CN210925951U - Bonding piece separation equipment - Google Patents
Bonding piece separation equipment Download PDFInfo
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- CN210925951U CN210925951U CN201921815962.7U CN201921815962U CN210925951U CN 210925951 U CN210925951 U CN 210925951U CN 201921815962 U CN201921815962 U CN 201921815962U CN 210925951 U CN210925951 U CN 210925951U
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- bonding
- bonding piece
- infrared scanning
- vacuum manipulator
- cutter
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Abstract
The utility model discloses a bonding piece splitter, which comprises a worktable, anterior department installs the same liftable magazine microscope carrier of a plurality of structures in the board, it is connected with the board to go up the vacuum manipulator, the left and right sides department of vacuum manipulator installs the same infrared scanning cutter of a pair of structure down, and is a pair of the infrared scanning cutter is connected with the board, and is a pair of the infrared scanning cutter is corresponding with bonding piece bonding position, the utility model relates to a bonding piece separation technology field, this bonding piece splitter, the utility model provides a bonding piece separator, it includes: a lift microscope carrier for placing the magazine can realize driving the magazine and reciprocate and make things convenient for vacuum robotic arm to absorb bonding piece, adopts above-mentioned structure, through getting the vacuum manipulator of bonding piece and acting as bonding piece separation microscope carrier, has infrared induction's double-card cutter and can come the motion of control being close to or keeping away from through adjusting device.
Description
Technical Field
The utility model relates to a bonding piece separation technology field specifically is a bonding piece splitter.
Background
With the development of the demand of people on electronic products towards miniaturization, the requirements of the preparation process of SOI are more and more strict, wherein the bonding process is an important link for preparing SOI, silicon wafer bonding is an advanced SOI material preparation technology, when two silicon wafers with very flat surfaces are very close to each other, the two silicon wafers are mutually bonded under the action of Van der Waals force between the silicon wafers, which is the so-called bonding technology, but when bonding, because the geometrical shapes of the upper silicon wafer and the lower silicon wafer cannot meet the ideal requirements, the distance between molecules is greater than the attractive force moment between the molecules, and cavity abnormity can occur after bonding. On the other hand, the bonding sheet has an offset abnormality due to a bonding machine or other factors. Therefore, it is necessary to separate the bonding abnormality sheet. When the SOI is prepared in a factory, due to the product limitation requirement, substrate silicon wafers with different thicknesses are required to be used as substrates, the top layer is also the same, and the abnormal bonding is difficult to process, the separation process requirement is strict, SOI preparation manufacturers with smaller scales separate the substrates in a manual wafer breaking mode, the operation is troublesome, the silicon wafers are easy to damage, the time and the labor are wasted, and the SOI preparation yield is lower; the SOI manufacture manufacturers with larger scale will introduce a de-bonder in the packaging technology to perform separation, but the device has overlarge volume, overhigh price and low cost performance.
To this end, the applicant has invented a method of separating bonded pieces by breaking van der waals forces between the bonded pieces with a cutter. However, researches show that a bonding sheet separating device with high automation degree and simple operation is needed to adapt to industrial production.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a bonding piece splitter has solved the problem that current degree of automation is low.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a bonding piece splitter, includes the board, the anterior department installs the same liftable bonding piece microscope carrier of a plurality of structures in the board, just be close to rear portion department in the board and install down vacuum manipulator, the top of vacuum manipulator is provided with vacuum manipulator down, it is connected with the board to go up vacuum manipulator, the left and right sides department of vacuum manipulator down installs the same infrared scanning cutter of a pair of structure, and is a pair of infrared scanning cutter is connected with the board, and is a pair of infrared scanning cutter is corresponding with bonding piece bonding position.
Preferably, a first infrared scanning device is installed at the center of the infrared scanning tool.
Preferably, the infrared scanning cutter comprises a hydraulic cylinder, the hydraulic cylinder is connected with the machine table, a blade is installed on the telescopic end face of the hydraulic cylinder, and a stress sensor is installed on the hydraulic cylinder.
Preferably, the upper vacuum manipulator and the lower vacuum manipulator are both provided with a second infrared scanning device.
Preferably, the liftable bonding sheet carrying platform comprises an electric push rod, the electric push rod is connected with the machine platform, and the bonding sheet carrying platform is installed on the electric push rod.
Preferably, the machine table is provided with a main control module, and the main control module is electrically connected with the liftable bonding sheet carrying platform, the lower vacuum manipulator, the upper vacuum manipulator and the infrared scanning cutter respectively.
Preferably, the number of the plurality of liftable bonding sheet carriers is two.
Advantageous effects
The utility model provides a bonding piece splitter. The utility model provides a bonding piece separator, it includes: a lift microscope carrier for placing the magazine can realize driving the magazine and reciprocate and make things convenient for vacuum robotic arm to absorb bonding piece, adopts above-mentioned structure, through getting the vacuum manipulator of bonding piece and acting as bonding piece separation microscope carrier, has infrared induction's double cassette cutter and can come the motion of control being close to or keeping away from through adjusting device, and the cutter of taking infrared induction can realize scanning bonding piece, scans bonding piece combination department with the cutter alignment combination department. A bonding sheet separating device, a lower vacuum manipulator with an infrared scanning device, which can scan the specific position of the bonding sheet in the cassette and suck the bonding sheet to be separated to a specified position, a tool scans the bonding sheet joint, the bonding sheet separating device, an upper vacuum manipulator with a force sensor device on the moment axis, the force sensor device can change the feed speed and force of the tool according to the resistance when the tool cuts into the bonding sheet joint, the tool infrared scanning device can detect the countermeasure tool after the bonding sheet is separated, the sensor receives the signal and feeds back the signal to an automatic device to control the upper vacuum manipulator to take away the upper sheet of the bonding sheet and place the upper sheet in the other corresponding cassette, and in the bonding sheet separating device, the lower vacuum manipulator can return the lower bonding sheet to the original position of the original cassette after the upper vacuum manipulator resets. The cassette lifting platform can reset to the initial position after all the bonding sheets are separated.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the structure of the infrared scanning cutter of the present invention.
Fig. 3 is a schematic structural view of the upper vacuum robot and the lower vacuum robot of the present invention.
In the figure: 1. a machine platform; 2. lifting the bonding sheet carrying platform; 3. a lower vacuum manipulator; 4. a vacuum manipulator is arranged; 5. infrared scanning of the tool; 501. a blade; 502. and a hydraulic cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a bonding piece separating device comprises a machine table 1, a plurality of lifting bonding piece carrying platforms 2 with the same structure are installed at the front portion in the machine table 1, a lower vacuum mechanical arm 3 is installed at the position, close to the rear portion, in the machine table 1, a lower vacuum mechanical arm 3 is installed, an upper vacuum mechanical arm 4 is arranged above the lower vacuum mechanical arm 3, the upper vacuum mechanical arm 4 is connected with the machine table 1, a pair of infrared scanning tools 5 with the same structure are installed at the left side and the right side of the lower vacuum mechanical arm 3, the pair of infrared scanning tools 5 are connected with the machine table 1, the pair of infrared scanning tools 5 correspond to the bonding piece bonding position, a first infrared scanning device is installed at the center of the infrared scanning tools 5, each infrared scanning tool 5 comprises a hydraulic cylinder 502, each hydraulic cylinder 502 is connected with the machine table 1, a blade 501 is installed on the telescopic end face of each hydraulic cylinder 502, the upper vacuum manipulator 4 and the lower vacuum manipulator 3 are respectively provided with a second infrared scanning device, the liftable bonding piece carrying platform 2 comprises an electric push rod, the electric push rod is connected with the machine table 1, the electric push rod is provided with a bonding piece carrying platform, the machine table 1 is provided with a main control module, the main control module is respectively electrically connected with the liftable bonding piece carrying platform 2, the lower vacuum manipulator 3, the upper vacuum manipulator 4 and the infrared scanning tool 5, and the number of the liftable bonding piece carrying platforms 2 is two.
The following electric devices have the following types and functions:
the first infrared scanning device: the infrared scanning cutter is arranged on the infrared scanning cutter, when the cutter is close to a bonding piece, infrared rays can scan the bonding joint of the bonding piece, and the cutter position is determined to be aligned to the bonding gap.
The second infrared scanning device: the upper and lower vacuum mechanical arms are provided with infrared scanning devices, so that the specific position of the bonding sheet in the cassette can be read, and the suction according to the sequence of the bonding sheets can be realized.
A stress sensor: when the cutter contacts the bonding joint of the bonding piece, the advancing speed and the force of the cutter are controlled according to different bonding forces.
The main control module: the main control circuit main chip adopts an AFM8316 chip of Shanghai Dongsi soft microelectronics, when the bonding piece is separated, an infrared scanning device arranged on an infrared scanning cutter can sense the cutter on the opposite side, a sensing signal is released to the main control module, the main control module transmits the signal after processing, and an upper vacuum mechanical arm and a lower vacuum mechanical arm are controlled to convey the upper piece of the bonding piece into a dark box.
A vacuum manipulator: the model number is VC50, and the bonding sheet is used for adsorbing and fixing the bonding sheet.
All the electrical components in the present application are connected with the power supply adapted to the electrical components through the wires, and an appropriate controller should be selected according to actual conditions to meet the control requirements, and specific connection and control sequences should be obtained.
Example (b): the utility model provides a device of separation bonding piece, it is including the lift microscope carrier of placing the bonding piece, the lower vacuum manipulator 3 of bonding piece absorption bonding piece and acting as the bonding piece microscope carrier is drawn to the scanning bonding piece, scannable bonding piece combines department, response countermeasure cutter and can the double separation cutter of sensing resistance, adsorbable bonding piece is gone up the piece and can be taken the last vacuum manipulator 4 who delivers, sensing device, controlling means, wherein the sensing, place in the controlling means inside board 1, utilize above-mentioned device to implement the process flow of bonding piece separation, concrete step is as follows: placing a bonding piece of a bonding piece to be separated on a carrier, placing another empty bonding piece on another bearing position of the carrier, then descending the carrier until an upper vacuum manipulator 4 scans the bonding piece, after the upper vacuum manipulator 4 scans the bonding piece to be separated, straightening the upper vacuum manipulator 4 to form a special angle with a lower vacuum manipulator 3, extending the upper vacuum manipulator 4 to the upper part of the bonding piece, placing the lower vacuum manipulator 3 in a machine to stand by, then adsorbing the bonding piece by the upper vacuum manipulator and retracting the bonding piece, drawing the lower vacuum manipulator and the upper vacuum manipulator close to each other until the positions are superposed, then adsorbing the bonding piece together with the upper vacuum manipulator, taking the piece to a central position, when a cutter scans the bonding piece joint, when the cutter scans the bonding piece joint by the upper vacuum manipulator, timely adsorbing the upper piece surface of the bonding piece, scanning the cutter with infrared scanning to the bonding piece and determining the bonding piece joint, the cutter is close to the alignment joint to the joint of the bonding sheet, the double cutters apply centripetal force to the bonding sheet, the feeding speed and force of the tool are adjusted through a force sensor on a hydraulic cylinder according to the resistance of the tool to the joint of the bonding sheet, after the bonding sheet is separated by force, an infrared sensor on the tool senses the tool on the opposite side, a main control module receives a signal and transmits the signal to a control device, after an upper vacuum manipulator 4 receives the signal of the control device, taking the separated upper bonding piece and sending the separated upper bonding piece to the position of the other empty bonding piece corresponding to the bonding piece of the original bonding piece, after the upper vacuum manipulator 4 is reset, the lower vacuum manipulator 3 sends the lower bonding piece of the bonding piece back to the position of the original bonding piece, after the first bonding piece is separated, the device circulates the process flow, and after all the bonding pieces are separated, the device is provided with an alarm bell which sounds.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a bonding piece splitter, includes board (1), its characterized in that, anterior department installs a plurality of liftable bonding piece microscope carriers (2) that the structure is the same in board (1), just be close to rear portion department in board (1) and install down vacuum manipulator (3), the top of vacuum manipulator (3) is provided with vacuum manipulator (4) down, it is connected with board (1) to go up vacuum manipulator (4), the left and right sides department of vacuum manipulator (3) down installs a pair of infrared scanning cutter (5) that the structure is the same, and is a pair of infrared scanning cutter (5) are connected with board (1), and is a pair of infrared scanning cutter (5) are corresponding with bonding piece bonding position.
2. Bonding die separating apparatus according to claim 1, characterized in that the infrared scanning tool (5) is centrally mounted with a first infrared scanning device.
3. The bonding and separating device according to claim 1, wherein the infrared scanning tool (5) comprises a hydraulic cylinder (502), the hydraulic cylinder (502) is connected to the machine table (1), a blade (501) is mounted on a telescopic end surface of the hydraulic cylinder (502), and a force sensor is mounted on the hydraulic cylinder (502).
4. Bonding wafer separating device according to claim 1, characterized in that the upper vacuum robot (4) and the lower vacuum robot (3) are each provided with a second infrared scanning device.
5. The bonding sheet separating device according to claim 1, wherein the liftable bonding sheet carrying platform (2) comprises an electric push rod, the electric push rod is connected with the machine platform (1), and the bonding sheet carrying platform is mounted on the electric push rod.
6. The bonding sheet separation device according to claim 1, wherein a main control module is installed on the machine table (1), and the main control module is electrically connected to the liftable bonding sheet carrying table (2), the lower vacuum manipulator (3), the upper vacuum manipulator (4) and the infrared scanning tool (5), respectively.
7. A bonding pad separating apparatus according to claim 1, wherein the number of said liftable bonding pad stages (2) is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921815962.7U CN210925951U (en) | 2019-10-28 | 2019-10-28 | Bonding piece separation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921815962.7U CN210925951U (en) | 2019-10-28 | 2019-10-28 | Bonding piece separation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210925951U true CN210925951U (en) | 2020-07-03 |
Family
ID=71350297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921815962.7U Active CN210925951U (en) | 2019-10-28 | 2019-10-28 | Bonding piece separation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210925951U (en) |
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2019
- 2019-10-28 CN CN201921815962.7U patent/CN210925951U/en active Active
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