CN210958944U

CN210958944U - But reuse's high heat dissipating's PCB circuit board

Info

Publication number: CN210958944U
Application number: CN201921934972.2U
Authority: CN
Inventors: 何延权; 辛小娟
Original assignee: Guangzhou Mankun Electronic Co ltd
Current assignee: Guangzhou Mankun Electronic Co ltd
Priority date: 2019-11-11
Filing date: 2019-11-11
Publication date: 2020-07-07
Anticipated expiration: 2029-11-11

Abstract

The utility model discloses a but recycle's high heat dissipating's PCB circuit board, including PCB circuit board, fixed plate, circuit board fixed slot piece, screw, buffer layer, waterproof layer, heat-conducting layer, heat dissipation stick and shock attenuation self-resuming device, the both ends of PCB circuit board are located to the circuit board fixed slot piece, the fixed plate is located on the side that PCB circuit board was kept away from to the circuit board fixed slot piece, the screw is located on the fixed plate, on the PCB circuit board was located to the heat-conducting layer, on the heat-conducting layer was located to the waterproof layer, in the heat-conducting layer was located to heat dissipation stick one end, the other end ran through the waterproof layer and locates the waterproof layer outside, the buffer layer is located between circuit board fixed slot piece and the PCB circuit board, in. The utility model belongs to the technical field of the PCB circuit board, specifically indicate the PCB circuit board of recoverable high heat dissipating that has good shock resistance.

Description

But reuse's high heat dissipating's PCB circuit board

Technical Field

The utility model belongs to the technical field of the PCB circuit board, specifically indicate a but recycle's high heat dissipating's PCB circuit board.

Background

The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The printed board is developed from a single layer to double-sided, multi-layer and flexible, and still keeps respective development trend, as the printed board is continuously developed towards high precision, high density and high reliability, the size is continuously reduced, the cost is reduced and the performance is improved, so that the printed board still keeps strong vitality in the development engineering of future electronic equipment, but still has some problems, the heat dissipation problem of the printed board is still not solved when the printed board is developed to the present, and the influence of a scrapped circuit board on the environment is increasingly greater along with the mass use of the printed board.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a but has the high thermal diffusivity's of recycle PCB circuit board of good shock resistance.

In order to realize the above functions, the utility model discloses the technical scheme who takes as follows: a PCB circuit board with high heat dissipation performance and capable of being recycled comprises a PCB circuit board, a fixing plate, circuit board fixing groove blocks, screws, a buffer layer, a waterproof layer, a heat conduction layer, a heat dissipation rod and a damping self-recovery device, wherein the circuit board fixing groove blocks are arranged at two ends of the PCB circuit board, the fixing plate is arranged on the side surface, away from the PCB circuit board, of the circuit board fixing groove blocks, the screws are arranged on the fixing plate, the heat conduction layer is arranged on the PCB circuit board, the waterproof layer is arranged on the heat conduction layer, one end of the heat dissipation rod is arranged in the heat conduction layer, the other end of the heat dissipation rod penetrates through the waterproof layer and is arranged on the outer side of the waterproof layer, the buffer layer is arranged between the circuit board fixing groove blocks and the PCB circuit board, one end of the, the shock attenuation resumes the storehouse and locates on vibration damping mount, support column one end is located in the shock attenuation resumes the storehouse, and the other end is located outside the shock attenuation resumes the storehouse, damping spring locates support column and shock attenuation and resumes between the storehouse inner wall.

Furthermore, a thread groove capable of fitting with the thread of the screw is formed in the fixing plate.

Further, the support column recovers the storehouse with the shock attenuation and contacts the department and be equipped with the recess, the shock attenuation recovers the storehouse and locates in the recess with the both ends of support column contact.

Furthermore, a cylinder is arranged in the damping spring.

Further, the PCB circuit board is made of natural shellac.

Further, the buffer layer is high resilience silica gel sponge buffer layer.

The utility model adopts the above structure to gain beneficial effect as follows: the utility model provides a pair of but recycle's PCB circuit board of high heat dissipating nature easy operation, the mechanism is compact, and reasonable in design, through covering heat-conducting layer and heat dissipation stick on the PCB circuit board, can concentrate the heat that PCB circuit board work produced to the heat-conducting layer and disperse to the air from the heat dissipation stick again, the influence of high temperature to various components on the PCB circuit board has been reduced, through setting up buffer layer and shock attenuation self-resuming device greatly increased the anti-vibration's of PCB circuit board ability, the spoilage of PCB circuit board has been reduced, for the enterprise has increased the income, the PCB circuit board adopts natural shellac to support. The PCB can be recycled, and sound of the environment is reduced.

Drawings

Fig. 1 is an overall structure diagram of a recyclable PCB circuit board with high heat dissipation performance;

fig. 2 is a structural diagram of a position a of the recyclable PCB circuit board with high heat dissipation.

The damping recovery device comprises a PCB (printed circuit board), 2, a fixing plate, 3, a circuit board fixing groove block, 4, screws, 5, a buffer layer, 6, a waterproof layer, 7, a heat conduction layer, 8, a heat dissipation rod, 9, a damping self-recovery device, 10, a support column, 11, a damping base, 12, a damping spring, 13 and a damping recovery bin.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to the following embodiments, and the technical features or the connection relations of the present invention, which are not described in detail, are the prior art adopted.

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1-2, the present invention relates to a recyclable PCB with high heat dissipation, comprising a PCB 1, a fixing plate 2, a circuit board fixing groove 3, a screw 4, a buffer layer 5, a waterproof layer 6, a heat conduction layer 7, a heat dissipation rod 8 and a damping self-recovery device 9, wherein the circuit board fixing groove 3 is disposed at both ends of the PCB 1, the fixing plate 2 is disposed at a side of the circuit board fixing groove 3 away from the PCB 1, the screw 4 is disposed on the fixing plate 2, the heat conduction layer 7 is disposed on the PCB 1, the waterproof layer 6 is disposed on the heat conduction layer 7, one end of the heat dissipation rod 8 is disposed in the heat conduction layer 7, the other end of the heat dissipation rod 8 penetrates through the waterproof layer 6 and is disposed at an outer side of the waterproof layer 6, the buffer layer 5 is disposed between the circuit board fixing groove 3 and the PCB 1, one end of the damping self, the shock attenuation is located in buffer layer 5 from recovery device 9 other end, shock attenuation is from recovery device 9 includes that support column 10, vibration damping mount 11, damping spring 12 and shock attenuation resume storehouse 13, shock attenuation resumes storehouse 13 and locates on vibration damping mount 11, support column 10 one end is located in shock attenuation resumes storehouse 13, the support column 10 other end is located outside shock attenuation resumes storehouse 13, damping spring 12 locates between support column 10 and the shock attenuation resumes 13 inner walls in storehouse.

And a thread groove matched with the thread of the screw 4 is arranged on the fixing plate 2.

The support column 10 resumes storehouse 13 contact department end with the shock attenuation and is equipped with the recess, the shock attenuation resumes the both ends of storehouse 13 and support column 10 contact and locates in the recess.

A cylinder is arranged in the damping spring 12.

The PCB 1 is made of natural shellac and comprises a PCB 1.

The buffer layer 5 is a silica gel sponge buffer layer 5.

During the specific use, with 1 both ends parcel of PCB circuit board buffer layer 5, then put into shock attenuation self recovery device 9 on the buffer layer 5 upper groove again, with shock attenuation self recovery device 9 along the spout on the fixed channel block 3 of circuit board and slide in, fix on 1 both ends of PCB circuit board on the fixed channel block 3 of circuit board, through the screw hole on fixed plate 2, fix PCB circuit board 1 in suitable place.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. The utility model provides a but PCB circuit board of recycle's high heat dissipating which characterized in that: the damping self-recovery device comprises a PCB circuit board, a fixing plate, a circuit board fixing groove block, a screw, a buffer layer, a waterproof layer, a heat conduction layer, a heat dissipation rod and a damping self-recovery device, wherein the circuit board fixing groove block is arranged at two ends of the PCB circuit board, the fixing plate is arranged on the side surface of the circuit board fixing groove block away from the PCB circuit board, the screw is arranged on the fixing plate, the heat conduction layer is arranged on the PCB circuit board, the waterproof layer is arranged on the heat conduction layer, one end of the heat dissipation rod is arranged in the heat conduction layer, the other end of the heat dissipation rod penetrates through the waterproof layer and is arranged on the outer side of the waterproof layer, the buffer layer is arranged between the circuit board fixing groove block and the PCB circuit board, one end of the damping self-recovery device is arranged in the circuit board fixing groove block, support column one end is located the shock attenuation and is resumeed in the storehouse, the shock attenuation is resumeed outside the storehouse is located to the support column other end, damping spring locates support column and shock attenuation and resumees between the storehouse inner wall.

2. The recyclable PCB of high heat dissipation property of claim 1, wherein: and a thread groove matched with the screw thread is arranged on the fixing plate.

3. The recyclable PCB of high heat dissipation property of claim 1, wherein: the contact end of the supporting column and the shock absorption recovery bin is provided with a groove, and two ends of the shock absorption recovery bin, which are in contact with the supporting column, are arranged in the groove.

4. The recyclable PCB of high heat dissipation property of claim 1, wherein: and a cylinder is arranged in the damping spring.

5. The recyclable PCB of high heat dissipation property of claim 1, wherein: the PCB circuit board is made of natural shellac.

6. The recyclable PCB of high heat dissipation property of claim 1, wherein: the buffer layer is silica gel sponge buffer layer.