CN210954951U

CN210954951U - High efficiency heat radiation structure of integration computer

Info

Publication number: CN210954951U
Application number: CN202020083427.3U
Authority: CN
Inventors: 胡强; 温春洪; 肖久彬; 王波; 朱雄伟; 蔡余; 肖尊利
Original assignee: Chengdu Xima Technology Development Co ltd
Current assignee: Chengdu Xima Technology Development Co ltd
Priority date: 2020-01-15
Filing date: 2020-01-15
Publication date: 2020-07-07
Anticipated expiration: 2030-01-15

Abstract

The utility model relates to a high efficiency heat radiation structure of integration computer, backplate (1) including the integration computer, backplate (1) is the aluminum alloy material and is provided with a plurality of inlet ports (6) and a plurality of exhaust hole (2), be provided with the fixed orifices that is used for installing mainboard (3) on backplate (1), backplate (1) and CPU (4) in close contact with, be provided with two exhaust regions of mainboard below exhaust region (7) and mainboard one side exhaust region (8) on backplate (1), two exhaust regions link to each other, a plurality of exhaust holes (2) set up respectively in two exhaust regions, a plurality of inlet ports (6) are located CPU (4) relative both sides respectively with mainboard one side exhaust region (8), form the heat dissipation wind channel for power through turbofan (5). The utility model discloses the circulation of heat dissipation air is smooth and easy, carries out dual heat dissipation through cooling air and backplate (1) heat conduction, has increased the radiating efficiency of integration computer.

Description

High efficiency heat radiation structure of integration computer

Technical Field

The utility model relates to a heat radiation structure of integration computer, especially a high efficiency heat radiation structure of integration computer.

Background

The all-in-one computer is a novel market product between a desktop computer and a notebook computer at present. The integrated computer integrates the host part and the display part together and has the characteristics of compact structure and small volume. Just because the volume of the integrated computer is small, the internal elements of the integrated computer are highly integrated, and when the higher and higher performance of the existing computer is met, the heat dissipation becomes the problem which cannot be avoided by the integrated computer. The integrated computer heat dissipation generally adopts a heat pipe to lead out the heat of high-heat elements such as a CPU (central processing unit) and the like, and then the high-heat elements are cooled by a fan, so that the cost is high, and the structure is complex.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a backplate structure convenient to integration computer high efficiency is radiating.

The purpose of the utility model is realized through the following technical scheme: the utility model provides a high efficiency heat radiation structure of integration computer, includes the aluminum alloy backplate of integration computer, and aluminum alloy backplate and air direct contact realize the conduction heat dissipation, be provided with a plurality of inlet ports and a plurality of exhaust hole on the backplate, be provided with the fixed orifices that is used for installing the mainboard on the backplate, backplate and CPU in close contact with, be provided with two exhaust regions in mainboard below exhaust region and mainboard one side exhaust region on the backplate, two exhaust regions link to each other, a plurality of exhaust holes set up respectively in two exhaust regions, a plurality of inlet ports are located the both sides that the mainboard is relative respectively with mainboard one side exhaust region, form the heat dissipation wind channel for power through turbofan. The two exhaust areas are convenient for discharging hot air, the cooling air passing through the lower part of the main board is subjected to heat exchange with the CPU to form hot air, the hot air at the position is directly discharged from the exhaust area below the main board, the cooling air passing through the upper part of the main board is subjected to heat exchange with the CPU to form hot air, and the hot air at the position is discharged from the exhaust area at one side of the main board.

Preferably, the plurality of air inlet holes are arranged in an array. The array structure of the air inlet holes is arranged according to the shape of the air inlet of the turbofan, and the array structure can be a rectangular array or an annular array.

Preferably, the power of the heat dissipation air duct is a turbofan. The turbofan is used as a power element for air flowing in the integrated computer and is used for sucking cold air and conveying the cold air to the main board and the CPU position for heat exchange, and simultaneously, promoting the hot air to be discharged from the exhaust hole.

Preferably, the plurality of exhaust holes are arranged in a rectangular array.

Preferably, the backplate is the aluminum alloy material, and aluminum alloy plate itself has good heat conductivility, and CPU in close contact with aluminum alloy backplate realizes the heat conduction, if gapped, can fill in suitable copper billet and aluminium billet and realize the heat conduction, and the aluminum alloy backplate can be directly with heat conduction in the air, inhales the air flow speed that cold air and discharge hot-air can increase the backplate both sides at turbofan, can promote the heat exchange rate of backplate and air simultaneously, has further accelerated the radiating efficiency.

The utility model has the advantages of it is following:

1. the heat dissipation air is smooth in circulation and high in cooling efficiency;

2. the backplate is the aluminum alloy material and direct and CPU in close contact with, and the backplate heat conduction efficiency of aluminum alloy material is high, directly conducts the heat to the air in, has increased the radiating efficiency of integration computer.

Drawings

Fig. 1 is a schematic structural view of the present invention;

in the figure: 1-back plate, 2-exhaust hole, 3-main plate, 4-CPU, 5-turbofan, 6-air inlet hole, 7-exhaust area under main plate, 8-exhaust area at one side of main plate.

Detailed Description

The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.

As shown in fig. 1, the high-efficiency heat dissipation structure of the integrated computer comprises an aluminum alloy back plate 1 of the integrated computer, wherein the back plate 1 is in close contact with a CPU4, and a plurality of air inlet holes 6 and a plurality of air outlet holes 2 are arranged on the back plate 1. The intake holes 6 are used for the turbo fan 5 to suck cold air, and the exhaust holes 2 are used for the hot air to be discharged after heat exchange.

Be provided with the fixed orifices that is used for installing mainboard 3 on backplate 1, on mainboard 3 passed through fixed orifices and fix with screw backplate 1, be provided with CPU4 on the mainboard 3, backplate 1 and CPU4 in close contact with, if gapped, can fill in suitable copper billet or aluminium billet, be provided with the regional 7 of mainboard below exhaust and regional 8 two exhaust regions of mainboard one side exhaust on backplate 1, two exhaust regions link to each other, and two exhaust regions are used for discharging respectively through mainboard 3 top and below hot-air, a plurality of exhaust holes 2 set up respectively in two exhaust regions, a plurality of inlet ports 6 are located the relative both sides of mainboard 3 respectively with mainboard one side exhaust region 8, and the cold air of being convenient for flows through mainboard 3 and CPU 4. The two-piece exhaust area facilitates the discharge of hot air, and the cooling air passing under the main board 3 is heat-exchanged with the CPU4 to form hot air, and the hot air is directly discharged from the main board lower exhaust area 7, and the cooling air passing over the main board 3 is heat-exchanged with the CPU4 to form hot air, and the hot air is discharged from the main board side exhaust area 8.

Preferably, the plurality of air inlet holes 6 are arranged in an array. The array structure of the air inlet holes 6 is arranged according to the shape of the air inlet of the turbofan 5, and can be a rectangular array or an annular array.

Preferably, the power of the heat dissipation air duct is a turbofan 5, and an air outlet of the turbofan 5 faces the CPU 4. The turbofan is used as a power element for air flowing in the integrated computer and is used for sucking cold air and conveying the cold air to the main board and the CPU position for heat exchange, and simultaneously, promoting the hot air to be discharged from the exhaust hole.

Preferably, the plurality of exhaust holes 2 are arranged in a rectangular array.

Preferably, the main board lower air discharge region 7 extends from one side of the main board 3 to the middle of the main board 3, and the maximum extension distance of the main board lower air discharge region 7 does not exceed the position on the main board 3 directly below the CPU 4. The cooling air blown by the turbo fan 5 passes directly through the CPU4, and high-efficiency air duct heat dissipation is achieved.

Preferably, backplate 1 is the aluminum alloy material, and metal material's backplate itself has good heat conductivility, and CPU in close contact with aluminum alloy backplate realizes the heat conduction, if gapped, can fill in suitable copper billet and aluminium billet and realize the heat conduction, and CPU 4's heat direct introduction metal backplate, metal backplate can be directly in the heat conduction air, inhales the air flow velocity that cold air and discharge hot-air can increase the backplate both sides at turbofan, can promote the heat exchange rate of backplate and air simultaneously, has further increased the radiating efficiency.

The working process of the utility model is as follows: after the integrated computer is started, the turbo fan 5 sucks cold air from the air intake 6 and blows the cold air toward the CPU4 and the air discharge hole 2. The cold air is heat-exchanged while passing through the CPU4 to lower the temperature of the CPU4, and the hot air formed after the heat exchange continues to flow forward and is discharged from the discharge hole 2. The cooling air passing under the main board 3 is heat-exchanged with the CPU4 to form hot air, the hot air is directly discharged from the main board lower exhaust area 7, and the cooling air passing over the main board 3 is heat-exchanged with the CPU4 to form hot air, and the hot air is discharged from the main board side exhaust area 8. Backplate 1 and CPU4 direct in close contact with, if gapped, fill in suitable copper billet or aluminium piece, CPU 4's heat conduction is advanced backplate 1, because backplate 1 is made for the aluminum alloy material, has good heat conductivility, during backplate 1 direct and external air contact and with heat conduction air, increased the radiating efficiency. When the cold air flows and exchanges heat with the CPU4, the cold air exchanges heat with the backboard 1, the close contact between the CPU4 and the backboard 1 increases the heat dissipation area of the CPU4, and the flowing cold air exchanges heat with the backboard 1 to accelerate the heat dissipation of the backboard 1. Thereby accomplishing the high-efficiency heat dissipation of the whole integrated computer.

Claims

1. A high efficiency heat radiation structure of integration computer which characterized in that: backplate (1) including the integration computer, backplate (1) is the aluminum alloy material and is provided with a plurality of inlet ports (6) and a plurality of exhaust hole (2), be provided with the fixed orifices that is used for installing mainboard (3) on backplate (1), backplate (1) and CPU (4) in close contact with, be provided with two exhaust regions of mainboard below exhaust region (7) and mainboard one side exhaust region (8) on backplate (1), two exhaust regions link to each other, a plurality of exhaust hole (2) set up respectively in two exhaust regions, a plurality of inlet ports (6) are located CPU (4) relative both sides respectively with mainboard one side exhaust region (8), form the heat dissipation wind channel for power through turbofan (5).

2. A high efficiency heat dissipation structure of an all-in-one computer as claimed in claim 1, wherein: the plurality of air inlet holes (6) are arranged in an array mode.

3. A high efficiency heat dissipation structure of an all-in-one computer as claimed in claim 1, wherein: the power of the heat dissipation air channel is a turbine fan (5).

4. A high efficiency heat dissipation structure of an all-in-one computer as claimed in claim 1, wherein: the exhaust holes (2) are arranged in an array mode.

5. A high efficiency heat dissipation structure of an all-in-one computer as claimed in claim 1, wherein: the back plate (1) is made of aluminum alloy.