CN206330317U - A kind of free of contamination refrigeration plant of lower price high efficiency - Google Patents
A kind of free of contamination refrigeration plant of lower price high efficiency Download PDFInfo
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- CN206330317U CN206330317U CN201621328877.4U CN201621328877U CN206330317U CN 206330317 U CN206330317 U CN 206330317U CN 201621328877 U CN201621328877 U CN 201621328877U CN 206330317 U CN206330317 U CN 206330317U
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- temperature
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- lower price
- contamination
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Abstract
The utility model discloses a kind of free of contamination refrigeration plant of lower price high efficiency, it is included：Semiconductor refrigeration sheet, hot junction temperature conducting block, cold end temperature conducting block, radiator, lead warm head and temperature controller.Bury equipped with temperature sensor the geometric center position for wherein leading warm head.High and low-temperature apparatus using semiconductor refrigeration sheet as core parts have the free of contamination advantage of lower price high efficiency, and volume very little is moved easily, and the later stage, also without special maintenance, is that component level fault location and troubleshooting provide reliable, efficient measure.There is very strong practicality and application prospect.
Description
Technical field
The utility model is related to a kind of refrigeration equipment, and in particular to a kind of free of contamination refrigeration plant of lower price high efficiency.
Background technology
At present, during actual production practices, it is often necessary to use high-low temperature chamber to carry out thermocycling.It is conventional
The core of high-low temperature chamber is compressor and refrigerant, it is desirable to have enough heat-dissipating spaces and industrial power supply, and can form one
Fixed pollution.And in use, the temperature inside the box reaches time of design temperature all in hours from room temperature, stand-by period of cooling is very
It is long.As large industry equipment, periodic maintaining again can not economization.These can not be kept away using conventional high-low temperature chamber
The shortcoming exempted from.
When running into troubleshooting, need to carry out monoblock veneer repeated multiple times low-temperature test to position failure component,
The continuous situation for taking high-low temperature chamber for a long time occurs, a large amount of quality time and resource is wasted.Meanwhile, low temperature is also to list repeatedly
Plate causes unnecessary loss.
In order to shorten debugging cycle, debugging place is saved, the existing high and low-temperature apparatus of improvement are needed badly, a kind of low cost is designed,
Easy care, high efficiency, high reliability is easy to the free of contamination refrigeration plant of new lower price high efficiency of movement, specifically designed for component
Low-temperature test.Although this small-sized high and low-temperature apparatus can not be used instead of conventional height case completely, conventional height can be reduced
The frequency that cryogenic box is used, so that conventional high/low temperature preferably does other and is necessarily required to the environmental test that it could be realized, is carried
Its high efficiency.And small volume due to the free of contamination refrigeration plant of lower price high efficiency, low-cost feature, new lower price high efficiency
Free of contamination refrigeration plant can not only develop to portability direction, it is also possible to as each debugging station standard configuration.
Utility model content
The purpose of this utility model is to provide a kind of free of contamination refrigeration plant of the lower price high efficiency of miniature portable, can be right
Component on veneer carries out independent low-temperature test, realizes low-temperature test and the low temperature troubleshooting of component level.
In order to achieve the above object, the utility model is achieved through the following technical solutions.
A kind of free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, a certain component on veneer can be carried out single
Only low-temperature test, including：Semiconductor refrigeration sheet, during energization, semiconductor refrigeration sheet is heated when refrigeration；Lead temperature in hot junction
Block, is connected with the face that heats of the semiconductor refrigeration sheet；Cold end temperature conducting block, is connected with the chill surface of the semiconductor refrigeration sheet；
Radiator, is connected with the hot junction temperature conducting block；Warm head is led, is connected with the cold end temperature conducting block, its geometric center position, which is buried, to be equipped with
The real time temperature of warm head is led in temperature sensor, monitoring；Temperature controller, leads the temperature sensor in warm head and is connected with described.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, it is described lead warm head material selection thermal conductivity factor be
386.4w/ (m*k) red copper, chooses heat-conducting silicone grease as adhesive, and uniform smear is allowed to closely sealed in cold end temperature conducting block centre bit
Put.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, the material of the hot junction temperature conducting block and cold end temperature conducting block
The surface area of the red copper that material selection thermal conductivity factor is 386.4w/ (m*k), size and refrigerating sheet is harmonious, and chooses heat-conducting silicone grease conduct
Adhesive, uniform smear is allowed to closely sealed above and below refrigerating sheet on two surfaces.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, the heat radiation power of the radiator have to be larger than half
Conductor refrigerating sheet heats power.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, the refrigeration temperature levels of the refrigerating sheet for normal temperature ~
Subzero 45 °C.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, temperature controller is detected according to temperature sensor
The real time temperature for leading warm head, judge whether to reach target temperature, to control the power on/off of semiconductor refrigeration sheet.
The above-mentioned free of contamination refrigeration plant of lower price high efficiency, it is characterized in that, it can stablize in 600 seconds and keep target temperature.
The high and low-temperature apparatus and tradition height produced using the free of contamination refrigeration plant of lower price high efficiency of the present utility model
Incubator is compared, and is had the following advantages：It is first by core of semiconductor refrigeration sheet due to make use of the Peltier effects of semiconductor
The high and low-temperature apparatus of part have the free of contamination advantage of lower price high efficiency, and volume very little is moved easily, and the later stage is also without specialty
Safeguard, be that component level fault location and troubleshooting provide reliable, efficient measure.There is very strong practicality and application prospect.
Brief description of the drawings
Fig. 1 is semiconductor refrigeration sheet schematic diagram of the prior art.
Fig. 2 is the schematic diagram of refrigerating part in the utility model.
Embodiment
It will be described in further detail respectively for Fig. 1 and Fig. 2 below.
Fig. 1 is the structural representation of semiconductor refrigeration sheet of the prior art.Semiconductor refrigeration sheet, is also named thermoelectric cooling
Piece, is a kind of heat pump.Its advantage is the part not slided, small volume, be suitably applied in some spaces be restricted and can
High, not allow refrigerant to pollute occasion is required by property.
The Peltier effects of semi-conducting material refer to：When the conductor of two kinds of different materials is connected, if two connections
Point keeps different temperature, then produces a thermoelectromotive force in the conductor：ES=S × △ T, wherein ESFor thermoelectromotive force, S is
Thermoelectric power（Seebeck coefficient）, △ T are the temperature difference between contact.When electric current flows through the contact of two different conductor formation
When, junction can produce heat release or endothermic thermal event, and heat release or heat absorption size are determined by the size of electric current： Qπ=π×I.Wherein π
=a×TC, QπFor heat release or Endothermic power, π is proportionality coefficient（Peltier coefficients）, I is operating current, and a is thermoelectromotive force
Rate, Tc is cold junction temperature.When electric current flows through the conductor that there is thermograde, except the Joule heat that is produced by conductor resistance it
Outside, heat will also be released or absorbed to conductor, the temperature difference for △ T 2 points of conductor between, its thermal discharge or caloric receptivity for QT=T ×
I×△T.Wherein QT is heat release or Endothermic power, and T is Thomson coefficient, and I is operating current, and △ T are thermograde.
Semiconductor refrigeration sheet is to be made using the Peltier effects of semi-conducting material, there is up to a hundred inside refrigerating sheet
To the semiconductor grain of N-type and p-type, connected by metallic conductor 12.A pair of particles are referred to as a pair of galvanic couples pair.In N-type semiconductor
The free electron in portion is that " hole " electronics inside negative polarity, P-type semiconductor is positive polarity.When galvanic couple is to two ends connection direct current
Behind source, semiconductor internal electron is migrated.Direction is the sense of current as indicated by the dashed arrow in fig. 1.Free electron is by N-type
Grain flows to p-type particle, and junction absorbs heat, as cold end 14, specific to the lower surface in Fig. 1 being semiconductor refrigeration sheet；It is " empty
Cave " electronics flows to N-type particle by p-type particle, junction release heat, as hot junction 13, specific to being conductor refrigeration in Fig. 1
Piece upper surface.So semiconductor refrigeration sheet just has the heat when cold, and semiconductor refrigeration sheet will freeze, and just have to heat
Amount is drained, and otherwise will offset the effect of refrigeration.So its hot junction will help to radiate by setting radiator.
Fig. 2 is the schematic diagram of refrigerating part in the utility model, wherein, semiconductor refrigeration sheet 1 is flake, thereon following table
Face is insulating ceramic film, after being powered 2 ~ 3 seconds, upper surface potsherd heating, as hot junction；Lower surface potsherd cools, and turns into
Cold end.Therefore in two ceramic surfaces up and down of semiconductor refrigeration sheet（Hot junction and cold end）On be separately installed with hot junction temperature conducting block 2
With cold end temperature conducting block 3, heat transfer can be gone out rapidly.Lead temperature first 5 be located at cold end temperature conducting block 3 centers, for
Tested component 6 in tested single board 7 is fully contacted, and heat is absorbed from tested component, manufactures the low temperature of small range
Environment, reaches refrigeration.
Design difficulty of the present utility model is 2 aspects：1st, semiconductor refrigeration sheet 1 and radiator are matched；2nd, partly lead
The cold end of body refrigerating sheet 1 to the temperature for leading temperature first 5 is consumed and conducting power.
On the matching problem between semiconductor refrigeration sheet 1 and radiator 4：
Vital effect, the hot junction of semiconductor refrigeration sheet 1 are played in performance of the radiator 4 to the performance of semiconductor refrigeration sheet 1
Heat energy do not fall as discharged slow or release, will result directly in the poor refrigerating capability of semiconductor refrigeration sheet 1 or even directly burn.Cause
This, it is necessary first to radiator is set on the hot junction temperature conducting block 2 positioned at the hot junction of semiconductor refrigeration sheet 1, and heat absorption must be selected
Power is more than the radiator of the heat release power of semiconductor refrigeration sheet 1.In order that semiconductor refrigeration sheet 1 is preferably matched with radiator 4,
The utility model uses water-filled radiator.
Described water-filled radiator makes the coolant in radiating tube circulate and be radiated using pump.Suction on a heat sink
Hot part（It is referred to as endothermic box in liquid cooling system）For absorbing heat from the hot junction of semiconductor refrigeration sheet.In the present embodiment,
Described water-filled radiator is used as water-cooled liquid using XSPC concentrates.
On semiconductor refrigeration sheet 1 and lead temperature first 5 between temperature consumption with conducting power problem：
In order to assist in keeping low temperature, Insulation can be taken around semiconductor refrigeration sheet 1.One comparison is rational
Insulation is the hot junction temperature conducting block 2 in radiator 4, semiconductor refrigeration sheet 1, cold end temperature conducting block 3 and the periphery for leading first 5 entirety of temperature
Filled with common cotton in the space wrapped up in a cylinder-like shell, shell.Cylinder upper end with briquetting by radiator 4, hot junction
Temperature conducting block 2, semiconductor refrigeration sheet 1, cold end temperature conducting block 3 is squeezed in cylinder with temperature first 5 is led, and is screwed locked.Cylinder bottom
The briquetting central aperture that portion is installed, exposes to bury and leads temperature first 5 equipped with temperature sensor, briquetting is locked with screw.
When mounted, absolute alcohol cotton is used first, by semiconductor refrigeration sheet 1, hot junction temperature conducting block 2, cold end temperature conducting block 3 and is led
The two sides of temperature first 5 is scrubbed respectively, uniformly coats one layer of very thin heat-conducting silicone grease；Installation surface should be processed, epidermis Pingdu
No more than 0.03MM, and clean up；In installation process between semiconductor refrigeration sheet 1 and hot junction temperature conducting block 2, conductor refrigeration
Between piece 1 and cold end temperature conducting block 3, cold end temperature conducting block 3 and leading all must reach between temperature first 4 good, hot junction temperature conducting block 2 should be with dissipating
Hot device 4 is contacted well.Lead and should be filled between temperature first 5 and radiator 4 with heat-barrier material, its thickness is advisable with 25 ~ 30MM.
Temperature controlled process：
After the free of contamination refrigeration plant of lower price high efficiency is started working, temperature sensor senses to the real-time temperature for leading temperature first 5
Degree, temperature controller reads Current Temperatures, compared with default value, leads to if not up to preset value to semiconductor refrigeration sheet 1
Electricity, makes it continue to cool, temporarily can be powered off if preset value has been reached to semiconductor refrigeration sheet 1, make it maintain Current Temperatures.
Temperature controller constantly repeats the process of above-mentioned reading-judgement-energization or power-off, to maintain the free of contamination system of this lower price high efficiency
The temperature of cool equipment.
The utility model utilizes the refrigeration characteristic of semiconductor refrigeration sheet, and the fast advantage of small volume, refrigerating speed, is component
Level fault location and troubleshooting provide reliable, efficient measure.There is very strong practicality and application prospect.
Claims (7)
1. a kind of free of contamination refrigeration plant of lower price high efficiency, it is characterised in that a certain component on veneer can be carried out single
Only low-temperature test, including：
Semiconductor refrigeration sheet（1）, during energization, semiconductor refrigeration sheet is heated when refrigeration；
Hot junction temperature conducting block（2）, with the semiconductor refrigeration sheet（1）Heat face connection；
Cold end temperature conducting block（3）, with the semiconductor refrigeration sheet（1）Chill surface connection；
Radiator（4）, with the hot junction temperature conducting block（2）Connection；
Lead warm head（5）, with the cold end temperature conducting block（3）Connection, its geometric center position is buried equipped with temperature sensor, and temperature is led in monitoring
Head（5）Real time temperature；
Temperature controller, warm head is led with described（5）In temperature sensor be connected.
2. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that described to lead warm head（5）Material
From the red copper that thermal conductivity factor is 386.4w/ (m*k), heat-conducting silicone grease is chosen as adhesive, and uniform smear is allowed to closely sealed cold
Hold temperature conducting block（3）Center.
3. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that the hot junction temperature conducting block（2）With
Cold end temperature conducting block（3）Material selection thermal conductivity factor be 386.4w/ (m*k) red copper, size and refrigerating sheet（1）Surface area phase
Close, choose heat-conducting silicone grease as adhesive, uniform smear is allowed to closely sealed in refrigerating sheet（1）Up and down on two surfaces.
4. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that the radiator（4）Radiating
Power have to be larger than semiconductor refrigeration sheet（1）Heat power.
5. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that the refrigerating sheet（1）Refrigeration
Temperature range is normal temperature ~ subzero 45 °C.
6. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that temperature controller is passed according to temperature
What sensor was detected leads warm head（5）Real time temperature, judge whether to reach target temperature, to control semiconductor refrigeration sheet（1）'s
Power on/off.
7. the free of contamination refrigeration plant of lower price high efficiency as claimed in claim 1, it is characterised in that can stablize in 600 seconds and keep
Target temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621328877.4U CN206330317U (en) | 2016-12-02 | 2016-12-02 | A kind of free of contamination refrigeration plant of lower price high efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621328877.4U CN206330317U (en) | 2016-12-02 | 2016-12-02 | A kind of free of contamination refrigeration plant of lower price high efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206330317U true CN206330317U (en) | 2017-07-14 |
Family
ID=59288428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621328877.4U Expired - Fee Related CN206330317U (en) | 2016-12-02 | 2016-12-02 | A kind of free of contamination refrigeration plant of lower price high efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206330317U (en) |
-
2016
- 2016-12-02 CN CN201621328877.4U patent/CN206330317U/en not_active Expired - Fee Related
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170714 Termination date: 20211202 |