CN210899801U

CN210899801U - Water-cooled UV curing module

Info

Publication number: CN210899801U
Application number: CN201921686454.3U
Authority: CN
Inventors: 丁润庚; 王超
Original assignee: Qingdao CCS Electric Corp
Current assignee: Qingdao CCS Electric Corp
Priority date: 2019-10-10
Filing date: 2019-10-10
Publication date: 2020-06-30
Anticipated expiration: 2029-10-10

Abstract

The utility model discloses a water-cooled UV curing module, which relates to the technical field of UV curing equipment and comprises a PCB (printed Circuit Board), wherein the PCB comprises a metal base layer, a heat conduction insulating layer arranged on the metal base layer and a conductive layer arranged on the heat conduction insulating layer, and a water channel which is used for water to flow through and is used for the metal base layer to run through is arranged in the metal base layer; further comprising a UV-LED lamp disposed on the conductive layer; the water supply device also comprises a water joint which is arranged at the port of the water channel and is used for being connected with an external water source. According to the arrangement, the function of water-cooling heat dissipation is realized after water flows through the water channel, the heat dissipation capacity of the water-cooling type UV curing module can be adjusted by adjusting the flow of water, the operation is simple and easy, and the heat dissipation capacity of the water-cooling type UV curing module can be adjusted in time according to the actual heat production condition of the UV-LED lamp.

Description

Water-cooled UV curing module

Technical Field

The utility model relates to a UV curing equipment technical field, more specifically say, relate to a water-cooled UV curing module.

Background

The UV curing process is a radiation hardening technique that uses a UV light source to irradiate a chemical, so that a 'light initiator' contained in the chemical is stimulated by the UV light source to produce gluing hardening of a 'polymerized monomer' contained in the chemical in a very short time, and in the industrial production process, the use of UV curing equipment is more and more widespread due to the good curing characteristic and flexible irradiation wavelength of the process.

However, the core part of the UV curing equipment is a UV-LED lamp which is a high-heat-value element, and the UV-LED is rapidly aged, the irradiation waveform is abnormal, and the service life is reduced due to improper heat dissipation treatment measures. In order to ensure the heat dissipation capacity of the UV-LED lamp, the UV curing equipment in the prior art simulates a thermodynamic vector by utilizing thermodynamic analysis in finite element analysis of a model, so as to build a heat dissipation framework. The technical difficulty of the method is high and complex, the time consumed for building the heat dissipation structure is long, the heat dissipation structures cannot be mutually combined and used and need to be built again under the condition that the quantity of the UV-LED lamps is different in heat production, and the heat dissipation structures cannot be timely adjusted according to actual conditions due to the fact that deviation hidden dangers exist in actual use.

Therefore, how to solve the problems that the heat dissipation processing mode of the UV curing equipment in the prior art is complex, and the heat dissipation capacity of the equipment cannot be adjusted and changed according to the actual heat generation condition of the UV-LED lamp becomes an important technical problem to be solved by the technicians in the field.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a water-cooled UV solidification module, it is simple than the radiating mode of UV solidification equipment processing among the prior art, easily carry out, and can in time adjust the heat dissipation capacity of water-cooled UV solidification module according to the actual heat production condition of UV-LED lamp.

The utility model provides a water-cooled UV curing module, including the PCB board, the PCB board includes metal-based layer, sets up heat conduction insulating layer on the metal-based layer, sets up the conducting layer on the heat conduction insulating layer, be provided with in the metal-based layer supply water flow through, and with the water course that the metal-based layer runs through; further comprising a UV-LED lamp disposed on the conductive layer; the water supply device also comprises a water joint which is arranged at the port of the water channel and is used for being connected with an external water source.

Preferably, the water channel is provided with a plurality of water channels which are communicated with each other.

Preferably, the PCB is provided with a plurality of water connectors, and the water connectors of any two adjacent PCBs are connected through a water pipe.

Preferably, the water swivel with the one end that the port of water course is connected is equipped with the external screw thread, the cavity of water course is cylindrical, and be equipped with in the port department with water swivel assorted internal thread.

Preferably, the number of the UV-LED lamps is n, all the UV-LED lamps in each group are in series connection, and all the groups are in parallel connection; wherein n is a positive integer greater than or equal to 1.

Preferably, the plurality of water channels include a main water channel and branch water channels vertically communicated with the main water channel, respectively, and the branch water channels are uniformly distributed.

Preferably, the metal base layer of the PCB board is a copper base layer.

Preferably, the LED lamp further comprises a temperature detection device which is arranged on the PCB and is positioned at the side of the UV-LED lamp.

Preferably, the temperature detection device is provided with a plurality of temperature detection devices, and the plurality of temperature detection devices are respectively arranged at different positions on the PCB.

Preferably, the temperature detection means comprises an NTC thermistor.

The utility model provides an among the technical scheme, in order including metal-based layer, the heat conduction insulating layer, the PCB board of conducting layer is as the carrier, set up the UV-LED lamp on the conducting layer of PCB board, be equipped with the water course that link up in the metal-based layer of PCB board, the water course port is equipped with the water swivel that can connect outside water source, the water course is located the metal-based layer that thermal conductivity is good, the security of using has been guaranteed to the heat conduction insulating layer transfer heat in the time, so set up, the rivers have just realized the function of water-cooling heat dissipation behind the water course, the heat dissipation capacity of water-cooled UV solidification module can be adjusted to the flow through adjusting water, this technical scheme's heat dissipation mode is simple and easy, and can in time adjust the heat dissipation capacity of water-cooled UV solidification.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a PCB board in an embodiment of the present invention;

FIG. 2 is a front view of a water-cooled UV curing module according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional structure view of a PCB board according to an embodiment of the present invention;

in fig. 1-3:

the solar water heater comprises a metal base layer 1, a heat conduction insulating layer 2, a conductive layer 3, a 4-UV-LED lamp, a 5-water joint, a 6-NTC thermistor, a 7-main water channel and an 8-branch water channel.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

An object of this embodiment is to provide a water-cooled UV curing module, it can solve the radiating mode complicacy of processing of UV curing equipment among the prior art, and the equipment heat dissipation capacity can not make the problem of adjustment change according to the actual heat production condition of UV-LED lamp.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments described below do not limit the scope of the invention described in the claims. Further, the entire contents of the configurations shown in the following embodiments are not limited to those necessary as a solution of the invention described in the claims.

Referring to fig. 1 and 2, the water-cooled UV curing module according to the present embodiment includes a PCB, a water channel, a UV-LED lamp 4, and a water connector 5, wherein the PCB includes a metal base layer 1, a heat conducting insulating layer 2 disposed on the metal base layer 1, and a conductive layer 3 disposed on the heat conducting insulating layer 2, the water channel is disposed in the metal base layer 1 and penetrates the metal base layer 1, the UV-LED lamp 4 is disposed on the conductive layer 3, and the water connector 5 is connected to an external water source and disposed at a port of the water channel.

According to the arrangement, the PCB comprising the metal base layer 1, the heat conducting insulating layer 2 and the conducting layer 3 is used as a carrier, a prefabricated circuit is arranged in the conducting layer 3, the UV-LED lamp 4 is welded on the conducting layer 3, heat generated by the UV-LED lamp 4 is transferred and diffused into the whole PCB, a through water channel is arranged in the metal base layer 1, a water joint capable of being connected with an external water source is arranged at the port of the water channel, after the water source is communicated, the metal base layer 1 has good heat conductivity, the water-cooling heat dissipation function is realized after water flows through the water channel, the heat dissipation capacity of the water-cooling type UV curing module can be adjusted by adjusting the flow of water, the heat dissipation mode is simple and easy to implement, the heat dissipation capacity of the water-cooling type UV curing module can be adjusted in time according to the actual heat production condition of the UV-LED lamp, the UV.

Specifically, the metal base layer 1 of the PCB board may be selectively provided as a copper base layer, and the thickness may be specifically set to 20 mm; the heat-conducting insulating layer 2 can be selected to be composed of a polymer (mainly epoxy resin) filled with high-heat-conducting and high-insulating ceramic powder, and the insulating layer has good heat-conducting performance, high insulating strength and good bonding performance; the conductive layer 3, or copper foil, is a printed circuit that is typically formed by etching.

In order to improve the water cooling effect, a plurality of water channels can be selectively arranged, the plurality of water channels can be selectively arranged in a mutually parallel mode in the metal base layer 1, and an external water source is respectively connected with the plurality of water channels, and can also be arranged in a mutually communicated mode in the metal base layer 1, and the external water source is connected with one of the plurality of water channels, so that water flowing through the water channels is discharged, collected and collected to one position.

Specifically, referring to fig. 3, the plurality of water channels include a main water channel 7 and two branch water channels 8 vertically connected to the main water channel 7, respectively, and the branch water channels 8 are uniformly distributed.

Further, the PCB board can be provided with a plurality of water connectors 5, and the water connectors 5 of any two adjacent PCB boards are connected through water pipes. Specifically, the cooperation is equipped with main water course 7 and a water course 8, series connection or parallelly connected between a plurality of main water courses 7, make and form series connection or parallelly connected relation between a plurality of PCB boards, rivers are realized shunting to every PCB board through every main water course 7, rivers are followed main water course 7 and are flowed to a water course 8 in and discharge after that, accomplish the cooling process, so make water-cooled UV solidification module have the expansibility, can splice according to the actual application condition, use the flexibility ratio high.

The connection between the water joint 5 and the port of the water channel can be specifically set to be that an external thread is arranged at one end of the water joint 5 connected with the port of the water channel, the cavity of the water channel is cylindrical, and an internal thread matched with the water joint 5 is arranged at the port. This connection and the associated water connection 5 are common and easy to handle.

Furthermore, a plurality of UV-LED lamps 4 are arranged and can be selectively divided into n groups, all the UV-LED lamps 4 in each group are in series connection, and all the groups are in parallel connection; wherein n is a positive integer greater than or equal to 1. Specifically, the wavelength range of the UV-LED lamp 4 in this embodiment is 315nm to 365nm, and 40 UV-LED lamps are provided in four groups. So set up, the UV-LED of each group can adopt individual lead wire control, has strengthened product development and flexibility of use.

In addition, in order to monitor the temperature of the UV-LED lamp 4 more accurately, a temperature detection device can be arranged on the PCB board and is positioned at the side of the UV-LED lamp 4. So set up, in time take counter-measure according to the temperature that temperature-detecting device detected, in time increase discharge when the temperature is too high, can suitably reduce discharge water saving after the temperature drops, it is required to explain that this process can be realized for controlling, also can be accomplished by the control unit cooperation solenoid valve of being connected with temperature-detecting device. The technical scheme that this embodiment provided is favorable to using water-cooled UV solidification module more conveniently, and it needs to explain, because the heat conductivity of whole PCB board is all better, can install temperature-detecting device in different positions as required among the practical application, in order to detect the temperature that is closest to 4 actual conditions of UV-LED lamp in this embodiment, select to set up temperature-detecting device at the avris of UV-LED lamp 4.

In order to avoid the influence of accidental errors generated during temperature detection on the actual situation as much as possible and improve the accuracy of temperature detection, a plurality of temperature detection devices can be selected and arranged at different positions on the PCB respectively.

Further, referring to fig. 2, the temperature detecting device may be selectively set to include an NTC thermistor 6, the NTC thermistor 6 has high sensitivity, good stability, strong overload capability, small volume, and simple application means, and can obtain corresponding different temperatures by detecting different resistance values thereof, thereby controlling the water flow. Specifically, the NTC thermistor 6 provided in the present embodiment is of 0805 type, and has a resistance value of 10K Ω.

It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments. The utility model provides a plurality of schemes contain the basic scheme of itself, mutual independence to restrict each other, but it also can combine each other under the condition of not conflicting, reaches a plurality of effects and realizes jointly.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A water-cooled UV curing module, comprising:

the PCB comprises a metal base layer (1), a heat conduction insulating layer (2) arranged on the metal base layer (1) and a conductive layer (3) arranged on the heat conduction insulating layer (2), wherein a water channel which is used for water to flow through and penetrates through the metal base layer (1) is arranged in the metal base layer (1);

a UV-LED lamp (4) arranged on the conductive layer (3);

and the water joint (5) is arranged at the port of the water channel and is used for being connected with an external water source.

2. The water-cooled UV curing module according to claim 1, wherein a plurality of said water passages are provided, and a plurality of said water passages are communicated with each other.

3. The water-cooled UV curing module according to claim 1, wherein said PCB is provided with a plurality of water connectors (5) of any two adjacent PCB connected by a water pipe.

4. The water-cooled UV curing module according to claim 1, wherein the water joint (5) has an external thread at the end connected to the port of the water channel, the cavity of the water channel is cylindrical, and an internal thread matching the water joint (5) is provided at the port.

5. The water-cooled UV curing module according to claim 1, wherein the UV-LED lamps (4) are divided into n groups, all the UV-LED lamps (4) of each group are connected in series, and all the groups are connected in parallel; wherein n is a positive integer greater than or equal to 1.

6. The water-cooled UV curing module according to claim 3, wherein a plurality of said water channels includes a main water channel (7) and branch water channels (8) vertically communicating with said main water channel (7), respectively, said branch water channels (8) being uniformly distributed.

7. The water-cooled UV curing module according to claim 1, wherein the metal base layer (1) of the PCB board is a copper base layer.

8. The water-cooled UV curing module according to claim 1, further comprising a temperature detection device disposed on the PCB and located at the side of the UV-LED lamp (4).

9. The water-cooled UV curing module according to claim 8, wherein a plurality of temperature detecting devices are provided, and the plurality of temperature detecting devices are respectively provided at different positions on the PCB.

10. The water-cooled UV curing module according to claim 8, wherein said temperature detection means comprises an NTC thermistor (6).