CN210924304U - Independent heating temperature control device for device aging test - Google Patents
Independent heating temperature control device for device aging test Download PDFInfo
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- CN210924304U CN210924304U CN201922112112.7U CN201922112112U CN210924304U CN 210924304 U CN210924304 U CN 210924304U CN 201922112112 U CN201922112112 U CN 201922112112U CN 210924304 U CN210924304 U CN 210924304U
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- heating
- porcelain
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 102
- 238000012360 testing method Methods 0.000 title claims abstract description 34
- 230000032683 aging Effects 0.000 title claims abstract description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000009413 insulation Methods 0.000 claims abstract description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 13
- 239000003990 capacitor Substances 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims description 34
- 230000007306 turnover Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910001094 6061 aluminium alloy Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 101001017827 Mus musculus Leucine-rich repeat flightless-interacting protein 1 Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model relates to an independent heating temperature control device for device aging testing is with comprises seal box and the independent heating system in the seal box. The independent heating system mainly comprises a heat insulation module, a heating unit, a porcelain-like heating unit, a radiator, a PT100 temperature sensor, a temperature control instrument PID and the like, wherein the porcelain-like heating unit, the heating unit and the radiator are arranged in the heat insulation module, the PT100 temperature sensor is arranged on the top surface of the heating unit, and the PT100 temperature sensor is connected with the temperature control instrument PID; a device matching circuit board is arranged on the top surface of the heating unit; the external connection line of the matching circuit board is connected with the female seat and the threaded feedthrough capacitor through SMA radio frequencies on the left side and the right side of the box-type shell. The heating temperature control device can be used for carrying out independent aging test on a single device and has the advantages of small volume, high efficiency, low power consumption, low nitrogen energy consumption and the like.
Description
Technical Field
The utility model relates to a device aging testing technique especially relates to a temperature control device suitable for radio frequency device aging testing.
Background
The aging condition of the device is tested, and the aging test method is an important work for ensuring the safety and reliability of products and equipment. At present, the device for testing the aging condition of the device in China mostly adopts a temperature control high temperature box device to test: put into the temperature control high temperature box device with the device under test and test, this temperature control high temperature box device mainly has: the inner box (the material is 304 corrosion resistant plate bending shaping), the outer container (the material is the cold-rolled steel sheet bending shaping of spraying plastics), there is heat preservation material (superfine super glass heat preservation cotton) between inner box and the outer container, install the electric heater formula heater (embedded heating element) in stainless steel cavity intermediate layer, air supply circulation system (adopt special fan to make the interior air forced circulation of box), control system (accurate microcomputer PID controller, PT100 temperature measurement sensor), safety arrangement (independent overtemperature prote protection and circuit set up short-circuit protection). Firstly, because the temperature control high-temperature box device has complex structure and large volume, the heating electric energy needs AC220V or AC380V alternating current, and the energy consumption power is very large; considering that the aging test is time-consuming and energy-consuming, a plurality of devices are only required to be concentrated together for one-time test, and even if the aging test is urgently needed by a single device, the test is not always needed; on the other hand, because the volume space in the temperature control high-temperature box device is large and the sealing performance is poor, when a plurality of devices are subjected to aging test together, a large amount of nitrogen is required to be filled into the device through a pipeline; moreover, the test temperature of the temperature control high-temperature box device is required to meet the requirement that the temperature control precision reaches less than or equal to +/-1 ℃, so that the temperature can only be heated to below 300 ℃ for ensuring the temperature control precision, but the aging test environment temperature of some special devices is required to be 300 ℃ or even higher, and the test device has no capability for the temperature control precision.
Disclosure of Invention
For solving the not enough of current device aging testing device existence, the utility model discloses a purpose: the temperature control device for the aging test of the device is small in size and suitable for the requirement of the aging test of a single device; the temperature environment of 300 ℃ or higher can be achieved under the condition that the temperature control precision is less than or equal to +/-1 ℃; nitrogen gas may be independently filled.
The utility model adopts the technical proposal that:
the independent heating temperature control device for the device aging test consists of a sealing box and an independent heating system in the sealing box.
The sealing box is composed of a box type shell 2 with an opening at the upper part and a turnover cover 1 above the box type shell, and the opening or closing of the turnover cover controls the opening and the sealing of the sealing box. The top of the box-type shell 2 is provided with a groove, and a sealing ring 20 is arranged in the groove; the position of the flip cover 1 corresponding to the sealing ring 20 is provided with a boss, the flip cover boss is attached to the sealing ring, and the flip cover 1 is pressed by the disk nuts 5 in front and at the back, so that the sealing performance of the sealing box is ensured.
The rear part of the box-shaped shell 2 is provided with a nitrogen interface 10 for charging nitrogen into the device.
The left side and the right side in the box type shell 2 are respectively provided with an SMA radio frequency connection female seat 8 and a threaded feedthrough capacitor 9 for connecting the lead inside the box type shell 2 to the outside.
The independent heating system mainly comprises an insulating module 14, a heating unit 15, a porcelain-like heating unit 16, a radiator 17, a PT100 temperature sensor 18, a temperature control instrument PID22, a matching circuit board 13, an SMA radio frequency connection female seat 8 and a threaded feedthrough capacitor 9.
The heat insulating module 14 is a part with a certain thickness and a rectangular groove, and a rectangular hole is arranged in the middle of the part, and is positioned in the groove in the shell 2. A heating unit 15 is arranged in the heat insulation module 14; a porcelain-like heating unit 16 is arranged in the heating unit 15; the top surface of the porcelain-like heating unit 16 is tightly attached to the plane of the bottom of the heating unit 15, and a radiator 17 is arranged on the bottom surface of the porcelain-like heating unit 16; the radiator 17 is fixed on the bottom surface of the heating unit 15, and the porcelain-like heating unit 16 is tightly pressed to ensure the close fit of the contact surfaces among the heating unit 15, the porcelain-like heating unit 16 and the radiator 17;
the power supply is used for heating the porcelain-like heating unit 16; the heat of the porcelain-like heating unit 16 is conducted to the heat generating unit 15, thereby raising the internal temperature of the cassette housing 2. A PT100 temperature sensor 18 is arranged on the top surface of the heating unit 15 and used for collecting the heating temperature of the heating unit 15; PT100 temperature sensor 18 is connected with temperature control instrument PID22, and the temperature that PT100 temperature sensor 18 was gathered in real time is through temperature control instrument PID22 intelligence control by temperature control instrument, guarantees the inside heating temperature of seal box and control by temperature change precision. A device matching circuit board 13 is mounted on the top surface of the heating unit 15 inside the sealed box; the external connection line of the matching circuit board 13 is fixedly connected with the threaded feedthrough capacitor 9 through SMA radio frequency connection female seats 8 arranged on the left side and the right side of the box-type shell 2.
When the heating temperature control device for the device aging test is used, a device to be tested is placed in a rectangular hole in the middle of a matching circuit 13 in a shell 2, and the rectangular hole is a device limiting placing hole designed according to the appearance of the device; after the device is placed, the flip cover 1 is closed and combined with the box-type shell 2, then the butterfly screw rod 4 is clamped into the notch of the flip cover 1, and the flip cover 1 is pressed tightly through the butterfly nut 5 on the butterfly screw rod 4. Then, the test heating temperature of the temperature control instrument PID22 is set, and the inside of the cassette housing 2 starts to be heated when the temperature control instrument PID22 is electrified; when the interior of the box-type shell 2 is heated to a preset temperature, the temperature value fed back by the temperature control instrument PID22 through the PT100 temperature sensor 18 is automatically kept at a constant temperature, the temperature in the shell 2 is kept at the preset temperature, the vertical deviation of the temperature is controlled to be plus or minus 1 ℃, and the temperature in the box-type shell 2 is kept within the preset temperature for a long time according to the aging time requirement of a tested device until the test is finished.
The utility model has the advantages that:
the heating temperature control device of the utility model has small volume which is one tenth of the volume of the traditional temperature control high temperature box device; on the premise of ensuring that the temperature control precision is less than or equal to +/-1 ℃, the heating environment temperature can reach 300 ℃ or higher, the temperature can be controlled independently, nitrogen is filled independently, the power consumption is low, and the nitrogen energy consumption is low; the power supply is DC power DC 48V. The device can carry out independent aging test on a single device, and can also realize independent temperature control on a plurality of devices by one PID temperature control meter. This independent heating temperature control device, simple structure, control is accurate, only needs to set for after preheating the temperature value, all the other PID temperature control algorithm, the automatic control temperature of taking certainly by temperature control instrument 22.
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
Drawings
FIG. 1 is a schematic perspective view of a temperature control device according to an embodiment of the present invention
FIG. 2 is a schematic perspective view of the temperature control device of this embodiment
FIG. 3 is a schematic diagram of a three-dimensional structure of the temperature control device after the cover is opened
FIG. 4 is a schematic diagram of an independent heating system of the temperature control device of this embodiment
FIG. 5 is a schematic diagram of a circuit temperature control system of the temperature control device of the present embodiment
In the figure: 1. a cover is turned; 2. a cassette case; 3. a flip pin shaft; 4. a dished screw; 5. a disc nut; 6. a dished screw pin; 7. a thermally insulating floor; 8, SMA radio frequency connection female seat; 9. a threaded feedthrough capacitor; 10. a nitrogen interface; 11. a flip-open handle; 12, a silica gel sealing ring; 13. a matching circuit board; 14. a heat insulation module; 15. a heat generating unit; 16. a porcelain-like heating unit; 17. a heat sink; a PT100 temperature sensor; 19. a heat sink sealing gasket; 20. a heat insulating base plate sealing gasket; 21. a heating power supply; 22. a temperature control instrument PID; 23. solid state relay.
Detailed Description
Embodiment 1A temperature control device capable of heating independently for device burn-in test
Fig. 1 and 2 are perspective views showing a temperature control device according to the present embodiment, fig. 1 is a front upper left view, and fig. 2 is a rear upper left view.
In the figure, a flip cover 1 is a top cover of the device; the flip pin shaft 3 movably connects the flip 1 to the upper part of the box type shell 2, and the flip 1 is pulled out or closed from the upper opening of the box type shell 2 through the flip handle 11; the disk nut 5 is used to lock the flap 1. The box-type shell and the turnover cover are made of 6061 aluminum alloy.
The box-type shell 2 is provided with a disc-shaped screw rod 4, and when the disc-shaped screw rod is clamped at the opening on the flip cover 1, the flip cover 1 is pressed tightly through a disc-shaped nut 5, so that the sealing between the flip cover 1 and the box-type shell 2 is ensured.
The left side and the right side in the box type shell 2 are respectively provided with an SMA radio frequency connection female seat 8 and a threaded feedthrough capacitor 9 for connecting the lead inside the box type shell 2 to the outside. The box type shell 2 is provided with a nitrogen interface 10 at the rear part for installing a nitrogen connector and filling nitrogen into the box type shell 2.
The middle part of the inner side plane of the flip cover 1 is provided with a boss structure; the middle of the top surface of the box-type shell 2 is provided with a groove structure, and a silica gel sealing ring 12 (shown in figure 3) is arranged in the groove. The boss structure on the flip 1 is engaged with the groove structure on the box-type shell 2.
SMA radio frequency connection female seats 8 arranged on the left side and the right side of the box type shell 2 are fixedly connected with a threaded feedthrough capacitor 9 and are connected together by high-temperature soldering tin.
The butterfly screw pin 6 is used for connecting the butterfly screw 4, is arranged at a hole on the front side surface of the shell 2, connects the butterfly screw 4 and the shell 2 together by penetrating through the hole on the front side surface of the shell 2 and the hole of the butterfly screw 4, and the butterfly screw 4 can rotate at a certain angle by taking the butterfly screw pin 6 as an axis, so that the butterfly screw 4 can be clamped at the opening of the flip cover 1, and the operation is convenient. The radiator 17 is connected with the bottom of the heating unit 15 inside through a rectangular hole groove at the bottom of the shell 2, and is used for compressing the porcelain-like heating unit 16 in the groove at the bottom of the heating unit 15. The heat insulation bottom plate 17 is installed on the bottom plane of the shell 2, the heat insulation bottom plate 17 is connected with the shell 2 through screw connection, and the heat insulation bottom plate 17 is made of stone and has poor heat conductivity, so that heat generated by the shell 2 can be effectively prevented, and a heat insulation effect is achieved.
FIG. 3 shows the three-dimensional structure of the temperature control device of this embodiment after the cover is opened
In fig. 3, the matching circuit 13 is mounted on the top surface of the heating unit 15 inside the housing 2, and is fixed to the heating unit 15 by screws, and the matching circuit is a circuit board for providing a test power supply to the device under test. The silica gel sealing ring 12 is arranged in a rectangular groove on the top surface of the shell 2 and used for sealing between the flip cover 1 and the shell 2, so that when the flip cover 1 is combined with the shell 2 and locked by the butterfly nut 5 on the butterfly screw rod 4, an effective closed space is formed inside the shell 2, and the air tightness when nitrogen is filled is improved.
FIG. 4 shows the structure of the temperature control device of this embodiment
In fig. 4, the cassette casing 2 is mounted with the heat insulating module 14 therein, and the heat source is insulated from the cassette casing 2 by the heat insulating module 14 so that the temperature of the heat source is not rapidly conducted to the surface of the cassette casing 2, and the inside of the casing can be rapidly heated to a high temperature. The heat insulation module 14 is made of synthetic stone.
The heat-generating unit 15 is installed in the groove on the top surface of the heat-insulating module 14. A PT100 temperature sensor 18 is arranged at a groove on the top surface of the heating unit 15; a porcelain-like heating unit 16 is arranged at the groove on the bottom surface of the heating unit 15. The radiator 17 is fixed on the bottom surface of the heating unit 15 through screws, and the porcelain-like heating unit 16 is tightly pressed, so that the contact surfaces of the heating unit 15, the porcelain-like heating unit 16 and the radiator 17 are tightly attached together, and good thermal conductivity can be ensured.
The heating unit 15 is made of copper.
In order to ensure the heating performance, the heat insulation bottom plate 7 is arranged on the bottom surface of the box type shell 2, and when the heat insulation bottom plate 7 is arranged, a radiator sealing gasket 19 and a heat insulation bottom plate sealing gasket 20 are arranged on the inner plane, so that the sealing performance of the inner part of the shell is ensured.
FIG. 5 shows a circuit temperature control system of the temperature control device of the present embodiment
The temperature control system of the circuit mainly comprises a porcelain-like heating unit 16, a PT100 temperature sensor 18, a heating power supply 21, a temperature control instrument PID22 and a solid-state relay 23.
The porcelain-like heating unit 16 is powered by a 150W heating power supply, the voltage is 48V, and the power is 130W; the matching circuit board 13 is a high temperature resistant ceramic circuit board.
The heating power supply 21 supplies power to the porcelain-like heating unit 16; the porcelain-like heating unit 16 generates heat to generate a heat source. Because the porcelain-like heating unit 16 is closely attached to the contact surfaces of the heating unit 15 and the radiator 17, and the heating unit 15 is made of copper, the porcelain-like heating unit has good heat conduction performance, and a heat source generated by the porcelain-like heating unit 16 can be quickly conducted to the surface of the heating unit 15. Since the heat generating unit 15 is installed inside the cassette housing 2, the inside of the housing is a sealed environment, and thus heat generated from the heat generating unit 15 is accumulated inside the housing, thereby rapidly increasing the temperature inside the housing to a set temperature. The top surface of the heating unit 15 is provided with a PT100 temperature sensor 18 which can collect the temperature of the heating unit 15 in real time and feed the temperature back to the temperature control instrument PID 22. Because the temperature control instrument PID22 sets the preset heating temperature in advance, the temperature precision of automatic control heating is realized through the PID temperature control algorithm after receiving the real-time acquisition feedback of the PT100 temperature sensor 18. When the temperature approaches to the preset temperature value, the temperature control instrument PID22 controls the solid-state relay 23 connected with the temperature control instrument PID22, the other end of the solid-state relay 23 is connected with the heating power supply 21, and therefore the on-off of the porcelain-like heating unit 16 is controlled, namely the porcelain-like heating unit 16 is controlled in a pulse type heating mode, and finally the preset temperature value is reached, and therefore the temperature control precision is guaranteed.
Claims (5)
1. An independent heating temperature control device for device aging test is provided with a PT100 temperature sensor (18) and a temperature control instrument PID (22); the method is characterized in that: the device comprises a sealing box and an independent heating system in the sealing box;
the sealing box is composed of a box-type shell (2) with an opening at the upper part and a turnover cover (1) above the box-type shell, and the opening or closing of the turnover cover (1) realizes the opening and sealing of the sealing box;
the rear part of the box-type shell (2) is provided with a nitrogen interface (10) for filling nitrogen into the shell;
an SMA radio frequency connection female seat (8) and a threaded feedthrough capacitor (9) are respectively mounted on the left side and the right side in the box-type shell (2) and used for connecting a lead inside the box-type shell (2) to the outside;
the independent heating system mainly comprises an insulating module (14), a heating unit (15), a porcelain-like heating unit (16), a radiator (17), a PT100 temperature sensor (18), a temperature control instrument PID (22), a matching circuit board (13), an SMA radio frequency connection female seat (8) and a threaded feedthrough capacitor (9);
the heat insulation module (14) is provided with a rectangular groove, and the center of the groove is provided with a rectangular hole; a heating unit (15) is arranged in the rectangular groove of the heat insulation module (14); the top of the heating unit (15) is a plane, and the bottom of the heating unit is provided with a rectangular groove; a porcelain-like heating unit (16) is arranged at a groove at the bottom of the heating unit (15); the top surface of the porcelain-like heating unit (16) is tightly attached to the bottom plane of the groove of the heating unit (15); a radiator (17) is arranged on the bottom surface of the porcelain-like heating unit (16); the radiator (17) is fixed on the bottom surface of the heating unit (15); the contact surfaces between the heating unit (15), the porcelain-like heating unit (16) and the radiator (17) are tightly attached;
a PT100 temperature sensor (18) is arranged on the top surface of the heating unit (15) and used for collecting the heating temperature of the heating unit (15); the PT100 temperature sensor (18) is connected with a temperature control instrument PID (22);
a device matching circuit board (13) is arranged on the top surface of the heating unit (15) in the sealing box; the external connection wire of the matching circuit board (13) is fixedly connected with the threaded feedthrough capacitor (9) through SMA radio frequency connection female seats (8) arranged on the left side and the right side of the box-type shell (2).
2. The independently-heated temperature control device for device burn-in test of claim 1, wherein: an inner groove is formed in the upper portion of the inner wall of the box type shell (2), and a sealing ring (20) is installed in the inner groove; the bottom surface of the flip cover (1) is provided with a flip cover boss corresponding to the sealing ring (20), and when the flip cover boss is attached to the sealing ring (20), the flip cover (1) and the box-type shell (2) are in a sealing state.
3. The independently-heated temperature control apparatus for device burn-in test according to claim 2, wherein: after the flip boss is attached to the sealing ring, the flip (1) is pressed through the disk nuts (5) at the front and the rear, so that the sealing performance of the sealing box is ensured.
4. The independently-heated temperature control device for device burn-in test of claim 1, wherein: the heating unit (15) is made of copper.
5. The independently-heated temperature control device for device burn-in test of claim 1, wherein: the matching circuit board (13) is a high-temperature-resistant porcelain-like circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922112112.7U CN210924304U (en) | 2019-12-01 | 2019-12-01 | Independent heating temperature control device for device aging test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922112112.7U CN210924304U (en) | 2019-12-01 | 2019-12-01 | Independent heating temperature control device for device aging test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210924304U true CN210924304U (en) | 2020-07-03 |
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ID=71344765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922112112.7U Active CN210924304U (en) | 2019-12-01 | 2019-12-01 | Independent heating temperature control device for device aging test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210924304U (en) |
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2019
- 2019-12-01 CN CN201922112112.7U patent/CN210924304U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An independent heating and temperature control device for device aging test Effective date of registration: 20220818 Granted publication date: 20200703 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: SHAAXI SANHAI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022610000504 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231023 Granted publication date: 20200703 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: SHAAXI SANHAI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022610000504 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |