CN210955119U - Optical fingerprint identification module and electronic equipment - Google Patents

Optical fingerprint identification module and electronic equipment Download PDF

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Publication number
CN210955119U
CN210955119U CN201922141014.6U CN201922141014U CN210955119U CN 210955119 U CN210955119 U CN 210955119U CN 201922141014 U CN201922141014 U CN 201922141014U CN 210955119 U CN210955119 U CN 210955119U
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CN
China
Prior art keywords
identification module
fingerprint identification
circuit board
flexible circuit
optical fingerprint
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CN201922141014.6U
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Chinese (zh)
Inventor
杨志
张靖恺
戴华东
谢旭彬
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Inferpoint Systems Shenzhen Ltd
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Inferpoint Systems Shenzhen Ltd
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Priority to CN201922141014.6U priority Critical patent/CN210955119U/en
Priority to TW109201801U priority patent/TWM596899U/en
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Publication of CN210955119U publication Critical patent/CN210955119U/en
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Abstract

The application provides an optics fingerprint identification module and electronic equipment through digging the hole design to flexible circuit board and stiffening plate, sets up fingerprint sensor in its back, has formed a more integrated, the thinner optics fingerprint identification module of thickness to satisfy the ultra-thin demand of individual electronic equipment. And, in order to obtain clear image, through the size of adjustment flexible circuit board and stiffening plate in order to satisfy electronic equipment performance requirement, electronic equipment's thickness is about the thickness of optics fingerprint identification module so, and does not increase electronic equipment's whole thickness because set up optics fingerprint identification module under the screen.

Description

Optical fingerprint identification module and electronic equipment
Technical Field
The utility model relates to a fingerprint identification technical field, more specifically say, relate to an optics fingerprint identification module and electronic equipment.
Background
With the continuous development of science and technology, various electronic devices are widely applied to the life and work of people, and great convenience is brought to the daily life of people.
Fingerprint identification technology has been widely applied to most of electronic equipment, and the thickness of electronic equipment can be increased due to the traditional underscreen fingerprint module stacking structure at present, and the ultrathin requirement of individual electronic equipment can not be met.
SUMMERY OF THE UTILITY MODEL
In view of this, for solving the above problem, the utility model provides an optical fingerprint identification module and electronic equipment, technical scheme is as follows:
the utility model provides an optical fingerprint identification module, optical fingerprint identification module includes:
a flexible circuit board;
the reinforcing plate is arranged on the front side of the flexible circuit board;
a through hole structure penetrating through the reinforcing plate and the flexible circuit board;
the fingerprint sensor is arranged on the back of the flexible circuit board, at least part of the fingerprint sensor is projected in the through hole structure area, and the fingerprint sensor is connected with the flexible circuit board.
Preferably, in the above optical fingerprint recognition module, the fingerprint sensor is a CIS sensor.
Preferably, in the optical fingerprint identification module, the reinforcing plate is a PI reinforcing plate, a steel sheet reinforcing plate or an FR4 reinforcing plate.
Preferably, in the optical fingerprint identification module, the thickness of the flexible circuit board is 100 μm to 150 μm, inclusive.
Preferably, in the optical fingerprint identification module, the thickness of the reinforcing plate is 100 μm to 300 μm, inclusive.
Preferably, in above-mentioned optical fingerprint identification module, the optical fingerprint identification module still includes:
and the touch display panel covers the reinforcing plate and the through hole structure.
Preferably, in the optical fingerprint identification module, the touch display panel displays a fingerprint touch identifier in an area corresponding to the through hole structure.
Preferably, in above-mentioned optical fingerprint identification module, fingerprint sensor with the flexible circuit board passes through the metal wire and connects.
Preferably, in above-mentioned optical fingerprint identification module, the optical fingerprint identification module still includes:
and the collimation layer is arranged in the through hole structure area.
An electronic device, the electronic device includes any one of the above optical fingerprint identification module.
Compared with the prior art, the utility model discloses the beneficial effect who realizes does:
this optics fingerprint identification module is through digging the hole design to flexible circuit board and stiffening plate, sets up fingerprint sensor in its back, and it is higher to have formed an integrated level, and the thinner optics fingerprint identification module of thickness to satisfy the ultra-thin demand of individual electronic equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical fingerprint identification module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an optical fingerprint identification module according to an embodiment of the present invention.
The optical fingerprint identification module includes:
a flexible circuit board 11;
a reinforcing plate 12 disposed on the front surface of the flexible circuit board 11;
a through hole structure 13 penetrating the reinforcing plate 12 and the flexible circuit board 11;
the fingerprint sensor 14 is arranged on the back surface of the flexible circuit board 11, at least part of the fingerprint sensor 14 is projected in the through hole structure 13 area, and the fingerprint sensor 14 is connected with the flexible circuit board 11.
Wherein the fingerprint sensor 14 is at least partially accommodated within the through hole structure 13 to efficiently receive light reflected back from the finger.
In this embodiment, the design of digging holes is performed on the flexible circuit board 11 and the reinforcing plate 12, and the fingerprint sensor 14 is arranged on the back of the flexible circuit board, so that the requirement that a certain distance is required to be met between the fingerprint sensor and a finger in order to obtain a clear optical image is met, and an optical fingerprint identification module with high integration level and thinner thickness is formed, so that the requirement that individual electronic equipment is ultrathin is met.
Moreover, the sizes of the flexible circuit board 11 and the reinforcing plate 12 are adjusted to meet the performance requirement and the thickness requirement of the electronic equipment, so that the thickness of the electronic equipment is about the thickness of the optical fingerprint identification module, and the whole thickness of the electronic equipment is not increased due to the fact that the optical fingerprint identification module is arranged under the screen.
Further, based on the utility model discloses above-mentioned embodiment, fingerprint sensor is the CIS sensor.
When the finger presses at fingerprint detection area, send from optics fingerprint identification module and shine and take place the reflection and form the reverberation at the light on finger surface, because the reflection light of the ridge of finger fingerprint and valley is different, the reflection light sees through from the display screen and is received and convert corresponding signal of telecommunication, fingerprint detection signal promptly by fingerprint sensor.
Fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further carried out, so that the optical fingerprint identification function is realized.
In this embodiment, the fingerprint sensor 14 includes, but is not limited to, a CIS sensor (Contact image sensor), and a more suitable fingerprint sensor may be selected according to actual needs.
Further, based on the above-mentioned embodiment of the present invention, the stiffening plate 12 is a setting on the positive PI stiffening plate, steel sheet stiffening plate or FR4 stiffening plate of the flexible circuit board 11.
Further, according to the above embodiment of the present invention, the thickness of the reinforcing plate 12 is 100 μm to 300 μm, inclusive.
In this embodiment, the thickness of the reinforcing plate 12 may be 100 μm, 150 μm, 200 μm, 300 μm, or the like.
Further, based on the above embodiments of the present invention, the thickness of the flexible circuit board 11 is 100 μm to 150 μm, inclusive.
In this embodiment, the thickness of the flexible circuit board 11 may be 100 μm, 120 μm, 150 μm, or the like.
Further, based on the utility model discloses above-mentioned embodiment, as shown in fig. 1, optics fingerprint identification module still includes:
and a touch display panel 17, wherein the touch display panel 17 covers the reinforcing plate 12 and the through hole structure 13.
Further, based on the above embodiment of the present invention, as shown in fig. 1, the touch display panel 17 displays a fingerprint touch mark in an area corresponding to the through hole structure 13.
In this embodiment, the position of the through hole structure 13 may be determined based on the display area of the corresponding electronic device, so as to facilitate the fingerprint unlocking of the user, which is not limited in the embodiment of the present invention.
Also, an Under-screen (Under-display) optical fingerprint system may be formed in the entire area Under the touch display panel 17.
Further, based on the above-mentioned embodiment of the present invention, as shown in fig. 1, the fingerprint sensor 14 is connected to the flexible circuit board 11 through a metal wire 15.
In this embodiment, the fingerprint sensor 14 is connected to the flexible circuit board 11 through a metal wire 15, so that the fingerprint sensor 14 can receive a control signal of a processing unit of a terminal device through the flexible circuit board 11, and can also output a fingerprint detection signal (e.g., a fingerprint image) to the processing unit or the control unit of the terminal device through the flexible circuit board 11.
Further, based on the utility model discloses above-mentioned embodiment, as shown in fig. 1, optics fingerprint identification module still includes:
a collimating layer 16 arranged in the region of the via structure 13.
In this embodiment, the alignment layer 16 may be packaged in the same optical fingerprint chip as the fingerprint sensor 14, or the alignment layer 16 may be disposed outside the chip formed by the fingerprint sensor 14, for example, the alignment layer 16 is attached to the top of the chip.
In particular, the collimating layer 16 collimates and modulates light reflected from the finger and incident on the collimating layer 16, and is further received by the fingerprint sensor 14 thereunder, so that the fingerprint sensor 14 can detect a fingerprint image of the finger.
Further, based on the utility model discloses above-mentioned embodiment, as shown in fig. 1, optics fingerprint identification module still includes:
a connector 18;
wherein the connector 18 is used for connecting with a controller. The controller is a processing unit or a control unit of the terminal equipment.
In this embodiment, when the optical fingerprint identification module is applied to a mobile phone, the connector is connected with a controller of the mobile phone.
Based on above-mentioned all embodiments of the utility model discloses still provide an electronic equipment in another embodiment, refer to fig. 2, fig. 2 is the utility model discloses a structural schematic diagram of the electronic equipment that provides, electronic equipment includes the optics fingerprint identification module.
In this embodiment, the electronic device 21 includes, but is not limited to, an electronic device such as a mobile phone, a tablet computer, etc., and fig. 2 illustrates a schematic diagram of a mobile phone, where a portion of the dashed-line frame 22 is a fingerprint touch identifier.
The optical fingerprint identification module and the electronic device provided by the present invention are introduced in detail, and the principle and the implementation of the present invention are explained by using specific examples, and the explanation of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides an optics fingerprint identification module, its characterized in that, optics fingerprint identification module includes:
a flexible circuit board;
the reinforcing plate is arranged on the front side of the flexible circuit board;
a through hole structure penetrating through the reinforcing plate and the flexible circuit board;
the fingerprint sensor is arranged on the back of the flexible circuit board, at least part of the fingerprint sensor is projected in the through hole structure area, and the fingerprint sensor is connected with the flexible circuit board.
2. The optical fingerprint recognition module of claim 1 wherein the fingerprint sensor is a CIS sensor.
3. The optical fingerprint identification module of claim 1, wherein the stiffener is a PI stiffener, a steel stiffener, or an FR4 stiffener.
4. The optical fingerprint recognition module of claim 1, wherein the flexible circuit board has a thickness of 100-150 μ ι η, inclusive.
5. The optical fingerprint recognition module of claim 1, wherein the thickness of the reinforcing plate is between 100 μ ι η and 300 μ ι η, inclusive.
6. The optical fingerprint identification module of claim 1, further comprising:
and the touch display panel covers the reinforcing plate and the through hole structure.
7. The optical fingerprint identification module of claim 6, wherein the touch display panel displays fingerprint touch marks in an area corresponding to the through hole structure.
8. The optical fingerprint identification module of claim 1, wherein the fingerprint sensor is connected to the flexible circuit board by a metal wire.
9. The optical fingerprint identification module of claim 1, further comprising:
and the collimation layer is arranged in the through hole structure area.
10. An electronic device, characterized in that the electronic device comprises an optical fingerprint recognition module according to any one of claims 1-9.
CN201922141014.6U 2019-12-03 2019-12-03 Optical fingerprint identification module and electronic equipment Active CN210955119U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201922141014.6U CN210955119U (en) 2019-12-03 2019-12-03 Optical fingerprint identification module and electronic equipment
TW109201801U TWM596899U (en) 2019-12-03 2020-02-18 Optical fingerprint identification module and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922141014.6U CN210955119U (en) 2019-12-03 2019-12-03 Optical fingerprint identification module and electronic equipment

Publications (1)

Publication Number Publication Date
CN210955119U true CN210955119U (en) 2020-07-07

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CN (1) CN210955119U (en)
TW (1) TWM596899U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022056935A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115482748A (en) * 2022-09-20 2022-12-16 业泓科技(成都)有限公司 Curved surface display device with fingerprint identification function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022056935A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device

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Publication number Publication date
TWM596899U (en) 2020-06-11

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