CN210868316U - Circuit board and electronic device - Google Patents
Circuit board and electronic device Download PDFInfo
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- CN210868316U CN210868316U CN201922144229.3U CN201922144229U CN210868316U CN 210868316 U CN210868316 U CN 210868316U CN 201922144229 U CN201922144229 U CN 201922144229U CN 210868316 U CN210868316 U CN 210868316U
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- circuit board
- substrate
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- layer
- mounting cavity
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Abstract
The utility model discloses a circuit board and electron device, this circuit board includes: the substrate is provided with a shell, the shell and the substrate are enclosed to form a mounting cavity, and the substrate is provided with a through hole communicated with the mounting cavity; and the electronic component comprises a first component and a second component which are arranged on the substrate, and the second component is positioned in the mounting cavity. The utility model aims at providing a can reduce line length, reduce cost, and compact structure's circuit board for the circuit board reduces parasitic capacitance, inductance, does not influence the signal.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to circuit board and electronic device who uses this circuit board.
Background
The existing circuit board usually packages power, communication, radio frequency, control and other IC devices and capacitance, resistance, inductance and other passive devices together, and leads out a pressure sensor, an environment sensor, an acoustic sensor and the like through a soft board and is attached on the soft board or other carrier boards, so that the circuit of the circuit board is long, parasitic capacitance and inductance are increased, signals are influenced, the cost is increased, and the whole structure of the circuit board is detached and is not compact.
The above description is only for the purpose of aiding understanding of the technical solutions of the present application and does not represent an admission of prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a circuit board and electron device, aim at providing one kind and can reduce line length, reduce cost, and compact structure's circuit board for the circuit board reduces parasitic capacitance, inductance, does not influence the signal.
In order to achieve the above object, the present invention provides a circuit board including:
the substrate is provided with a shell, the shell and the substrate are enclosed to form a mounting cavity, and the substrate is provided with a through hole communicated with the mounting cavity; and
and the electronic component comprises a first component and a second component which are arranged on the substrate, and the second component is positioned in the mounting cavity.
In an embodiment, a solder mask layer is further disposed on a side of the substrate facing away from the housing, a via hole is formed in the solder mask layer corresponding to the through hole, and the first device is disposed on a side of the solder mask layer facing away from the substrate.
In an embodiment, the aperture of the via hole is greater than or equal to the aperture of the through hole.
In an embodiment, the circuit board further includes a shielding member disposed at the through hole to seal the through hole.
In an embodiment, the shielding member is a shielding film, and the shielding film is disposed in the through hole and/or the mounting cavity and covers the through hole.
In one embodiment, the thickness of the shielding film is smaller than that of the solder resist layer.
In an embodiment, the shielding member is a protective plug, and the protective plug is inserted into the through hole to seal the through hole.
In one embodiment, the circuit board further includes at least one protective layer, and the protective layer covers the first device and the housing and is connected to the substrate.
In one embodiment, the first device is one or more of a power supply, communication, radio frequency, control, capacitor, resistor, and inductor;
and/or the second device is one or more of a pressure sensor, an environment sensor and an acoustic sensor;
and/or the shell cover is made of plastic materials, metal materials or ceramic materials.
The utility model also provides an electron device, including the circuit board, this circuit board is the aforesaid the circuit board.
The circuit board of the technical scheme of the utility model is characterized in that the shell cover is arranged on the substrate, the shell cover and the substrate are matched to form the mounting cavity, and the through hole is arranged on the substrate, so that the second device of the electronic component is arranged in the mounting cavity, and the first device and the second device of the electronic component are simultaneously arranged on the substrate, thereby effectively reducing the line length of the circuit board and enabling the structure of the circuit board to be more compact; meanwhile, the through hole is formed in the substrate, so that the through hole is communicated with the mounting cavity, the parasitic capacitance and the inductance of the circuit board are reduced by the through hole, and signals are not affected.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a circuit board according to the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the circuit board of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
161 | |
| 1 | |
162 | Metal layer |
| 1a | |
17 | |
| 11 | |
2 | |
| 12 | |
21 | |
| 13 | |
22 | |
| 14 | Through |
31 | |
| 15 | |
32 | |
| 151 | Via hole | 4 | |
| 16 | Substrate layer |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a circuit board 100. It is understood that the circuit board 100 is applicable to electronic devices, such as mobile phones, tablet computers, notebook computers, etc., and is not limited thereto.
Referring to fig. 1 and fig. 2 in combination, in an embodiment of the present invention, the circuit board 100 includes a substrate 1 and an electronic component 2, wherein the substrate 1 is provided with a housing 13, the housing 13 and the substrate 1 enclose to form a mounting cavity 1a, and the substrate 1 is provided with a through hole 14 communicating with the mounting cavity 1 a; the electronic component 2 comprises a first device 21 and a second device 22 arranged on the substrate 1, and the second device 22 is located in the mounting cavity 1 a.
It is understood that the circuit board 100 may be a printed circuit board, and the material thereof may be FR4 epoxy resin board; or the circuit board 100 may be a flexible circuit board made of any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride, and natural rubber. Or the circuit board 100 is a combination of a rigid circuit board and a flexible circuit board, and the number of circuit layers may be a single layer, a double layer or a multilayer.
In the present embodiment, the plurality of electronic components 2 are disposed on the substrate 1 of the circuit board 100, and the plurality of electronic components 2 may be disposed on the same surface of the substrate 1. Of course, in order to improve the utilization rate of the circuit board 100, a plurality of electronic components 2 may be disposed on the opposite surfaces of the substrate 1.
In the present embodiment, the electronic component 2 includes a first device 21 and a second device 22 provided on the substrate 1. The first device 21 is an IC device or a passive device, and the first device 21 may be one or more of a power supply, a communication device, a radio frequency device, a control device, a capacitor, a resistor, and an inductor. The second device 22 may be selected from one or more of a pressure sensor, an environmental sensor, an acoustic sensor.
In the present embodiment, the electronic component 2 includes a plurality of first devices 21 and a plurality of second devices 22. In order to integrate a plurality of first devices 21 and a plurality of second devices 22 of the electronic component 2 on the substrate 1, the circuit board 100 of the technical scheme of the utility model utilizes the housing 13 and the substrate 1 to cooperate to form the mounting cavity 1a by arranging the housing 13 on the substrate 1, and arranging the through hole 14 on the substrate 1, so that the second devices 22 of the electronic component 2 are arranged in the mounting cavity 1a, and the first devices 21 and the second devices 22 of the electronic component 2 are simultaneously arranged on the substrate 1, thereby effectively reducing the line length of the circuit board 100 and enabling the structure of the circuit board 100 to be more compact; meanwhile, the through hole 14 is formed in the substrate 1, so that the through hole 14 is communicated with the mounting cavity 1a, and the parasitic capacitance and inductance of the circuit board 100 are reduced by using the through hole 14 without affecting signal transmission.
As can be understood, the substrate 1 is provided with the housing 13, so that a plastic package region and a non-plastic package region are formed on the substrate 1, the first device 21 of the electronic component 2 is arranged in the plastic package region, and the second device 22 of the electronic component 2 is arranged in the non-plastic package region, so that the first device 21 and the second device 22 of the electronic component 2 are effectively integrated on the substrate 1 at the same time, and thus, the line length of the circuit board 100 can be effectively reduced, the cost of the circuit board 100 can be reduced, and the structure of the circuit board 100 is more compact; meanwhile, the parasitic capacitance and the inductance of the circuit board 100 can be reduced, and signals are not affected.
In the present embodiment, the substrate 1 is used for mounting the electronic component 2, and in order to make the circuit board 100 present different states, such as a hard circuit board, a flexible circuit board or a printed circuit board, the material of the substrate 1 may be a hard material, such as FR4 epoxy board, of course, the material of the substrate 1 may be a soft material, such as any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride and natural rubber, and is not limited herein.
In one embodiment, the material of the housing 13 may be selected from a plastic material, a metal material or a ceramic material. The second device 22 in the non-molding region of the package circuit board 100 is protected by the casing 13, and the material of the casing 13 is not limited to plastic material, metal material or ceramic material. As can be appreciated, the use of the plastic housing 13 can save costs; the metal shell cover 13 can be used for electromagnetic shielding; the ceramic shell 13 can be used for supporting components with strong force or components sensitive to stress/deformation.
In an embodiment, as shown in fig. 1 and fig. 2, the substrate 1 includes a first mounting surface 11 and a second mounting surface 12 that are oppositely disposed, the housing 13 is disposed on the first mounting surface 11 and encloses the first mounting surface 11 to form the mounting cavity 1a, the first device 21 is disposed on the first mounting surface 11 and/or the second mounting surface 12, and the second device 22 is disposed on the first mounting surface 11 and is located in the mounting cavity 1 a.
It is understood that the electronic component 2 includes a plurality of the first devices 21 and a plurality of the second devices 22, the plurality of the first devices 21 are disposed at intervals on the first mounting surface 11 and the second mounting surface 12, and the plurality of the second devices 22 are disposed at intervals on the first mounting surface 11 and located in the mounting cavity 1 a.
In this embodiment, the substrate 1 includes a base material layer 16 and coating layers 17, and the coating layers 17 are provided on opposite sides of the base material layer 16. It is understood that the substrate layer 16 and the coating layer 17 of the substrate 1 are stacked, that is, the substrate layer 16 of the substrate 1 is sandwiched between two coating layers 17. In order to ensure that the coating layer 17 can completely cover the substrate layer 16, thereby protecting the substrate layer 16, the shape profile of the substrate layer 16 is the same as the shape profile of the coating layer 17, and the size of the substrate layer 16 is the same as the size of the coating layer 17.
As shown in fig. 1 and 2, the base material layer 16 of the substrate 1 includes an insulating layer 161 and a metal layer 162, and the metal layer 162 is provided on opposite sides of the insulating layer 161. It is understood that the insulating layer 161 and the metal layer 162 are stacked, that is, the insulating layer 161 of the substrate layer 16 is sandwiched between two metal layers 162.
In this embodiment, the coating layers 17 are disposed on two opposite sides of the substrate layer 16, that is, the two coating layers 17 cover the two metal layers 162 respectively, so that the surface of the metal layer 162 of the substrate layer 16 can be protected from being exposed in the air, the metal layer 162 of the substrate layer 16 is prevented from being damaged by oxidation or poor in contact, the coating layers are also covered for subsequent surface treatment, and a solder resist effect is achieved.
It is understood that the insulating layer 161 is an insulating resin such as a phenol resin, an epoxy resin (EP), a polyphenylene oxide resin (PPO), a polyimide resin (PI), a polyester resin (PET), a cyanate ester resin (CE), a polytetrafluoroethylene resin (PTFE), a bismaleimide triazine resin BT, and the like. In the present embodiment, the insulating layer 161 may be selected from polyimide resin (PI). Optionally, the metal layer 162 is a copper layer or a copper foil. It is understood that the copper foil is electrolytic copper or rolled copper, and the rolled copper has better mechanical properties and meets the requirement of flexibility.
In this embodiment, the coating layer 17 may be selected from polyimide resins (PI). It is understood that the coating layer 17 is polyimide resin (PI), and the coating layer 17 may be laminated on the surface of the metal layer 162 in the substrate layer 16 by means of lamination. Of course, the coating layer 17 may be provided on the surface of the metal layer 162 in the substrate layer 16 by other means, for example, by means of adhesive. In other embodiments, the coating layer 17 may be made of a polyester resin (PET), and is not limited herein.
In one embodiment, the coating layer 17 includes a two-layer structure of a combination of a polyimide resin (PI) and a glue layer, and the glue layer is disposed between the polyimide resin (PI) and the metal layer 162, that is, the polyimide resin (PI) is adhered to the surface of the metal layer 162 in the substrate layer 16 through the glue layer. Optionally, the adhesive layer is an adhesive or a glue layer or an adhesive, etc., such as a pressure sensitive adhesive or a hot melt adhesive, etc. Of course, the coating layer 17 may be made of a polyester resin (PET), and is not limited thereto.
In one embodiment, as shown in fig. 1 and fig. 2, a solder mask layer 15 is further disposed on a side of the substrate 1 facing away from the housing 13, the solder mask layer 15 has a via 151 corresponding to the through hole 14, and the first device 21 is disposed on a side of the solder mask layer 15 facing away from the substrate 1.
It can be understood that by providing the solder resist layer 15 on the second mounting surface 12 of the substrate 1, the first component 21 of the electronic component 2 can be conveniently disposed on the second mounting surface 12 of the substrate 1, so that the utilization rate of the substrate 1 in the circuit board 100 can be improved. Through set up via hole 151 at solder mask 15 for via hole 151 corresponds with through-hole 14, thereby makes things convenient for circuit board 100 to realize reducing the parasitic capacitance, the inductance of circuit board 100 through-hole 14 and via hole 151, does not influence signal transmission.
In one embodiment, as shown in fig. 1 and 2, the circuit board 100 further includes a shielding member disposed at the through hole 14 to seal the through hole 14.
It can be understood that, by providing the shielding member at the through hole 14, in the manufacturing and packaging processes of the circuit board 100, the shielding member can be used to block the through hole 14, so as to avoid the situation that a complicated link may damage the sensitive second device 22 in the mounting cavity 1a, or the through hole 14 is blocked to disable the second device 22, and the like. For example, water flow, dust, etc. are introduced during the manufacturing and packaging processes, and may enter the mounting cavity 1a through the through hole 14 to damage the second device 22.
In an embodiment, as shown in fig. 1, the shielding member is a shielding film 31, and the shielding film 31 is disposed in the through hole 151 and/or the mounting cavity 1a and covers the through hole 14.
It can be understood that the shielding member is a shielding film 31, and the shielding film 31 is disposed in the through hole 151 of the solder mask layer 15 and covers the through hole 14, so as to seal or block the through hole 14, and effectively prevent water flow, dust and the like from entering the mounting cavity 1a through the through hole 14 to damage the second device 22.
Of course, in order to further ensure the sealing effect of the through hole 14, the shielding member is two layers of shielding films 31, one layer of shielding film 31 is arranged in the through hole 151 of the solder mask layer 15 and covers the through hole 14; another layer of shielding film 31 is disposed in the mounting cavity 1a and covers the through hole 14. Therefore, the two layers of shielding films 31 cover the openings at the two ends of the through hole 14, so that the sealing effect is improved, and the dustproof and waterproof purposes are achieved, but air can flow freely, air pressure, sound waves and the like are not affected, and the signal transmission of the second device 22 is not affected by the shielding films 31. If the shielding film 31 is a common sealing film, the shielding film 31 is only disposed in the via hole 151 of the solder mask 15 and covers the through hole 14, and when the circuit board 100 leaves the factory after being manufactured, the shielding film 31 can be removed to open the through hole 14, so that the shielding film 31 can be effectively prevented from affecting the signal transmission of the second device 22.
In one embodiment, as shown in fig. 1 and 2, the aperture of the via hole 151 is greater than or equal to the aperture of the through hole 14. Optionally, the aperture of the via hole 151 is larger than that of the through hole 14, so that the shielding film 31 can be embedded in the via hole 151, and thus the shielding film 31 can be protected by the via hole 151 of the solder resist layer 15.
In one embodiment, the thickness of the shielding film 31 is smaller than the thickness of the solder resist layer 15. In this embodiment, the thickness of the solder mask layer 15 is about 20um, and the thickness of the shielding film 31 is about 10um to 15um, i.e. the shielding film 31 is slightly lower than the surface of the solder mask layer 15, so that the shielding film 31 is effectively prevented from being damaged by mechanical stress such as friction in the subsequent process.
In one embodiment, as shown in fig. 2, the shielding member is a protection plug 32, and the protection plug 32 is inserted into the through hole 14 to seal the through hole 14.
It will be appreciated that the protective plug 32 may alternatively be a flocculent protective plug, the protective plug 32 not affecting the signal transmission of the second device 22. Thus, the protective plug 32 can be used for achieving the purposes of dust prevention and water prevention, but air can flow freely, and air pressure, sound waves and the like are not affected. Thus, when the circuit board 100 is shipped after being manufactured, the protection plug 32 can be shipped together with the circuit board 100 without being removed. If the protection plug 32 is a common sealing plug or rubber plug, the protection plug 32 is used in the manufacturing or packaging of the circuit board 100, and when the circuit board 100 leaves the factory after being manufactured, the protection plug 32 can be removed to open the through hole 14, so that the protection plug 32 can be effectively prevented from affecting the signal transmission of the second device 22.
In one embodiment, as shown in fig. 1 and 2, the circuit board 100 further includes at least one protection layer 4, and the protection layer 4 covers the first device 21 and the housing 13 and is connected to the substrate 1.
It can be understood that, by providing the protective layer 4, the electronic component 2 on the substrate 1 can be protected by the protective layer 4, thereby improving the service life of the circuit board 100.
In one embodiment, the number of the protective layer 4 is one, two or more layers, and the protective layer 4 covers the first component 21 and the housing 13 of the electronic component 2 on the substrate 1 and is connected with the first mounting surface 11 of the substrate 1, so as to improve the service life of the circuit board 100. Alternatively, the material of the protective layer 4 may be selected from resin.
Of course, in other embodiments, the second mounting surface 12 of the substrate 1 is also covered with the protective layer 4, so that the first device 21 on the second mounting surface 12 can be protected by the protective layer 4.
The utility model discloses still provide an electronic device, including circuit board 100, the concrete structure of this circuit board 100 refers to above-mentioned embodiment, because this electronic device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A circuit board, comprising:
the substrate is provided with a shell, the shell and the substrate are enclosed to form a mounting cavity, and the substrate is provided with a through hole communicated with the mounting cavity; and
and the electronic component comprises a first component and a second component which are arranged on the substrate, and the second component is positioned in the mounting cavity.
2. The circuit board of claim 1, wherein a solder mask is further disposed on a side of the substrate opposite to the housing, the solder mask has via holes corresponding to the through holes, and the first device is disposed on a side of the solder mask opposite to the substrate.
3. The circuit board of claim 2, wherein an aperture of the via is greater than or equal to an aperture of the through-hole.
4. The circuit board of claim 2, further comprising a shield disposed at the through hole to seal the through hole.
5. The circuit board of claim 4, wherein the shielding member is a shielding film, and the shielding film is disposed in the through hole and/or the mounting cavity and covers the through hole.
6. The circuit board according to claim 5, wherein a thickness of the shielding film is smaller than a thickness of the solder resist layer.
7. The circuit board of claim 4, wherein the shielding member is a protective plug, and the protective plug is inserted into the through hole to seal the through hole.
8. The circuit board of any one of claims 1 to 7, further comprising at least one protective layer, one of the protective layers covering the first device and the housing and being connected to the substrate.
9. The circuit board of any one of claims 1 to 7, wherein the first device is one or more of a power supply, communication, radio frequency, control, capacitance, resistance, inductance;
and/or the second device is one or more of a pressure sensor, an environment sensor and an acoustic sensor;
and/or the shell cover is made of plastic materials, metal materials or ceramic materials.
10. An electronic device comprising a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922144229.3U CN210868316U (en) | 2019-12-03 | 2019-12-03 | Circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922144229.3U CN210868316U (en) | 2019-12-03 | 2019-12-03 | Circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210868316U true CN210868316U (en) | 2020-06-26 |
Family
ID=71293215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922144229.3U Active CN210868316U (en) | 2019-12-03 | 2019-12-03 | Circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210868316U (en) |
-
2019
- 2019-12-03 CN CN201922144229.3U patent/CN210868316U/en active Active
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