CN210927632U

CN210927632U - Multipurpose SFP optical module

Info

Publication number: CN210927632U
Application number: CN201921855491.2U
Authority: CN
Inventors: 侯平胜
Original assignee: Wuhan Yongxinfeng Technology Co ltd
Current assignee: Wuhan Yongxinfeng Technology Co ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-07-03
Anticipated expiration: 2029-10-31

Abstract

The utility model relates to a multipurpose SFP optical module, including the main chip, the laser instrument, APD photoelectric detector, preamplifier, boost circuit and electrical interface circuit, the main chip is a trinity chip, its inside transmission drive that has integrateed, receive LA and the three chip of MCU, the main chip, the laser instrument, APD photoelectric detector all is connected with the electrical interface circuit electricity, the main chip is connected with laser instrument and preamplifier electricity respectively, preamplifier is connected with the photoelectric detector electricity, boost circuit provides higher operating voltage for photoelectric detector, in order to reach farther distance's transmission demand. The utility model discloses a trinity chip is as the main chip of circuit, and the integrated level is high and with low costs, has very big commercial value.

Description

Multipurpose SFP optical module

Technical Field

The utility model belongs to the technical field of optical communication, concretely relates to multipurpose SFP optical module.

Background

With the development of global communication technology, optical fiber communication technology has been developed greatly and gradually replaces the traditional cable communication. With the development of optical fiber communication technology, the application of the photoelectric conversion module is also wider, and the optical module with low cost and high efficiency becomes a mainstream product in the market.

At present, the main optical modules in the market are SFP optical modules, SFP + optical modules, and the like, and the SFP optical modules are mainly used for short-distance low-rate transmission. The circuit part of the traditional SFP optical module adopts a transmitting terminal driving chip U1, an LA chip U3 and an MCU chip U5 which are mutually independent. The emitting end driving chip U1 receives an electrical signal sent by an external system device, the electrical signal is converted into a current through the driving chip to drive the laser to send out an optical signal, the optical signal is transmitted to the photoelectric detector of the receiving end through the optical fiber connection, the detector converts the detected optical signal into an electrical signal to be sent to

pins

2 and 3 of a receiving LA chip (sometimes called limited amplification) U3 on a circuit board, the electrical signal is amplified through the receiving LA chip U3, and the electrical signal is sent to a differential signal RX +, RX-of a receiving port of a connecting system device (a switch, a photoelectric conversion device and the like) through an output differential signal DOUT of the U3. On one hand, the SFP optical module circuit adopts an independent chip, so that the integration level is low and the cost is high; on the other hand, the currently commonly used 1.25GSFP optical module is generally designed according to the purpose below 80km, and the receiving optical path unit adopts a PIN detector, so that the transmission requirement of higher distance is difficult to achieve.

Disclosure of Invention

The utility model aims at the aforesaid current situation, provide a simple structure, efficient, with low costs and many SFP optical module of function.

In order to achieve the above object, the present invention provides the following technical solutions:

a multipurpose SFP optical module is characterized by comprising a main chip, a laser, a photoelectric detector, a preamplifier, a booster circuit and an electrical interface circuit, wherein the electrical interface circuit is respectively and electrically connected with the main chip, the laser and the photoelectric detector; the laser and the preamplifier are electrically connected with the main chip; the preamplifier and the booster circuit are both electrically connected with a photoelectric detector, and the photoelectric detector is used for converting optical signals into electric signals.

Preferably, the laser is an FP laser, and the photodetector is an APD photodetector.

Preferably, the boost circuit adopts a MAX15059 chip.

Preferably, the main chip is a three-in-one chip, and the main chip is internally integrated with three chips of transmitting drive, receiving LA and MCU.

Preferably, the model of the master chip is I7525.

Preferably, the main chip is directly electrically connected with the laser, and the main chip drives the laser to emit light through an internal emission driving chip.

Preferably, the main chip is directly electrically connected to the preamplifier, the preamplifier amplifies the electrical signal from the photodetector, and the main chip further amplifies the electrical signal from the preamplifier by the reception LA chip.

Preferably, the electrical interface circuit is a 20PIN interface circuit.

Preferably, a Digital diagnostic detector is further integrated inside the main chip, and the Digital diagnostic detector is used for detecting DDM (Digital Diagnostics Monitoring) parameters.

The utility model discloses the outstanding substantive characteristics of technical scheme and the progress that is showing mainly reflect: the utility model provides a multipurpose SFP optical module, the circuit part adopts trinity main chip, its inside integrates three chips of transmitting drive, receiving LA and MCU, the integration level is high, the cost is low; the photoelectric detector of the optical path part adopts an APD photoelectric detector, the sensitivity is higher than that of a common PIN photoelectric detector, in addition, the APD photoelectric detector is also connected with a boosting single path, the SFP optical module designed by the design not only can be used as a conventional data communication 1.25G optical module, but also can be used as a GPON-ONU optical module which is transmitted by 1.25G and received by 2.5G and used for fiber to the home, a common PCB circuit board can be used, only surface mounted components are different, the material management is convenient, and the cost can be reduced.

Drawings

The drawings referred to in the description of the embodiments of the present invention are briefly introduced below to more clearly and completely describe the technical solutions in the embodiments of the present invention, and the following drawings are only for some embodiments of the present invention and are not intended to limit the present invention.

Fig. 1 is a functional block diagram of the multi-purpose SFP optical module of the present invention;

fig. 2 is a schematic diagram of the main chip + boost circuit of the multi-purpose SFP optical module of the present invention.

Reference numerals: 1-a main chip; 2-a laser; 3-a photodetector; 4-a preamplifier; 5-a boost circuit; 6-electrical interface circuit.

Detailed Description

The principles and features of the present invention will be described in more detail below with reference to the accompanying drawings, which are provided for purposes of illustration only and are not intended to limit the scope of the invention.

As shown in fig. 1 and fig. 2, the utility model provides a multipurpose SFP optical module, including main chip 1, laser 2, photodetector 3, preamplifier 4, boost circuit 5 and electrical interface circuit 6, main chip 1, laser 2, photodetector 3 all are connected with electrical interface circuit 6 electrically; the laser 2 and the preamplifier 4 are both electrically connected with the main chip 1; the preamplifier 4 and the booster circuit 5 are both electrically connected to the photodetector 3.

In this embodiment, the laser 2 is an FP laser, which is the most common semiconductor laser, widely used in the field of optical communication, and is suitable for low-rate optical signal transmission. The photoelectric detector 3 adopts an APD photoelectric detector for detecting optical signals and converting the detected optical signals into electrical signals, and the APD photoelectric detector has higher sensitivity compared with the traditional PIN photoelectric detector. The booster circuit 5 is connected to the photodetector 3 and provides a higher operating voltage for the photodetector 3, so that the photodetector 3 can obtain a higher sensitivity, which meets the requirement of a transmission distance of 120 km. The preamplifier 4 is used for amplifying the electrical signal from the photodetector 3 and then transmitting the amplified electrical signal to the main chip 1.

The main chip 1 is shown as U1 in the figure, the main chip 1 is a three-in-one chip with the model of I7525, and three chips of transmitting drive, receiving LA and MCU are integrated inside the main chip. The laser 2 and the preamplifier 4 are both connected with the main chip 1, the main chip 1 drives the laser 2 to emit optical signals through an internal transmitting driving chip, and the main chip 1 further amplifies the electrical signals from the preamplifier 4 through an internal receiving LA chip. The main chip 1 is provided with a peripheral circuit composed of a resistor, a capacitor and the like, the manufacturing cost of the SFP optical module and the complexity of the circuit can be reduced by adopting a receiving and transmitting integrated three-in-one chip, the electric interface circuit 6 is a 20PIN interface circuit, the 20PIN interface circuit is used for establishing communication connection between the SFP optical module and remote equipment, and the packaging form of the corresponding SFP optical module is also defined by a 20PIN PIN.

The boost circuit 5 is composed of a boost chip MAX15059 and a peripheral circuit (the boost chip is denoted as U2 in the figure), and specifically: one end of a first resistor R1 is connected with an RLIM pin of the U2, the other end of the first resistor R1 is grounded, one end of a second resistor R2 is connected with an output pin MOUT pin of the U2, the other end of the second resistor R2 is grounded, one end of a third resistor R3 is connected with an APD pin of the U2, the other end of the third resistor R3 is connected with a photodetector and one end of a first capacitor C1, the other end of the first capacitor C1 is grounded, a fourth resistor R4 and one end of a second capacitor C2 are connected in series and then connected in parallel with one end of a third capacitor C3 to a BIAS pin of the U2, the other end of the C2 and the other end of the C3 are grounded, one end of a first inductor L1 and one end of a diode D1 are connected with an LX pin of the U9, the other end of a first inductor L1 is connected in series with a fourth capacitor C56 and then grounded, and the other end of a diode D1 is connected in series and then.

The main chip 1 is also integrated with a digital diagnosis detector, and the external part can set DDM parameters without a microprocessor, so that an MCU chip is not required to be separately configured on the circuit. The utility model discloses the value of SFP optical module owner chip 1 register is controlled and is changed to the accessible host computer, debugs the required parameter of transmitting terminal light path and receiving terminal light path through the value that changes the 1 register of main chip.

The utility model discloses a what the circuit adopted is a low-cost trinity main chip + boost chip circuit, can be the 1.25G SFP optical module that conventional data communication was used, also can be the GPON-ONU optical module that the 1.25G transmission 2.5G of optical fiber to the user used received, can general same kind of PCB circuit board, only the paster components and parts are different, make things convenient for material management like this, reduce the cost of labor of material management.

The above is only the preferred embodiment of the present invention, and the present invention is not limited to the above embodiments, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A multipurpose SFP optical module is characterized by comprising a main chip, a laser, a photoelectric detector, a preamplifier, a booster circuit and an electrical interface circuit, wherein the electrical interface circuit is respectively and electrically connected with the main chip, the laser and the photoelectric detector; the laser and the preamplifier are electrically connected with the main chip; the preamplifier and the booster circuit are both electrically connected with a photoelectric detector, and the photoelectric detector is used for converting optical signals into electric signals.

2. The multi-purpose SFP optical module of claim 1, wherein the laser is a FP laser and the photodetector is an APD photodetector.

3. The multi-purpose SFP optical module of claim 1, wherein the boost circuit is a MAX15059 chip.

4. The multi-purpose SFP optical module of claim 1, wherein the main chip is a three-in-one chip, and three chips of transmitting driving, receiving LA and MCU are integrated therein.

5. The multipurpose SFP optical module of claim 4, wherein the master chip model is I7525.

6. The multipurpose SFP optical module as in claim 4, wherein the main chip is directly electrically connected with the laser, and the main chip drives the laser to emit light through an emission driving chip.

7. The multi-purpose SFP optical module of claim 4 wherein the main chip is directly electrically connected to the preamplifier, the preamplifier amplifying the electrical signal from the photodetector, the main chip further amplifying the electrical signal from the preamplifier by receiving the LA chip.

8. The multipurpose SFP optical module of claim 1 wherein the electrical interface circuit is a 20PIN interface circuit.

9. The multipurpose SFP optical module as claimed in claim 1, wherein the main chip further has a digital diagnostic detector integrated therein, the digital diagnostic detector being configured to detect DDM parameters.