CN206907747U - A kind of semiconductor wafer package conveying device - Google Patents
A kind of semiconductor wafer package conveying device Download PDFInfo
- Publication number
- CN206907747U CN206907747U CN201720832490.0U CN201720832490U CN206907747U CN 206907747 U CN206907747 U CN 206907747U CN 201720832490 U CN201720832490 U CN 201720832490U CN 206907747 U CN206907747 U CN 206907747U
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- China
- Prior art keywords
- fixedly connected
- cross bar
- fixed mount
- semiconductor wafer
- motor
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Abstract
The utility model discloses a kind of semiconductor wafer package conveying device, including base, support bar is fixedly connected with the left of the base top, operating desk is fixedly connected with the top of the support bar, cross bar is provided with the top of the base, the left end and right-hand member at the cross bar back side have been movably connected with first rotating shaft and the second rotating shaft, are connected between the first rotating shaft and the second rotating shaft by pulley drive, and the positive right-hand member of cross bar is fixedly connected with the first motor.The setting that the utility model passes through the second motor, pinion rotation can be driven, pass through the setting of gear and tooth plate, cross bar can be driven to rise, by the setting of mobile bar, drive adjusting rod and pulley to slide during mobile bar follows cross bar to rise, increase the stability that cross bar rises, solve and the height of conveying can not be adjusted simultaneously, semiconductor wafer conveying inconvenience, the problem of reducing transfer efficiency are caused in conveying.
Description
Technical field
Semiconductor wafer conveying technology field is the utility model is related to, specially a kind of semiconductor wafer package is filled with conveying
Put.
Background technology
With the development of semiconductor and electronic technology, the thickness more and more thinner of semiconductor package, integrated level is increasingly
Height, for example, the thickness of part semiconductor encapsulating structure can accomplish 0.33mm, in view of current semiconductor package leads to
Often include lead frame（Or substrate）, chip（die）, lead（wire）And injection-moulded housing, therefore the thickness of encapsulating structure with
Lead frame（Or substrate）, chip, lead height and marking depth（markingdepth）Deng there is relation, in this situation
Under, 0.33mm semiconductor package thickness has been the limit that current semiconductor packaging process can be accomplished, and semiconductor die
Piece is conveyed in encapsulation needs, because the height of conveying can not be adjusted for existing conveying device, is caused in conveying
Semiconductor wafer conveying inconvenience, reduces transfer efficiency.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor wafer package conveying device, and possessing can be to conveying
Highly it is adjusted, increases the convenience of semiconductor wafer conveying in conveying, the advantages of improving transfer efficiency, solve nothing
The height of conveying is adjusted method, and semiconductor wafer conveying inconvenience, the problem of reducing transfer efficiency are caused in conveying.
To achieve the above object, the utility model provides following technical scheme：A kind of semiconductor wafer package is filled with conveying
Put, including base, be fixedly connected with support bar on the left of the base top, operation is fixedly connected with the top of the support bar
Platform, is provided with cross bar at the top of the base, the left end and right-hand member at the cross bar back side be movably connected with first rotating shaft and
Second rotating shaft, connected between the first rotating shaft and the second rotating shaft by pulley drive, the positive right-hand member of cross bar is fixed
The first motor is connected with, the output shaft of first motor is described through cross bar and with being fixedly connected at the axle center of the second rotating shaft
The first fixed mount is fixedly connected with the top of base, the both sides of the first fixed mount inner chamber have been fixedly connected with fixed block, institute
The inside for stating fixed block offers chute, and the internal slide of the chute is connected with pulley, and the surface of the pulley is slidably connected
There is adjusting rod, mobile bar is fixedly connected with the left of the cross bar bottom, the one end of the mobile bar away from cross bar runs through first
Fixed mount simultaneously extends to the inside of the first fixed mount and is fixedly connected with adjusting rod, and is fixedly connected with the right side of the base top
Two fixed mounts, second fixed mount are internally provided with tooth plate, and the top of the tooth plate through the second fixed mount and extends to
The outside of second fixed mount is fixedly connected with being fixedly connected on the right side of cross bar bottom on the left of the second fixed mount intracavity bottom
Have a supporting plate, the positive top of supporting plate is provided with the second motor, the output shaft of second motor be fixedly connected with
Tooth plate meshed gears.
Preferably, cushion pad, the cushion pad and chute inner chamber are provided with the top and bottom of the chute inner chamber
Top and bottom are fixedly connected by fixture.
Preferably, the back side of second motor is fixedly connected with beam, and the back side of the beam and supporting plate are just
It is fixedly connected at the top of face.
Preferably, the top on the right side of the operating desk is fixedly connected with swash plate, and the one end of the swash plate away from operating desk is prolonged
Extend the top of belt pulley.
Preferably, the bottom on the right side of the tooth plate is fixedly connected with connecting rod, and the right-hand member of the connecting rod and second are fixed
Frame is slidably connected on the right side of inner chamber.
Compared with prior art, the beneficial effects of the utility model are as follows：
1st, the utility model can drive pinion rotation by the setting of the second motor, by the setting of gear and tooth plate,
Cross bar can be driven to rise, by the setting of mobile bar, adjusting rod and cunning are driven during mobile bar follows cross bar to rise
Slipping, the stability that increase cross bar rises, while solve and the height of conveying can not be adjusted, cause half in conveying
The conveying inconvenience of conductor chip, the problem of reducing transfer efficiency.
2nd, the utility model can be supported to operating desk by the setting of support bar, pass through the setting of swash plate, convenience
Semiconductor wafer is slid, and is convenient for conveying, and passes through the setting of cushion pad, it is possible to reduce pulley is hit with chute inwall
Hit, pulley is protected, by the setting of beam, the second motor can be protected, extend the use of the second motor
In the life-span, by the setting of connecting rod, the stability of tooth plate rising can be increased, prevent skew.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the utility model gear left view structural representation；
Fig. 3 is the utility model A partial structurtes enlarged diagram.
In figure：1 base, 2 support bars, 3 operating desks, 4 cross bars, 5 first rotating shafts, 6 second rotating shafts, 7 belt pulleys, 8 first electricity
Machine, 9 first fixed mounts, 10 fixed blocks, 11 chutes, 12 pulleys, 13 adjusting rods, 14 mobile bars, 15 second fixed mounts, 16 tooth plates,
17 supporting plates, 18 second motors, 19 gears, 20 cushion pads, 21 beams, 22 swash plates, 23 connecting rods.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-3, a kind of semiconductor wafer package conveying device, including base 1 are referred to, the left side at the top of base 1 is consolidated
Surely support bar 2 is connected with, by the setting of support bar 2, operating desk 3 can be supported, the top of support bar 2 is fixedly connected
There is operating desk 3, the top on the right side of operating desk 3 is fixedly connected with swash plate 22, and the one end of swash plate 22 away from operating desk 3 extends to belt
The top of wheel 7, by the setting of swash plate 22, facilitates semiconductor wafer to be slid, is convenient for conveying, the top of base 1 is set
Cross bar 4 is equipped with, the left end and right-hand member at the back side of cross bar 4 have been movably connected with the rotating shaft 6 of first rotating shaft 5 and second, the He of first rotating shaft 5
It is connected between second rotating shaft 6 by belt pulley 7,4 positive right-hand member of cross bar is fixedly connected with the first motor 8, the first motor 8
Output shaft through cross bar 4 and with being fixedly connected at the axle center of the second rotating shaft 6, the top of base 1 is fixedly connected with the first fixation
Frame 9, the both sides of the inner chamber of the first fixed mount 9 have been fixedly connected with fixed block 10, and the inside of fixed block 10 offers chute 11, chute
Cushion pad 20 is provided with the top and bottom of 11 inner chambers, cushion pad 20 and the top and bottom of the inner chamber of chute 11 pass through fixation
Part is fixedly connected, and passes through the setting of cushion pad 20, it is possible to reduce the shock of pulley 12 and the inwall of chute 11, pulley 12 is protected
Shield, the internal slide of chute 11 are connected with pulley 12, and the surface of pulley 12 slidably connects adjusting rod 13, a left side for the bottom of cross bar 4
Side is fixedly connected with mobile bar 14, and the one end of mobile bar 14 away from cross bar 4 is through the first fixed mount 9 and extends to the first fixed mount
9 inside is fixedly connected with adjusting rod 13, and the right side at the top of base 1 is fixedly connected with the second fixed mount 15, the second fixed mount 15
Be internally provided with tooth plate 16, the bottom on the right side of tooth plate 16 is fixedly connected with connecting rod 23, and the right-hand member of connecting rod 23 is consolidated with second
Determine to be slidably connected on the right side of the inner chamber of frame 15, by the setting of connecting rod 23, the stability of the rising of tooth plate 16 can be increased, prevented out
Now offset, the top of tooth plate 16 through the second fixed mount 15 and extends to the outside of the second fixed mount 15 and the right side of the bottom of cross bar 4
Side is fixedly connected, and supporting plate 17 is fixedly connected with the left of the intracavity bottom of the second fixed mount 15, and 17 positive top of supporting plate is set
The second motor 18 is equipped with, the back side of the second motor 18 is fixedly connected with beam 21, and the back side of beam 21 and supporting plate 17 are just
It is fixedly connected at the top of face, by the setting of beam 21, the second motor 18 can be protected, extends the second motor 18
Service life, the output shaft of the second motor 18 be fixedly connected with the meshed gears 19 of tooth plate 16, pass through setting for the second motor 18
Put, can be rotated with moving gear 19, by the setting of gear 19 and tooth plate 16, cross bar 4 can be driven to rise, pass through mobile bar 14
Setting, drive adjusting rod 13 and pulley 12 to slide during mobile bar 14 follows cross bar 4 to rise, increase cross bar 4 rises
Stability, while solve and the height of conveying can not be adjusted, semiconductor wafer conveying inconvenience, drop are caused in conveying
The problem of low transfer efficiency.
In use, starting the first motor 8 first and the second motor 18 works, the first motor 8 drives the second rotating shaft 6 and belt
Wheel 7 rotates, and the output shaft driven gear 19 of the second motor 18 rotates, and is driven by the cooperation of gear 19 and tooth plate 16 on cross bar 4
Rise, while connecting rod 23 follows tooth plate 16 to move, and drives mobile bar 14 to rise while cross bar 4 moves, while the band of adjusting rod 13
Movable pulley 12 height of conveying device is adjusted in the internal slide of chute 11.
In summary：The semiconductor wafer package conveying device, pass through chute 11, pulley 12, adjusting rod 13, mobile bar
14th, the cooperation of the second fixed mount 15, tooth plate 16, supporting plate 17, the second motor 18 and gear 19, solving can not be to the height of conveying
Degree is adjusted, and semiconductor wafer conveying inconvenience, the problem of reducing transfer efficiency are caused in conveying.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of semiconductor wafer package conveying device, including base（1）, it is characterised in that：The base（1）The left side at top
Side is fixedly connected with support bar（2）, the support bar（2）Top be fixedly connected with operating desk（3）, the base（1）Top
Portion is provided with cross bar（4）, the cross bar（4）The left end and right-hand member at the back side have been movably connected with first rotating shaft（5）With second turn
Axle（6）, the first rotating shaft（5）With the second rotating shaft（6）Between pass through belt pulley（7）Drive connection, the cross bar（4）It is positive
Right-hand member is fixedly connected with the first motor（8）, first motor（8）Output shaft run through cross bar（4）And with the second rotating shaft（6）'s
It is fixedly connected at axle center, the base（1）Top be fixedly connected with the first fixed mount（9）, first fixed mount（9）Inner chamber
Both sides be fixedly connected with fixed block（10）, the fixed block（10）Inside offer chute（11）, the chute（11）
Internal slide be connected with pulley（12）, the pulley（12）Surface slidably connect adjusting rod（13）, the cross bar（4）Bottom
Mobile bar is fixedly connected with the left of portion（14）, the mobile bar（14）Away from cross bar（4）One end run through the first fixed mount（9）
And extend to the first fixed mount（9）Inside and adjusting rod（13）It is fixedly connected, the base（1）It is fixedly connected on the right side of top
There is the second fixed mount（15）, second fixed mount（15）Be internally provided with tooth plate（16）, the tooth plate（16）Top pass through
Wear the second fixed mount（15）And extend to the second fixed mount（15）Outside and cross bar（4）It is fixedly connected on the right side of bottom, it is described
Second fixed mount（15）Supporting plate is fixedly connected with the left of intracavity bottom（17）, the supporting plate（17）Positive top is set
There is the second motor（18）, second motor（18）Output shaft be fixedly connected with and tooth plate（16）Meshed gears（19）.
A kind of 2. semiconductor wafer package conveying device according to claim 1, it is characterised in that：The chute（11）
Cushion pad is provided with the top and bottom of inner chamber（20）, the cushion pad（20）With chute（11）The top and bottom of inner chamber are equal
It is fixedly connected by fixture.
A kind of 3. semiconductor wafer package conveying device according to claim 1, it is characterised in that：Second motor
（18）The back side be fixedly connected with beam（21）, the beam（21）The back side and supporting plate（17）Positive top is fixed
Connection.
A kind of 4. semiconductor wafer package conveying device according to claim 1, it is characterised in that：The operating desk
（3）Swash plate is fixedly connected with the top of right side（22）, the swash plate（22）Away from operating desk（3）One end extend to belt pulley
（7）Top.
A kind of 5. semiconductor wafer package conveying device according to claim 1, it is characterised in that：The tooth plate（16）
The bottom on right side is fixedly connected with connecting rod（23）, the connecting rod（23）Right-hand member and the second fixed mount（15）The right side of inner chamber
It is slidably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720832490.0U CN206907747U (en) | 2017-07-10 | 2017-07-10 | A kind of semiconductor wafer package conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720832490.0U CN206907747U (en) | 2017-07-10 | 2017-07-10 | A kind of semiconductor wafer package conveying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206907747U true CN206907747U (en) | 2018-01-19 |
Family
ID=61312174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720832490.0U Active CN206907747U (en) | 2017-07-10 | 2017-07-10 | A kind of semiconductor wafer package conveying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206907747U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192685A (en) * | 2018-10-10 | 2019-01-11 | 曾繁洪 | A kind of chip manufacture placement equipment |
-
2017
- 2017-07-10 CN CN201720832490.0U patent/CN206907747U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192685A (en) * | 2018-10-10 | 2019-01-11 | 曾繁洪 | A kind of chip manufacture placement equipment |
| CN109192685B (en) * | 2018-10-10 | 2021-11-05 | 慧芯通(深圳)技术有限公司 | Chip processing is with subsides installation |
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