CN210897205U

CN210897205U - Packaging hardware is used in paster diode production

Info

Publication number: CN210897205U
Application number: CN201921920562.2U
Authority: CN
Inventors: 王天宇
Original assignee: Taicang Vistone Electronic Technology Co ltd
Current assignee: Taicang Vistone Electronic Technology Co ltd
Priority date: 2019-11-08
Filing date: 2019-11-08
Publication date: 2020-06-30
Anticipated expiration: 2029-11-08

Abstract

The utility model relates to a paster diode production technical field just discloses an encapsulation device is used in production of paster diode, comprising a base plate, the top fixedly connected with supporting shoe of bottom plate, the top fixedly connected with output motor of supporting shoe, the output shaft fixedly connected with axis of rotation of output motor, the right-hand member fixedly connected with output gear of axis of rotation, the top meshing of output gear has driven gear, driven gear's left side fixedly connected with dwang, the left side fixedly connected with connecting block at bottom plate top, the square piece of right side fixedly connected with of connecting block, the spout has been seted up on the right side of square piece, the inside sliding connection of spout has the slider. This packaging hardware is used in paster diode production through setting up damping spring, has strengthened paster diode production packaging hardware's stability, through setting up accommodate motor, and the effectual highly convenient for who makes the sucking disc adjusts.

Description

Packaging hardware is used in paster diode production

Technical Field

The utility model relates to a paster diode production technical field specifically is an encapsulation device is used in paster diode production.

Background

The chip diode is a diode for short, and is an electronic device with unidirectional conduction current, space charge layers are formed on two sides of an interface of the chip diode to form a self-established electric field, and when an external voltage is equal to zero, diffusion current caused by the concentration difference of carriers on two sides is equal to drift current caused by the self-established electric field, so that the chip diode is in an electric balance state.

The essential thing of paster diode production is packaging hardware, and the encapsulation means of current generally is artificial encapsulation, and artificial encapsulation is at the bottom of the encapsulation efficiency, mechanical packaging, during the encapsulation, needs the height of manual regulation encapsulation anchor clamps, and is not convenient enough, and the motor will acutely shake, produces the noise that makes the annoyance, influences packaging hardware's stability, so proposes a packaging hardware for paster diode production and solves the above-mentioned problem of proposing.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a packaging hardware is used in paster diode production possesses advantages such as stability is strong, height and packaging efficiency height about being convenient for adjust, has solved the problem that packaging hardware is not enough for the production of paster diode, height and stability are not enough about being not convenient for adjust.

(II) technical scheme

For the purpose that realizes above-mentioned stability is strong and encapsulation efficiency is high, the utility model provides a following technical scheme: a packaging device for producing a Surface Mount Diode (SMD) comprises a base plate, wherein a supporting block is fixedly connected to the top of the base plate, an output motor is fixedly connected to the top of the supporting block, a rotating shaft is fixedly connected to an output shaft of the output motor, an output gear is fixedly connected to the right end of the rotating shaft, a driven gear is meshed to the top of the output gear, a rotating rod is fixedly connected to the left side of the driven gear, a connecting block is fixedly connected to the left side of the top of the base plate, a square block is fixedly connected to the right side of the connecting block, a sliding groove is formed in the right side of the square block, a sliding block is slidably connected to the inside of the sliding groove, a supporting plate is fixedly connected to the right side of the sliding block, a threaded cylinder is fixedly connected to, the equal fixedly connected with snubber blocks in the left and right sides of accommodate motor, two the damping groove has all been seted up to the relative one side of snubber block, the inside fixedly connected with damping spring of damping groove, the bottom fixedly connected with pneumatic chamber of backup pad, the bottom fixedly connected with connecting pipe of pneumatic chamber, the bottom fixedly connected with sucking disc of connecting pipe.

Preferably, the right side fixedly connected with rectangular block of connecting block, and the right side of rectangular block has seted up the rotation groove, the left end of dwang is located the inside in rotation groove.

Preferably, the top end of the connecting shaft is positioned in the threaded cylinder and is in threaded connection with the threaded cylinder.

Preferably, the top of bottom plate fixed connection regulating block, and the left side of regulating block has seted up hollow hole, and hollow hole rotates with the axis of rotation to be connected.

Preferably, the outer surface transmission of dwang is connected with the conveyer belt, and the diode has been placed at the top of conveyer belt.

Preferably, the bottom of the supporting plate is fixedly connected with a hydraulic tank, and an adjusting pipe is fixedly connected between the hydraulic tank and the air pressure tank.

(III) advantageous effects

Compared with the prior art, the utility model provides a packaging hardware is used in paster diode production possesses following beneficial effect:

1. this packaging hardware is used in paster diode production, through setting up damping spring, under damping spring's cushioning effect, the vibration amplitude of accommodate motor reduces, paster diode production packaging hardware's stability has been strengthened, through function accommodate motor, accommodate motor's output shaft drives the connecting axle and rotates, under the limiting displacement of slider, the rotation of connecting axle drives a screw thread section of thick bamboo and reciprocates, reciprocating of a screw thread section of thick bamboo drives atmospheric pressure case in proper order, connecting pipe and sucking disc reciprocate, the effectual highly convenient to adjust that makes the sucking disc.

2. This packaging hardware is used in paster diode production, place the packaging casing in the bottom of sucking disc, adsorption at the sucking disc is under, the packaging casing is fixed, function output motor, the output shaft of output motor drives the axis of rotation and rotates, the rotation of axis of rotation drives output gear and rotates, output gear's rotation drives driven gear and rotates, driven gear's rotation drives the dwang and rotates, the rotation of dwang drives the conveyer belt and slides, make the diode carried to the below of sucking disc, through setting up the hydraulic pressure case, under the pressure effect of hydraulic pressure case, pressure in the sucking disc is greater than external pressure, thereby the packaging box breaks away from the sucking disc, and then accomplish the encapsulation, this process, the packaging efficiency of packaging hardware is used in paster diode production has been improved.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: the device comprises a base plate 1, supporting blocks 2, an output motor 3, a rotating shaft 4, an output gear 5, a driven gear 6, a rotating rod 7, a connecting block 8, a square block 9, a sliding groove 10, a sliding block 11, a supporting plate 12, a threaded cylinder 13, an adjusting motor 14, a connecting shaft 15, a damping block 16, a damping groove 17, a damping spring 18, a pneumatic box 19, a connecting pipe 20 and a sucking disc 21.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a packaging device for producing a chip diode comprises a base plate 1, a top of the base plate 1 is fixedly connected with an adjusting block, a hollow hole is formed in the left side of the adjusting block, the hollow hole is rotatably connected with a rotating shaft 4, a top of the base plate 1 is fixedly connected with a supporting block 2, a top of the supporting block 2 is fixedly connected with an output motor 3, the output motor 3 can be of an RS775 type, an output shaft of the output motor 3 is fixedly connected with the rotating shaft 4, a right end of the rotating shaft 4 is fixedly connected with an output gear 5, a top of the output gear 5 is engaged with a driven gear 6, a left side of the driven gear 6 is fixedly connected with a rotating rod 7, a left side of the top of the base plate 1 is fixedly connected with a connecting block 8, a right side of the connecting block 8 is fixedly connected with a rectangular block, a rotating groove is formed in the right, the outer surface of the rotating rod 7 is in transmission connection with a conveyor belt, the top of the conveyor belt is provided with a diode, the right side of the square block 9 is provided with a chute 10, the inside of the chute 10 is in sliding connection with a slide block 11, the right side of the slide block 11 is fixedly connected with a support plate 12, the right side of the support plate 12 is fixedly connected with a threaded cylinder 13, the right side of the top of the bottom plate 1 is fixedly connected with an adjusting motor 14, the model of the adjusting motor 14 can be RS775, the output shaft of the adjusting motor 14 is fixedly connected with a connecting shaft 15, the top end of the connecting shaft 15 is positioned inside the threaded cylinder 13 and in threaded connection with the threaded cylinder 13, the left side and the right side of the adjusting motor 14 are both fixedly connected with damping blocks 16, one sides of the two damping blocks 16 opposite to each other are both provided with a damping groove, an adjusting pipe is fixedly connected between the hydraulic box and the air pressure box 19, a connecting pipe 20 is fixedly connected at the bottom of the air pressure box 19, a sucker 21 is fixedly connected at the bottom of the connecting pipe 20, a damping spring 18 is arranged, the vibration amplitude of an adjusting motor 14 is reduced under the damping action of the damping spring 18, the stability of the packaging device for producing the chip diode is enhanced, the output shaft of the adjusting motor 14 drives a connecting shaft 15 to rotate by operating the adjusting motor 14, the connecting shaft 15 rotates to drive a threaded cylinder 13 to move up and down under the limiting action of a slide block 11, the up and down movement of the threaded cylinder 13 sequentially drives the air pressure box 19, the connecting pipe 20 and the sucker 21 to move up and down, the height of the sucker 21 is effectively convenient to adjust, a packaging shell is placed at the bottom of the sucker 21, the packaging shell is fixed under the adsorption action of the sucker 21, the output motor 3 operates, and, rotation of axis of rotation 4 drives output gear 5 and rotates, output gear 5's rotation drives driven gear 6 and rotates, driven gear 6's rotation drives dwang 7 and rotates, the rotation of dwang 7 drives the conveyer belt and slides, make the diode carried to the below of sucking disc 21, through setting up the hydraulic pressure case, under the pressure effect of hydraulic pressure case, pressure in the sucking disc 21 is greater than external pressure, thereby the encapsulation box breaks away from sucking disc 21, and then accomplish the encapsulation, this process, the packaging efficiency of packaging hardware is used in paster diode production has been improved.

When in use, by arranging the damping spring 18, under the damping action of the damping spring 18, the vibration amplitude of the adjusting motor 14 is reduced, and the stability of the packaging device for producing the surface mount diode is enhanced, by operating the adjusting motor 14, the output shaft of the adjusting motor 14 drives the connecting shaft 15 to rotate, under the limiting action of the slide block 11, the rotation of the connecting shaft 15 drives the threaded cylinder 13 to move up and down, the up-and-down movement of the threaded cylinder 13 drives the air pressure box 19 to move up and down, the up-and-down movement of the air pressure box 19 drives the connecting pipe 20 to move up and down, the up-and-down movement of the connecting pipe 20 drives the sucking disc 21 to move up and down, the height of the sucking disc 21 is effectively convenient to adjust, the packaging shell is placed at the bottom of the sucking disc 21, under the adsorption action of the sucking disc 21, the packaging shell, the rotation of output gear 5 drives driven gear 6 and rotates, driven gear 6's rotation drives dwang 7 and rotates, and the rotation of dwang 7 drives the conveyer belt and slides, makes the diode carried to the below of sucking disc 21, through setting up the hydraulic pressure case, under the pressure effect of hydraulic pressure case, pressure in the sucking disc 21 is greater than external pressure, thereby the encapsulation box breaks away from sucking disc 21, and then accomplishes the encapsulation, and this process has improved paster diode production and has used packaging device's encapsulation efficiency.

In conclusion, according to the packaging device for producing the chip diode, the damping spring 18 is arranged, under the damping action of the damping spring 18, the vibration amplitude of the adjusting motor 14 is reduced, the stability of the packaging device for producing the chip diode is enhanced, the adjusting motor 14 is operated, the output shaft of the adjusting motor 14 drives the connecting shaft 15 to rotate, under the limiting action of the sliding block 11, the connecting shaft 15 rotates to drive the threaded cylinder 13 to move up and down, the threaded cylinder 13 moves up and down to sequentially drive the air pressure box 19, the connecting pipe 20 and the sucking disc 21 to move up and down, and the height of the sucking disc 21 is effectively adjusted conveniently.

And, the packaging shell is placed at the bottom of the sucker 21, the packaging shell is fixed under the adsorption action of the sucker 21, the output motor 3 is operated, the output shaft of the output motor 3 drives the rotating shaft 4 to rotate, the rotating shaft 4 drives the output gear 5 to rotate, the rotation of the output gear 5 drives the driven gear 6 to rotate, the rotation of the driven gear 6 drives the rotating rod 7 to rotate, the rotation of the rotating rod 7 drives the conveying belt to slide, so that the diode is conveyed to the lower part of the sucker 21, and by arranging the hydraulic tank, under the pressure of the hydraulic tank, the pressure in the suction cup 21 is higher than the external pressure, the packaging box is separated from the suction cup 21, and then accomplish the encapsulation, this process has improved packaging efficiency of packaging hardware for the production of paster diode, has solved that packaging hardware for the production of paster diode packaging efficiency is not enough, be not convenient for adjust the problem that height and stability are not enough from top to bottom.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a packaging hardware is used in paster diode production, includes bottom plate (1), its characterized in that: the top of the bottom plate (1) is fixedly connected with a supporting block (2), the top of the supporting block (2) is fixedly connected with an output motor (3), an output shaft of the output motor (3) is fixedly connected with a rotating shaft (4), the right end of the rotating shaft (4) is fixedly connected with an output gear (5), the top of the output gear (5) is meshed with a driven gear (6), the left side of the driven gear (6) is fixedly connected with a rotating rod (7), the left side of the top of the bottom plate (1) is fixedly connected with a connecting block (8), the right side of the connecting block (8) is fixedly connected with a square block (9), the right side of the square block (9) is provided with a sliding groove (10), the inside of the sliding groove (10) is slidably connected with a sliding block (11), the right side of the sliding block (11) is fixedly connected with a supporting plate (12, the utility model discloses a damping device, including bottom plate (1), the right side fixedly connected with adjusting motor (14) at top, the output shaft fixedly connected with connecting axle (15) of adjusting motor (14), the equal fixedly connected with snubber block (16) in both sides about adjusting motor (14), two snubber block (16) relative one side has all seted up damping groove (17), the inside fixedly connected with damping spring (18) of damping groove (17), the bottom fixedly connected with atmospheric pressure case (19) of backup pad (12), the bottom fixedly connected with connecting pipe (20) of atmospheric pressure case (19), the bottom fixedly connected with sucking disc (21) of connecting pipe (20).

2. The packaging device for producing a chip diode according to claim 1, wherein: the right side fixedly connected with rectangular block of connecting block (8), and the right side of rectangular block has seted up the rotation groove, the left end of dwang (7) is located the inside in rotation groove.

3. The packaging device for producing a chip diode according to claim 1, wherein: the top end of the connecting shaft (15) is positioned in the threaded cylinder (13) and is in threaded connection with the threaded cylinder (13).

4. The packaging device for producing a chip diode according to claim 1, wherein: the top fixed connection regulating block of bottom plate (1), and the hollow hole has been seted up on the left side of regulating block, and hollow hole rotates with axis of rotation (4) and is connected.

5. The packaging device for producing a chip diode according to claim 1, wherein: the surface transmission of dwang (7) is connected with the conveyer belt, and the diode has been placed at the top of conveyer belt.

6. The packaging device for producing a chip diode according to claim 1, wherein: the bottom of the supporting plate (12) is fixedly connected with a hydraulic tank, and an adjusting pipe is fixedly connected between the hydraulic tank and the air pressure tank (19).