CN210954784U

CN210954784U - Computer chip with mounting structure

Info

Publication number: CN210954784U
Application number: CN201921772657.4U
Authority: CN
Inventors: 李敏锋
Original assignee: Suzhou Zaibao Intelligent Iot Technology Co ltd
Current assignee: Suzhou Zaibao Intelligent Iot Technology Co ltd
Priority date: 2019-10-22
Filing date: 2019-10-22
Publication date: 2020-07-07
Anticipated expiration: 2029-10-22

Abstract

The utility model relates to a computer chip with a mounting structure, belonging to the technical field of computer chips, the computer chip with the mounting structure comprises a chip body and two L-shaped mounting plates for fixing the chip body, the two L-shaped mounting plates are symmetrically arranged at both sides of the chip body, a packaging shell is arranged at the upper end of the chip body, the outer side walls of the two packaging shells are fixedly connected with buckling mechanisms, the opposite inner walls of the two L-shaped mounting plates are fixedly connected with fixing and buckling plates matched with the buckling mechanisms, the chip body is fixedly arranged between the two L-shaped mounting plates through the buckling connection of the buckling mechanism connected on the chip body and the fixed buckling plate on the L-shaped mounting plates, the buckling mechanism realizes the buckling or the dismounting between the movable buckling plate and the fixed buckling plate by pressing the arc-shaped elastic sheet, thereby effectively improving the simplification of the installation.

Description

Computer chip with mounting structure

Technical Field

The utility model relates to a computer chip technical field especially relates to a computer chip with mounting structure.

Background

The computer chip is a thin sheet made of silicon material, and one chip is formed by connecting hundreds of microcircuits, and its volume is small, and the microcircuits for producing pulse current are distributed on the chip.

The existing computer chip is connected to the circuit board through welding, the welding fixing mode is convenient, but if the welding spot is aged, the chip is easy to break away from the original installation position in the long-term use process, and if the chip needs to be reconnected or the old chip needs to be replaced, welding is carried out again, the welding difficulty of the welding point of the circuit board is easily increased, and the chip is inconvenient to disassemble and assemble for the chip with smaller size.

Therefore, the computer chip with the mounting structure is provided to effectively realize simple and convenient disassembly and assembly of the computer chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a computer chip with mounting structure in order to overcome prior art not enough.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

a computer chip with a mounting structure comprises a chip body and two L-shaped mounting plates for fixing the chip body, wherein the two L-shaped mounting plates are symmetrically arranged at two sides of the chip body, a packaging shell is arranged at the upper end of the chip body, the outer side walls of the two packaging shells are fixedly connected with buckling mechanisms, fixed buckling plates matched with the buckling mechanisms are fixedly connected to the opposite inner walls of the two L-shaped mounting plates, each buckling mechanism comprises an arc-shaped elastic sheet fixedly connected to the outer side wall of the packaging shell, the lower ends of the arc-shaped elastic sheets are fixedly connected with movable buckling plates mutually buckled and connected with the fixed buckling plates, the upper end of the packaging shell is fixedly connected with a heat dissipation mechanism, the side walls at two ends of the heat dissipation mechanism are respectively connected with the two L-shaped mounting plates through embedding plates and are buckled and connected with the fixed buckling plates on the L-shaped mounting plates through the buckling mechanisms connected to the chip body, the chip body is fixedly installed between the two L-shaped installation plates, the buckling mechanism realizes the buckling or dismounting between the movable buckling plate and the fixed buckling plate by pressing the arc-shaped elastic sheet, and therefore the simplification of installation is effectively improved.

Further, move to detain and establish the board and be cylindrical plate, the lateral surface of establishing the board is detained surely for with cylindrical plate assorted arcwall face, the curved surface that matches each other is favorable to both to detain each other and establishes the slip, easily detains to establish and connects also easily to slide and demolish.

Further, the interior bottom of L shape mounting panel is for detaining the arc curved surface of establishing the board and matcing with moving, the arc curved surface sets up downwards towards the one end slope of detaining the setting board certainly, and this arc curved surface sets up along moving the inclined motion direction of detaining after establishing the board and being pressed promptly, is convenient for move and detains the motion of establishing the board, and the interior bottom fixedly connected with arc cushion of L shape mounting panel, to moving detaining and establishing the board and play the extrusion effect, further effectively improve to move to detain and establish the board and detain the steadiness of establishing the board and detaining and establishing the connection surely, also have certain elasticity simultaneously because arc cushion to move to detain the in-process of establishing the board and detaining or demolising and can not cause the influence to its motion moving.

Furthermore, the bottom of the movable buckle setting plate is abutted and embedded with the side wall of the upper end of the arc-shaped elastic cushion, and the movable buckle setting plate is arranged with the end face of the arc-shaped elastic cushion in a sliding manner.

Further, heat dissipation mechanism includes the heating panel of fixed connection on encapsulation shell top, the equidistant fixedly connected with a plurality of heat dissipation strips of horizontal direction are followed to the upper end of heating panel, have effectively improved the radiating effect of this chip body at the during operation.

Furthermore, the inner bottom of the packaging shell is coated with a heat-conducting silica gel layer, and the heat-conducting silica gel layer is abutted to the side wall of the top end of the chip body.

Further, inlay and establish the board setting between the top of heating panel and L shape mounting panel, inlay the bottom fixedly connected with who establishes the board and inlay and establish the strip, the up end of establishing the board is the inclined plane that upwards sets up is detained surely, the up end of establishing the board is detained surely and is seted up and inlay and establish the chamber of establishing that the strip assorted inlays, inlays to establish the strip and inlays to establish the chamber and closely inlay and establish and be connected the back, realizes will inlaying to establish the board and inlay and establish and connect between the top of L shape mounting panel and heating panel.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

1. this scheme establishes the mechanism and establishes the board knot through linking the knot of detaining on the chip body and establishing the connection with deciding on the L shape mounting panel and establish the connection, realizes chip body fixed mounting between two L shape mounting panels, and detains and establishes the mechanism and realize moving to detain through pressing down arc flexure strip and establish the board and decide to detain the knot between establishing the board and establish or demolish to effectively improved the simplification nature of installation, need not to adopt traditional welding mode can realize the installation of chip.

2. The movable buckle is a cylindrical plate, the outer side surface of the fixed buckle is an arc-shaped surface matched with the cylindrical plate, and the mutually matched curved surfaces are beneficial to mutual buckling of the movable buckle and the cylindrical plate to realize sliding, and easy buckling, connection and sliding removal are also realized.

3. The interior bottom of L shape mounting panel is the arc curved surface, this arc curved surface sets up along moving the slope direction of motion of detaining after establishing the board and being pressed, be convenient for move and detain the motion of establishing the board, and the interior bottom fixedly connected with arc cushion of L shape mounting panel, detain to moving and establish the board and play the extrusion, further effectively improve to move to detain and establish the board and detain the steadiness of establishing the connection with deciding, simultaneously also because arc cushion has certain elasticity, thereby can not cause the influence to its motion moving the in-process of detaining and establishing the board and detaining or demolising.

4. The heat dissipation mechanism comprises a heat dissipation plate fixedly connected to the top end of the packaging shell, the upper end of the heat dissipation plate is fixedly connected with a plurality of heat dissipation strips at equal intervals along the horizontal direction, a heat conduction silica gel layer is coated on the inner bottom of the packaging shell, and the heat dissipation effect of the chip body in working is effectively improved.

5. Inlay and establish the board setting between the top of heating panel and L shape mounting panel, inlay the bottom fixedly connected with who establishes the board and inlay and establish the strip, the up end of establishing the board is the inclined plane that upwards sets up for the fixed knot, the up end of establishing the board is detained surely to set up and inlay and establish the strip assorted and inlay and establish the chamber, inlay and establish the chamber and closely inlay and establish and be connected the back, realize will inlay and establish the board and inlay and establish and connect between the top of L shape mounting panel and heating panel.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic three-dimensional structure diagram of the joint of the chip body, the buckling mechanism and the heat dissipation mechanism of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the L-shaped mounting plate and the embedding plate of the present invention;

fig. 4 is a schematic diagram of an external three-dimensional structure of the L-shaped mounting plate of the present invention.

Wherein: 1. a chip body; 2. an L-shaped mounting plate; 3. a package housing; 4. a fixed buckle setting plate; 5. an arc-shaped elastic sheet; 6. a movable buckling plate; 7. an arc-shaped elastic pad; 8. a heat dissipation plate; 9. a heat dissipating strip; 10. embedding a plate; 11. embedding a strip; 12. the cavity is embedded.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in the accompanying drawings 1-4 the utility model discloses a computer chip with mounting structure, including chip body 1 and be used for carrying out two L shape mounting panels 2 fixed to chip body 1, two L shape mounting panels 2 symmetry sets up the both sides at chip body 1, package housing 3 is installed to chip body 1's upper end, the equal fixedly connected with of lateral wall of two package housing 3 detains the establishment mechanism, equal fixedly connected with detains establishment mechanism assorted on two L shape mounting panels 2's the relative inner wall and detains establishment board 4, it includes arc flexure strip 5 of fixed connection on package housing 3 lateral wall to detain the establishment mechanism, the lower extreme fixedly connected with of arc flexure strip 5 detains the movable knot that establishes the connection each other with detaining establishment board 4 and establishes and detain establishment board 6.

What need supplement here is that the movable buckle setting plate 6 is a cylindrical plate, the outer side surface of the fixed buckle setting plate 4 is an arc-shaped surface matched with the cylindrical plate, and the mutually matched curved surfaces are beneficial to mutual buckling of the movable buckle setting plate and the cylindrical plate to set sliding, and easy buckling, connection and easy sliding removal are realized.

In addition, the inner bottom of the L-shaped mounting plate 2 is an arc-shaped curved surface matched with the movable buckling plate 6, the arc-shaped curved surface is obliquely and downwards arranged towards one end of the fixed buckling plate 4, namely, the arc-shaped curved surface is arranged along the inclined movement direction of the pressed movable buckling plate 6, so that the movable buckling plate 6 can move conveniently, an arc-shaped elastic cushion 7 is fixedly connected at the inner bottom of the L-shaped mounting plate 2, the bottom end of the movable buckle plate 6 is abutted against the side wall of the upper end of the arc-shaped elastic cushion 7, the movable buckle plate 6 is arranged with the end surface of the arc-shaped elastic cushion 7 in a sliding way, when the movable buckling plate 6 is buckled and connected with the fixed buckling plate 4, the arc-shaped elastic cushion 7 plays a role in extruding the movable buckling plate 6, so that the stability of the buckling and connection of the movable buckling plate 6 and the fixed buckling plate 4 is further effectively improved, meanwhile, the arc-shaped elastic cushion 7 has certain elasticity, so that the movement of the movable buckling plate 6 cannot be influenced in the process of buckling or dismantling the movable buckling plate.

The upper end fixedly connected with heat dissipation mechanism of encapsulation shell 3, the both ends lateral wall of heat dissipation mechanism all is connected with two L shape mounting panels 2 respectively through inlaying establishing board 10.

Specifically, heat dissipation mechanism includes fixed connection at the heating panel 8 on 3 tops of encapsulation shell, and a plurality of heat dissipation strips 9 of equidistant fixedly connected with of horizontal direction are followed to the upper end of heating panel 8, and the interior bottom coating of encapsulation shell 3 has heat conduction silica gel layer, and heat conduction silica gel layer offsets with the top lateral wall of chip body 1, has effectively improved the radiating effect of this chip body 1 at the during operation.

Inlay and establish board 10 and set up between the top of heating panel 8 and L shape mounting panel 2, the bottom fixedly connected with who inlays and establish strip 11 of establishing board 10, the up end of establishing board 4 is the inclined plane that upwards sets up is detained surely, the up end of establishing board 4 is detained surely sets up and inlays and establish strip 11 assorted and inlay and establish chamber 12, inlay and establish strip 11 and inlay and establish chamber 12 and closely inlay and establish and be connected the back, the realization will inlay and establish board 10 and inlay and establish and connect between the top of L shape mounting panel 2 and heating panel 8.

When the chip body 1 of the utility model is installed, the technicians in the field can fix two L-shaped mounting plates 2 for fixing the chip body 1 on a circuit board in advance according to the size of the chip, welding or screw connection can be adopted, the installation mode is the prior art, and the details are not repeated herein, the chip body 1 with a heat dissipation mechanism is embedded between the two L-shaped mounting plates 2, the concrete operation is that the technicians press the arc-shaped elastic sheet 5 towards the inner side of the chip body 1 by both hands, the arc-shaped elastic sheet 5 has super elasticity, when pressing, the movable buckle setting plate 6 is driven to move away from one side of the fixed buckle setting plate 4, so that the movable buckle setting plate 6 smoothly passes over the fixed buckle setting plate 4 and moves downwards, when the bottom end of the chip body 1 contacts the circuit board, the movable buckle setting plate 6 extrudes the arc-shaped elastic pad 7 and is positioned below the fixed buckle setting plate 4, at the moment, the arc-shaped elastic sheet 5 is loosened, the arc-shaped elastic sheet 5 resets to drive the movable buckling plate 6 to move towards one side far away from the chip body 1, so that buckling connection between the movable buckling plate 6 and the fixed buckling plate 4 is realized, the arc-shaped elastic cushion 7 arranged at the bottom in the L-shaped mounting plate 2 plays a role in extruding the movable buckling plate 6, the stability of buckling connection between the movable buckling plate 6 and the fixed buckling plate 4 is further effectively improved, meanwhile, the arc-shaped elastic cushion 7 has certain elasticity, so that influence on movement of the movable buckling plate 6 in the buckling or dismantling process is avoided, finally, top end packaging is carried out through the embedding plate 10, after the installation is finished, the circuit surface of the chip body 1 is in close contact with the circuit board to realize electric connection, and the prior art is provided;

when needs are dismantled, will inlay and establish board 10 and extract the back from L shape mounting panel 2, like the same, press arc flexure strip 5 to one side of chip body 1 to the realization will move to detain and establish board 6 and demolish from deciding to detain and establish board 4, convenient operation need not to realize the installation of chip through welding repeatedly.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. The utility model provides a computer chip with mounting structure, includes chip body (1) and is used for carrying out two L shape mounting panels (2) fixed to chip body (1), its characterized in that: two L shape mounting panel (2) symmetry sets up the both sides in chip body (1), encapsulation shell (3), two are installed to the upper end of chip body (1) the equal fixedly connected with of lateral wall of encapsulation shell (3) is detained and is established the mechanism, two equal fixedly connected with on the relative inner wall of L shape mounting panel (2) with detain and establish mechanism assorted and detain and establish board (4), detain and establish mechanism and include arc flexure strip (5) of fixed connection on encapsulation shell (3) lateral wall, the lower extreme fixedly connected with of arc flexure strip (5) detain with detain to establish board (4) the action of establishing the connection each other and detain and establish board (6), the upper end fixedly connected with heat dissipation mechanism of encapsulation shell (3), the both ends lateral wall of heat dissipation mechanism is all established board (10) through inlaying and is connected with two L shape mounting panels (2) respectively.

2. The computer chip with the mounting structure of claim 1, wherein: the movable buckle setting plate (6) is a cylindrical plate, and the outer side face of the fixed buckle setting plate (4) is an arc-shaped face matched with the cylindrical plate.

3. A computer chip with a mounting structure according to claim 2, wherein: the interior bottom of L shape mounting panel (2) is for detaining with moving and establish board (6) assorted arc curved surface, the arc curved surface sets up downwards to the one end slope of detaining fixedly and establishing board (4), and the interior bottom fixedly connected with arc cushion (7) of L shape mounting panel (2).

4. A computer chip with a mounting structure according to claim 3, wherein: the bottom end of the movable buckle establishing plate (6) is abutted and embedded with the upper end side wall of the arc-shaped elastic cushion (7), and the movable buckle establishing plate (6) and the end face of the arc-shaped elastic cushion (7) are arranged in a sliding mode.

5. The computer chip with the mounting structure of claim 4, wherein: the heat dissipation mechanism comprises a heat dissipation plate (8) fixedly connected to the top end of the packaging shell (3), and a plurality of heat dissipation strips (9) are fixedly connected to the upper end of the heat dissipation plate (8) at equal intervals along the horizontal direction.

6. The computer chip with the mounting structure of claim 5, wherein: the inner bottom of the packaging shell (3) is coated with a heat-conducting silica gel layer, and the heat-conducting silica gel layer is abutted to the side wall of the top end of the chip body (1).

7. The computer chip with the mounting structure of claim 6, wherein: inlay and establish board (10) and set up between the top of heating panel (8) and L shape mounting panel (2), inlay the bottom fixedly connected with who establishes board (10) and inlay and establish strip (11), the up end of establishing board (4) is the inclined plane that upwards sets up is detained surely, the up end of establishing board (4) is detained surely and is seted up and inlays and establish strip (11) assorted and inlay and establish chamber (12).