CN210927975U - MEMS microphone chip - Google Patents
MEMS microphone chip Download PDFInfo
- Publication number
- CN210927975U CN210927975U CN201922301021.8U CN201922301021U CN210927975U CN 210927975 U CN210927975 U CN 210927975U CN 201922301021 U CN201922301021 U CN 201922301021U CN 210927975 U CN210927975 U CN 210927975U
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- back plate
- mems microphone
- microphone chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a MEMS microphone chip, at the bottom of and the vibrating diaphragm including the substrate, substrate bottom edge fixed connection first insulation board, first insulation board upper end fixed connection second insulation board, the insulating back plate of second insulation board upper end fixed connection, the inside parcel conductor back plate of insulating back plate, be connected the vibrating diaphragm between the bottom of insulating back plate and the substrate, four at least vertical arrangement's of fixed connection spacing post, four at least between the bottom of insulating back plate and the substrate spacing post all runs through the vibrating diaphragm. The utility model provides a MEMS microphone chip has because conductor back plate and vibrating diaphragm produce effective electric capacity in effective vibration district, and does not produce electric capacity between insulating back plate and the vibrating diaphragm to reduce parasitic capacitance, improved the work sensitivity, spacing post effectively prevents vibrating diaphragm horizontal hunting in addition, has improved life, and makes the vibration of vibrating diaphragm more accurate, has improved the sound effect of chip.
Description
Technical Field
The utility model relates to an electron device technical field especially relates to a MEMS microphone chip.
Background
The MEMS microphone chip is a key component of the MEMS microphone, the MEMS microphone chip is generally formed by superposing a substrate layer, a diaphragm layer and a back pole layer according to specific design requirements, and the existing MEMS microphone chip structure is as follows: by supreme stratum basale down in proper order, rete and back of the body utmost point layer vibrate, be provided with the sound chamber on the stratum basale, the portion that covers in the sound chamber on the rete vibrates is the effective vibration district of vibrating diaphragm, other positions are the ineffective vibration district, and the parasitic capacitance that can form in the ineffective vibration district, and parasitic capacitance can the sensitivity and the SNR of MEMS microphone, in addition because the vibrating diaphragm itself has elasticity, receiving the vibration in-process, the horizontal hunting takes place easily, can lead to the vibration effect poor like this, and the vibrating diaphragm takes place the distortion easily under big amplitude, fall into the back of the body chamber even.
Therefore, it is necessary to provide a MEMS microphone chip to solve the above technical problems.
Disclosure of Invention
The utility model provides a MEMS microphone chip has solved sensitivity and the SNR that parasitic capacitance that the invalid vibration district produced can the MEMS microphone, in addition because vibrating diaphragm itself has elasticity, receiving the vibration in-process, takes place the horizontal hunting easily, can lead to the vibration effect poor like this to the vibrating diaphragm takes place the distortion easily under big amplitude, falls into the problem in the back of the body chamber even.
For solving the technical problem, the utility model provides a pair of MEMS microphone chip, at the bottom of and the vibrating diaphragm including the substrate, substrate bottom edge fixed connection first insulation board, first insulation board upper end fixed connection second insulation board, upside at the bottom of second insulation board upper end fixed connection insulating back polar plate and insulating back polar plate are in the substrate, the inside parcel conductor back polar plate of insulating back polar plate, be connected the vibrating diaphragm between at the bottom of insulating back polar plate and the substrate, four at least vertical arrangement's of fixed connection spacing post, four at least between insulating back polar plate and the substrate spacing post all runs through the vibrating diaphragm.
Preferably, a sound cavity with a through upper surface and a through lower surface is processed on the substrate bottom, and the vibrating diaphragm covers the upper side of the sound cavity.
Preferably, a plurality of sound holes are formed in the insulating back plate and penetrate through the conductor back plate.
Preferably, the vibrating diaphragm is provided with at least four guide holes, and a sliding sleeve is bonded in the guide holes and is connected to the annular outer side of the limiting column in a sliding manner.
Preferably, the lower end of the insulating back plate is bonded with a plurality of second salient points, the second salient points are positioned on the upper side of the vibrating diaphragm, and the upper end of the base material is bonded with a plurality of first salient points, the first salient points are positioned on the lower side of the vibrating diaphragm.
Preferably, a plurality of limiting plates are bonded to the annular inner wall of the first insulating plate, and the limiting plates are located on the upper side of the vibrating diaphragm.
Preferably, a plurality of second salient points are bonded to the upper end of the vibrating diaphragm, and a plurality of first salient points are bonded to the lower end of the vibrating diaphragm.
Preferably, the upper and lower sides of the conductor back plate are both bonded with insulating back plates.
Preferably, the limiting column is made of a cylinder processed by monocrystalline silicon, polycrystalline silicon, silicon dioxide or silicon nitride.
Compared with the prior art, the utility model provides a MEMS microphone chip has following beneficial effect:
the utility model provides a MEMS microphone chip, because conductor back plate and vibrating diaphragm produce electric capacity in effective vibration district, this electric capacity is effective electric capacity, and the inside parcel conductor back plate of insulating back plate, make and not produce electric capacity between insulating back plate and the vibrating diaphragm, thereby parasitic capacitance has been reduced, the work sensitivity has been improved, spacing post effectively prevents the transverse oscillation of vibrating diaphragm in the vibration process in addition, prevent that the vibrating diaphragm from taking place the distortion because of the too big amplitude and getting into in the vocal cavity even or dropping from the vocal cavity, service life is prolonged, and make the vibration of vibrating diaphragm more accurate, the sound effect of chip has been improved.
Drawings
Fig. 1 is a schematic structural diagram of a MEMS microphone chip according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a MEMS microphone chip;
FIG. 3 is a schematic structural diagram of another embodiment of a MEMS microphone chip;
fig. 4 is a schematic structural diagram of the diaphragm shown in fig. 1.
Reference numbers in the figures: 1. the base material is at the bottom, 2, vibrating diaphragm, 3, first insulating board, 4, second insulation board, 5, insulating back plate, 6, conductor back plate, 7, phonic hole, 8, spacing post, 11, acoustic cavity, 12, first bump, 13, limiting plate, 14, second bump, 21, guide hole.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
Please refer to fig. 1, fig. 2, fig. 3 and fig. 4 in combination, wherein fig. 1 is a schematic diagram of embodiment 1; FIG. 2 is a schematic view of example 3; FIG. 3 is a schematic view of example 2; fig. 4 shows the diaphragm 2. The utility model provides a MEMS microphone chip, 1 and vibrating diaphragm 2 at the bottom of including the substrate, 1 upper end border position fixed connection first insulation board 3 at the bottom of the substrate, 3 upper end fixed connection second insulation boards 4 of first insulation board, 4 upper ends fixed connection insulating back polar plate 5 of second insulation board and insulating back polar plate 5 locate at the bottom of the substrate 1 upside, insulating back polar plate 5 inside parcel conductor back polar plate 6, connect vibrating diaphragm 2 at the bottom of insulating back polar plate 5 and the substrate 1 between, fixed connection four at least vertical arrangement's spacing post 8 at the bottom of insulating back polar plate 5 and the substrate 1, vibrating diaphragm 2 is all run through to four at least spacing posts 8.
Specifically, because the conductor back plate 6 is a conductor, the conductor back plate 6 can generate capacitance with the vibrating diaphragm 2, and because the conductor back plate 6 is located in the back region, which is vertically corresponding to the effective vibration region of the vibrating diaphragm 2, the conductor back plate 6 and the effective vibration region of the vibrating diaphragm 2 generate capacitance, which is effective capacitance, and the insulating back plate 5 is internally wrapped by the conductor back plate 6, no capacitance is generated between the insulating back plate 5 and the vibrating diaphragm 2, thereby reducing parasitic capacitance, improving working sensitivity, and in addition, the vibrating diaphragm 2 can vibrate vertically along the limiting column 8, so that the limiting column 8 effectively prevents the vibrating diaphragm 2 from swinging transversely in the vibration process, preventing the vibrating diaphragm 2 from being distorted and even entering the sound cavity 11 or falling from the sound cavity 11 due to too large amplitude, improving service life, and making the vibration of the vibrating diaphragm 2 more accurate, the sound effect of the chip is improved.
The substrate bottom 1 is provided with a sound cavity 11 with a through upper surface and a through lower surface, and the vibrating diaphragm 2 covers the upper side of the sound cavity 11, and particularly, external vibration is conveniently transmitted to the vibrating diaphragm 2.
A plurality of sound holes 7 are formed in the insulating back plate 5, and the sound holes 7 penetrate through the conductor back plate 6, so that sound can be transmitted conveniently.
Set up four at least guide holes 21 on vibrating diaphragm 2, bonding sliding sleeve and sliding sleeve sliding connection are in the 8 annular outsides of spacing post in the guide hole 21, specifically, enable spacing post 8 to run through guide hole 21, realize the installation of vibrating diaphragm 2, and the design of sliding sleeve is even in vibrating diaphragm 2 reciprocates along spacing post 8 in addition, also realizes protect function in addition.
3 annular inner walls of first insulation board bond a plurality of limiting plates 13 and limiting plate 13 is in the 2 upsides of vibrating diaphragm, specifically, the design of limiting plate 13 is effectively spacing 2 edge portions of vibrating diaphragm, further prevents that vibrating diaphragm 2 from taking place the distortion.
In embodiment 3, the conductive back plate 6 is bonded with the insulating back plate 5 on the upper and lower sides, and particularly, as shown in fig. 2, the production is convenient.
The limiting column 8 is made of a cylinder processed by monocrystalline silicon, polycrystalline silicon, silicon dioxide or silicon nitride, and specifically, the material of the limiting column 8 may be, but is not limited to monocrystalline silicon, polycrystalline silicon, silicon dioxide or silicon nitride. The above materials are similar to those of the vibrating diaphragm 2 and the base material 1, so that the working is not influenced and the processing is convenient.
The utility model provides a MEMS microphone chip's theory of operation as follows: specifically, during operation, external sound waves enter from the acoustic cavity 11 to drive the vibrating diaphragm 2 to vibrate in a containing space formed between the insulating back plate 5 and the substrate bottom 1, the vibrating diaphragm 2 and a conductor in the back region interact with each other to generate an electric signal, the conductor back plate 6 is a conductor, so that the conductor back plate 6 and the vibrating diaphragm 2 can generate capacitance, and the conductor back plate 6 is located in the back region which corresponds to the effective vibration region of the vibrating diaphragm 2 up and down, so that the conductor back plate 6 and the effective vibration region of the vibrating diaphragm 2 generate capacitance which is effective capacitance, the conductor back plate 6 is wrapped inside the insulating back plate 5, so that no capacitance is generated between the insulating back plate 5 and the vibrating diaphragm 2, thereby reducing parasitic capacitance and improving working sensitivity, in addition, the vibrating diaphragm 2 can vibrate up and down along the limiting column 8 during vibration, wherein spacing post 8 can effectively stop vibrating diaphragm 2 at the lateral swing of vibration in-process, prevents that vibrating diaphragm 2 from taking place the distortion because of the too big amplitude and even getting into in the vocal chamber 11 or dropping from the vocal chamber 11, has improved life to make vibrating diaphragm 2's vibration more accurate, improved the sound effect of chip.
Compared with the prior art, the utility model provides a MEMS microphone chip has following beneficial effect: because conductor back plate 6 and vibrating diaphragm 2 produce electric capacity in effective vibration district, this electric capacity is effective electric capacity, and insulating back plate 5 inside parcel conductor back plate 6, make and do not produce electric capacity between insulating back plate 5 and the vibrating diaphragm 2, thereby parasitic capacitance has been reduced, the working sensitivity has been improved, spacing post 8 effectively prevents vibrating diaphragm 2 in the lateral swing of vibration in-process in addition, prevent vibrating diaphragm 2 because of the too big distortion that takes place of amplitude even get into in the acoustic cavity 11 or drop from the acoustic cavity 11, service life is prolonged, and make the vibration of vibrating diaphragm 2 more accurate, the sound effect of chip has been improved.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (9)
1. A MEMS microphone chip characterized in that: including at the bottom of the substrate and vibrating diaphragm, substrate bottom edge position fixed connection first insulation board, first insulation board upper end fixed connection second insulation board, upside at the bottom of the insulating back plate of second insulation board upper end fixed connection and insulating back plate are in the substrate, the inside parcel conductor back plate of insulating back plate, connect the vibrating diaphragm between insulating back plate and the substrate at the bottom, four at least vertical spacing posts of arranging of fixed connection between insulating back plate and the substrate at the bottom, at least four the spacing post all runs through the vibrating diaphragm.
2. The MEMS microphone chip of claim 1, wherein: and an acoustic cavity with a through upper surface and a through lower surface is processed on the substrate bottom, and the vibrating diaphragm covers the upper side of the acoustic cavity.
3. The MEMS microphone chip of claim 1, wherein: and a plurality of sound holes are formed in the insulating back plate and penetrate through the conductor back plate.
4. The MEMS microphone chip of claim 1, wherein: at least four guide holes are formed in the vibrating diaphragm, and sliding sleeves are bonded in the guide holes and are connected to the outer side of the limiting column in a sliding mode.
5. The MEMS microphone chip of claim 1, wherein: the lower end of the insulating back plate is bonded with a plurality of second salient points, the second salient points are positioned on the upper side of the vibrating diaphragm, the upper end of the base material is bonded with a plurality of first salient points, and the first salient points are positioned on the lower side of the vibrating diaphragm.
6. The MEMS microphone chip of claim 1, wherein: a plurality of limiting plates are bonded to the annular inner wall of the first insulating plate, and the limiting plates are located on the upper side of the vibrating diaphragm.
7. The MEMS microphone chip of claim 1, wherein: a plurality of second salient points are bonded to the upper end of the vibrating diaphragm, and a plurality of first salient points are bonded to the lower end of the vibrating diaphragm.
8. The MEMS microphone chip of claim 1, wherein: and the upper and lower parts of the conductor back plate are bonded with the insulating back plate.
9. The MEMS microphone chip of claim 1, wherein: the limiting column is made of a column body processed by monocrystalline silicon, polycrystalline silicon, silicon dioxide or silicon nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922301021.8U CN210927975U (en) | 2019-12-19 | 2019-12-19 | MEMS microphone chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922301021.8U CN210927975U (en) | 2019-12-19 | 2019-12-19 | MEMS microphone chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210927975U true CN210927975U (en) | 2020-07-03 |
Family
ID=71353344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922301021.8U Active CN210927975U (en) | 2019-12-19 | 2019-12-19 | MEMS microphone chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210927975U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN112492474A (en) * | 2020-11-23 | 2021-03-12 | 瑞声新能源发展(常州)有限公司科教城分公司 | MEMS microphone chip |
| CN112584282A (en) * | 2020-11-30 | 2021-03-30 | 瑞声新能源发展(常州)有限公司科教城分公司 | Silicon microphone and processing method thereof |
| CN113709641A (en) * | 2021-08-27 | 2021-11-26 | 歌尔微电子股份有限公司 | Microphone |
| CN114205696A (en) * | 2020-09-17 | 2022-03-18 | 通用微(深圳)科技有限公司 | Silicon-based microphone device and electronic equipment |
| WO2023185736A1 (en) * | 2022-03-31 | 2023-10-05 | 歌尔微电子股份有限公司 | Micro-electro-mechanical system microphone and electronic device |
-
2019
- 2019-12-19 CN CN201922301021.8U patent/CN210927975U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114205696A (en) * | 2020-09-17 | 2022-03-18 | 通用微(深圳)科技有限公司 | Silicon-based microphone device and electronic equipment |
| CN112492474A (en) * | 2020-11-23 | 2021-03-12 | 瑞声新能源发展(常州)有限公司科教城分公司 | MEMS microphone chip |
| WO2022105007A1 (en) * | 2020-11-23 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems microphone chip |
| CN112584282A (en) * | 2020-11-30 | 2021-03-30 | 瑞声新能源发展(常州)有限公司科教城分公司 | Silicon microphone and processing method thereof |
| CN112492487A (en) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | Microphone chip, MEMS microphone and electronic device |
| CN113709641A (en) * | 2021-08-27 | 2021-11-26 | 歌尔微电子股份有限公司 | Microphone |
| WO2023185736A1 (en) * | 2022-03-31 | 2023-10-05 | 歌尔微电子股份有限公司 | Micro-electro-mechanical system microphone and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210927975U (en) | MEMS microphone chip | |
| CN103347808B (en) | Silica-based MEMS microphone, the system comprising this microphone and encapsulation | |
| US9628919B2 (en) | Wafer level assembly of a MEMS sensor device and related MEMS sensor device | |
| US8921957B1 (en) | Method of improving MEMS microphone mechanical stability | |
| US10433068B2 (en) | MEMS acoustic transducer with combfingered electrodes and corresponding manufacturing process | |
| CN101272636B (en) | Capacitor type microphone chip | |
| CN104488290B (en) | Capacitance-type sensor, sound transducer and microphone | |
| CN104469640A (en) | Acoustic transducer and microphone | |
| CN104640038A (en) | System and method for a MEMS transducer | |
| CN102742301A (en) | Microelectromechanical transducer and corresponding assembly process | |
| US8861753B2 (en) | Acoustic transducer, and microphone using the acoustic transducer | |
| CN206640794U (en) | MEMS sonic transducers and electronic equipment | |
| CN210986419U (en) | MEMS microphone and electronic device | |
| CN107484051B (en) | MEMS microphone | |
| US20140353780A1 (en) | Detection structure for a mems acoustic transducer with improved robustness to deformation | |
| CN203368755U (en) | Impact resistant silicon substrate MEMS microphone | |
| CN103270776B (en) | Oscillation device and electronic equipment | |
| WO2022016735A1 (en) | Mems acoustic sensor | |
| CN107105378A (en) | MEMS chip, microphone and preparation method and method for packing | |
| CN104204844B (en) | Ultrasonic sensor and method for measuring an object distance | |
| CN205123990U (en) | Bone conduction loudspeaker | |
| CN106060753A (en) | Mobile terminal equipment | |
| CN104796831B (en) | A kind of Electret Condencer Microphone and its manufacturing method | |
| CN204014056U (en) | A kind of MEMS microphone | |
| EP3177038A1 (en) | Mems microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |