CN210957066U

CN210957066U - Integrated SIM card with multi-operator integration

Info

Publication number: CN210957066U
Application number: CN201922114442.XU
Authority: CN
Inventors: 胡文东
Original assignee: Shenzhen Sunrisim Technology Development Co ltd
Current assignee: Shenzhen Sunrisim Technology Development Co ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-07-07
Anticipated expiration: 2029-11-28

Abstract

The utility model discloses an integrated SIM card that many operators fused, include from up cassette, integrated chip and the PCB support plate that sets gradually down, integrated chip cover set up in the surface of cassette, integrated chip include main control chip and with a plurality of SIM cards that the main control chip electricity is connected, integrated chip with PCB support plate electricity is connected, the PCB support plate is used for being connected with the mobile terminal cassette. The service that fuses a plurality of operators is an integrated SIM card, a plurality of SIM cards can cover a plurality of operator networks, the operator of optional access, and when the operator network broke down, can switch to another operator network, keep the online production activity that does not influence of equipment, let the thing networking more reliable and intelligent, the cost of artifical troubleshooting maintenance has been reduced, also can directly replace current plug-in SIM card, it is very convenient to operate, can also directly use on the equipment of single SIM card.

Description

Integrated SIM card with multi-operator integration

Technical Field

The utility model relates to a SIM card field, the more specifically integrated SIM card that many operators fuse that says so.

Background

With the rapid popularization and application of the technology of the internet of things, China Mobile/China Unicom/China telecom of three operators in China all invest huge capital to build a signal overlay network serving the internet of things. But the three operators have different capital strengths and different allocated radio frequencies. The coverage of the mobile network is wide according to the network coverage, and the communication is carried out next time; the frequency penetration coverage of the telecommunication is the strongest according to the frequency dominance, and then the telecommunication is moved. And communicating the second telecommunication after the fastest movement according to the network speed. From the above description, the network services of the three operators are each advantageous and each has a short board. However, the internet of things equipment based on network service cannot determine the quality of the network, and the network coverage can be known only after deployment, which often causes difficulty in selecting and deploying network service providers for the internet of things equipment. Even if the network of one operator can not ensure uninterrupted operation all the year round without network faults, the reliability of the operation of the equipment of the internet of things can be influenced, once the network of the operator has faults, the equipment of the internet of things is offline, and the production activity assembly can be greatly influenced.

The prior technical proposal has the defects that the cut and polished SIM cards are the conventional plastic packaging plug-in SIM cards, the physical damage of the SIM cards is easy to damage in the processing process, and the processing efficiency is low; in addition, the electrical conduction between the processed SIM card contact surface and the bracket device is formed by surface extrusion contact, so the contact reliability is poor; in addition, the whole thickness is increased due to the combination mode, and the clamping groove can not be suitable for various devices to be smoothly plugged.

Another solution in the prior art is a multi-modem internet of things solution, which integrates multiple modem modules for wireless networking into one internet of things device, and each module uses different operator SIM cards, so as to achieve the purpose of accessing different operator services. However, the multi-modem scheme needs to greatly increase the cost of the internet of things device, is not beneficial to the miniaturization and low power consumption of the device, and is a scheme with high cost, low benefit and no accordance with the production rule.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's not enough, provide an integrated SIM card that many operators fuse.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an integrated SIM card that many operators fuse, includes from up the cassette that sets gradually down, integrated chip and PCB support plate, integrated chip cover set up in the surface of cassette, integrated chip include main control chip and with a plurality of SIM cards that the main control chip electricity is connected, integrated chip with PCB support plate electricity is connected, the PCB support plate is used for being connected with the mobile terminal cassette.

The further technical scheme is as follows: the number of the SIM cards is three.

The further technical scheme is as follows: the integrated SIM card also comprises a welding layer, and the welding layer welds the integrated chip on the PCB carrier plate.

The further technical scheme is as follows: the welding layer is an SMT tin paste welding layer, and the thickness of the welding layer is 0.03 mm.

The further technical scheme is as follows: the thickness of the integrated chip is 0.6 mm.

The further technical scheme is as follows: the thickness of the PCB carrier plate is 0.13 mm.

The further technical scheme is as follows: the model of the main control chip is SIM 908.

Compared with the prior art, the utility model beneficial effect be: the utility model provides an integrated SIM card that many operators fuse is through setting up a plurality of SIM cards on the microchip, the main control chip electricity that sets up on a plurality of SIM cards and the microchip is connected, and be connected microchip and PCB support plate electricity, the service that fuses a plurality of operators is an integrated SIM card, a plurality of SIM cards can cover a plurality of operator networks, the operator of optional access, and when the operator network breaks down, can switch to another operator network, keep equipment online not influencing the production activity, let the thing networking more reliable and intelligent, the cost of artifical troubleshooting maintenance has been reduced, also can directly replace current pull-plug formula SIM card, it is very convenient to operate, can also directly use on the equipment of single SIM card, need not to carry out the hardware adjustment of equipment and just can realize the full network and lead to the service.

The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.

Drawings

Fig. 1 is a schematic structural diagram of an integrated SIM card with multi-operator convergence;

fig. 2 is a schematic structural diagram of an integrated SIM card with multi-operator convergence.

Reference numerals

10. Integrating the SIM card; 11. a card holder; 12. an integrated chip; 121. a SIM card; 122. a main control chip; 13. a PCB carrier plate; 14. and (7) welding the layers.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and the following detailed description.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "secured" are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

As shown in fig. 1 to 2, an integrated SIM card 10 with multiple operators integrated therein includes a card socket 11, an integrated chip 12 and a PCB carrier 13 sequentially disposed from bottom to top, the integrated chip 12 is disposed on a surface of the card socket 11 in a covering manner, the integrated chip 12 includes a main control chip 122 and multiple SIM cards 121 electrically connected to the main control chip 122, the integrated chip 12 is electrically connected to the PCB carrier 13, and the PCB carrier 13 is configured to be connected to the card socket 11 of the mobile terminal. The service that fuses a plurality of operators is an integrated SIM card 10, a plurality of SIM cards 121 can cover a plurality of operator networks, the operator of optional access, and when the operator network broke down, can switch to another operator network, keep the online production activity that does not influence of equipment, let the thing networking more reliable and intelligent, the cost of artifical troubleshooting maintenance has been reduced, also can directly replace current plug-in SIM card, it is very convenient to operate, can also directly use on the equipment of single SIM card, need not to carry out the hardware adjustment of equipment and just can realize the general network service.

Specifically, as shown in fig. 2, the SIM cards 121 are three in number. The three SIM cards 121 are a mobile operator SIM card, a universal operator SIM card and a telecom operator SIM card, respectively.

Specifically, the material adopted by the card seat 11 is epoxy resin glue.

Specifically, as shown in fig. 2, the integrated SIM card 10 further includes a soldering layer 14, and the soldering layer 14 solders the integrated chip 12 on the PCB carrier 13.

Specifically, the soldering layer 14 is an SMT solder paste soldering layer 14, and the thickness of the soldering layer 14 is 0.03mm, so that the integrated SIM card 10 can operate in an environment with an extremely high temperature and an extremely low temperature, and is resistant to moisture and deformation.

Specifically, the patch type SIM card of MFF2 model released by a telecom operator is ground and thinned by a grinder, the patch SIM cards 121 of a plurality of different operators are attached to the PCB carrier 13 by an SMT surface welding process, wherein a main control chip 122 is also attached to the PCB carrier 13, the PCB carrier 13 attached with the SIM cards 121 and the main control chip 122 is packaged into a solid sheet by a semiconductor chip plastic package process, and then the sheet is cut into a required shape by using a laser cutter or a high pressure water jet cutter, and can be cut into a standard SIM card 121 of 2FF model, or a standard SIM card of 3FF (Micro-SIM card) or a standard SIM card of 4FF (Nano-SIM card) or other non-standard shapes according to actual needs. The SIM card chips of a plurality of operators are integrated into one device, and the device is used in a single Internet of things modem module in a plugging mode or a mounting mode, so that a plugging SIM card for communication is replaced in the existing Internet of things equipment, and the Internet of things equipment has the capacity of multi-network coverage.

Specifically, the thickness of the integrated chip 12 is 0.6 mm.

Specifically, the thickness of the PCB carrier 13 is 0.13 mm.

Specifically, the model of the main control chip 122 is SIM908, which has the capability of running programs, and also has pins for connecting the functions of the three SIM cards 121, i.e., the SIM1 card and the SIM2 card, i.e., the SIM3 card, and pins connected to the SIM card 121 socket of the mobile phone, and the running programs play a role in communication forwarding.

The main control chip 122 has 8 pins:

VCC: supplying power

GND: ground wire

And SIO: data line connected with 11 data IO ports of mobile phone card holder

RST: reset signal pin

CLK: communication synchronous clock pin

IO 1: data IO port connected with SIM1

IO 2: data IO port connected with SIM2

IO 3: data IO port connected with SIM2

Specifically, the main control chip 122 selects the SIM card 121 according to a preset value or a network service condition:

the main control chip 122 monitors the data flow between the modem and the SIM card 121 through the software running on the main control chip, and realizes the capability of monitoring the operator signal coverage and the service quality of the modem terminal in real time, so as to perform switching and selected use of the SIM card 121 accordingly. When the SIM1 is selected to be used, the main control chip 122 selects to read and write data stream from the IO1, forward the read and write data stream to the SIO, and send the read and write data stream to the mobile phone card socket, at this time, the communication modem module is connected to the SIM1, and uses the SIM1 to interactively communicate and log in a network of a local SIM1 operator. SIM2 and SIM3 are not accessed at this time; when the SIM2 is selected to be used, the main control chip 122 selects reading and writing data from the IO2 to forward to the SIO, and uses the SIM2 to interactively communicate and log in a network of a local SIM2 operator, and at the moment, the SIM1 and the SIM3 are not accessed; when the SIM3 is selected to be used, the main control chip 122 selects reading and writing data from the IO3 to forward to the SIO, and uses the SIM3 to interactively communicate and log in a network of a local SIM3 operator, and at the moment, the SIM1 and the SIM2 are not accessed;

specifically, the integrated SIM card 121 is packaged by a semiconductor plastic package process, and can operate in an extremely high-temperature and extremely low-temperature environment, and is moisture-resistant and deformation-resistant. These are properties that conventional pvc plastic encapsulated plug-in SIM cards 121 do not possess.

Specifically, the present invention is a conventional SIM card by integrating patch SIM cards 121 of multiple operators into a whole. The physical reliability of each SIM card 121 combination is more reliable through the SMT surface mounting welding process in the process; the semiconductor plastic package process is used for carrying out integral package, has the characteristics of high temperature resistance, low temperature resistance, moisture resistance and deformation resistance, and can be operated in a severe environment; the full-mechanized processing and manufacturing are easy to produce and manufacture; the existing plug-in SIM card is directly replaced, and the operation is very convenient. From the compatibility, the invention can be directly used on the equipment with a single SIM card, and can realize the whole network communication service without hardware adjustment of the equipment. From the benefit, the scheme realizes the multi-network-in-one service for the Internet of things equipment, the Internet of things equipment overcomes the problem of network coverage in deployment, and the operation cost can be saved through the network service with the price competition of multiple operators and the selective price ratio being better. According to the high availability of the network service, when one of the SMD SIM cards has hardware fault, the other SMD SIM card can be automatically switched to, so that the operation of the Internet of things equipment is more reliable and intelligent, and the cost of manual troubleshooting and maintenance is reduced.

Specifically, according to the standard specification of the communication industry, the thickness of the surface-mounted SIM card is about 0.75mm, and the overall dimension is 5mm X6 mm; this scheme requires finished product thickness control within 0.9mm thickness to the smooth and easy of the general SIM cassette of adaptation is pulled out and is inserted. In order to meet the requirements of the plastic packaging process, the thickness of the integrated SIM card needs to be reduced to 0.6mm, and the reduction is only to grind one layer of the surface of the material for plastic packaging of the SMD SIM card by using a grinder without damaging the structure of a chip.

Compared with the prior art, the utility model provides an integrated SIM card that many operators fuse is through setting up a plurality of SIM cards on the microchip, the main control chip electricity that sets up on a plurality of SIM cards and the microchip is connected, and be connected microchip and PCB support plate electricity, the service that fuses a plurality of operators is an integrated SIM card, a plurality of SIM cards can cover a plurality of operator networks, the operator of optional access, and when the operator network breaks down, can switch to another operator network, it does not influence the production activity to keep equipment online, let the thing networking more reliable and intelligent, the cost of artifical troubleshooting maintenance has been reduced, also can directly replace and insert the formula SIM card, it is very convenient to operate, can also directly use on the equipment of single SIM card, need not to carry out the hardware adjustment of equipment and just can realize the whole network and lead to the service.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. The utility model provides an integrated SIM card that many operators fuse, its characterized in that includes from up cassette, integrated chip and the PCB support plate that sets gradually down, integrated chip cover set up in the surface of cassette, integrated chip include main control chip and with a plurality of SIM cards that the main control chip electricity is connected, integrated chip with the PCB support plate electricity is connected, the PCB support plate is used for being connected with the mobile terminal cassette.

2. The multi-operator converged integrated SIM card according to claim 1, wherein the number of SIM cards is three.

3. The multi-operator converged integrated SIM card according to claim 1, further comprising a soldering layer, the soldering layer soldering the integrated chip on the PCB carrier.

4. The multi-operator converged integrated SIM card of claim 3, wherein the solder layer is an SMT solder paste solder layer, the solder layer having a thickness of 0.03 mm.

5. The multi-operator converged integrated SIM card according to claim 1, wherein the integrated chip has a thickness of 0.6 mm.

6. The multi-operator converged integrated SIM card according to claim 1, wherein the PCB carrier plate has a thickness of 0.13 mm.

7. The multi-operator converged integrated SIM card according to claim 1, wherein the master chip model is SIM 908.