugging are carried out to the lath, have increaseed installation and debugging efficiency greatly.

Description

Athermal resonant cavity structure capable of being adjusted in two directions

Technical Field

The invention relates to the field of laser, in particular to a pair of resonant cavity configurations.

Background

With the development trend of miniaturization and light weight of small laser lighting/distance measuring products, the thermal design and the installation and adjustment design of the laser increasingly become bottlenecks which restrict the performance of the products. At present, an air-cooled slab laser adopting semiconductor pumping is the main configuration of a small laser, but with the increase of energy requirements and the reduction of weight and volume, the performance of the air-cooled slab laser can not meet the use requirements gradually, and the main problems are concentrated on the following points:

1) the laser has poor design and adjustment performance, and the adjustment period of a single set of laser is too long.

2) The laser has poor thermal stability and low reliability, and can not meet the index requirements.

A conventional resonant cavity configuration is shown in fig. 1 and 2, a laser housing (1) is a cavity structure, all optical elements are installed in the cavity from the top, and are sealed by an array of heat dissipation fins (2). This configuration has the following disadvantages:

1) the core working substance unidirectional slab laser rod (7) of the laser is arranged right below the unidirectional semiconductor array (5), and the position of the unidirectional slab laser rod (7) cannot be dynamically finely adjusted when the laser works. When the position of the unidirectional lath laser rod (7) needs to be adjusted in the assembling and adjusting process, the unidirectional array radiating fin (2), the unidirectional TEC (3) and the unidirectional semiconductor array (5) need to be disassembled, the assembling and adjusting process of the laser is complicated due to repeated assembling and disassembling, the assembling and adjusting difficulty is high, the period is long, and the array is extremely easy to damage in the assembling and disassembling process.

2) The unidirectional slab heat sink (8) of the slab laser bar is in direct contact with the unidirectional laser shell (1), and the heat of the unidirectional slab heat sink is conducted to the shell through the heat sink and then dissipated to the outside through the shell. The shell is heated to cause the deformation of the mounting position of the unidirectional slab laser rod (7), the mounting precision of the slab laser rod is influenced, and the performance of a laser is reduced in severe cases.

Disclosure of Invention

To overcome the deficiencies of the prior art, the present invention provides a bidirectionally adjustable athermalized resonator configuration.

The technical scheme adopted by the invention for solving the technical problems is as follows:

a bidirectionally-adjustable athermalized resonant cavity structure comprises a laser shell, a slab heat sink heat insulation pad, a slab heat dissipation fin, a slab heat sink, a slab laser rod, an array heat sink heat insulation pad, an array heat sink, a TEC, a semiconductor array, an array heat dissipation fin, an array heat dissipation fan and a slab heat dissipation fan;

the laser shell (9) is of a bidirectional cavity structure, is an installation base of all optics and structural parts, fixes the slab heat dissipation fins (11) and the array heat dissipation fins (18), the slab heat dissipation fins (11) and the array heat dissipation fins (18) are positioned at two openings of the cavity of the laser shell (9), the slab laser rod (13) is welded on the slab heat sink (12) in a welding mode, the slab heat sink (12) is positioned above the slab laser rod (13), the slab heat dissipation fins (11) dissipate heat of the slab laser rod (13), the slab laser rod (13) transmits heat to the slab heat dissipation fins (11) through the slab heat sink (12), the heat is dissipated out through the slab heat dissipation fins (11), the slab heat sink heat insulation pad (10) is positioned between the slab heat dissipation fins (11) and the laser shell (9), and the semiconductor array (17) generates spectral radiation, the heat dissipation structure is positioned below the slab laser rod (13), the array heat sink (15) is positioned below the semiconductor array (17), the array heat sink (15) is a heat conduction structure of the semiconductor array (17), the heat dissipation fins of the array heat sink (15) dissipate heat of the semiconductor array (17), the semiconductor array (17) conducts heat to the heat dissipation fins of the array heat sink (15) through the array heat sink (15), the heat is dissipated through the heat dissipation fins of the array heat sink (15), the TEC (16) is positioned between the array heat sink (15), the TEC (16) controls the temperature of the array heat sink (15), the array heat sink heat insulation pad (14) is positioned between the isolation array heat sink (15) and the laser shell (9), and the heat conduction between the array heat sink (15) and the laser shell (9) is isolated; array radiating fin (18) are located array heat sink (15) below, array radiating fan (19) are located array radiating fin (18), lath radiating fan (20) are adorned on laser casing (9), array radiating fan (19) dispel the heat to array radiating fin (18), array radiating fan (19) are opened to high temperature during operation, blow away the heat on array radiating fin (18), lath radiating fan (20) dispel the heat to lath radiating fin (11), the fan is opened to high temperature during operation, blow away the heat on lath radiating fin (11).

The invention has the beneficial effects that:

1. athermalization design of laser housing

The laser shell is only used as a mounting base of the resonant cavity element and is not used as a heat dissipation medium of the slab laser rod, heat of the slab laser rod is directly dissipated through the heat dissipation fins arranged on the other surface of the slab heat sink, and meanwhile, heat insulation materials are added between the array heat sink and the shell, so that the influence of heating of the array and the laser rod on other optical devices is greatly reduced.

2. On-line adjustable design of lath laser bar

The laser shell is changed into a bidirectional cavity structure from a single-side cavity structure, the installation mode of the slab laser rod and the array is changed into bidirectional installation from equidirectional installation, wherein the slab laser rod is fixed on the laser shell from the upper part through the slab heat sink, and the semiconductor array is fixed on the laser shell from the lower part through the array heat sink. Therefore, the array component does not need to be disassembled when the laser rod is adjusted, the plate can be installed and adjusted in real time when the laser works, and the installing and adjusting efficiency is greatly improved.

Drawings

FIG. 1 is a schematic diagram of a conventional laser resonator configuration cut away.

Fig. 2 is a schematic three-dimensional appearance of a conventional laser resonator configuration.

FIG. 3 is a sectional view of the resonant cavity of the bi-directionally tunable laser of the present invention.

Fig. 4 is a schematic three-dimensional appearance diagram of a resonant cavity configuration of a bi-directionally tunable laser according to the present invention, fig. 4(a) is a schematic diagram of an array heat dissipation fin and an array heat dissipation fan, and fig. 4(b) is a schematic diagram of a laser housing and an array heat dissipation fin.

1-one-way laser shell; 2-unidirectional array radiating fins; 3-unidirectional TEC; 4-unidirectional array heat sink; 5-unidirectional semiconductor array; 6-one-way fan; 7-unidirectional slab laser bar; 8-one-way slab heat sink, 9-laser shell, 10-slab heat sink heat insulation pad, 11-slab heat dissipation fin, 12-slab heat sink, 13-slab laser rod, 14-array heat sink heat insulation pad, 15-array heat sink, 16-TEC, 17-semiconductor array, 18-array heat dissipation fin, 19-array heat dissipation fan and 20-slab heat dissipation fan.

Detailed Description

The invention is further illustrated with reference to the following figures and examples.

As shown in fig. 3 and 4, the laser housing is changed from a single-side cavity structure to a bidirectional cavity structure, and the installation mode of the slab laser bar and the array is changed from the same-direction installation to the bidirectional installation, wherein the slab laser bar is fixed on the laser housing from the upper part through the slab heat sink, and the semiconductor array is fixed on the laser housing from the lower part through the array heat sink. Therefore, the array component does not need to be disassembled when the laser rod is adjusted, the plate can be installed and adjusted in real time when the laser works, and the installing and adjusting efficiency is greatly improved.

the laser shell (9) is of a bidirectional cavity structure, is an installation base of all optics and structural parts and is used for fixing the slab heat dissipation fins (11) and the array heat dissipation fins (18), the slab heat dissipation fins (11) and the array heat dissipation fins (18) are positioned at two openings of the cavity of the laser shell (9), the slab laser rod (13) is an optical device and is welded on the slab heat sink (12) in a welding mode, the slab heat sink (12) is made of tungsten-copper alloy and is positioned above the slab laser rod (13), the linear expansion coefficient of the slab laser rod is closer to that of the slab laser rod (13), the slab laser rod (13) has higher heat conductivity and is a heat conduction structure of the slab laser rod (13), the slab heat dissipation fins (11) dissipate heat of the slab laser rod (13), the slab laser rod (13) conducts the heat to the slab heat dissipation fins (11) through the slab heat sink (12), and then dissipates the heat through the slab heat dissipation fins (11), the slab heat sink heat insulation pad (10) is made of a non-metal material and is positioned between the slab heat dissipation fins (11) and the laser shell (9) to isolate heat conduction between the slab heat dissipation fins (11) and the laser shell (9), so that the influence of the heat of the slab laser rod (13) on other optical devices is reduced; the semiconductor array (17) generates spectral radiation and is positioned below the slab laser bar (13), the array heat sink (15) is positioned below the semiconductor array (17), the array heat sink (15) is made of high-conductivity pure copper material and has higher heat conductivity and is a heat conduction structure of the semiconductor array (17), the heat dissipation fins of the array heat sink (15) dissipate heat of the semiconductor array (17), the semiconductor array (17) conducts the heat to the heat dissipation fins of the array heat sink (15) through the array heat sink (15) and then dissipates the heat through the heat dissipation fins of the array heat sink (15), the TEC (16) is positioned between the array heat sinks (15), the TEC (16) controls the temperature of the array heat sink (15), the array heat sink heat insulation pad (14) is made of non-metal material and is positioned between the array heat sink (15) and the laser shell (9), and the heat conduction between the array heat sink (15) and the laser shell (9) is isolated, reducing the effect of heat from the semiconductor array (17) on other optical devices; the array radiating fin (18) is located below the array heat sink (15), the array radiating fan (19) is located on the array radiating fin (18), as shown in fig. 4(b), the slat radiating fan (20) is installed on the laser shell (9), as shown in fig. 4(a), the array radiating fan (19) radiates the array radiating fin (18), the array radiating fan (19) is started during high-temperature work, heat on the array radiating fin (18) is blown away, the slat radiating fan (20) radiates the slat radiating fin (11), and the fan is started during high-temperature work, so that heat on the slat radiating fin (11) is blown away.

When the bidirectionally-adjustable athermalized resonant cavity is mounted, the slab laser bar (13) is welded on the slab heat sink (12), and the slab heat sink (12) is mounted on the slab heat dissipation fins (11); the method comprises the following steps that (1) a batten heat dissipation fin (11) is installed on a laser shell (9), and a batten heat sink heat insulation pad (14) is arranged on a middle pad to insulate heat between the batten heat dissipation fin (11) and the laser shell (9); mounting a semiconductor array (17) on an array heat sink (15), mounting the array heat sink (15) on the laser housing (9), and insulating heat between the array heat sink (15) and the laser housing (9) by an array heat sink heat insulation pad (14) on an intermediate pad; mounting heat dissipation fins of an array heat sink (15) on a laser shell (9), and padding a TEC (16) on a middle pad; mounting an array radiator fan (19) on the array radiator fins (18); a slat radiator fan (20) is mounted on the laser housing (9).

Claims

1. A athermalized resonant cavity configuration that is capable of being adjusted in two directions, comprising:

the laser heat dissipation device comprises a laser shell (9), a slab heat sink heat insulation pad (10), a slab heat dissipation fin (11), a slab heat sink (12), a slab laser rod (13), an array heat sink heat insulation pad (14), an array heat sink (15), a TEC (16), a semiconductor array (17), an array heat dissipation fin (18), an array heat dissipation fan (19) and a slab heat dissipation fan (20);