CN210945767U - Magnetron sputtering coating device - Google Patents
Magnetron sputtering coating device Download PDFInfo
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- CN210945767U CN210945767U CN201921014840.8U CN201921014840U CN210945767U CN 210945767 U CN210945767 U CN 210945767U CN 201921014840 U CN201921014840 U CN 201921014840U CN 210945767 U CN210945767 U CN 210945767U
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Abstract
The utility model provides a magnetron sputtering coating device, magnetron sputtering coating device includes: the device comprises a process chamber, a sputtering power supply and at least one cathode mechanism, wherein the anode of the sputtering power supply is connected with the process chamber, the cathode of the sputtering power supply is connected with the cathode mechanism, and the cathode mechanism comprises: the device comprises a cathode, a target and a lifting unit, wherein one end of the cathode is connected with the lifting unit, the other end of the cathode is connected with the target, the target is arranged in the process chamber, and the lifting unit is used for driving the target to move close to or far away from a substrate to be processed so as to adjust the distance between the target and the substrate to be processed; the utility model discloses a according to the consumption degree of target, adjust the parameter of lift unit to adjust the target and wait to process the distance between the base plate, and then guarantee the stability and the homogeneity of coating film.
Description
Technical Field
The utility model relates to a coating device's technical field, concretely relates to magnetron sputtering coating device.
Background
Magnetron sputtering coating refers to a coating technology of using a coating material as a target cathode, bombarding the target material with argon ions to generate cathode sputtering, and sputtering target material atoms onto a workpiece to form a deposition layer, but it is found that the target material connected with the cathode is continuously consumed along with the coating, and the distance between the target material and a substrate to be processed is continuously increased along with the consumption process, but it is found that: because the distance between the target and the substrate to be processed cannot be adjusted, the stability and uniformity of the coating film cannot be ensured.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the present invention is to provide a magnetron sputtering coating apparatus, so as to alleviate the technical problem caused by the fact that the distance between the target and the substrate to be processed cannot be adjusted.
Technical scheme (I)
The utility model provides a magnetron sputtering coating device, magnetron sputtering coating device includes: the device comprises a process chamber, a sputtering power supply and at least one cathode mechanism, wherein the anode of the sputtering power supply is connected with the process chamber, the cathode of the sputtering power supply is connected with the cathode mechanism, and the cathode mechanism comprises: the device comprises a cathode, a target and a lifting unit, wherein one end of the cathode is connected with the lifting unit, the other end of the cathode is connected with the target, the target is arranged in the process chamber, and the lifting unit is used for driving the target to move close to or away from a substrate to be processed so as to adjust the distance between the target and the substrate to be processed.
Optionally, the cathode mechanism further includes: the laser ranging device comprises a laser ranging sensor, the setting position of the laser ranging sensor is the same as the setting position of the lifting unit, the transmitting end of the laser ranging sensor faces the direction of the target material, laser emitted by the laser ranging sensor irradiates the consumption position of the target material, and the laser ranging sensor is used for detecting the distance between the consumption position and the consumption position of the target material in real time.
Optionally, the lifting unit and the laser ranging sensor are both arranged outside the process chamber, an observation window is arranged at a position where the laser ranging sensor is in contact with a light path of the process chamber, and laser emitted by the laser ranging sensor passes through the observation window and irradiates a consumption position of the target.
Optionally, the magnetron sputtering coating device further comprises a PLC controller, the PLC controller is disposed on one side of the process chamber, the lifting unit and the laser ranging sensor are electrically connected to the PLC controller, the laser ranging sensor sends a distance signal detected in real time to the PLC controller, and the PLC controller adjusts the number of revolutions of the lifting unit according to the distance signal to change the distance between the target and the substrate to be processed.
Optionally, the PLC controller includes a central processing module and a storage module, an output end of the storage module is connected to an input end of the central processing module, and the storage module is configured to store a preset distance between the laser ranging sensor and the target, and use the distance as a process parameter.
Optionally, the PLC controller further includes a difference determination module, where the difference determination module is configured to perform difference analysis on the received distance signal and a preset process parameter, and transmit a difference analysis result to the central processing module, and the central processing module converts the difference analysis result into rotation number adjustment information of the lifting unit, so as to change a distance between the target and the substrate to be processed.
Optionally, an output end of the laser ranging sensor is connected to an input end of the difference value determining module, and an output end of the difference value determining module is connected to another input end of the central processing module.
Optionally, an output end of the central processing module is connected to an input end of the controller of the lifting unit, and the central processing module is configured to convert the received difference analysis result into parameter adjustment information of the lifting unit, and send the adjustment information to the controller of the lifting unit in real time, so as to change a distance between the target and the substrate to be processed.
Optionally, a transmission device is arranged in the process chamber, the substrate to be processed is placed on the transmission device, and the cathode mechanism is arranged on one side close to the substrate to be processed.
Optionally, the number of the cathode mechanisms is at least two, the two cathode mechanisms are arranged at two ends of the process chamber, and the two cathode mechanisms are arranged on the same side wall surface of the process chamber.
(II) beneficial effect:
compared with the prior art, the utility model, following beneficial effect has:
the utility model provides a magnetron sputtering coating device, magnetron sputtering coating device includes: the device comprises a process chamber, a sputtering power supply and at least one cathode mechanism, wherein the anode of the sputtering power supply is connected with the process chamber, the cathode of the sputtering power supply is connected with the cathode mechanism, and the cathode mechanism comprises: the device comprises a cathode, a target and a lifting unit, wherein one end of the cathode is connected with the lifting unit, the other end of the cathode is connected with the target, the target is arranged in the process chamber, and the lifting unit is used for driving the target to move close to or far away from a substrate to be processed so as to adjust the distance between the target and the substrate to be processed; the utility model discloses a according to the consumption degree of target, adjust the parameter of lift unit to adjust the target and wait to process the distance between the base plate, and then guarantee the stability and the homogeneity of coating film.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained without inventive exercise, wherein:
fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is the utility model discloses well lift unit and laser rangefinder sensor complex structure block diagram.
Reference numerals:
1. a process chamber; 2. a cathode mechanism; 3. a target material; 4. a lifting unit; 5. a laser ranging sensor; 6. an observation window; 7. a difference value judging module; 8. a central processing module; 9. a bellows; 10. a transmission device; 11. a storage module; 12. a substrate to be processed; 13. and a cathode.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention will be described in further detail with reference to the following drawings and embodiments:
as shown in fig. 1 and 2, the present application discloses a magnetron sputtering coating device, including: the sputtering device comprises a process chamber 1, a sputtering power supply and at least one cathode mechanism 2, wherein the anode of the sputtering power supply is connected with the process chamber 1, specifically, the anode of the sputtering power supply is connected with a grounding wire of the process chamber 1, the cathode of the sputtering power supply is connected with the cathode mechanism 2, and the cathode mechanism 2 comprises: the cathode 13, the target 3 and the lifting unit 4, wherein the lifting unit 4 can be a lifting motor or a lifting cylinder, an oil cylinder and the like, preferably, the lifting unit 4 is set as a lifting motor, the cathode 13 is a planar cathode 13, and the target 3 is a graphite target; one end of negative pole 13 is connected with lift unit 4, and the other end of negative pole 13 is connected with target 3, lift unit 4 can set up the outside at process chamber 1, also can set up the inboard at process chamber 1, target 3 sets up in process chamber 1, lift unit 4 is used for driving target 3 and is close to or keeps away from the motion of treating processing base plate 12, in order to adjust the distance between target 3 and the base plate 12 of treating processing, preferably, lift unit 4 sets up to servo motor, can change the distance between target 3 and the base plate 12 of treating processing in real time through adjusting servo motor's parameter, because servo motor's adjustment precision is higher, can reach within 0.1mm, can adjust the distance between target 3 and the base plate 12 of treating processing more accurately, lift unit 4's lectotype is confirmed according to the production needs, for example: the type of the lifting unit 4 is R88D-1SN04H-ECT or R88M-1M 40030T-O.
The utility model discloses a according to the consumption degree of target 3, adjust the parameter of lift unit 4 to adjust target 3 and wait to process the distance between the base plate 12, and then guarantee the stability and the homogeneity of coating film.
When the device is used, argon gas is introduced into the process chamber 1, an electric field is generated between the cathode 13 and the substrate 12 to be processed by using a sputtering power supply, then electrons fly to the substrate 12 to be processed under the action of the electric field E and collide with argon atoms in the flying process to ionize the argon atoms to generate argon positive ions and new electrons, the new electrons continuously fly to the substrate 12 to be processed, the argon ions accelerate to fly to the target 3 arranged on the cathode 13 under the action of the electric field and finally bombard the surface of the target 3 with high energy to sputter the target 3, so that neutral target atoms or molecules in sputtered particles are deposited on the substrate 12 to be processed to form a film, and the film coating process is further completed.
According to an embodiment of the present invention, for more accurately adjusting the distance between the target 3 and the substrate 12 to be processed, the cathode mechanism 2 further includes: laser rangefinder sensor 5, laser rangefinder sensor 5 can set up in the 1 outside of process chamber, or can set up the inside at process chamber 1, laser rangefinder sensor 5 set up the position the same with the lifting unit 4 set up the position, this design guarantees the distance signal that detects through laser rangefinder sensor 5, can be through the accurate distance between 3 and the pending base plate 12 of adjusting target of lifting unit 4, and the transmitting terminal of laser rangefinder sensor 5 is towards the direction of target 3, the laser irradiation that laser rangefinder sensor 5 sent is in the consumption department of target 3, laser rangefinder sensor 5 is used for the distance between the real-time detection and the 3 consumption departments of target.
According to an embodiment of the present invention, the lifting unit 4 and the laser distance measuring sensor 5 are both disposed outside the process chamber 1, the observation window 6 is disposed at the position where the laser distance measuring sensor 5 contacts with the optical path of the process chamber 1, and the laser emitted from the laser distance measuring sensor 5 passes through the observation window 6 and irradiates the consumption part of the target 3; preferably, the observation window 6 is made of a material with a low dielectric constant, which ensures that the laser can penetrate through the observation window 6 and cannot be absorbed by the observation window 6; when the laser ranging device is used, the emitting end of the laser ranging sensor 5 emits laser to the surface of the target 3, the laser can be reflected after the laser is contacted with the target 3, the receiving end of the laser ranging sensor 5 receives part of the reflected laser, the timer of the laser ranging sensor 5 measures the time from emitting to receiving of the laser beam in real time, and the distance from the emitting end of the laser ranging sensor 5 to the target 3 is calculated.
According to the utility model discloses an embodiment is equipped with bellows 9 between elevating unit 4 and the process chamber 1, and bellows 9 is used for sealing elevating unit 4 and the junction of process chamber 1 to guarantee process chamber 1's vacuum environment, and then guarantee the coating film effect.
According to the utility model discloses an embodiment, for realizing accurate control between lifting unit 4 and the laser range sensor 5, magnetron sputtering coating device still includes the PLC controller, the PLC controller sets up the one side at process chamber 1, lifting unit 4 and laser range sensor 5 all with PLC controller electric connection, laser range sensor 5 sends the distance signal that detects in real time for the PLC controller, the PLC controller will adjust lifting unit 4's revolution according to the distance signal, with the distance between 3 and the pending processing base plate 12 of change target, wherein, not only be limited to the revolution of adjusting lifting unit 4, for example, power and the time that can be through adjusting lifting unit 4 are also in the parameter range that this application was considered.
According to the utility model discloses an embodiment, the PLC controller includes central processing module 8 and storage module 11, and storage module 11's output is connected with an input of central processing module 8, and storage module 11 is used for storing the distance between predetermined laser rangefinder sensor 5 and the target 3 to regard this distance as technological parameter.
According to the utility model discloses an embodiment, still include difference judgment module 7 in the PLC controller, difference judgment module 7 is used for carrying out the difference analysis with received distance signal and predetermined technological parameter, the difference of received distance is subtracted with predetermined technological parameter promptly to give central processing module 8 with the difference analysis result transmission, central processing module 8 turns into the revolution adjustment information of lift unit 4 with this difference analysis result, with change target 3 and wait to process the distance between the base plate 12.
According to the utility model discloses an embodiment, laser rangefinder sensor 5's output is connected with difference judgment module 7's input for acquire predetermined technological parameter in the storage module, difference judgment module 7's output is connected with another input of central processing module 8.
According to the utility model discloses an embodiment, an output of central processing module 8 is connected with the controller input of lift unit 4, and central processing module 8 is used for turning into lift unit 4's parameter adjustment information with received difference analysis result to send this adjustment information for lift unit 4's controller in real time, with the distance of changing target 3 and waiting to process between the base plate 12.
Specifically, the method for adjusting the distance between the target 3 and the substrate 12 to be processed includes the following steps:
s1: and inputting a preset distance between the laser ranging sensor 5 and the target 3 in a storage module of the PLC as a process parameter.
S2: the distance between the emitting end of the laser ranging sensor 5 and the target 3 is measured by the laser sensor, and then the distance information is transmitted to a difference value judgment module 7 of the PLC.
S3: the difference value judging module 7 performs difference value analysis on the received distance and the preset distance between the laser ranging sensor 5 and the target 3, that is, the difference value of the received distance is subtracted from the preset process parameter, the difference value is the thickness consumed by the target 3, and when the difference value is 0, the step returns to S2; and when the difference is not 0, transmitting the analysis result of the difference to the central processing module 8 in real time.
S4: the central processing module 8 receives the difference analysis result sent by the difference judgment module 7, converts the difference analysis result into parameter adjustment information of the lifting unit 4, and sends the adjustment information to the controller of the lifting unit 4 in real time to change the distance between the target 3 and the substrate 12 to be processed, for example, if the target 3 consumes 2mm, the parameter of the lifting unit 4 is correspondingly changed to shorten the distance between the target 3 and the substrate 12 to be processed by 2mm, so as to ensure that the distance between the target 3 and the substrate 12 to be processed is kept constant in a consistent manner in the film coating process, thereby ensuring the stability and uniformity of the film coating.
According to the utility model discloses an embodiment, in order to guarantee that the surface of waiting to process base plate 12 is whole by the coating film, be equipped with transmission device 10 in process chamber 1, wait to process base plate 12 and place on transmission device 10, transmission device 10 can set up to conveyer belt or cylinder, and cathode mechanism 2 sets up in the one side that is close to waiting to process base plate 12 to guarantee that the surface of waiting to process base plate 12 all is plated the film, guarantee to wait to process base plate 12's coating film effect.
According to the utility model discloses an embodiment, because the scope of 2 coating films of a cathode mechanism is limited, treat the coating film effect on the processing base plate 12 in order to guarantee, can set up two 2 cooperation works of cathode mechanism, theoretically, 2 quantity of cathode mechanism that set up are more, treat that the coating film effect on the processing base plate 12 is better, the region of coating film not can not appear, nevertheless save the cost in order to guarantee the coating film effect, cathode mechanism 2 sets up to at least two, two 2 setting of cathode mechanism are at process chamber 1's both ends, and two 2 all setting of cathode mechanism are on process chamber 1's same lateral wall face, the coating film technology that two 2 cooperation of cathode mechanism go on of this design assurance is all plated on the coplanar of treating processing base plate 12, and can not appear plating the condition on coplanar, guarantee the coating film effect.
The working process of the utility model is explained as follows:
when the device is used, a power supply is switched on, argon is introduced into the process chamber 1, an electric field is generated between the cathode 13 and the substrate 12 to be processed by using a sputtering power supply, then electrons fly to the substrate 12 to be processed under the action of the electric field E and collide with argon atoms in the flying process to ionize the argon atoms to generate argon positive ions and new electrons, the new electrons continuously fly to the substrate 12 to be processed, the argon ions accelerate to fly to the target 3 arranged on the cathode 13 under the action of the electric field and finally bombard the surface of the target 3 with high energy to sputter the target 3, so that neutral target atoms or molecules in sputtered particles are deposited on the substrate 12 to be processed to form a thin film, and the film coating process is further completed.
Meanwhile, the distance between the target 3 and the substrate 12 to be processed is adjusted as follows:
s1: and inputting a preset distance between the laser ranging sensor 5 and the target 3 in a storage module of the PLC as a process parameter.
S2: the distance between the emitting end of the laser ranging sensor 5 and the target 3 is measured by the laser sensor, and then the distance information is transmitted to a difference value judgment module 7 of the PLC.
S3: the difference value judging module 7 performs difference value analysis on the received distance and the preset distance between the laser ranging sensor 5 and the target 3, that is, the difference value of the received distance is subtracted from the preset process parameter, the difference value is the thickness consumed by the target 3, and when the difference value is 0, the step returns to S2; and when the difference is not 0, transmitting the analysis result of the difference to the central processing module 8 in real time.
S4: the central processing module 8 receives the difference analysis result sent by the difference judgment module 7, converts the difference analysis result into parameter adjustment information of the lifting unit 4, and sends the adjustment information to the controller of the lifting unit 4 in real time to change the distance between the target 3 and the substrate 12 to be processed, for example, if the target 3 consumes 2mm, the parameter of the lifting unit 4 is correspondingly changed to shorten the distance between the target 3 and the substrate 12 to be processed by 2mm, so as to ensure that the distance between the target 3 and the substrate 12 to be processed is kept constant in a consistent manner in the film coating process, thereby ensuring the stability and uniformity of the film coating.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the words "bottom" and "top", "inner" and "outer" refer to directions toward and away from, respectively, a particular component geometry.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only for the preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A magnetron sputtering coating device is characterized by comprising: the device comprises a process chamber (1), a sputtering power supply and at least one cathode mechanism (2), wherein the positive pole of the sputtering power supply is connected with the process chamber (1), the negative pole of the sputtering power supply is connected with the cathode mechanism (2), and the cathode mechanism (2) comprises: the device comprises a cathode (13), a target (3) and a lifting unit (4), wherein one end of the cathode (13) is connected with the lifting unit (4), the other end of the cathode (13) is connected with the target (3), the target (3) is arranged in the process chamber (1), and the lifting unit (4) is used for driving the target (3) to move close to or away from a substrate (12) to be processed so as to adjust the distance between the target (3) and the substrate (12) to be processed.
2. The magnetron sputtering coating device according to claim 1, wherein the cathode mechanism (2) further comprises: the device comprises a laser ranging sensor (5), wherein the setting position of the laser ranging sensor (5) is the same as that of the lifting unit (4), the emitting end of the laser ranging sensor (5) faces the direction of the target (3), laser emitted by the laser ranging sensor (5) irradiates the consumption part of the target (3), and the laser ranging sensor (5) is used for detecting the distance between the consumption part and the consumption part of the target (3) in real time.
3. The magnetron sputtering coating device according to claim 2, wherein the lifting unit (4) and the laser ranging sensor (5) are both disposed outside the process chamber (1), an observation window (6) is disposed at a position where the laser ranging sensor (5) is in contact with the optical path of the process chamber (1), and the laser emitted by the laser ranging sensor (5) passes through the observation window (6) and irradiates the consumed part of the target (3).
4. The magnetron sputtering coating device according to claim 1, further comprising a PLC controller disposed at one side of the process chamber (1), wherein the lifting unit (4) and the laser distance measuring sensor (5) are electrically connected to the PLC controller, the laser distance measuring sensor (5) sends a real-time detected distance signal to the PLC controller, and the PLC controller adjusts the number of rotations of the lifting unit (4) according to the distance signal to change the distance between the target (3) and the substrate (12) to be processed.
5. The magnetron sputtering coating device according to claim 4, wherein the PLC controller comprises a central processing module (8) and a storage module (11), an output end of the storage module (11) is connected with an input end of the central processing module (8), and the storage module (11) is used for storing a preset distance between the laser ranging sensor (5) and the target (3) and taking the distance as a process parameter.
6. The magnetron sputtering coating device according to claim 5, further comprising a difference value determining module (7) in the PLC, wherein the difference value determining module (7) is configured to perform a difference value analysis on the received distance signal and a preset process parameter, and transmit a difference value analysis result to the central processing module (8), and the central processing module (8) converts the difference value analysis result into rotation number adjustment information of the lifting unit (4) to change a distance between the target (3) and the substrate (12) to be processed.
7. The magnetron sputtering coating device according to claim 6, wherein the output end of the laser ranging sensor (5) is connected with the input end of the difference value judging module (7), and the output end of the difference value judging module (7) is connected with the other input end of the central processing module (8).
8. The magnetron sputtering coating device according to claim 7, wherein an output end of the central processing module (8) is connected with an input end of a controller of the lifting unit (4), and the central processing module (8) is configured to convert the received difference analysis result into parameter adjustment information of the lifting unit (4) and send the adjustment information to the controller of the lifting unit (4) in real time to change the distance between the target (3) and the substrate (12) to be processed.
9. The magnetron sputtering coating device according to claim 1, wherein a transfer device (10) is provided in the process chamber (1), the substrate (12) to be processed is placed on the transfer device (10), and the cathode mechanism (2) is provided on a side close to the substrate (12) to be processed.
10. The magnetron sputtering coating device according to claim 9, wherein the number of the cathode mechanisms (2) is at least two, two cathode mechanisms (2) are arranged at two ends of the process chamber (1), and the two cathode mechanisms (2) are arranged on the same side wall surface of the process chamber (1).
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| CN201921014840.8U CN210945767U (en) | 2019-07-01 | 2019-07-01 | Magnetron sputtering coating device |
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| CN201921014840.8U CN210945767U (en) | 2019-07-01 | 2019-07-01 | Magnetron sputtering coating device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113718209A (en) * | 2021-07-23 | 2021-11-30 | 镇江市德利克真空设备科技有限公司 | Lifting type adjusting device for planar cathode device |
| DE102020006604A1 (en) | 2020-10-28 | 2022-04-28 | Michael Walde | Device for producing coatings by magnetron sputtering |
-
2019
- 2019-07-01 CN CN201921014840.8U patent/CN210945767U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020006604A1 (en) | 2020-10-28 | 2022-04-28 | Michael Walde | Device for producing coatings by magnetron sputtering |
| CN113718209A (en) * | 2021-07-23 | 2021-11-30 | 镇江市德利克真空设备科技有限公司 | Lifting type adjusting device for planar cathode device |
| CN113718209B (en) * | 2021-07-23 | 2023-10-17 | 镇江市德利克真空设备科技有限公司 | Lifting type adjusting device for planar cathode device |
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Effective date of registration: 20210112 Address after: 101149 102-lq307, 1-3 / F, building 26, No. 17, huanke Middle Road, Jinqiao Science and technology industrial base, Tongzhou Park, Zhongguancun Science and Technology Park, Tongzhou District, Beijing Patentee after: Deyun Chuangxin (Beijing) Technology Co.,Ltd. Address before: 100176 10th floor, building 2, yard 9, Ronghua South Road, Yizhuang Economic and Technological Development Zone, Daxing District, Beijing Patentee before: Juntai innovation (Beijing) Technology Co.,Ltd. |