CN210868541U

CN210868541U - Novel heat dissipation mechanism of electronic equipment

Info

Publication number: CN210868541U
Application number: CN201921496445.8U
Authority: CN
Inventors: 吕朋朋
Original assignee: China Keshi'an Technology Co Ltd
Current assignee: China Keshi'an Technology Co Ltd
Priority date: 2019-09-09
Filing date: 2019-09-09
Publication date: 2020-06-26
Anticipated expiration: 2029-09-09

Abstract

The utility model belongs to the field of electronic equipment, in particular to a novel heat dissipation mechanism of electronic equipment, which comprises a shell with a C-shaped structure and a mounting plate arranged in the shell, wherein one side of the shell, which is away from an opening, is provided with a plurality of radiating fins and is of an integrated structure with the radiating fins, one side of the shell is fixedly provided with a shell, and one side of the shell, which is away from the shell, is provided with a through hole; the fin can be through the mode of metal heat conduction, go out the heat transfer in the casing, thereby guarantee radiating efficiency, place the circuit board on the mounting panel, through promoting the fixed plate, make the fixed plate remove until the recess with the circuit board cladding along the spout through the slider, fix the preforming, thereby accomplish the fixed to the circuit board, promote the fixed plate with recess and circuit board separation, can accomplish the dismantlement to the circuit board, avoid dismantling or in the installation with the corner of circuit board contact, reduce wearing and tearing.

Description

Novel heat dissipation mechanism of electronic equipment

Technical Field

The utility model relates to an electronic equipment field especially relates to a novel heat dissipation mechanism of electronic equipment.

Background

Electronic equipment means by integrated circuit, the transistor, electronic tube etc. electronic components constitutes, the equipment that the applied electronics technique (including) software play a role, including electronic computer and by electronic computer controlled robot, numerical control or programme-controlled system etc. circuit board chip is as the essential original paper in the electronic equipment, in order to guarantee normal work, the louvre has been seted up on the shell of circuit board outside many and the inside is dispelled the heat to inside, make outside dust easily get into inside the shell through the louvre, cause the circuit board pollution, influence normal work, and because it is many that the circuit board makes to install in the shell through embedded, the corner easily with the shell in produce the friction touch, easily produce the damage.

In order to solve the above problems, the present application provides a novel heat dissipation mechanism for an electronic device.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a novel heat dissipation mechanism of electronic equipment has the assurance radiating effect, effectively blocks the dust and gets into, easy to assemble and dismantle the circuit board, reduces the characteristics of wearing and tearing.

(II) technical scheme

In order to solve the above problems, the present invention provides a novel heat dissipation mechanism for electronic equipment, comprising a casing having a C-shaped structure, and a mounting plate installed in the casing, wherein a plurality of heat dissipation fins are disposed on one side of the casing away from an opening, and the heat dissipation fins are integrally formed, a housing is fixedly disposed on one side of the casing, a through hole is formed on one side of the housing away from the casing, a fan is disposed in the housing and fixedly connected to the fan, a through groove is symmetrically formed on one side of the casing away from the housing, a filter screen is embedded in the through groove and fixedly connected to the filter screen, a fan housing is disposed outside the through groove and fixedly welded to the casing, a mounting plate is disposed in the housing and fixedly connected to the mounting plate, a mounting frame is fixedly disposed on one side of the mounting plate, and a fixing plate is disposed on one side of, and is connected with the fixed plate in a sliding way, and one side of the fixed plate, which is far away from the mounting rack, is provided with a pressing sheet and is fixedly connected with the pressing sheet.

Preferably, the mounting plate is located at the center of the inner wall of the housing, and the through grooves are symmetrically arranged along the mounting plate.

Preferably, the two sides of the machine shell are symmetrically welded with mounting seats, and the mounting seats and the machine shell are positioned on the same horizontal plane.

Preferably, the fan housing is arc-shaped to cover the through groove, and the opening of the fan housing faces downwards.

Preferably, the mounting bracket with the spout has been seted up at the junction of fixed plate, the spout is embedded to have the slider, and with slider sliding connection, just the slider with fixed plate fixed connection.

Preferably, both sides of the sliding groove penetrate through the mounting frame and form an opening.

Preferably, the fixing plate is attached to the through hole, a groove is formed in the attachment position of the fixing plate and the mounting plate, and the pressing sheet and one side, far away from the mounting frame, of the fixing plate are located on the same horizontal plane.

The above technical scheme of the utility model has following profitable technological effect:

the fan can blow gas in the casing at the during operation, guarantee circulation of air and heat dissipation in the casing, and can blow off adnexed dust on the filter screen, make the difficult jam of filter screen, the fin can pass through the mode of metal heat conduction, heat transfer in the casing is gone out, thereby guarantee the radiating efficiency, place the circuit board on the mounting panel, through promoting the fixed plate, make the fixed plate remove until the recess with the circuit board cladding through the slider along the spout, fix the preforming, thereby accomplish the fixed to the circuit board, promote the fixed plate and separate recess and circuit board, can accomplish the dismantlement to the circuit board, avoid dismantling or contact with the corner of circuit board in the installation, reduce wearing and tearing.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view between the middle casing and the fan housing of the present invention;

fig. 3 is a perspective view of the mounting plate of the present invention;

fig. 4 is a schematic structural view between the middle mounting frame and the fixing plate of the present invention.

Reference numerals:

1. a housing; 2. filtering with a screen; 3. a through groove; 4. a heat sink; 5. a through hole; 6. a mounting seat; 7. a fan; 8. a housing; 9. mounting a plate; 10. a fan housing; 11. a mounting frame; 12. a fixing plate; 13. a chute; 14. a slider; 15. a groove; 16. and (6) tabletting.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1-4, the novel heat dissipation mechanism for electronic equipment provided by the present invention comprises a casing 1 having a C-shaped structure and a mounting plate 9 mounted in the casing 1, wherein a plurality of heat dissipation fins 4 are disposed on a side of the casing 1 away from an opening and are integrally formed with the heat dissipation fins 4, a casing 8 is fixedly disposed on one side of the casing 1, a through hole 5 is disposed on one side of the casing 8 away from the casing 1, a fan 7 is disposed in the casing 8 and is fixedly connected with the fan 7, through grooves 3 are symmetrically disposed on one side of the casing 1 away from the casing 8, a filter screen 2 is embedded in the through grooves 3 and is fixedly connected with the filter screen 2, a fan housing 10 is disposed outside the through grooves 3, the fan housing 10 is welded and fixed to the casing 1, a mounting plate 9 is disposed in the casing 1 and is fixedly connected with the mounting plate 9, a mounting frame 11 is, and is connected with the fixed plate 12 in a sliding way, and one side of the fixed plate 12 far away from the mounting rack 11 is provided with a pressing sheet 16 and is fixedly connected with the pressing sheet 16.

It should be noted that, a mounting hole is reserved on the casing 1 for performing sealing operation on the casing 1 and enhancing protection on the circuit board; the fan 7 is supported by an external power supply and is used for circulating the air in the casing 1 and blowing away the dust on the filter screen 2 to avoid the blockage of the filter screen 2.

The utility model discloses in, fan 7 can blow gas to casing 1 in at the during operation, guarantee circulation of air and heat dissipation in the casing 1, and can blow off adnexed dust on the filter screen 2, make the filter screen 2 difficult the jam, fin 4 can be through the mode of metal heat conduction, go out the heat transfer in the casing 1, thereby guarantee the radiating efficiency, place the circuit board on mounting panel 9, through promoting fixed plate 12, make fixed plate 12 remove until recess 15 with the circuit board cladding along spout 13 through slider 14, fix preforming 16, thereby accomplish the fixed to the circuit board, promote fixed plate 12 and separate recess 15 and circuit board, can accomplish the dismantlement to the circuit board, avoid contacting with the corner of circuit board in dismantlement or the installation, reduce wear and tear.

Fig. 1 is a schematic structural view of the present invention;

as shown in fig. 1, the mounting plate 9 is located at the center of the inner wall of the cabinet 1, and the through slots 3 are symmetrically arranged along the mounting plate 9.

As shown in fig. 1, the mounting seats 6 are symmetrically welded to both sides of the casing 1, and the mounting seats 6 and the casing 1 are located on the same horizontal plane.

It should be noted that the through grooves 3 and the fans 7 can be matched with each other to circulate air in the casing 1, so that the heat dissipation efficiency is ensured, and the mounting seat 6 is reserved with empty grooves, so that people can conveniently mount the casing 1.

Fig. 2 is a schematic structural view between the casing 1 and the fan housing 10 of the present invention;

as shown in fig. 2, the fan housing 10 is curved to cover the through-groove 3 and has a downward opening.

It should be noted that, because the fan housing 10 is arc-shaped to cover the through groove 3, and the opening faces downward, dust is not easy to enter the through groove 3 through the fan housing 10, and external dust is effectively blocked.

Fig. 3 is a perspective view of the mounting plate 9 of the present invention;

as shown in fig. 3, a sliding groove 13 is formed at a joint of the mounting frame 11 and the fixing plate 12, a sliding block 14 is embedded in the sliding groove 13 and is slidably connected with the sliding block 14, and the sliding block 14 is fixedly connected with the fixing plate 12.

As shown in fig. 3, both sides of the slide groove 13 penetrate the mounting frame 11 and form an opening.

It should be noted that, through promoting fixed plate 12, make fixed plate 12 move along spout 13 through slider 14 until recess 15 with the circuit board cladding, fix preforming 16 to make things convenient for people to fix the circuit board, because the mounting bracket 11 is run through to the both sides of spout 13, and form the opening, make things convenient for people to shift out spout 13 with slider 14 in order to dismantle the circuit board.

Fig. 4 is a schematic structural view between the mounting frame 11 and the fixing plate 12 in the present invention;

as shown in fig. 4, the fixing plate 12 is attached to the through hole 5, a groove 15 is formed at the attachment position of the fixing plate 12 and the mounting plate 9, and the pressing plate 16 and one side of the fixing plate 12 away from the mounting frame 11 are located on the same horizontal plane.

It should be noted that, the fixing plate 12 is moved until the groove 15 covers the circuit board, and the groove 15 is attached to the mounting plate 9, so that the circuit board is limited, and people can conveniently fix the pressing sheet 16 to complete the mounting of the circuit board.

The utility model discloses a theory of operation and use flow: the fan 7 can blow gas into the machine case 1 during operation, so as to ensure ventilation and heat dissipation in the machine case 1, and can blow away dust attached to the filter screen 2, so that the filter screen 2 is not easy to block, the heat dissipation fins 4 can transfer heat in the machine case 1 in a metal heat conduction mode, so as to ensure heat dissipation efficiency, the through grooves 3 are covered by the arc-shaped fan cover 10 with the opening facing downwards, so that dust is not easy to enter the through grooves 3 formed by the fan cover 10, external dust is effectively blocked, a circuit board is placed on the mounting plate 9, the circuit board is covered by the grooves 15 by moving the fixing plate 12 along the sliding grooves 13 through the sliding blocks 14 by pushing the fixing plate 12, and the pressing sheets 16 are fixed, so that people can fix the circuit board conveniently, the sliding blocks 14 can move out of the sliding grooves 13 to detach the circuit board due to the fact that the two sides of the sliding grooves 13 penetrate through the, avoid dismantling or contact with the corner of circuit board in the installation, reduce wearing and tearing.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. The novel heat dissipation mechanism of the electronic equipment is characterized by comprising a casing (1) with a C-shaped structure and a mounting plate (9) installed in the casing (1), wherein one side, away from an opening, of the casing (1) is provided with a plurality of heat dissipation fins (4) and is of an integrally formed structure with the heat dissipation fins (4), one side of the casing (1) is fixedly provided with a shell (8), one side, away from the casing (1), of the shell (8) is provided with a through hole (5), a fan (7) is arranged in the shell (8) and is fixedly connected with the fan (7), one side, away from the shell (8), of the casing (1) is symmetrically provided with a through groove (3), a filter screen (2) is embedded in the through groove (3) and is fixedly connected with the filter screen (2), a fan cover (10) is arranged outside the through groove (3), and the fan cover (10) is welded and fixed with the casing (1), be equipped with mounting panel (9) in casing (1), and with mounting panel (9) fixed connection, one side of mounting panel (9) is fixed and is equipped with mounting bracket (11), one side of mounting bracket (11) is equipped with fixed plate (12), and with fixed plate (12) sliding connection, fixed plate (12) are kept away from one side of mounting bracket (11) is equipped with preforming (16), and with preforming (16) fixed connection.

2. The novel heat dissipation mechanism for electronic equipment as claimed in claim 1, wherein the mounting plate (9) is located at the center of the inner wall of the housing (1), and the through slots (3) are symmetrically arranged along the mounting plate (9).

3. The novel heat dissipation mechanism of electronic equipment according to claim 1, wherein the mounting seats (6) are symmetrically welded to two sides of the casing (1), and the mounting seats (6) and the casing (1) are located at the same horizontal plane.

4. The novel heat dissipation mechanism of electronic equipment as claimed in claim 1, wherein the hood (10) is curved to cover the through slot (3) and has a downward opening.

5. The novel heat dissipation mechanism of electronic equipment according to claim 1, wherein a sliding groove (13) is formed at a joint of the mounting frame (11) and the fixing plate (12), a sliding block (14) is embedded in the sliding groove (13) and is slidably connected with the sliding block (14), and the sliding block (14) is fixedly connected with the fixing plate (12).

6. The novel heat dissipation mechanism of electronic equipment as claimed in claim 5, wherein both sides of the sliding slot (13) penetrate through the mounting frame (11) and form an opening.

7. The novel heat dissipation mechanism of electronic equipment according to claim 1, wherein the fixing plate (12) is attached to the through hole (5), a groove (15) is formed at the attachment position of the fixing plate (12) and the mounting plate (9), and the pressing sheet (16) and one side of the fixing plate (12) away from the mounting frame (11) are located on the same horizontal plane.