CN210958667U - Power amplifier board with heat dissipation function - Google Patents

Power amplifier board with heat dissipation function Download PDF

Info

Publication number
CN210958667U
CN210958667U CN201921890721.9U CN201921890721U CN210958667U CN 210958667 U CN210958667 U CN 210958667U CN 201921890721 U CN201921890721 U CN 201921890721U CN 210958667 U CN210958667 U CN 210958667U
Authority
CN
China
Prior art keywords
power amplifier
amplifier board
heat dissipation
main part
board main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921890721.9U
Other languages
Chinese (zh)
Inventor
郑海亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Liszao Audio Co ltd
Original Assignee
Guangzhou Liszao Audio Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Liszao Audio Co ltd filed Critical Guangzhou Liszao Audio Co ltd
Priority to CN201921890721.9U priority Critical patent/CN210958667U/en
Application granted granted Critical
Publication of CN210958667U publication Critical patent/CN210958667U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Amplifiers (AREA)

Abstract

The utility model discloses a power amplifier board with heat dissipation function belongs to the power amplifier board that uses in the audio amplifier, including power amplifier board main part and radiator unit, radiator unit including supporting curb plate, fixed plate and heat dissipation mechanism, support curb plate symmetry fixed mounting on the surface of power amplifier board main part, and support fixed mounting between the curb plate has the fixed plate, fixed plate surface evenly distributed has the through-hole, the fixed plate side keep away from one side on power amplifier board surface and install heat dissipation mechanism. This power amplifier board radiating efficiency is high, has avoided the problem of the long-time high use temperature of power amplifier board to take place.

Description

Power amplifier board with heat dissipation function
Technical Field
The utility model belongs to a power amplifier board that uses in the audio amplifier, specifically speaking relates to a power amplifier board with heat dissipation function.
Background
The power amplifier board is an electronic control power amplifier board which is used for being installed in sound equipment and is commonly used in the sound equipment; the power amplifier board is a core component of components in the sound box, and mainly has the main function of controlling the work of each component in the sound box;
along with the continuous progress of the technique of china, the research and development technique of power amplifier board has obtained improving well to a certain extent, can be convenient for the power amplifier board to operate, but current power amplifier board still has certain not enough, because the power amplifier board is installed inside the audio amplifier, audio amplifier power is great, consequently, current power amplifier board still has certain defect in the inside use of influence:
the existing power amplification board cannot effectively dissipate heat when in use, and is easy to damage after long-time use, so that sound box equipment cannot operate, certain influence is brought in the actual use process, and therefore, the power amplification board with the heat dissipation function is provided.
SUMMERY OF THE UTILITY MODEL
Problems to be solved
To the poor problem of current power amplifier board radiating effect, the utility model provides a power amplifier board with heat dissipation function, it can be effectively with the heat discharge that produces when components and parts used on the power amplifier board, improved the radiating efficiency of power amplifier board greatly to solve the problem that proposes in the background art.
Technical scheme
In order to solve the above problems, the utility model adopts the following technical proposal.
The utility model provides a power amplifier board with heat dissipation function, includes power amplifier board main part and radiator unit, radiator unit including supporting curb plate, fixed plate and heat dissipation mechanism, support curb plate symmetry fixed mounting on the surface of power amplifier board main part, and support fixed mounting between the curb plate has the fixed plate, fixed plate surface evenly distributed has the through-hole, the fixed plate side keep away from one side on power amplifier board surface and install heat dissipation mechanism.
Preferably, the heat dissipation mechanism includes a driving motor and a heat dissipation fan.
Preferably, a uniform distribution net is fixedly installed on one side, far away from the heat dissipation mechanism, between the supporting side plates.
Preferably, the uniform distribution net is of an arc-shaped structure.
Preferably, the radiating fins are uniformly distributed on the lower surface of the power amplification plate main body.
Preferably, a uniform distribution net is fixedly arranged on one side of the supporting side plates, which is far away from the heat dissipation mechanism; and the lower surface of the power amplification plate main body is uniformly distributed with radiating fins.
Preferably, power amplifier board main part surface movable mounting have left sound channel output and right sound channel output, and the upper end surface of power amplifier board main part is located central point and puts fixed mounting and have electric capacity, power amplifier board main part surface mounting have control chip, and the surface movable mounting of power amplifier board main part has current input end, the surface mounting of power amplifier board main part have audio input seat, install audio input port on the audio input seat, and power amplifier board main part performance is provided with volume adjuster, the last volume knob that is provided with of volume adjuster, and volume knob is located the surface of audio amplifier shell body.
Has the beneficial effects of
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the power amplifier board comprises a power amplifier board main body and a heat dissipation assembly, wherein the heat dissipation assembly comprises a heat dissipation mechanism, the heat dissipation mechanism comprises a driving motor and a heat dissipation fan, the driving motor drives the heat dissipation fan to rotate to blow wind to the surface of the power amplifier board main body through heat dissipation holes, the heat dissipation holes have an even distribution effect on the wind, and the heat dissipation efficiency of the power amplifier board main body is improved;
(2) the heat dissipation assembly in the utility model also comprises a uniform distribution net which adopts an arc structure, and the heat dissipation fan can be blown to the surface of the power amplifier board main body in a large area after being evenly distributed through the uniform distribution net in the rotation process, thereby avoiding the problem of heat dissipation dead angles and further improving the heat dissipation efficiency of the power amplifier board main body;
(3) the utility model provides a power amplifier board lower surface still is provided with the fin, and the fin can effectively absorb the heat that produces in the power amplifier board main part working process and discharge, has further strengthened the radiating effect of power amplifier board main part.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the middle heat dissipation mechanism of the present invention.
In the figure:
10. a power amplifier board main body; 11. a left channel output end; 12. a capacitor; 13. a control chip; 14. a current input terminal; 15. a right channel output end; 16. an audio input seat; 17. an audio input port; 18. a volume adjuster; 19. a volume adjusting knob;
20. a heat dissipating component; 21. supporting the side plates; 22. a fixing plate; 23. a uniform distribution net; 24. a heat dissipation mechanism;
30. and a heat sink.
Detailed Description
The invention will be further described below in connection with specific embodiments.
Example 1
Fig. 1 is a schematic structural diagram of a power amplifier board with a heat dissipation function according to a preferred embodiment of the present invention; the power amplifier comprises a power amplifier board main body 10, wherein a left sound channel output end 11 and a right sound channel output end 15 are movably mounted on the surface of the power amplifier board main body 10, a capacitor 12 is fixedly mounted at the central position of the upper end surface of the power amplifier board main body 1, a control chip 13 is mounted on the surface of the power amplifier board main body 10, a current input end 14 is movably mounted on the surface of the power amplifier board main body 10, an audio input seat 16 is mounted on the surface of the power amplifier board main body 10, an audio input port 17 is mounted on the audio input seat 16, a volume adjuster 18 is arranged on the power amplifier board main body 10, a volume adjusting knob 19 is arranged on the volume adjuster 18, and the volume adjusting knob 19 is located on the surface of a sound box outer shell;
the power amplifier board with the heat dissipation function further comprises a heat dissipation assembly 20, the heat dissipation assembly 10 comprises supporting side plates 21, fixing plates 22 and heat dissipation mechanisms 24, the supporting side plates 21 are symmetrically and fixedly installed on the surface of the power amplifier board main body 10, the fixing plates 22 are fixedly installed between the supporting side plates 21, through holes are uniformly distributed on the surfaces of the fixing plates 22, and the heat dissipation mechanisms 24 are installed on one side, far away from the surface of the power amplifier board 10, of the side surface of each fixing plate 22;
the heat dissipation mechanism 24 includes a driving motor and a heat dissipation fan, the driving motor drives the heat dissipation fan to rotate to blow wind to the surface of the power amplifier board main body 10, the heat dissipation holes in the fixing plate 22 uniformly distribute the wind to blow to the components, the heat dissipation is performed on the power amplifier board main body 10, and the heat dissipation efficiency of the power amplifier board main body 10 is greatly improved.
Example 2
Fig. 1 is a schematic structural diagram of a power amplifier board with a heat dissipation function according to another preferred embodiment of the present invention; on the basis of embodiment 1, a uniform distribution net 22 is fixedly installed between the supporting side plates 21 and on the side far away from the heat dissipation mechanism 24, preferably, the uniform distribution net 22 is of an arc structure;
in this embodiment, when the heat dissipation mechanism 24 draws wind to blow toward the surface of the power amplifier board main body 10, the uniform distribution net 22 can effectively and uniformly distribute the wind to blow toward the components, so as to further enhance the heat dissipation efficiency of the power amplifier board main body 10;
example 3
Fig. 1 is a schematic structural diagram of a power amplifier board with a heat dissipation function according to another preferred embodiment of the present invention; on the basis of embodiment 1 or 2, the heat dissipation fins 30 are uniformly distributed on the lower surface of the power amplifier board main body 10, and the heat dissipation fins 30 can effectively absorb and discharge heat generated during the operation of the power amplifier board main body 10, thereby further enhancing the heat dissipation effect of the power amplifier board main body 10.
The above description is for further details of the present invention, and it is not assumed that the embodiments of the present invention are limited to these descriptions, and it is obvious to those skilled in the art that the present invention can be implemented by a plurality of simple deductions or replacements without departing from the concept of the present invention, and all should be considered as belonging to the protection scope defined by the claims submitted by the present invention.

Claims (7)

1. A power amplifier board with heat dissipation function comprises a power amplifier board main body (10) and a heat dissipation component (20),
the method is characterized in that:
radiating component (20) including supporting curb plate (21), fixed plate (22) and heat dissipation mechanism (24), support curb plate (21) symmetry fixed mounting on the surface of power amplifier board main part (10), and support fixed mounting between curb plate (21) have fixed plate (22), fixed plate (22) surface evenly distributed has the through-hole, fixed plate (22) side keep away from one side on power amplifier board main part (10) surface and install heat dissipation mechanism (24).
2. The power amplifier board with heat dissipation function of claim 1, wherein: the heat dissipation mechanism (24) comprises a driving motor and a heat dissipation fan.
3. The power amplifier board with heat dissipation function of claim 1, wherein: and a uniform distribution net (23) is fixedly arranged between the supporting side plates (21) at one side far away from the heat dissipation mechanism (24).
4. The power amplifier board with heat dissipation function of claim 3, wherein: the uniform distribution net (23) is of an arc-shaped structure.
5. The power amplifier board with heat dissipation function of claim 1, wherein: the lower surface of the power amplification plate main body (10) is uniformly distributed with radiating fins (30).
6. The power amplifier board with heat dissipation function of claim 1, wherein: a uniform distribution net (23) is fixedly arranged between the supporting side plates (21) and on one side far away from the heat dissipation mechanism (24); and the lower surface of the power amplification plate main body (10) is uniformly distributed with radiating fins (30).
7. The power amplifier board with heat dissipation function according to any one of claims 1 to 6, wherein: power amplifier board main part (10) surface movable mounting have left channel output (11) and right channel output (15), and the upper end surface of power amplifier board main part (10) is located central point and puts fixed mounting and have electric capacity (12), power amplifier board main part (10) surface mounting have control chip (13), and the surface movable mounting of power amplifier board main part (10) has current input end (14), the surface mounting of power amplifier board main part (10) have audio frequency input seat (16), install audio frequency input port (17) on audio frequency input seat (16), and power amplifier board main part (10) performance is provided with volume adjuster (18), be provided with volume knob (19) on volume adjuster (18), and volume knob (19) are located the surface of audio amplifier shell body.
CN201921890721.9U 2019-11-05 2019-11-05 Power amplifier board with heat dissipation function Expired - Fee Related CN210958667U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921890721.9U CN210958667U (en) 2019-11-05 2019-11-05 Power amplifier board with heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921890721.9U CN210958667U (en) 2019-11-05 2019-11-05 Power amplifier board with heat dissipation function

Publications (1)

Publication Number Publication Date
CN210958667U true CN210958667U (en) 2020-07-07

Family

ID=71378141

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921890721.9U Expired - Fee Related CN210958667U (en) 2019-11-05 2019-11-05 Power amplifier board with heat dissipation function

Country Status (1)

Country Link
CN (1) CN210958667U (en)

Similar Documents

Publication Publication Date Title
CN210958667U (en) Power amplifier board with heat dissipation function
CN109194096A (en) A kind of low-pressure energy-saving variable-frequency governor
CN206021171U (en) A kind of closed case of utilization piezoelectric fan radiating
CN205124214U (en) Heat radiation structure of motor controller
CN210381564U (en) High-efficient heat dissipation shell is used to automatically controlled cabinet
CN109245555B (en) Synchronous rectification high-frequency switch power supply
CN108769838B (en) Computer network LAN switch
CN210856786U (en) Disc type heat dispersion device
CN207896007U (en) A kind of network communication power switch with long service life
CN216597201U (en) Fastening heat radiation structure of high-frequency transformer
CN206097023U (en) Heat radiator for be used for quick -witted case of standard combination
CN216352177U (en) Cooling device of storage equipment for software engineering
CN207637062U (en) A kind of DC power control device
CN219875856U (en) Wireless transmitter
CN220984301U (en) Air-cooled heat dissipation transformer core
CN204696902U (en) Transducer power device blocks
CN212486871U (en) Energy-efficient printed board subassembly
CN213783930U (en) Heat radiation structure of microwave generation system
CN204948603U (en) A kind of electric machine controller of active heat removal
CN204129639U (en) A kind of active fan assembly of efficient reduction board chip temperature
CN219592966U (en) Heat dissipation shell
CN210839005U (en) Charging circuit board's heating panel structure, heating panel system and power charger
CN219999896U (en) KVM switch convenient to heat dissipation
CN217037792U (en) Heat dissipation device of electric box for communication engineering
CN219592922U (en) Frequency converter convenient to heat dissipation type

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200707

Termination date: 20211105